LINER LTC1850 8-channel, 10-bit/12-bit, 1.25msps sampling adc Datasheet

LTC1850/LTC1851
8-Channel, 10-Bit/12-Bit,
1.25Msps Sampling ADCs
DESCRIPTIO
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FEATURES
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The 10-bit LTC®1850 and 12-bit LTC1851 are complete
8-channel data acquisition systems. They include a flexible 8-channel multiplexer, a 1.25Msps successive approximation analog-to-digital converter with sample-and-hold,
an internal 2.5V reference and reference buffer amplifier,
and a parallel output interface. The multiplexer can be configured for single-ended or differential inputs, two gain
ranges and unipolar or bipolar operation.
Flexible 8-Channel Multiplexer
Single-Ended or Differential Inputs
Two Gain Ranges Plus Unipolar and Bipolar
Operation
1.25Msps Sampling Rate
Single 5V Supply and 40mW Power Dissipation
Scan Mode and Programmable Sequencer
Pin Compatible 10-Bit LTC1850 and 12-Bit LTC1851
True Differential Inputs Reject Common Mode Noise
Internal 2.5V Reference
Parallel Output Includes MUX Address
Easy Interface to 3V Logic
Nap and Sleep Shutdown Modes
The ADCs have a scan mode that will repeatedly cycle
through all 8 multiplexer channels and can also be
programmed with a sequence of up to 16 addresses and
configurations that can be scanned in succession. The
sequence memory can also be read back. The reference
and buffer amplifier provide pin strappable ranges of
4.096V, 2.5V and 2.048V. The parallel output includes
the 10-bit or 12-bit conversion result plus the 4-bit
multiplexer address. The digital outputs are powered
from a separate supply allowing for easy interface to 3V
digital logic. Typical power consumption is 40mW at
1.25Msps from a single 5V supply.
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APPLICATIO S
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High Speed Data Acquisition
Test and Measurement
Imaging Systems
Telecommunications
Industrial Process Control
Spectrum Analysis
, LTC and LT are registered trademarks of Linear Technology Corporation.
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BLOCK DIAGRA
CH1
CONTROL LOGIC
AND
PROGRAMMABLE
SEQUENCER
CH2
CH3
CH4
8-CHANNEL
MULTIPLEXER
INTERNAL
CLOCK
CH5
M1
SHDN
CS
CONVST
RD
WR
DIFF
A2
A1
A0
UNI/BIP
PGA
M0
OVDD
CH6
CH7
COM
REFOUT
REFIN
REFCOMP
2.5V
REFERENCE
REF AMP
12-BIT
1.25Msps ADC
DATA
LATCHES
OUTPUT
DRIVERS
BUSY
DIFFOUT/S6
A2OUT/S5
A1OUT/S4
A0OUT/S3
D11/S2
D10/S1
D9/S0
D8
D7
D6
D5
D4
D3
D2
D1
D0
Integral Linearity, LTC1851
1.00
INL COC ERROR (LSBs)
LTC1851
CH0
0.50
0.00
–0.50
–1.00
0
512 1024 1536 2048 2560 3072 3584 4096
CODE
LTC1850/51 G01
OGND
1851 BD
18501f
1
LTC1850/LTC1851
W W
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AXI U
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ABSOLUTE
RATI GS
OVDD = VDD (Notes 1, 2)
Supply Voltage (VDD) ................................................. 6V
Analog Input Voltage (Note 3) ..... – 0.3V to (VDD + 0.3V)
Digital Input Voltage (Note 4) ....................– 0.3V to 10V
Digital Output Voltage .................. – 0.3V to (VDD + 0.3V)
Power Dissipation .............................................. 500mW
Ambient Operating Temperature Range
LTC1850C/LTC1851C ............................ 0°C to 70°C
LTC1850I/LTC1851I .......................... – 40°C to 85°C
Storage Temperature Range ................. – 65°C to 150°C
Lead Temperature (Soldering, 10 sec)................ 300°C
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PACKAGE/ORDER I FOR ATIO
TOP VIEW
CH0
1
48 M1
CH1
2
47 SHDN
CH2
3
46 CS
CH3
4
45 CONVST
CH4
5
44 RD
CH5
6
43 WR
CH6
7
42 DIFF
CH7
8
COM
9
REFOUT 10
REFIN 11
REFCOMP 12
ORDER PART
NUMBER
TOP VIEW
CH0
1
48 M1
CH1
2
47 SHDN
CH2
3
46 CS
CH3
4
45 CONVST
CH4
5
44 RD
CH5
6
43 WR
CH6
7
42 DIFF
41 A2
CH7
8
41 A2
40 A1
COM
9
40 A1
39 A0
REFOUT 10
39 A0
LTC1850CFW
LTC1850IFW
38 UNI/BIP
37 PGA
REFIN 11
REFCOMP 12
LTC1851CFW
LTC1851IFW
38 UNI/BIP
37 PGA
GND 13
36 M0
GND 13
36 M0
VDD 14
35 OVDD
VDD 14
35 OVDD
VDD 15
34 OGND
VDD 15
34 OGND
GND 16
33 BUSY
GND 16
33 BUSY
DIFFOUT/S6 17
32 NC
DIFFOUT/S6 17
32 D0
A2OUT/S5 18
31 NC
A2OUT/S5 18
31 D1
A1OUT/S4 19
30 D0
A1OUT/S4 19
30 D2
A0OUT/S3 20
29 D1
A0OUT/S3 20
29 D3
D9/S2 21
28 D2
D11/S2 21
28 D4
D8/S1 22
27 D3
D10/S1 22
27 D5
D7/S0 23
26 D4
D9/S0 23
26 D6
D6 24
25 D5
D8 24
25 D7
FW PACKAGE
48-LEAD PLASTIC TSSOP
TJMAX = 150°C, θJA = 110°C/W
ORDER PART
NUMBER
FW PACKAGE
48-LEAD PLASTIC TSSOP
TJMAX = 150°C, θJA = 110°C/W
Consult LTC Marketing for parts specified with wider operating temperature ranges.
18501f
2
LTC1850/LTC1851
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CO VERTER CHARACTERISTICS
The ● denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. (Notes 5, 6)
PARAMETER
CONDITIONS
MIN
Resolution (No Missing Codes)
Integral Linearity Error
●
(Note 7)
Differential Linearity Error
Offset Error (Bipolar and Unipolar)
Gain = 1 (PGA = 1)
Gain = 1 (PGA = 1)
Gain = 2 (PGA = 0)
(Note 8)
REFCOMP ≥ 2V
REFCOMP ≥ 2V
LTC1850
LTC1851
TYP
MAX MIN
TYP
MAX
10
12
±0.25
± 0.5
±0.35
±1
LSB
●
±0.25
±0.5
±0.25
±1
LSB
●
●
±0.5
±1
±2
±2
±4
±1
±2
±5
±7
±10
LSB
LSB
LSB
±0.5
±1
LSB
±2
±4
±6
±10
LSB
LSB
±0.5
±1
LSB
±2
±4
±6
±10
LSB
LSB
±0.5
±1
LSB
With External 4.096V Reference
Applied to REFCOMP (Note 12)
Unipolar Gain Error Match
Bipolar Gain Error
Gain = 1 (PGA = 1)
Gain = 2 (PGA = 0)
Bits
●
Offset Error Match
Unipolar Gain Error
Gain = 1 (PGA = 1)
Gain = 2 (PGA = 0)
UNITS
With External 4.096V Reference
Applied to REFCOMP (Note 12)
Bipolar Gain Error Match
Full-Scale Error Temperature Coefficient
15
15
ppm/°C
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A ALOG I PUT The ● denotes the specifications which apply over the full operating temperature range, otherwise
specifications are at TA = 25°C. (Note 5)
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
VIN
Analog Input Range (Note 9)
Unipolar, Gain = 1 (PGA = 1)
Unipolar, Gain = 2 (PGA = 0)
Bipolar, Gain = 1 (PGA = 1)
Bipolar, Gain = 2 (PGA = 0)
4.75V ≤ VDD ≤ 5.25V
IIN
Analog Input Leakage Current
VIN > 0V < VDD, All Channels
CIN
Analog Input Capacitance
Between Conversions (Gain = 1)
Between Conversions (Gain = 2)
During Conversions
tACQ
Sample-and-Hold Acquisition Time
●
50
150
ns
tS(MUX)
Multiplexer Settling Time (Includes tACQ)
●
50
150
ns
tAP
Sample-and-Hold Aperture Delay Time
tjitter
Sample-and-Hold Aperture Delay Time Jitter
CMRR
Analog Input Common Mode Rejection Ratio
0 – REFCOMP
0 – REFCOMP/2
±REFCOMP/2
±REFCOMP/4
15
25
5
– 0.5
0V < (AIN – = AIN +) < 5V
V
V
V
V
±1
●
UNITS
µA
pF
pF
pF
ns
2
psRMS
60
dB
18501f
3
LTC1850/LTC1851
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DY A IC ACCURACY
