LINER LTC2634IMSE-LZ10TRPBF Quad 12-/10-/8-bit rail-to-rail dacs with 10ppm/â°c reference Datasheet

LTC2634
Quad 12-/10-/8-Bit
Rail-to-Rail DACs with
10ppm/°C Reference
FEATURES
DESCRIPTION
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The LTC®2634 is a family of quad 12-, 10- and 8-bit voltage output DACs with an integrated, high accuracy, low
drift 10ppm/°C reference in 16-lead QFN and 10-lead
MSOP packages. It has rail-to-rail output buffers and is
guaranteed monotonic. The LTC2634-L has a full-scale
output of 2.5V, and operates from a single 2.7V to 5.5V
supply. The LTC2634-H has a full-scale output of 4.096V,
and operates from a 4.5V to 5.5V supply. Each DAC can
also operate with an external reference, which sets the
full-scale output to the external reference voltage.
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Integrated Precision Reference
2.5V Full-Scale 10ppm/°C (LTC2634-L)
4.096V Full-Scale 10ppm/°C (LTC2634-H)
Maximum INL Error: ±2.5 LSB (LTC2634-12)
Low Noise: 0.75mVP-P 0.1Hz to 200KHz
Guaranteed Monotonic over –40°C to 125°C
Temperature Range
Selectable Internal or External Reference
2.7V to 5.5V Supply Range (LTC2634-L)
Ultralow Crosstalk Between DACs (2.4nV•s)
Low Power: 0.6mA at 3V
Power-On Reset to Zero-Scale/Mid-Scale
Double Buffered Data Latches
Tiny 16-Lead 3mm × 3mm QFN and 10-Lead
MSOP Packages
These DACs communicate via an SPI/MICROWIRE compatible 3-wire serial interface which operates at clock rates
up to 50MHz. Serial data output (SDO), a hardware clear
(CLR), and an asynchronous DAC update (LDAC) capability
are available in the QFN package. The LTC2634 incorporates
a power-on reset circuit. Options are available for reset
to zero-scale or reset to mid-scale in internal reference
mode, or reset to mid-scale in external reference mode
after power-up.
APPLICATIONS
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Mobile Communications
Process Control and Industrial Automation
Automatic Test Equipment
Portable Equipment
Automotive
L, LT, LTC and LTM are registered trademarks of Linear Technology Corporation.
All other trademarks are the property of their respective owners.
Protected by U.S. Patents including 5396245, 5859606, 6891433, 6937178, 7414561.
BLOCK DIAGRAM
INTERNAL
REFERENCE
GND
SWITCH
REF
Integral Nonlinearity
(LTC2634-LZ12)
VREF
VCC
REGISTER
REGISTER
DAC A
REGISTER
2
DAC D
1
VREF
REGISTER
REGISTER
REGISTER
DAC B
REGISTER
VREF
VOUTB
VCC = 3V
INTERNAL REF
VOUTD
DAC C
CS/LD
VOUTC
SDI
CONTROL
LOGIC
INL (LSB)
VOUTA
REGISTER
(REFLO)
SDI
0
–1
DECODE
–2
SCK
(LDAC)
32-BIT SHIFT REGISTER
POWER-ON
RESET
(CLR)
0
1024
2048
3072
4095
CODE
(SDO)
2634 TA01
2634 BD
( ) QFN PACKAGE ONLY
2634f
1
LTC2634
ABSOLUTE MAXIMUM RATINGS (Notes 1, 2)
Supply Voltage (VCC) ................................... –0.3V to 6V
CS/LD, SCK, SDI, LDAC, CLR, SDO, REFLO.. –0.3V to 6V
VOUTA-VOUTD .................... –0.3V to Min (VCC + 0.3V, 6V)
REF .................................. –0.3V to Min (VCC + 0.3V, 6V)
Operating Temperature Range
LTC2634C ................................................ 0°C to 70°C
LTC2634I.............................................. –40°C to 85°C
LTC2634H (Note 3) ............................ –40°C to 125°C
Maximum Junction Temperature........................... 150°C
Storage Temperature Range................... –65°C to 150°C
Lead Temperature (Soldering, 10 sec)
MSOP ............................................................... 300°C
GND
NC
VCC
TOP VIEW
REFLO
PIN CONFIGURATION
16 15 14 13
TOP VIEW
VOUTA 1
12 VOUTD
VOUTB 2
11 VOUTC
17
LDAC 3
10 REF
CS/LD 4
6
7
8
SCK
NC
SDO
SDI
9
5
CLR
UD PACKAGE
16-LEAD (3mm s 3mm) PLASTIC QFN
VCC 1
VOUTA 2
VOUTB 3
CS/LD 4
SCK 5
11
10
9
8
7
6
GND
VOUTD
VOUTC
REF
SDI
MSE PACKAGE
10-LEAD PLASTIC MSOP
TJMAX = 125°C, θJA = 35°C/W
EXPOSED PAD (PIN 11) IS GND, MUST BE SOLDERED TO PCB
TJMAX = 125°C, θJA = 68°C/W
EXPOSED PAD (PIN 17) IS GND, MUST BE SOLDERED TO PCB
2634f
2
LTC2634
ORDER INFORMATION
LTC2634 C
UD
-L
Z
12
#TR
PBF
LEAD FREE DESIGNATOR
PBF = Lead Free
TAPE AND REEL
TR = 2,500-Piece Tape and Reel
RESOLUTION
12 = 12-Bit
10 = 10-Bit
8 = 8-Bit
POWER-ON RESET
MI = Reset to Mid-Scale in Internal Reference Mode
MX = Reset to Mid-Scale in External Reference Mode
Z = Reset to Zero-Scale in Internal Reference Mode
FULL-SCALE VOLTAGE, INTERNAL REFERENCE MODE
L = 2.5V
H = 4.096V
PACKAGE TYPE
UD = 16-Lead QFN
MSE = 10-Lead MSOP
TEMPERATURE GRADE
C = Commercial Temperature Range (0°C to 70°C)
I = Industrial Temperature Range (–40°C to 85°C)
H = Automotive Temperature Range (–40°C to 125°C)
PRODUCT PART NUMBER
Consult LTC Marketing for information on non-standard lead based finish parts.
For more information on lead free part marking, go to: http://www.linear.com/leadfree/
For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/
2634f
3
LTC2634
PRODUCT SELECTION GUIDE
PART MARKING*
VFS WITH INTERNAL
POWER-ON
REFERENCE
RESET TO CODE
POWER-ON
REFERENCE
MODE
PART NUMBER
QFN
MSOP
RESOLUTION
VCC
MAXIMUM INL
LTC2634-LMI12
LTC2634-LMI10
LTC2634-LMI8
LDQX
LDRF
LDRN
LTDRV
LTDSC
LTDSK
2.5V • (4095/4096)
2.5V • (1023/1024)
2.5V • (255/256)
Mid-Scale
Mid-Scale
Mid-Scale
Internal
Internal
Internal
12-Bit
10-Bit
8-Bit
2.7V to 5.5V
2.7V to 5.5V
2.7V to 5.5V
±2.5LSB
±1LSB
±0.5LSB
LTC2634-LMX12
LTC2634-LMX10
LTC2634-LMX8
LDQW
LDRD
LDRM
LTDRT
LTDSB
LTDSJ
2.5V • (4095/4096)
2.5V • (1023/1024)
2.5V • (255/256)
Mid-Scale
Mid-Scale
Mid-Scale
External
External
External
12-Bit
10-Bit
8-Bit
2.7V to 5.5V
2.7V to 5.5V
2.7V to 5.5V
±2.5LSB
±1LSB
±0.5LSB
LTC2634-LZ12
LTC2634-LZ10
LTC2634-LZ8
LDQV
LDRC
LDRK
LTDRS
LTDRZ
LTDSH
2.5V • (4095/4096)
2.5V • (1023/1024)
2.5V • (255/256)
Zero-Scale
Zero-Scale
Zero-Scale
Internal
Internal
Internal
12-Bit
10-Bit
8-Bit
2.7V to 5.5V
2.7V to 5.5V
2.7V to 5.5V
±2.5LSB
±1LSB
±0.5LSB
LTC2634-HMI12
LTC2634-HMI10
LTC2634-HMI8
LDRB
LDRJ
LDRR
LTDRY
LTDSG
LTDSP
4.096V • (4095/4096)
4.096V • (1023/1024)
4.096V • (255/256)
Mid-Scale
Mid-Scale
Mid-Scale
Internal
Internal
Internal
12-Bit
10-Bit
8-Bit
4.5V to 5.5V
4.5V to 5.5V
4.5V to 5.5V
±2.5LSB
±1LSB
±0.5LSB
LTC2634-HMX12
LTC2634-HMX10
LTC2634-HMX8
LDQZ
LDRH
LDRQ
LTDRX
LTDSF
LTDSN
4.096V • (4095/4096)
4.096V • (1023/1024)
4.096V • (255/256)
Mid-Scale
Mid-Scale
Mid-Scale
External
External
External
12-Bit
10-Bit
8-Bit
4.5V to 5.5V
4.5V to 5.5V
4.5V to 5.5V
±2.5LSB
±1LSB
±0.5LSB
LTC2634-HZ12
LTC2634-HZ10
LTC2634-HZ8
LDQY
LDRG
LDRP
LTDRW 4.096V • (4095/4096)
LTDSD 4.096V • (1023/1024)
LTDSM 4.096V • (255/256)
Zero-Scale
Zero-Scale
Zero-Scale
Internal
Internal
Internal
12-Bit
10-Bit
8-Bit
4.5V to 5.5V
4.5V to 5.5V
4.5V to 5.5V
±2.5LSB
±1LSB
±0.5LSB
*Above options are available in a 16-lead QFN package (LTC2634-UD) or 10-lead MSOP package (LTC2634-MSE).