(Note 5)
SYMBOL
PARAMETER
CONDITIONS
SNR
Signal-to-Noise Ratio
Unipolar, PGA = 0
Unipolar, PGA = 1
Bipolar, PGA = 0
Bipolar, PGA = 1
47kHz Input Signal
Signal-to-(Noise + Distortion) Ratio
Unipolar, PGA = 0
Unipolar, PGA = 1
Bipolar, PGA = 0
Bipolar, PGA = 1
47kHz Input Signal
Total Harmonic Distortion
Unipolar, PGA = 0
Unipolar, PGA = 1
Bipolar, PGA = 0
Bipolar, PGA = 1
47kHz Input Signal,
First 5 Harmonics
Spurious-Free Dynamic Range
Unipolar, PGA = 0
Unipolar, PGA = 1
Bipolar, PGA = 0
Bipolar, PGA = 1
47kHz Input Signal
S/(N+D)
THD
SFDR
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I TER AL REFERE CE
MIN
LTC1850
TYP
MAX
LTC1851
TYP
MAX
MIN
UNITS
61.6
61.7
61.6
61.7
71
72
71
72
dB
dB
dB
dB
61.0
61.0
61.0
61.2
70
71
71
72
dB
dB
dB
dB
–76
–78
–81
–80
–80
–82
–87
–86
dB
dB
dB
dB
74
80
84
82
82
86
90
88
dB
dB
dB
dB
TA = 25°C. (Notes 5, 6)
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
REFOUT Output Voltage
IOUT = 0
2.48
2.50
2.52
V
REFOUT Output Temperature Coefficient
IOUT = 0
±15
REFOUT Line Regulation
ppm/°C
0.01
LSB/V
Reference Buffer Gain
VREFCOMP/VREFIN
1.636
1.638
1.640
V/V
REFCOMP Output Voltage
External 2.5V Reference
Internal 2.5V Reference
4.090
4.060
4.096
4.096
4.100
4.132
V
V
REFCOMP Impedance
REFIN = VDD
6.4
kΩ
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DIGITAL I PUTS A D DIGITAL OUTPUTS
The ● denotes the specifications which apply over the
full operating temperature range, otherwise specifications are at TA = 25°C. (Note 5)
SYMBOL
PARAMETER
VIH
High Level Input Voltage
VDD = 5.25V
●
VIL
Low Level Input Voltage
VDD = 4.75V
IIN
Digital Input Current
VIN = 0V to VDD
CIN
Digital Input Capacitance
VOH
High Level Output Voltage
VOL
Low Level Output Voltage
CONDITIONS
MIN
MAX
UNITS
●
0.8
V
●
±5
µA
VDD = 4.75V, IO = –10µA
VDD = 4.75V, IO = – 200µA
●
VDD = 4.75V, IO = 160µA
VDD = 4.75V, IO = 1.6mA
●
TYP
2.4
V
2
pF
4.5
V
V
4.0
0.05
0.10
IOZ
Hi-Z Output Leakage D11 to D0, ADOUT, A1OUT, A2OUT, DIFFOUT VOUT = 0V to VDD, CS High
●
COZ
Hi-Z Capacitance D11 to D0, ADOUT, A1OUT, A2OUT, DIFFOUT
CS High (Note 9)
●
ISOURCE
Output Source Current
VOUT = 0V
– 20
ISINK
Output Sink Current
VOUT = VDD
30
0.4
V
V
±10
µA
15
pF
mA
mA
18501f
4
LTC1850/LTC1851
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POWER REQUIRE E TS
The ● denotes the specifications which apply over the full operating temperature
range, otherwise specifications are at TA = 25°C. (Note 5)
SYMBOL
PARAMETER
CONDITIONS
MAX
UNITS
VDD
Positive Supply Voltage
(Note 10)
●
4.75
MIN
TYP
5.25
V
OVDD
Output Positive Supply Voltage
(Note 10)
●
2.7
5.25
V
IDD
Positive Supply Current
VDD = VDD = OVDD = 5V,
fSAMPLE = 1.25MHz
●
8
10
mA
PDISS
Power Dissipation
●
40
50
mW
Power Down Positive Supply Current
Nap Mode
Sleep Mode
SHDN = 0V, CS = 0V
SHDN = 0V, CS = 5V
1
50
mA
µA
Power Down Power Dissipation
Nap Mode
Sleep Mode
SHDN = 0V, CS = 0V
SHDN = 0V, CS = 5V
5
0.25
mW
mW
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TI I G CHARACTERISTICS
The ● denotes the specifications which apply over the full operating temperature
range, otherwise specifications are at TA = 25°C. (Note 5)
SYMBOL
PARAMETER
fSAMPLE(MAX)
Maximum Sampling Frequency
Acquisition + Conversion
CONDITIONS
●
●
MIN
MAX
UNITS
800
MHz
ns
tCONV
Conversion Time
tACQ
Acquisition Time
●
650
ns
●
150
ns
t1
CS to RD Setup Time
(Notes 9, 10)
●
0
t2
CS to CONVST Setup Time
(Notes 9, 10)
●
10
t3
CS to SHDN Setup Time
(Notes 9, 10)
200
ns
t4
SHDN to CONVST Wake-Up Time
Nap Mode (Note 10)
Sleep Mode, 10µF REFCOMP
Bypass Capacitor (Note 10)
200
10
ns
ms
t5
CONVST Low Time
(Notes 10, 11)
t6
CONVST to BUSY Delay
CL = 25pF
●
TYP
1.25
ns
ns
50
ns
10
60
●
t7
Data Ready Before BUSY
●
t8
Delay Between Conversions
t9
Wait Time RD After BUSY
t10
Data Access Time After RD
(Note 10)
20
15
35
50
ns
●
–5
ns
CL = 25pF
CL = 100pF
20
35
45
ns
ns
25
45
60
ns
ns
10
30
35
40
ns
ns
ns
●
BUS Relinquish Time
0°C to 70°C
– 40°C to 85°C
t12
RD Low Time
t13
CONVST High Time
t14
Latch Setup Time
t15
Latch Hold Time
t16
WR Low Time
ns
ns
●
●
t11
ns
ns
●
●
●
t10
ns
(Note 10)
●
50
ns
(Notes 9, 10)
●
10
ns
(Notes 9, 10)
●
10
ns
(Note 10)
●
50
ns
18501f
5
LTC1850/LTC1851
WU
TI I G CHARACTERISTICS
The ● denotes the specifications which apply over the full operating temperature
range, otherwise specifications are at TA = 25°C. (Note 5)
SYMBOL
PARAMETER
CONDITIONS
t17
WR High Time
(Note 10)
●
50
ns
t18
M1 to M0 Setup Time
(Notes 9, 10)
●
10
ns
t19
M0 to BUSY Delay
M1 High
t20
M0 to WR (or RD) Setup Time
(Notes 9, 10)
●
t19
ns
t21
M0 High Pulse Width
(Note 10)
●
50
ns
t22
RD High Time Between Readback Reads
(Note 10)
●
50
ns
t23
Last WR (or RD) to M0
(Note 10)
●
10
ns
t24
M0 to RD Setup Time
(Notes 9, 10)
●
t19
ns
t25
M0 to CONVST
(Note 10)
●
t19
ns
t26
Aperture Delay
– 0.5
t27
Aperture Jitter
2
Note 1: Absolute maximum ratings are those values beyond which the life
of a device may be impaired.
Note 2: All voltage values are with respect to ground with GND, OGND and
GND wired together unless otherwise noted.
Note 3: When these pin voltages are taken below ground or above VDD,
they will be clamped by internal diodes. This product can handle input
currents of 100mA below ground or above VDD without latchup.
Note 4: When these pin voltages are taken below ground, they will be
clamped by internal diodes. This product can handle input currents of
100mA below ground without latchup. These pins are not clamped to VDD.
Note 5: VDD = 4.75V to 5.25V, fSAMPLE = 1.25MHz, tr = tf = 2ns unless
otherwise specified.
Note 6: Linearity, offset and full-scale specifications apply for a singleended input on any channel with COM grounded.
MIN
TYP
20
MAX
UNITS
ns
ns
psRMS
Note 7: Integral nonlinearity is defined as the deviation of a code from a
straight line passing through the actual end points of the transfer curve.
The deviation is measured from the center of the quantization band.
Note 8: Bipolar offset is the offset voltage measured from – 0.5LSB when
the output code flickers between 0111 1111 1111 and 1000 0000 0000 for
LTC1851 and between 01 1111 1111 and 10 0000 0000 for LTC1850.
Note 9: Guaranteed by design, not subject to test.
Note 10: Recommended operating conditions.
Note 11: The falling CONVST edge starts a conversion. If CONVST returns
high at a critical point during the conversion it can create small errors. For
the best results, ensure that CONVST returns high either within 400ns
after the start of the conversion or after BUSY rises.
Note 12: The analog input range is determined by the voltage on
REFCOMP. The gain error specification is tested with an external 4.096V
but is valid for any value of REFCOMP.