2634f
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LTC2634
ELECTRICAL CHARACTERISTICS
The l denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. VCC = 2.7V to 5.5V, VOUT unloaded unless otherwise specified.
LTC2634-LMI12/-LMI10/-LMI8/-LMX12/-LMX10/-LMX8/-LZ12/-LZ10/-LZ8 (VFS = 2.5V)
SYMBOL PARAMETER
LTC2634-8
LTC2634-10
LTC2634-12
MIN TYP MAX MIN TYP MAX MIN TYP MAX
CONDITIONS
UNITS
DC Performance
DNL
Resolution
l
8
Monotonicity
VCC = 3V, Internal Ref. (Note 4)
l
8
Differential Nonlinearity
VCC = 3V, Internal Ref. (Note 4)
l
±0.5
±0.05 ±0.5
10
12
10
Bits
12
Bits
±0.5
±1
LSB
INL
Integral Nonlinearity
VCC = 3V, Internal Ref. (Note 4)
l
±0.2
±1
±1
±2.5
LSB
ZSE
Zero-Scale Error
VCC = 3V, Internal Ref., Code = 0
l
0.5
5
0.5
5
0.5
5
mV
VOS
Offset Error
VCC = 3V, Internal Ref. (Note 5)
l
±0.5
±5
±0.5
±5
±0.5
±5
mV
VOSTC
VOS Temperature
Coefficient
VCC = 3V, Internal Ref.
l
±10
±10
±10
μV/°C
±0.2 ±0.8
±0.2 ±0.8
±0.2 ±0.8
%FSR
GE
Gain Error
VCC = 3V, Internal Ref.
GETC
Gain Temperature
Coefficient
VCC = 3V, Internal Ref. (Note 10)
C-Grade
I-Grade
H-Grade
Load Regulation
Internal Ref., Mid-Scale
VCC = 3V ±10%, –5mA ≤ IOUT ≤ 5mA
l
0.009 0.016
0.035 0.064
0.14 0.256 LSB/mA
Internal Ref., Mid-Scale
VCC = 5V ±10%, –10mA ≤ IOUT ≤ 10mA
l
0.009 0.016
0.035 0.064
0.14 0.256 LSB/mA
Internal Ref., Mid-Scale
VCC = 3V ±10%, –5mA ≤ IOUT ≤ 5mA
l
0.09 0.156
0.09 0.156
0.09 0.156
Ω
Internal Ref., Mid-Scale
VCC = 5V ±10%, –10mA ≤ IOUT ≤ 10mA
l
0.09 0.156
0.09 0.156
0.09 0.156
Ω
ROUT
DC Output Impedance
10
10
10
10
10
10
SYMBOL
PARAMETER
CONDITIONS
MIN
VOUT
DAC Output Span
External Reference
Internal Reference
PSR
Power Supply Rejection
VCC = 3V ±10% or 5V ±10%
ISC
Short-Circuit Output Current (Note 6)
Sinking
Sourcing
VFS = VCC = 5.5V
Zero-Scale; VOUT Shorted to VCC
Full-Scale; VOUT Shorted to GND
l
l
10
10
10
TYP
ppm/°C
ppm/°C
ppm/°C
MAX
UNITS
0 to VREF
0 to 2.5
V
V
–80
dB
27
–27
48
–48
mA
mA
Power Supply
VCC
Positive Supply Voltage
For Specified Performance
l
5.5
V
ICC
Supply Current (Note 7)
VCC = 3V, VREF = 2.5V, External Reference
VCC = 3V, Internal Reference
VCC = 5V VREF = 2.5V, External Reference
VCC = 5V, Internal Reference
l
l
l
l
0.5
0.6
0.6
0.7
0.7
0.8
0.8
0.9
mA
mA
mA
mA
ISD
Supply Current in Power-Down Mode (Note 7) VCC = 5V, C-Grade, I-Grade
VCC = 5V, H-Grade
l
l
0.5
0.5
10
15
μA
μA
2.7
2634f
5
LTC2634
ELECTRICAL CHARACTERISTICS
The l denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. VCC = 2.7V to 5.5V, VOUT unloaded unless otherwise specified.