18501f
6
LTC1850/LTC1851
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TYPICAL PERFOR A CE CHARACTERISTICS
Typical DNL, PGA =1, LTC1851
1.00
0.50
0.50
0.50
0.00
–0.50
DNL EOC ERROR (LSBs)
1.00
0.00
–0.50
–1.00
–1.00
0
0
512 1024 1536 2048 2560 3072 3584 4096
CODE
512 1024 1536 2048 2560 3072 3584 4096
CODE
0.00
–0.50
–1.00
0
512 1024 1536 2048 2560 3072 3584 4096
CODE
LTC1850/51 G04
LTC1850/51 G01
LTC1850/51 G02
Nonaveraged 4096 Point FFT,
fIN = 47kHz, Bipolar Mode,
PGA = 0, LTC1851
Nonaveraged 4096 Point FFT,
fIN = 47kHz, Unipolar Mode,
PGA = 0, LTC1851
Typical INL, PGA = 0, LTC1851
1.00
0
0
SNR = 71.2dB
SFDR = 82.0dB
SINAD = 70.6dB
–20
SNR = 71.35dB
SFDR = 90.4dB
SINAD = 71.2dB
–20
0.00
AMPLITUDE (dB)
AMPLITUDE (dB)
0.50
–40
–60
–80
–0.50
–40
–60
–80
–100
–100
–1.00
512 1024 1536 2048 2560 3072 3584 4096
CODE
–110
0
100
500
200
300
400
FREQUENCY (kHz)
LTC1850/51 G07
Nonaveraged 4096 Point FFT,
fIN = 47kHz, Unipolar Mode,
PGA = 1, LTC1851
0
–120
0
100
200
300
400
FREQUENCY (kHz)
500
600
LTC1850/51 G05
Nonaveraged 4096 Point FFT,
fIN = 47kHz, Bipolar Mode,
PGA = 1, LTC1851
0
SNR = 72.3dB
SFDR = 87.3dB
SINAD = 71.4dB
–20
600
LTC1850/51 G03
–40
–60
–80
SNR = 72.3dB
SFDR = 89.3dB
SINAD = 72.1dB
–20
AMPLITUDE (dB)
0
AMPLITUDE (dB)
INL COC ERROR (LSBs)
Typical DNL, PGA = 0, LTC1851
1.00
DNL EOC ERROR (LSBs)
INL COC ERROR (LSBs)
Typical INL, PGA =1, LTC1851
–40
–60
–80
–100
–100
–110
0
100
200
300
400
FREQUENCY (kHz)
500
600
LTC1850/51 G06
–120
0
100
200
300
400
FREQUENCY (kHz)
500
600
LTC1850/51 G08
18501f
7
LTC1850/LTC1851
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TYPICAL PERFOR A CE CHARACTERISTICS
–50
–55
–55
–55
–60
–60
–60
–65
–65
–65
THD
–70
–75
–80
–85
3RD HARMONIC
–70
THD
–75
3RD HARMONIC
–80
–85
–90
2ND HARMONIC
–95
DISTORTION (dB)
–50
DISTORTION (dB)
DISTORTION (dB)
–50
–90
1000
100
FREQUENCY (kHz)
2ND HARMONIC
–80
3RD HARMONIC
–85
–100
10
10000
–75
–95
–100
10
THD
–70
–90
2ND HARMONIC
–95
–100
1000
100
FREQUENCY (kHz)
10000
10
185051 G19
80
80
–55
70
70
60
60
50
50
–60
CMRR (dB)
–70
2ND HARMONIC
–75
–80
–85
–90
3RD HARMONIC
–95
40
30
10
10
10000
1k
10k
100k
70
70
60
60
50
50
40
30
10
10
FREQUENCY (Hz)
LTC1850/51 G13
30
20
10M
10M
40
20
1M
1M
Input Common Mode Rejection Ratio
vs Frequency, Unipolar Mode,
PGA = 1
80
100k
100k
LTC1850/51 G11
CMRR (dB)
CMRR (dB)
10k
FREQUENCY (Hz)
80
10k
1k
FREQUENCY (Hz)
Input Common Mode Rejection
Ratio vs Frequency, Bipolar Mode,
PGA = 1
1k
0
10M
1M
185051 G20
0
30
20
0
1000
100
FREQUENCY (kHz)
40
20
–100
10
CMRR (dB)
–50
THD
10000
Input Common Mode Rejection
Ratio vs Frequency, Unipolar Mode,
PGA = 0
Input Common Mode Rejection
Ratio vs Frequency, Bipolar Mode,
PGA = 0
Distortion vs Input Frequency,
Unipolar Mode, PGA = 1
–65
1000
100
FREQUENCY (kHz)
185051 G10
185051 G09
DISTORTION (dB)
Distortion vs Input Frequency,
Unipolar Mode, PGA = 0
Distortion vs Input Frequency,
Bipolar Mode, PGA = 0
Distortion vs Input Frequency,
Bipolar Mode, PGA = 1
0
1k
10k
100k
1M
10M
FREQUENCY (Hz)
LTC1850/51 G14
LTC1850/51 G16
18501f
8
LTC1850/LTC1851
U W
TYPICAL PERFOR A CE CHARACTERISTICS
Channel-to-Channel Isolation
(Worst Pair), Unipolar Mode,
PGA = 0
110
110
100
100
90
ISOLATION (dB)
ISOLATION (dB)
Channel-to-Channel Isolation
(Worst Pair) Bipolar Mode,
PGA = 0
LIMIT OF MEASUREMENT
80
70
60
90
LIMIT OF MEASUREMENT
80
70
60
50
0
2M
4M
6M
8M
INPUT FREQUENCY (Hz)
50
10M
0
2M
4M
6M
8M
INPUT FREQUENCY (Hz)
LTC1850/51 G12
LTC1850/51 G15
Channel-to-Channel Isolation
(Worst Pair), Bipolar Mode,
PGA =1
Channel-to-Channel Isolation
(Worst Pair), Unipolar Mode,
PGA = 1
110
110
100
100
90
ISOLATION (dB)
ISOLATION (dB)
10M
LIMIT OF MEASUREMENT
80
70
90
LIMIT OF MEASUREMENT
80
70
60
60
50
50
0
2M
4M
6M
FREQUENCY (Hz)
8M
10M
LTC1850/51 G18
0
2M
4M
6M
8M
INPUT FREQUENCY (Hz)
10M
LTC1850/51 G17
18501f
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LTC1850/LTC1851
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PI FU CTIO S
CH0 to CH7 (Pins 1 to 8): Analog Input Pins. Input pins can
be used single ended relative to the analog input common
pin (COM) or differentially in pairs (CH0 and CH1, CH2 and
CH3, CH4 and CH5, CH6 and CH7).
COM (Pin 9): Analog Input Common Pin. For single-ended
operation (DIFF = 0), COM is the “–” analog input. COM is
disabled when DIFF is high.
REFOUT (Pin 10): Internal 2.5V Reference Output. Requires bypass to analog ground plane with 1µF.
REFIN (Pin 11): Reference Mode Select/Reference Buffer
Input. REFIN selects the Reference mode and acts as the
reference buffer Input. REFIN tied to ground will produce
2.048V on the REFCOMP pin. REFIN tied to the positive
supply disables the reference buffer to allow REFCOMP to
be driven externally. For voltages between 1V and 2.6V,
the reference buffer produces an output voltage on the
REFCOMP pin equal to 1.6384 times the voltage on REFIN
(4.096V on REFCOMP for a 2.5V input on REFIN).
REFCOMP (Pin 12): Reference Buffer Output. REFCOMP
sets the full-scale input span. The reference buffer produces an output voltage on the REFCOMP pin equal to
1.6384 times the voltage on the REFIN pin (4.096V on
REFCOMP for a 2.5V input on REFIN). REFIN tied to
ground will produce 2.048V on the REFCOMP pin.
REFCOMP can be driven externally if REFIN is tied to the
positive supply. Requires bypass to analog ground plane
with 10µF tantalum in parallel with 0.1µF ceramic or 10µF
ceramic.
GND (Pin 13): Ground. Tie to analog ground plane.
VDD (Pin 14): 5V Supply. Short to Pin 15.
VDD (Pin 15): 5V Supply. Bypass to GND with 10µF
tantalum in parallel with 0.1µF ceramic or 10µF ceramic.
GND (Pin 16): Ground for Internal Logic. Tie to analog
ground plane.
DIFFOUT/S6 (Pin 17): Three-State Digital Data Output.
Active when RD is low. Following a conversion, the singleended/differential bit of the present conversion is available
on this pin concurrent with the conversion result. In
Readback mode, the single-ended/differential bit of the
current sequencer location (S6) is available on this pin.
The output swings between OVDD and OGND.
A2OUT/S5, A1OUT/S4, A0OUT/S3 (Pins 18 to 20): ThreeState Digital MUX Address Outputs. Active when RD is
low. Following a conversion, the MUX address of the
present conversion is available on these pins concurrent
with the conversion result. In Readback mode, the MUX
address of the current sequencer location (S5-S3) is
available on these pins. The outputs swing between OVDD
and OGND.
D9/S2 (Pin 21, LTC1850): Three-State Digital Data Output. Active when RD is low. Following a conversion, bit 9
of the present conversion is available on this pin. In
Readback mode, the unipolar/bipolar bit of the current
sequencer location (S2) is available on this pin. The output
swings between OVDD and OGND.
D11/S2 (Pin 21, LTC1851): Three-State Digital Data Output. Active when RD is low. Following a conversion, bit 11
of the present conversion is available on this pin. In
Readback mode, the unipolar/bipolar bit of the current
sequencer location (S2) is available on this pin. The output
swings between OVDD and OGND.
D8/S1 (Pin 22, LTC1850): Three-State Digital Data Outputs. Active when RD is low. Following a conversion, bit 8
of the present conversion is available on this pin. In
Readback mode, the gain bit of the current sequencer
location (S1) is available on this pin. The output swings
between OVDD and OGND.
D10/S1 (Pin 22, LTC1851): Three-State Digital Data Outputs. Active when RD is low. Following a conversion, bit 10
of the present conversion is available on this pin. In
Readback mode, the gain bit of the current sequencer
location (S1) is available on this pin. The output swings
between OVDD and OGND.
D7/S0 (Pin 23, LTC1850): Three-State Digital Data Outputs. Active when RD is low. Following a conversion, bit 7
of the present conversion is available on this pin. In
Readback mode, the end of sequence bit of the current
sequencer location (S0) is available on this pin. The output
swings between OVDD and OGND.
18501f
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D9/S0 (Pin 23, LTC1851): Three-State Digital Data Outputs. Active when RD is low. Following a conversion, bit 9
of the present conversion is available on this pin. In
Readback mode, the end of sequence bit of the current
sequencer location (S0) is available on this pin. The output
swings between OVDD and OGND.
D6 to D0 (Pins 24 to 30, LTC1850): Three-State Digital
Data Outputs. Active when RD is low. The outputs swing
between OVDD and OGND.