LTC2634-LMI12/-LMI10/-LMI8/-LMX12/-LMX10/-LMX8/-LZ12/-LZ10/-LZ8 (VFS = 2.5V)
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
VCC
V
160
200
kΩ
0.005
0.1
μA
1.25
1.26
Reference Input
VREF
Input Voltage Range
l
1
Resistance
l
120
Capacitance
IREF
Reference Current, Power-Down Mode
14
DAC Powered Down
l
pF
Reference Output
l
Output Voltage
1.24
V
Reference Temperature Coefficient
±10
ppm/°C
Output Impedance
0.5
kΩ
Capacitive Load Driving
10
μF
2.5
mA
Short-Circuit Current
VCC = 5.5V, REF Shorted to GND
VIH
Digital Input High Voltage
VCC = 3.6V to 5.5V
VCC = 2.7V to 3.6V
l
l
VIL
Digital Input Low Voltage
VCC = 4.5V to 5.5V
VCC = 2.7V to 4.5V
l
l
VOH
Digital Output High Voltage
Load Current = –100μA
l
VOL
Digital Output Low Voltage
Load Current = 100μA
l
ILK
Digital Input Leakage
VIN = GND to VCC
CIN
Digital Input Capacitance
(Note 8)
Digital I/O
2.4
2.0
V
V
0.8
0.6
V
V
0.4
V
l
±1
μA
l
2.5
pF
VCC – 0.4
V
AC Performance
tS
en
Settling Time
VCC = 3V (Note 9)
±0.39% (±1LSB at 8 Bits)
±0.098% (±1LSB at 10 Bits)
±0.024% (±1LSB at 12 Bits)
3.3
3.8
4.2
μs
μs
μs
Voltage Output Slew Rate
1.0
V/μs
Capacitive Load Driving
500
pF
2.1
nV•s
Glitch Impulse
At Mid-Scale Transition
DAC-to-DAC Crosstalk
1 DAC Held at FS, 1 DAC Switch 0 – FS
2.1
nV•s
Multiplying Bandwidth
External Reference
320
kHz
Output Voltage Noise Density
At f = 1kHz, External Reference
At f = 10kHz, External Reference
At f = 1kHz, Internal Reference
At f = 10kHz, Internal Reference
180
160
200
180
nV/√Hz
nV/√Hz
nV/√Hz
nV/√Hz
Output Voltage Noise
0.1Hz to 10Hz, External Reference
0.1Hz to 10Hz, Internal Reference
0.1Hz to 200kHz, External Reference
0.1Hz to 200kHz, Internal Reference
CREF = 0.1μF
35
40
680
730
μVP-P
μVP-P
μVP-P
μVP-P
2634f
6
LTC2634
ELECTRICAL CHARACTERISTICS
The l denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. VCC = 2.7V to 5.5V, VOUT unloaded unless otherwise specified.
LTC2634-LMI12/-LMI10/-LMI8/-LMX12/-LMX10/-LMX8/-LZ12/-LZ10/-LZ8 (VFS = 2.5V)
SYMBOL
PARAMETER
t1
SDI Valid to SCK Setup
CONDITIONS
l
MIN
4
TYP
MAX
UNITS
ns
t2
SDI Valid to SCK Hold
l
4
ns
t3
SCK High Time
l
9
ns
t4
SCK Low Time
l
9
ns
t5
CS/LD Pulse Width
l
10
ns
t6
LSB SCK High to CS/LD High
l
7
ns
t7
CS/LD Low to SCK High
l
7
ns
t8
CLR Pulse Width
l
20
ns
t9
LDAC Pulse Width
l
15
ns
l
7
t10
CS/LD High to SCK Positive Edge
SCK Frequency
t11
CS/LD High to LDAC High or Low Transition
t12
SDO Propagation Delay from SCK Falling Edge
50% Duty Cycle
l
l
CLOAD = 10pF
VCC = 4.5V to 5.5V
VCC = 2.7V to 5.5V
l
l
ns
50
200
MHz
ns
20
45
ns
ns
2634f
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LTC2634
ELECTRICAL CHARACTERISTICS
The l denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. VCC = 4.5V to 5.5V, VOUT unloaded unless otherwise specified.