D8 to D0 (Pins 24 to 32, LTC1851): Three-State Digital
Data Outputs. Active when RD is low. The outputs swing
between OVDD and OGND.
NC (Pins 31, 32, LTC1850): No Connect. There is no
internal connection to these pins.
BUSY (Pin 33): Converter Busy Output. The BUSY output
has two functions. At the start of a conversion, BUSY will
go low and remain low until the conversion is completed.
The rising edge may be used to latch the output data. BUSY
will also go low while the part is in Program/Readback
mode (M1 high, M0 low) and remain low until M0 is
brought back high. The output swings between OVDD and
OGND.
OGND (Pin 34): Digital Data Output Ground. Tie to analog
ground plane. May be tied to logic ground if desired.
OVDD (Pin 35): Digital Data Output Supply. Normally tied
to 5V, can be used to interface with 3V digital logic. Bypass
to OGND with 10µF tantalum in parallel with 0.1µF ceramic
or 10µF ceramic. See Table 5.
UNI/BIP (Pin 38): Unipolar/Bipolar Select Input. Logic low
selects a unipolar input span, a high logic level selects a
bipolar input span.
A0 to A2 (Pins 39 to 41): MUX Address Input Pins.
DIFF (Pin 42): Single-Ended/Differential Select Input. A
low logic level selects single-ended mode, a high logic
level selects differential mode.
WR (Pin 43): Write Input. In Direct Address mode, WR low
enables the MUX address and configuration input pins
(Pins 37 to 42). WR can be tied low or the rising edge of
WR can be used to latch the data. In Program mode, WR
is used to program the sequencer. WR low enables the
MUX address and configuration input pins (Pins 37 to 42).
The rising edge of WR latches the data and increments the
counter to the next sequencer location.
RD (Pin 44): Read Input. During normal operation, RD
enables the output drivers when CS is low. In Readback
mode (M1 high, M0 low), RD going low reads the current
sequencer location, RD high advances to the next sequencer
location.
CONVST (Pin 45): Conversion Start Input. This active low
signal starts a conversion on its falling edge.
CS (Pin 46): Chip Select Input. The chip select input must
be low for the ADC to recognize the CONVST and RD
inputs. If SHDN is low, a low logic level on CS selects Nap
mode; a high logic level on CS selects Sleep mode.
M0 (Pin 36): Mode Select Pin 0. Used in conjunction with
M1 to select operating mode. See Table 5
SHDN (Pin 47): Power Shutdown Input. A low logic level
will invoke the Shutdown mode selected by the CS pin. CS
low selects Nap mode, CS high selects Sleep mode. Tie
high if unused.
PGA (Pin 37): Gain Select Input. A high logic level selects
gain = 1, a low logic level selects gain = 2.
M1 (Pin 48): Mode Select Pin 1. Used in conjunction with
M0 to select operating mode.
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PIN
NAME
DESCRIPTION
MIN
NOMINAL (V)
TYP
MAX
ABSOLUTE MAXIMUM (V)
MIN
MAX
1 to 8
CH0 to CH7
Analog Inputs
0
VDD
– 0.3
VDD + 0.3
9
COM
Analog Input Common Pin
0
VDD
– 0.3
VDD + 0.3
10
REFOUT
2.5V Reference Output
– 0.3
VDD + 0.3
11
REFIN
Reference Buffer Input
12
REFCOMP
Reference Buffer Output
13
GND
Ground, Substrate Ground
14
VDD
Supply
4.75
5
15
VDD
Supply
4.75
5
16
GND
Ground
17
DIFFOUT/S6
Single-Ended/Differential Output
OGND
18
A2OUT/S5
MUX Address Output
OGND
19
A1OUT/S4
MUX Address Output
OGND
20
A0OUT/S3
MUX Address Output
21
D9/S2 (LTC1850)
Data Output
21
D11/S2 (LTC1851)
22
22
23
2.5
0
– 0.3
VDD + 0.3
4.096
2.5
VDD
– 0.3
VDD + 0.3
0
– 0.3
VDD + 0.3
5.25
– 0.3
6
5.25
– 0.3
6
–0.3
VDD + 0.3
OVDD
–0.3
VDD + 0.3
OVDD
–0.3
VDD + 0.3
OVDD
–0.3
VDD + 0.3
OGND
OVDD
–0.3
VDD + 0.3
OGND
OVDD
–0.3
VDD + 0.3
Data Output
OGND
OVDD
–0.3
VDD + 0.3
D8/S1 (LTC1850)
Data Output
OGND
OVDD
–0.3
VDD + 0.3
D10/S1 (LTC1851)
Data Output
OGND
OVDD
–0.3
VDD + 0.3
D7/S0 (LTC1850)
Data Output
OGND
OVDD
–0.3
VDD + 0.3
23
D9/S0 (LTC1851)
Data Output
OGND
OVDD
–0.3
VDD + 0.3
24 to 30
D6 to D0 (LTC1850)
Data Outputs
OGND
OVDD
–0.3
VDD + 0.3
24 to 32
D8 to D0 (LTC1851)
Data Outputs
OGND
OVDD
–0.3
VDD + 0.3
31 to 32
NC (LTC1850)
33
BUSY
Converter Busy Output
OGND
OVDD
–0.3
VDD + 0.3
34
OGND
Output Ground
– 0.3
VDD + 0.3
35
OVDD
Output Supply
5.25
– 0.3
6
36
M0
Mode Select Pin 0
0
VDD
– 0.3
10
37
PGA
Gain Select Input
0
VDD
– 0.3
10
0
0
2.7
5
38
UNI/BIP
Unipolar/Bipolar Input
0
VDD
– 0.3
10
39 to 41
A0 to A2
MUX Address Inputs
0
VDD
– 0.3
10
42
DIFF
Single-Ended/Differential Input
0
VDD
– 0.3
10
43
WR
Write Input, Active Low
0
VDD
– 0.3
10
44
RD
Read Input, Active Low
0
VDD
– 0.3
10
45
CONVST
Conversion Start Input, Active Low
0
VDD
– 0.3
10
46
CS
Chip Select Input, Active Low
0
VDD
– 0.3
10
47
SHDN
Shutdown Input, Active Low
0
VDD
– 0.3
10
48
M1
Mode Select Pin 1
0
VDD
– 0.3
10
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APPLICATIO S I FOR ATIO
The LTC1850/LTC1851 are complete and very flexible data
acquisition systems. They consist of a 10-bit/12-bit,
1.25Msps capacitive successive approximation A/D converter with a wideband sample-and-hold, a configurable
8-channel analog input multiplexer, an internal reference
and reference buffer amplifier, a 16-bit parallel digital
output and digital control logic including a programmable
sequencer.
CONVERSION DETAILS
The core analog-to-digital converter in the LTC1850/
LTC1851 uses a successive approximation algorithm and
an internal sample-and-hold circuit to convert an analog
signal to a 10-bit/12-bit parallel output. Conversion start
is controlled by the CS and CONVST inputs. At the start of
the conversion, the successive approximation register
(SAR) is reset. Once a conversion cycle is begun, it cannot
be restarted. During the conversion, the internal differential 10-bit/12-bit capacitive DAC output is sequenced by
the SAR from the most significant bit (MSB) to the least
significant bit (LSB). The outputs of the analog input
multiplexer are connected to the sample-and-hold capacitors (CSAMPLE) during the acquire phase and the
comparator offset is nulled by the zeroing switches. In
this acquire phase, a minimum delay of 150ns will provide
enough time for the sample-and-hold capacitors to acquire the analog signal. During the convert phase, the
comparator zeroing switches are open, putting the comparator into compare mode. The input switches connect
CSAMPLE to ground, transferring the differential analog
input charge onto the summing junction. This input
charge is successively compared with the binary weighted
charges supplied by the differential capacitive DAC. Bit
decisions are made by the high speed comparator. At the
end of the conversion, the differential DAC output balances the input charges. The SAR contents (a 10-bit/
12-bit data word), which represents the difference of the
analog input multiplexer outputs, and the 4-bit address
word are loaded into the 14-bit/16-bit output latches.
DYNAMIC PERFORMANCE
Signal-to-Noise Ratio
The signal-to-noise plus distortion ratio [S/(N + D)] is the
ratio between the RMS amplitude of the fundamental input
frequency and the RMS amplitude of all other frequency
components at the ADC output. The output is band limited
to frequencies above DC to below half the sampling
frequency. The effective number of bits (ENOBs) is a
measurement of the resolution of an ADC and is directly
related to the S/(N + D) by the equation:
ENOB = [S/(N + D) – 1.76]/6.02
where ENOB is the effective number of bits and S/(N + D)
is expressed in dB. At the maximum sampling rate of
1.25MHz, the LTC1850/LTC1851 maintain near ideal
ENOBs up to and beyond the Nyquist input frequency of
625kHz.
Total Harmonic Distortion
Total harmonic distortion is the ratio of the RMS sum of all
harmonics of the input signal to the fundamental itself. The
out-of-band harmonics alias into the frequency band
between DC and half the sampling frequency. THD is
expressed as:
THD = 20Log
V22 + V32 + V 42 + ...Vn2
V1
where V1 is the RMS amplitude of the fundamental frequency and V2 through Vn are the amplitudes of the
second through nth harmonics. The LTC1850/LTC1851
have good distortion performance up to the Nyquist frequency and beyond.
Intermodulation Distortion
If the ADC input signal consists of more than one spectral
component, the ADC transfer function nonlinearity can
produce intermodulation distortion (IMD) in addition to
THD. IMD is the change in one sinusoidal input caused by
the presence of another sinusoidal input at a different
frequency.