LTC2634-HMI12/-HMI10/-HMI8/-HMX12/-HMX10/-HMX8/-HZ12/-HZ10/-HZ8 (VFS = 4.096V)
SYMBOL PARAMETER
LTC2634-8
LTC2634-10
LTC2634-12
MIN TYP MAX MIN TYP MAX MIN TYP MAX
CONDITIONS
UNITS
DC Performance
DNL
Resolution
l
8
Monotonicity
VCC = 5V, Internal Ref. (Note 4)
l
8
Differential Nonlinearity
VCC = 5V, Internal Ref. (Note 4)
l
±0.5
±0.05 ±0.5
10
12
10
Bits
12
Bits
±0.5
±1
LSB
INL
Integral Nonlinearity
VCC = 5V, Internal Ref. (Note 4)
l
±0.2
±1
±1
±2.5
LSB
ZSE
Zero-Scale Error
VCC = 5V, Internal Ref., Code = 0
l
0.5
5
0.5
5
0.5
5
mV
VOS
Offset Error
VCC = 5V, Internal Ref. (Note 5)
l
±0.5
±5
±0.5
±5
±0.5
±5
mV
VOSTC
VOS Temperature
Coefficient
VCC = 5V, Internal Ref.
l
±10
±10
±10
μV/°C
±0.2 ±0.8
±0.2 ±0.8
±0.2 ±0.8
%FSR
GE
Gain Error
VCC = 5V, Internal Ref.
GETC
Gain Temperature
Coefficient
VCC = 5V, Internal Ref. (Note 10)
C-Grade
I-Grade
H-Grade
Load Regulation
VCC = 5V ±10%, Internal Ref., Mid-Scale,
–10mA ≤ IOUT ≤ 10mA
l
0.006 0.01
0.022 0.04
0.09 0.16 LSB/mA
VCC = 5V ±10%, Internal Ref., Mid-Scale,
–10mA ≤ IOUT ≤ 10mA
l
0.09 0.156
0.09 0.156
0.09 0.156
ROUT
DC Output Impedance
SYMBOL PARAMETER
10
10
10
10
10
10
CONDITIONS
MIN
VOUT
DAC Output Span
External Reference
Internal Reference
PSR
Power Supply Rejection
VCC = 5V ±10%
ISC
Short-Circuit Output Current (Note 6)
Sinking
Sourcing
VFS = VCC = 5.5V
Zero-Scale; VOUT Shorted to VCC
Full-Scale; VOUT Shorted to GND
l
l
10
10
10
TYP
ppm/°C
ppm/°C
ppm/°C
MAX
Ω
UNITS
0 to VREF
0 to 4.096
V
V
–80
dB
27
–27
48
–48
mA
mA
5.5
V
Power Supply
VCC
Positive Supply Voltage
For Specified Performance
l
ICC
Supply Current (Note 7)
VCC = 5V, VREF = 4.096V, External Reference
VCC = 5V, Internal Reference
l
l
0.6
0.7
0.8
0.9
mA
mA
ISD
Supply Current in Power-Down Mode
(Note 7)
VCC = 5V, C-Grade, I-Grade
VCC = 5V, H-Grade
l
l
0.5
0.5
10
15
μA
μA
4.5
2634f
8
LTC2634
ELECTRICAL CHARACTERISTICS
The l denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. VCC = 4.5V to 5.5V, VOUT unloaded unless otherwise specified.