18501f
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APPLICATIO S I FOR ATIO
If two pure sine waves of frequencies fa and fb are applied
to the ADC input, nonlinearities in the ADC transfer function can create distortion products at the sum and difference frequencies of mfa ± nfb, where m and n = 0, 1, 2, 3,
etc. For example, the 2nd order IMD terms include (fa ± fb).
If the two input sine waves are equal in magnitude, the
value (in decibels) of the 2nd order IMD products can be
expressed by the following formula:
(
)
IMD fa ± fb = 20Log
(
Amplitude at fa ± fb
)
Amplitude at fa
Peak Harmonic or Spurious Noise
The peak harmonic or spurious noise is the largest spectral component excluding the input signal and DC. This
value is expressed in decibels relative to the RMS value of
a full-scale input signal.
Full-Power and Full-Linear Bandwidth
The full-power bandwidth is that input frequency at which
the amplitude of the reconstructed fundamental is
reduced by 3dB for a full-scale input signal.
The full-linear bandwidth is the input frequency at which
the S/(N + D) has dropped to 68dB for the LTC1851 (11
effective bits) or 56dB for the LTC1850 (9 effective bits).
The LTC1850/LTC1851 have been designed to optimize
input bandwidth, allowing the ADC to undersample input
signals with frequencies above the converter’s Nyquist
frequency. The noise floor stays very low at high frequencies; S/(N + D) becomes dominated by distortion at
frequencies far beyond Nyquist.
ANALOG INPUT MULTIPLEXER
The analog input multiplexer is controlled using the singleended/differential pin (DIFF), three MUX address pins (A2,
A1, A0), the unipolar/bipolar pin (UNI/BIP) and the gain
select pin (PGA). The single-ended/differential pin (DIFF)
allows the user to configure the MUX as eight singleended channels relative to the analog input common pin
(COM) when DIFF is low or as four differential pairs (CH0
and CH1, CH2 and CH3, CH4 and CH5, CH6 and CH7) when
DIFF is high. The channels (and polarity in the differential
case) are selected using the MUX address inputs as shown
in Table 1. Unused inputs (including the COM in the
differential case) should be grounded to prevent noise
coupling.
Table 1. Multiplexer Address Table
MUX ADDRESS
SINGLE-ENDED CHANNEL SELECTION
DIFF A2 A1 A0 CH0 CH1 CH2 CH3 CH4 CH5 CH6 CH7 COM
0
0
0
0
+
–
0
0
0
1
0
0
1
0
0
0
1
1
0
1
0
0
0
1
0
1
0
1
1
0
0
1
1
1
+
MUX ADDRESS
DIFFERENTIAL CHANNEL SELECTION
+
–
+
–
+
–
+
–
+
–
+
–
–
DIFF A2 A1 A0 CH0 CH1 CH2 CH3 CH4 CH5 CH6 CH7 COM
1
0
0
0
+
–
*
1
0
0
1
–
+
*
1
0
1
0
+
–
1
0
1
1
–
+
1
1
0
0
+
–
*
1
1
0
1
–
+
*
1
1
1
0
+
–
*
1
1
1
1
–
+
*
*
*
*Not used in differential mode. Connect to GND.
In addition to selecting the MUX channel, the LTC1850/
LTC1851 also allows the user to select between two gains
and unipolar or bipolar inputs for a total of four input
spans. PGA high selects a gain of 1 (the input span is equal
to the voltage on REFCOMP). PGA low selects a gain of 2
where the input span is equal to half of the voltage on
REFCOMP. UNI/BIP low selects a unipolar input span,
UNI/BIP high selects a bipolar input span. Table 2 summarizes the possible input spans.
18501f
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APPLICATIO S I FOR ATIO
Table 2. Input Span Table
INPUT SPAN
UNI/BIP
PGA
0
0
0 – REFCOMP/2
REFCOMP = 4.096V
0 – 2.048V
0
1
0 – REFCOMP
0 – 4.096V
1
0
±REFCOMP/4
±1.024V
1
1
±REFCOMP/2
±2.048V
It should be noted that the bipolar input span of the
LTC1850/LTC1851 does not allow negative inputs with
respect to ground. The LTC1850/LTC1851 have a unique
differential sample-and-hold circuit that allows rail-to-rail
inputs. The ADC will always convert the difference of the
“+” and “–” inputs independent of the common mode
voltage. The common mode rejection holds up to high
frequencies. The only requirement is that both inputs can
not exceed the VDD power supply voltage or ground. When
a bipolar input span is selected the “+” input can swing
±full scale relative to the “–” input but neither input can
exceed VDD or go below ground.
Integral nonlinearity errors (INL) and differential nonlinearity errors (DNL) are independent of the common mode
voltage, however, the bipolar zero error (BZE) will vary.
The change in BZE is typically less than 0.1% of the
common mode voltage.
Some AC applications may have their performance limited by distortion. The ADC and many other circuits exhibit
higher distortion when signals approach the supply or
ground. THD will degrade as the inputs approach either
power supply rail. Distortion can be reduced by reducing
the signal amplitude and keeping the common mode
voltage at approximately midsupply.
Driving the Analog Inputs
The inputs of the LTC1850/LTC1851 are easy to drive.
Each of the analog inputs can be used as a single-ended
input relative to the input common pin (CH0-COM, CH1COM, etc.) or in pairs (CH0 and CH1, CH2 and CH3, CH4
and CH5, CH6 and CH7) for differential inputs. Regardless
of the MUX configuration, the “+” and “–” inputs are
sampled at the same instant. Any unwanted signal that is
common mode to both inputs will be reduced by the
common mode rejection of the sample-and-hold circuit.
The inputs draw only one small current spike while charging the sample-and-hold capacitors at the end of conversion. During conversion, the analog inputs draw only a
small leakage current. If the source impedance of the
driving circuit is low, then the LTC1850/LTC1851 inputs
can be driven directly. As source impedance increases, so
will acquisition time. For minimum acquisition time with
high source impedance, a buffer amplifier should be used.
The only requirement is that the amplifier driving the
analog input(s) must settle after the small current spike
before the next conversion starts (settling time must be
150ns for full throughput rate).
Choosing an Input Amplifier
Choosing an input amplifier is easy if a few requirements
are taken into consideration. First, to limit the magnitude
of the voltage spike seen by the amplifier from charging
the sampling capacitor, choose an amplifier that has a low
output impedance (<100Ω) at the closed-loop bandwidth
frequency. For example, if an amplifier is used in a gain of
+1 and has a unity-gain bandwidth of 50MHz, then the
output impedance at 50MHz should be less than 100Ω.
The second requirement is that the closed-loop bandwidth
must be greater than 20MHz to ensure adequate smallsignal settling for full throughput rate. The following list is
a summary of the op amps that are suitable for driving the
LTC1850/LTC1851, more detailed information is available
in the Linear Technology Databooks, the LinearViewTM
CD-ROM and on our web site at www.linear-tech.com.
LT®1360: 50MHz Voltage Feedback Amplifier. ±2.5V to
±15V supplies. 5mA supply current. Low distortion.
LT1363: 70MHz Voltage Feedback Amplifier. ±2.5V to
±15V supplies. 7.5mA supply current. Low distortion.
LT1364/LT1365: Dual and Quad 70MHz Voltage Feedback
Amplifiers. ±2.5V to ±15V supplies. 7.5mA supply current
per amplifier. Low distortion.
LinearView is a trademark of Linear Technology Corporation.
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APPLICATIO S I FOR ATIO
LT1468/LT1469: Single and Dual 90MHz Voltage Feedback Amplifier. ±5V to ±15V supplies. 7mA supply current
per amplifier. Lowest noise and low distortion.
LT1630/LT1631: Dual and Quad 30MHz Rail-to-Rail Voltage Feedback Amplifiers. Single 3V to ±15V supplies.
3.5mA supply current per amplifier. Low noise and low
distortion.
LT1632/LT1633: Dual and Quad 45MHz Rail-to-Rail Voltage Feedback Amplifiers. Single 3V to ±15V supplies.
4.3mA supply current per amplifier. Low distortion.
LT1806/LT1807: Single and Dual 325MHz Rail-to-Rail
Voltage Feedback Amplifier. Single 3V to ±5V supplies.
13mA supply current. Lowest distortion.
LT1809/LT1810: Single and Dual 180MHz Rail-to-Rail
Voltage Feedback Amplifier. Single 3V to ±15V supplies.
20mA supply current. Lowest distortion.
LT1812/LT1813: 100MHz Voltage Feedback Amplifier.
Single 5V to ±5V supplies. 3.6mA supply current. Low
noise and low distortion.
Input Filtering
The noise and the distortion of the input amplifier and
other circuitry must be considered since they will add to
the LTC1850/LTC1851 noise and distortion. Noisy input
circuitry should be filtered prior to the analog inputs to
minimize noise. A simple 1-pole RC filter is sufficient for
many applications. For instance, a 100Ω source resistor
and a 1000pF capacitor to ground on the input will limit the
input bandwidth to 1.6MHz. The capacitor also acts as a
charge reservoir for the input sample-and-hold and isolates the ADC input from sampling glitch sensitive circuitry. High quality capacitors and resistors should be
used since these components can add distortion. NPO and
silver mica type dielectric capacitors have excellent linearity. Carbon surface mount resistors can also generate
distortion from self heating and from damage that may
occur during soldering. Metal film surface mount resistors
are much less susceptible to both problems.
REFERENCE
The LTC1850/LTC1851 include an on-chip, temperature
compensated, curvature corrected, bandgap reference
that is factory trimmed to 2.500V and has a very flexible
3-pin interface. REFOUT is the 2.5V bandgap output,
REFIN is the input to the reference buffer and REFCOMP
is the reference buffer output. REFOUT must be bypassed
with a 1µF or greater capacitor to ground for stability. The
input span is determined by the voltage appearing on the
REFCOMP pin as shown in Table 2. The reference buffer
has a gain of 1.6384 and is factory trimmed by forcing an
external 2.500V on the REFIN pin and trimming REFCOMP
to 4.096V. The 3-pin interface allows for three pinstrappable Reference modes as well as two additional
external Reference modes. For voltages on the REFIN pin
ranging from 1V to 2.6V, the output voltage on REFCOMP
will equal 1.6384 times the voltage on the REFIN pin. In
this mode, the REFIN pin can be tied to REFOUT to utilize
the internal 2.5V reference to get 4.096V on REFCOMP or
driven with an external reference or DAC. If REFIN is tied
low, the internal 2.5V reference divided by 2 (1.25V) is
connected internally to the input of the reference buffer
resulting in 2.048V on REFCOMP. If REFIN is tied high, the
reference buffer is disabled and REFCOMP can be tied to
REFOUT to achieve a 2.5V span or driven with an external
reference or DAC. Table 3 summarizes the Reference
modes.
Table 3. Reference Mode Table
MODE
REFIN
REFCOMP
REFIN Tied Low
= GND
2.048V Output
1V to 2.6V Input
1.6384V to 4.26V Output
(1.6384 • REFIN)
= VDD
Input, 6.4kΩ to Ground
REFIN is Buffer Input
REFIN Tied High
Full Scale and Offset
In applications where absolute accuracy is important,
offset and full-scale errors can be adjusted to zero during
a calibration sequence. Offset error must be adjusted
before full-scale error. Zero offset is achieved by adjusting
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the offset applied to the “–” input. For single-ended inputs,
this offset should be applied to the COM pin. For differential inputs, the “–” input is dictated by the MUX address.
For zero offset error, apply 0.5LSB (actual voltage will vary
with input span selected) to the “+” input and adjust the
offset at the “–” input until the output code flickers
between 0000 0000 0000 and 0000 0000 0001 for the
LTC1851 and between 00 0000 0000 and 00 0000 0001 for
the LTC1850.
OUTPUT DATA FORMAT
As mentioned earlier, the internal reference is factory
trimmed to 2.500V. To make sure that the reference buffer
gain is not compensating for trim errors in the reference,
REFCOMP is trimmed to 4.096V with an accurate external
2.5V reference applied to REFIN. Likewise, to make sure
that the full-scale gain trim is not compensating for errors
in the reference buffer gain, the input full-scale gain is
trimmed with an accurate 4.096V reference applied to
REFCOMP (REFIN = 5V to disable the reference buffer).
This allows the use of either a 2.5V reference applied to
REFIN or a 4.096V reference applied to REFCOMP to
achieve accurate results. Full-scale errors can be trimmed
to zero by adjusting the appropriate reference voltage. For
unipolar inputs, an input voltage of FS – 1.5LSBs should
be applied to the “+” input and the appropriate reference
adjusted until the output code flickers between 1111 1111
1110 and 1111 1111 1111 for the LTC1851 and between
11 1111 1110 and 11 1111 1111 for the LTC1850.
The data format of the conversion result is automatically
selected and determined by the UNI/BIP input pin. If the
UNI/BIP pin is low indicating a unipolar input span
(0 – REFCOMP assuming PGA = 1), the format for the
data is straight binary with 1 LSB = FS/4096 (1mV for
REFCOMP = 4.096V) for the LTC1851 and 1LSB = FS/
1024 (4mV for REFCOMP = 4.096V) for the LTC1850.
For bipolar inputs, an input voltage of FS – 1.5LSBs should
be applied to the “+” input and the appropriate reference
adjusted until the output code flickers between 0111 1111
1110 and 0111 1111 1111 for the LTC1851 and between
01 1111 1110 and 01 1111 1111 for the LTC1850.
These adjustments as well as the factory trims affect all
channels. The channel-to-channel offset and gain error
matching are guaranteed by design to meet the specifications in the Converter Characteristics table.
The LTC1850/LTC1851 have a 14-bit/16-bit parallel output. The output word normally consists of a 10-bit/12-bit
conversion result data word and a 4-bit address (three
address bits A2OUT, A1OUT, A0OUT and the DIFFOUT bit).
The output drivers are enabled when RD is low provided
the chip is selected (CS is low). All 14/16 data output pins
and BUSY are supplied by OVDD and OGND to allow easy
interface to 3V or 5V digital logic.
If the UNI/BIP pin is high indicating a bipolar input span
(±REFCOMP/2 for PGA = 1), the format for the data is
two’s complement binary with 1 LSB = [(+FS) – (– FS)]/
4096 (1mV for REFCOMP = 4.096V) for the LTC1851 and
1LSB = [(+FS) – (– FS)]/1024 (4mV for REFCOMP =
4.096V) for the LTC1850.
In both cases, the code transitions occur midway between
successive integer LSB values (i.e., – FS + 0.5LSB,
– FS + 1.5LSB, ... – 1.5LSB, – 0.5LSB, 0.5LSB, 1.5LSB, ...
FS – 1.5LSB, FS – 0.5LSB).
The three most significant bits of the data word (D11,
D10, and D9 for the LTC1851; D9, D8 and D7 for the
LTC1850) also function as output bits when reading the
contents of the programmable sequencer. During
readback, a 7-bit status word (S6-S0) containing the
contents of the current sequencer location is available
when RD is low. The individual bits of the status word are
outlined in Figure 1. During readback, the D8 to D0 pins
(LTC1851) or D6 to D0 pins (LTC1850) remain high
impedance irrespective of the state of RD.
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as free of breaks and holes as possible, such that a low
impedance path between all ADC grounds and all ADC
decoupling capacitors is provided. It is critical to prevent
digital noise from being coupled to the analog inputs,
reference or analog power supply lines. Layout for the
printed circuit board should ensure that digital and analog
signal lines are separated as much as possible. In particular, care should be taken not to run any digital track
alongside an analog signal track or underneath the ADC.
Unipolar Transfer Characteristic
(UNI/BIP = 0)
1111...1111
1111...1110
OUTPUT CODE
1111...1101
1000...0001
1000...0000
0111...1111
0111...1110
0000...0010
0000...0001
0000...0000
An analog ground plane separate from the logic system
ground should be established under and around the ADC.
Pin 34 (OGND), Pin 13 (GND), Pin 16 (ADC’s GND) and all
other analog grounds should be connected to this single
analog ground point. The bypass capacitors should also
be connected to this analog ground plane. No other digital
grounds should be connected to this analog ground plane.
In some applications, it may be desirable to connect the
OVDD to the logic system supply and OGND to the logic
system ground. In these cases, OVDD should be bypassed
to OGND instead of the analog ground plane.
FS = VREFCOMP
0
FS – 1LSB
INPUT VOLTAGE (V)
1851 F01A
Bipolar Transfer Characteristic
(UNI/BIP = 1)
0111...1111
0111...1110
BIPOLAR
ZERO
OUTPUT CODE
0111...1101
0000...0001
0000...0000
1111...1111
1111...1110
1000...0010
1000...0001
V
FS = REFCOMP
2
1000...0000
– FS
–1LSB 0 1LSB
INPUT VOLTAGE (V)
FS – 1LSB
1851 F01B
S6
S5
S4
S3
S2
A1
A2
A0
MUX ADDRESS
SINGLE-ENDED/
DIFFERENTIAL BIT
S1
S0
PGA BIT
END OF
UNIPOLAR/
BIPOLAR BIT SEQUENCE BIT
1851 F01
Figure 1. Readback Status Word
BOARD LAYOUT AND BYPASSING
To obtain the best performance from the LTC1850/
LTC1851, a printed circuit board with ground plane is
required. The ground plane under the ADC area should be
Low impedance analog and digital power supply common
returns are essential to the low noise operation of the ADC
and the foil width for these tracks should be as wide as
possible. In applications where the ADC data outputs and
control signals are connected to a continuously active
microprocessor bus, it is possible to get errors in the
conversion results. These errors are due to feedthrough
from the microprocessor to the successive approximation
comparator. The problem can be eliminated by forcing the
microprocessor into a WAIT state during conversions or
by using three-state buffers to isolate the ADC bus. The
traces connecting the pins and bypass capacitors must be
kept short and should be made as wide as possible.
The LTC1850/LTC1851 have differential inputs to minimize noise coupling. Common mode noise on the “+” and
“–” inputs will be rejected by the input CMRR. The LTC1850/
LTC1851 will hold and convert the difference between
whichever input is selected as the “+” input and whichever
input is selected as the “–” input. Leads to the inputs
should be kept as short as possible.
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SUPPLY BYPASSING
CS
High quality, low series resistance ceramic 10µF bypass
capacitors should be used. Surface mount ceramic capacitors provide excellent bypassing in a small board
space. Alternatively, 10µF tantalum capacitors in parallel
with 0.1µF ceramic capacitors can be used. Bypass capacitors must be located as close to the pins as possible.
The traces connecting the pins and the bypass capacitors
must be kept short and should be made as wide as
possible.
DIGITAL INTERFACE
Internal Clock
The A/D converter has an internal clock that eliminates the
need of synchronization between the external clock and
the CS and RD signals found in other ADCs. The internal
clock is factory trimmed to achieve a typical conversion
time of 550ns, and a maximum conversion time over the
full operating temperature range of 650ns. No external
adjustments are required. The guaranteed maximum acquisition time is 150ns. In addition, a throughput time of
800ns and a minimum sampling rate of 1.25Msps is
guaranteed.
CS
t3
t2
CONVST
t1
RD
1851 F04
Figure 4. CS to CONVST Setup Timing
Power Shutdown
The LTC1850/LTC1851 provide two power shutdown
modes, Nap and Sleep, to save power during inactive
periods. The Nap mode reduces the power to 5mW and
leaves only the digital logic and reference powered up. The
wake-up time from Nap to active is 200ns. In Sleep mode,
all bias currents are shut down and only leakage current
remains—about 50µA. Wake-up time from sleep mode is
much slower since the reference circuit must power-up
and settle to 0.005% for full 12-bit accuracy (0.02% for full
10-bit accuracy). Sleep mode wake-up time is dependent
on the value of the capacitor connected to the REFCOMP
(Pin 12). The wake-up time is 10ms with the recommended 10µF capacitor.
Shutdown is controlled by Pin 47 (SHDN); the ADC is in
shutdown when it is low. The shutdown mode is selected
with Pin 46 (CS); low selects Nap.
Timing and Control
SHDN
1851 F02
Figure 2. CS to SHDN Timing
SHDN
t4
CONVST
1851 F03
Figure 3. SHDN to CONVST Wake-Up Timing
Conversion start and data read operations are controlled
by three digital inputs: CONVST, CS and RD. A transition
from 1 to 0 applied to the CONVST pin will start a
conversion after the ADC has been selected (i.e., CS is
low). Once initiated, it cannot be restarted until the conversion is complete. Converter status is indicated by the
BUSY output. BUSY is low during a conversion. If CONVST
returns high at a critical point during the conversion it can
create small errors. For the best results, ensure that
CONVST returns high either within 400ns after the start of
the conversion or after BUSY rises.
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Figures 5 through 9 show several different modes of
operation. In modes 1a and 1b (Figures 5 and 6),
CS and RD are both tied low. The falling edge of
CONVST starts the conversion. The data outputs are
always enabled and data can be latched with the
BUSY rising edge. Mode 1a shows operation with a narrow
logic low CONVST pulse. Mode 1b shows a narrow logic
high CONVST pulse.
In mode 2 (Figure 7), CS is tied low. The falling edge of
CONVST signal again starts the conversion. Data outputs
are in three-state until read by the MPU with the
RD signal. Mode 2 can be used for operation with a shared
MPU databus.
In slow memory and ROM modes (Figures 8 and 9), CS is
tied low and CONVST and RD are tied together. The MPU
starts the conversion and reads the output with the RD
signal. Conversions are started by the MPU or DSP (no
external sample clock).
tCONV
CS = RD = LOW
t5
CONVST
t6
t8
BUSY
t7
DATA
DATA (N – 1)
DATA N
1851 F05
Figure 5. Mode 1a CONVST Starts a Conversion. Data Outputs Always Enabled
t8
tCONV
t5
CS = RD = LOW
t13
CONVST
t6
t6
BUSY
t7
DATA
DATA (N – 1)
DATA N
1851 F06
Figure 6. Mode 1b CONVST Starts a Conversion. Data is Read by RD
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tCONV
CS = LOW
t5
t8
CONVST
t13
t6
BUSY
t9
t12
RD
t10
DATA
t11
DATA N
1851 F07
Figure 7. Mode 2 CONVST Starts a Conversion. Data is Read by RD
tCONV
CS = LOW
t8
RD = CONVST
t11
t6
BUSY
t10
DATA
t7
DATA (N – 1)
DATA N
DATA N
DATA (N + 1)
1851 F08
Figure 8. Slow Memory Mode Timing
tCONV
CS = LOW
t8
RD = CONVST
t6
t11
BUSY
t10
DATA
DATA (N – 1)
DATA N
1851 F09
Figure 9. ROM Mode Timing
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In slow memory mode, the processor applies a logic low
to RD ( = CONVST), starting the conversion. BUSY goes
low, forcing the processor into a Wait state. The previous
conversion result appears on the data outputs. When the
conversion is complete, the new conversion results appear on the data outputs; BUSY goes high releasing the
processor, and the processor takes RD ( = CONVST) back
high and reads the new conversion data.
In ROM mode, the processor takes RD ( = CONVST) low,
starting a conversion and reading the previous conversion
result. After the conversion is complete, the processor can
read the new result and initiate another conversion.
MODES OF OPERATION
Direct Address Mode
The simplest mode of operation is the Direct Address
mode. This mode is selected when both the M1 and M0
pins are low. In this mode, the address input pins directly
control the MUX and the configuration input pins directly
control the input span. The address and configuration
input pins are enabled when WR is low. WR can be tied low
if the pins will be constantly driven or the rising edge of WR
can be used to latch and hold the inputs for as long as WR
is held high.
CH4-COM, CH5-COM, CH6-COM, CH7-COM, repeat). At
the maximum conversion rate the throughput rate for each
channel would be 1.25Msps/8 or 156.25ksps. If DIFF is
held high, the scan pattern will consist of four differential
pairs (CH0-CH1, CH2-CH3, CH4-CH5, CH6-CH7, repeat).
At the maximum conversion rate, the throughput rate for
each pair would be 1.25Msps/4 or 312.5ksps. It is possible to drive the DIFF input pin while the part is in Scan
mode to achieve combinations of single-ended and differential inputs. For instance, if the A0OUT pin is tied to the
DIFF input pin, the scan pattern will consist of four singleended inputs and two differential pairs (CH0-COM singleended, CH1-COM single-ended, CH2-CH3 differential,
CH4-COM single-ended, CH5-COM single-ended, CH6CH7 differential, repeat).
The scan counter is reset to zero whenever the M0 pin
changes state so that the first conversion after M0 rises
will be MUX Address 000 (CH0-COM single-ended or CH0CH1 differential depending on the state of the DIFF pin). A
conversion is initiated by the falling edge of CONVST. After
each conversion, the address counter is advanced (by one
if DIFF is low, by two if DIFF is high) and the MUX address
for the present conversion is available on the address
output pins (DIFFOUT, A2OUT to A0OUT) along with the
conversion result.
Program/Readback Mode
Scan Mode
Scan mode is selected when M1 is low and M0 is high. This
mode allows the converter to scan through all of the input
channels sequentially and repeatedly without the user
having to provide an address. The address input pins (A2
to A0) are ignored but the DIFF, PGA and UNI/BIP pins are
still enabled when WR is low. As in the direct address
mode, WR can be held low or the rising edge of WR can be
used to latch and hold the information on these pins for as
long as WR is held high. The DIFF pin selects the scan
pattern. If DIFF is held low, the scan pattern will consist of
all eight channels in succession, single-ended relative to
COM (CH0-COM, CH1-COM, CH2-COM, CH3-COM,
The LTC1850/LTC1851 include a sequencer that can be
programmed to run a sequence of up to 16 locations
containing a MUX address and input configuration. The
MUX address and input configuration for each location are
programmed using the DIFF, A2 to A0, UNI/BIP and PGA
pins and are stored in memory along with an end-ofsequence (EOS) bit that is generated automatically. The
six input address and configuration bits plus the EOS bit
can be read back by accessing the 7-bit readback status
word (S6-S0) through the data output pins. The sequencer
memory is a 16 × 7 block of memory represented by the
block diagram in Figure 10.
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S6
DIFF
S5
A2
S4
A1
S3
A0
S2
UNI/BIP
S1
PGA
S0
EOS
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
LOCATION 0000
LOCATION 0001
LOCATION 0010
LOCATION 1110
LOCATION 1111
1851 F10
Figure 10. Sequencer Memory Block Diagram
The sequencer is accessed by taking the M1 mode pin
high. With M1 high, the sequencer memory is accessed by
taking the M0 mode pin low. This will cause BUSY to go
low, disabling conversions during the programming and
readback of the sequencer. The sequencer is reset to
location 0000 whenever M1 or M0 changes state. One of
these signals should be cycled prior to any read or write
operation to guarantee that the sequencer will be programmed or read starting at location 0000.
The sequencer is programmed sequentially starting from
location 0000. RD and WR should be held high, the
appropriate signals applied to the DIFF pin, the A2 to A0
MUX address pins, the UNI/BIP pin and the PGA pin and
WR taken low to write to the memory. The rising edge of
WR will latch the data into memory and advance the
pointer to the next sequencer location. Up to 16 locations
can be programmed and the last location written before
M0 is taken back high will be the last location in the
sequence. After 16 writes, the pointer is reset to location
0000 and any subsequent writes will overwrite the previous contents and start a new sequence.
The sequencer memory can be read by holding WR high
and driving RD. Taking RD low accesses the sequencer
memory and enables the data output pins. The sequencer
should be reset to location 0000 (by pulsing M0 high)
before beginning a read operation. The seven output bits
will be available on the DIFFOUT/S6, A2OUT/S5, A1OUT/S4,
A0OUT/S3, D11/S2, D10/S1 and D9/S0 pins (LTC1851) or
DIFFOUT/S6, A2OUT/S5, A1OUT/S4, A0OUT/S3, D9/S2, D8/
S1 and D7/S0 pins (LTC1850). The D8 to D0 (LTC1851) or
D6 to D0 (LTC1850) data output pins will remain high
impedance during readback. RD going high will return the
data output pins to a high impedance state and advance the
pointer to the next location. A logic 1 on the D9/S0 (or D7/
S0) pin indicates the last location in the current sequence
but all 16 locations can be read by continuing to clock RD.
After 16 reads, the pointer is reset to location 0000. When
all programming and/or reading of the sequencer memory
is complete, M0 is taken high. BUSY will come back high
enabling CONVST and indicating that the part is ready to
start a conversion.
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Sequence Run Mode
Once the sequencer is programmed, M0 is taken high.
BUSY will also come back high enabling CONVST and the
next falling CONVST will begin a conversion using the
MUX address and input configuration stored in location
0000 of the sequencer memory. After each conversion, the
sequencer pointer is advanced by one and the MUX
address (the actual channel or channels being converted,
not the sequencer pointer) for the present conversion is
available on the address output pins along with the conversion result. When the sequencer finishes converting
the last programmed location, the sequencer pointer will
return to location 0000 for the next conversion. The
sequencer will also reset to location 0000 anytime the M1
or M0 pin changes state.
The contents of the sequencer memory will be retained as
long as power is continuously applied to the part. This
allows the user to switch from Sequence Run mode to
either Direct Address or Scan Mode and back without
losing the programmed sequence. The part can also be
disabled using CS or shutdown in Nap or Sleep mode
without losing the programmed sequence. Table 5 outlines the operational modes of the LTC1850/LTC1851.
Figures 11 and 12 show the timing diagrams for writing to,
reading from and running a sequence with the LTC1850/
LTC1851.
Table 5
OPERATION MODE
M1
M0
WR
RD
COMMENTS
Direct Address
0
0
0
0
0
OE
OE
Address and Configuration are Driven from External Pins
Address and Configuration are Latched on Rising Edge of WR or Falling Edge of CONVST
Scan
0
0
1
1
0
OE
OE
Address is Provided by Internal Scan Counter, Configuration is Driven from External Pins
Configuration is Latched on Rising Edge of WR or Falling Edge of CONVST
Program
1
0
1
Readback
1
0
1
Write Sequencer Location, WR Low Enables Inputs, Rising Edge of WR Latches Data and
Advances to Next Location
Read Sequencer Location, Falling Edge of RD Enables Output, Rising Edge of RD
Advances to Next Location
Sequence Run
1
1
X
OE
Run Programmed Sequence, Falling Edge of CONVST Starts Conversion and Advances to
Next Location
18501f
24
D6 TO D0 (LTC1850)
D8 TO D0 (LTC1851)
S6 TO S0
Hi-Z
L0CATION 0001
L0CATION 0000
PGA
Hi-Z
L0CATION 0001
L0CATION 0000
UNI/BIP
BUSY
L0CATION 0001
L0CATION 0000
A2 TO A0
t19
L0CATION 0001
t16
L0CATION 0000
t20
t17
DIFF
RD
WR
CONVST
t23
LOCATION
0000
t11
t24
Figure 11. Sequencer I/O
L0CATION n
L0CATION n
L0CATION n
L0CATION n
t14
t15
t22
t10
LOCATION
0001
t12
LOCATION
n
LOCATION
n+1
t23
1851 F11
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t18
APPLICATIO S I FOR ATIO
U
M1
LTC1850/LTC1851
18501f
25
Hi-Z
DIFFOUT
A2OUT TO A0OUT
D9 TO D0 (LTC1850)
D11 TO D0 (LTC1851)
L0CATION 0010
L0CATION 0010
L0CATION 0010
L0CATION 0010
t23
t25
t6
t8
DATA
0000
CONVERT
0001
Figure 12. Programming and Running a Sequence
L0CATION 0001
L0CATION 0000
PGA
BUSY
L0CATION 0001
L0CATION 0000
UNI/BIP
t19
L0CATION 0001
L0CATION 0000
t15
A2 TO A0
t14
L0CATION 0001
t16
t17
L0CATION 0000
t20
DIFF
RD
WR
CONVST
CONVERT
0000
t7
DATA
0001
CONVERT
0010
t11
t10
DATA
0010
t5
CONVERT
0000
DATA
0000
1851 F12
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M0
t18
APPLICATIO S I FOR ATIO
U
M1
LTC1850/LTC1851
18501f
LTC1850/LTC1851
U
PACKAGE DESCRIPTIO
FW Package
48-Lead Plastic TSSOP (6.1mm)
(Reference LTC DWG # 05-08-1651)
12.4 – 12.6*
(.488 – .496)
0.95 ±0.10
8.1 ±0.10
48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25
6.2 ±0.10
7.9 – 8.3
(.311 – .327)
0.32 ±0.05
0.50 TYP
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24
RECOMMENDED SOLDER PAD LAYOUT
1.20
(.0473)
MAX
6.0 – 6.2**
(.236 – .244)
0° – 8°
-T.10 C
-C0.09 – 0.20
(.0035 – .008)
0.45 – 0.75
(.018 – .029)
0.50
(.0197)
BSC
0.17 – 0.27
(.0067 – .0106)
0.05 – 0.15
(.002 – .006)
FW48 TSSOP 0502
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
MILLIMETERS
2. DIMENSIONS ARE IN
(INCHES)
3. DRAWING NOT TO SCALE
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH SHALL NOT EXCEED .152mm (.006") PER SIDE
**DIMENSIONS DO NOT INCLUDE INTERLEAD FLASH. INTERLEAD FLASH SHALL NOT EXCEED .254mm (.010") PER SIDE
18501f
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
27
LTC1850/LTC1851
U
TYPICAL APPLICATIO
Data buffering using two IDT7202LA15 1k x 9-bit FIFOs
allows rapid collection of 1024 samples and simple interface to low power, low speed, 8-bit microcontrollers. Data
and channel information are clocked in simultaneously
and read out as two bytes using READ HIGH FIFO and
READ LOW FIFO lines. In the event of bus contention,
resistors limit peak output current. If both FIFOs are read
completely or reset before a burst of conversions, the
empty, half full, and full flags from only one FIFO need to
be monitored. The retransmit inputs may also be tied
together. Retransmit may be used to read data repeatedly,
allowing a memory limited processor to perform transform and filtering functions that would otherwise be
difficult.
0.1µF
INPUT
CONFIGURATION:
ALL 8 CHANNELS
SINGLE ENDED TO COM
CH0–CH7: 0V TO 4.096V
5V
5V
5V
0.1µF
10µF
OVDD 35
15
14
VDD
0.1µF
10µF
VDD
24
25
M1 48
M0 36
LTC1851
5V
SHDN 47
CONTROL LOGIC
AND
PROGRAMMABLE
SEQUENCER
3 CH2
4 CH3
8-CHANNEL
MULTIPLEXER
INTERNAL
CLOCK
27
4
RD 44
5
WR 43
6
DIFF 42
1
A2 41
A1 40
8
A0 39
22
UNI/BIP 38
PGA 37
6 CH5
26
3
CONVST 45
2 CH1
5 CH4
5V
CS 46
1 CH0
2
5V
28
IDT7202LA15 13
D8
Q8
8 × 1k
18
D7
Q7
18
D6
Q6
17
D5
Q5
16
D4
Q4
12
D3
Q3
11
D2
Q2
10
D1
Q1
9
D0
Q0
15
WR
R
READ_HIGH_FIFO
21
FF
EF
HIGH_FIFO_EMPTY
20
RS
HF
HIGH_FIFO_HALF_FULL
23
RT
HIGH BYTE_FIFO_RETRANSMIT
GND
XI
7
14
7 CH6
BUSY 33
8 CH7
DIFFOUT/S6 17
HIGH_FIFO_FULL_FLAG
A2OUT/S5 18
LOW_FIFO_FULL_FLAG
9 COM
A1OUT/S4 19
2.5V
REFERENCE
+
–
12-BIT
SAMPLING
ADC
DATA
LATCHES
OUTPUT
DRIVERS
D10/S1 22
D9/S0 23
D8 24
D7 25
11 REFIN
D6 26
REF AMP
D5 27
1µF
D4 28
1.6384X
D3 29
D2 30
D1 31
D0 32
GND
REFCOMP
12
4.096V
0.1µF
OGND 34
GND
13
16
*CONVERT
CLOCK
UP TO 1024
10µF
D5
D4
D3
D2
D1
D0
0.1µF
D11/S2 21
10 REFOUT
D6
FIFO_RESET
A0OUT/S3 20
2.5V
8-BIT
DATA BUS
D7
5V
28
IDT7202LA15
13
2
D8
Q8
19
24
D7
Q7
18
25
D6
Q6
17
26
D5
Q5
16
27
D4
Q4
12
3
D3
Q3
11
4
D2
Q2
10
5
D1
Q1
9
6
D0
Q0
15
1
WR
R
21
8
FF
EF
20
22
RS
HF
23
RT
GND
XI
7
14
8 × 1k
READ_LOW_FIFO
LOW_FIFO_EMPTY
LOW_FIFO_HALF_FULL
LOW BYTE_FIFO_RETRANSMIT
18501 TA01
RELATED PARTS
PART NUMBER
LTC1410
LTC1415
LTC1418
LTC1419
LTC1604
LTC1852/LTC1853
DESCRIPTION
12-Bit, 1.25Msps, ±5V ADC
12-Bit, 1.25Msps, Single 5V ADC
14-Bit, 200ksps, Single 5V ADC
Low Power 14-Bit, 800ksps ADC
16-Bit, 333ksps, ±5V ADC
10-Bit/12-Bit, 8-Channel, 400ksps ADCs
COMMENTS
71.5dB SINAD at Nyquist, 150mW Dissipation
55mW Power Dissipation, 72dB SINAD
15mW, Serial/Parallel ±10V
True 14-Bit Linearity, 81.5dB SINAD, 150mW Dissipation
90dB SINAD, 220mW Power Dissipation, Pin Compatible with LTC1608
Pin-Compatible, Programmable Multiplexer and Sequencer
18501f
28
Linear Technology Corporation
LT/TP 0303 2K • PRINTED IN THE USA
1630 McCarthy Blvd., Milpitas, CA 95035-7417
(408) 432-1900 ● FAX: (408) 434-0507
●
www.linear.com
 LINEAR TECHNOLOGY CORPORATION 2001
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