LTC2634-HMI12/-HMI10/-HMI8/-HMX12/-HMX10/-HMX8/-HZ12/-HZ10/-HZ8 (VFS = 4.096V)
SYMBOL PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
VCC
V
200
kΩ
0.005
0.1
μA
2.048
2.064
Reference Input
VREF
Input Voltage Range
l
1
Resistance
l
120
Capacitance
IREF
Reference Current, Power-Down Mode
160
14
DAC Powered Down
l
pF
Reference Output
l
Output Voltage
2.032
V
Reference Temperature Coefficient
±10
ppm/°C
Output Impedance
0.5
kΩ
Capacitive Load Driving
10
μF
4
mA
Short-Circuit Current
VCC = 5.5V, REF Shorted to GND
Digital I/O
VIH
Digital Input High Voltage
l
2.4
V
l
VIL
Digital Input Low Voltage
VOH
Digital Output High Voltage
Load Current = –100μA
l
VOL
Digital Output Low Voltage
Load Current = 100μA
l
ILK
Digital Input Leakage
VIN = GND to VCC
CIN
Digital Input Capacitance
(Note 8)
0.8
VCC – 0.4
V
V
0.4
V
l
±1
μA
l
2.5
pF
AC Performance
tS
en
Settling Time
VCC = 5V (Note 9)
±0.39% (±1LSB at 8 Bits)
±0.098% (±1LSB at 10 Bits)
±0.024% (±1LSB at 12 Bits)
3.8
4.2
4.8
μs
μs
μs
Voltage Output Slew Rate
1.0
V/μs
Capacitive Load Driving
500
pF
Glitch Impulse
At Mid-Scale Transition
3.0
nV•s
DAC-to-DAC Crosstalk
1 DAC Held at FS, 1 DAC Switch 0 – FS
2.4
nV•s
Multiplying Bandwidth
External Reference
320
kHz
Output Voltage Noise Density
At f = 1kHz, External Reference
At f = 10kHz, External Reference
At f = 1kHz, Internal Reference
At f = 10kHz, Internal Reference
180
160
250
230
nV/√Hz
nV/√Hz
nV/√Hz
nV/√Hz
Output Voltage Noise
0.1Hz to 10Hz, External Reference
0.1Hz to 10Hz, Internal Reference
0.1Hz to 200kHz, External Reference
0.1Hz to 200kHz, Internal Reference
CREF = 0.1μF
35
50
680
750
μVP-P
μVP-P
μVP-P
μVP-P
2634f
9
LTC2634
ELECTRICAL CHARACTERISTICS
The l denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. VCC = 4.5V to 5.5V, VOUT unloaded unless otherwise specified.
LTC2634-HMI12/-HMI10/-HMI8/-HMX12/-HMX10/-HMX8/-HZ12/-HZ10/-HZ8 (VFS = 4.096V)
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
t1
SDI Valid to SCK Setup
l
4
ns
t2
SDI Valid to SCK Hold
l
4
ns
t3
SCK High Time
l
9
ns
t4
SCK Low Time
l
9
ns
t5
CS/LD Pulse Width
l
10
ns
t6
LSB SCK High to CS/LD High
l
7
ns
t7
CS/LD Low to SCK High
l
7
ns
t8
CLR Pulse Width
l
20
ns
t9
LDAC Pulse Width
l
15
ns
t10
CS/LD High to SCK Positive Edge
l
7
ns
SCK Frequency
t11
CS/LD High to LDAC High or Low Transition
t12
SDO Propagation Delay from SCK Falling Edge
l
50% Duty Cycle
l
CLOAD = 10pF
VCC = 4.5V to 5.5V
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2: All voltages are with respect to GND.
Note 3: High temperatures degrade operating lifetimes. Operating lifetime
is derated at temperatures greater than 105°C.
Note 4: Linearity and monotonicity are defined from code kL to code
2N – 1, where N is the resolution and kL is given by kL = 0.016 • (2N/ VFS),
rounded to the nearest whole code. For VFS = 2.5V and N = 12, kL = 26
and linearity is defined from code 26 to code 4,095. For VFS = 4.096V and
N = 12, kL = 16 and linearity is defined from code 16 to code 4,095.
Note 5: Inferred from measurement at code 16 (LTC2634-12), code 4
(LTC2634-10) or code 1 (LTC2634-8), and at full-scale.
l
50
200
MHz
ns
20
ns
Note 6: This IC includes current limiting that is intended to protect the
device during momentary overload conditions. Junction temperature can
exceed the rated maximum during current limiting. Continuous operation
above the specified maximum operating junction temperature may impair
device reliability.
Note 7: Digital inputs at 0V or VCC.
Note 8: Guaranteed by design and not production tested.
Note 9: Internal Reference mode. DAC is stepped 1/4 scale to 3/4 scale
and 3/4 scale to 1/4 scale. Load is 2kΩ in parallel with 100pF to GND.
Note 10: Temperature coefficient is calculated by dividing the maximum
change in output voltage by the specified temperature range.
2634f
10
LTC2634
TYPICAL PERFORMANCE CHARACTERISTICS
TA = 25°C, unless otherwise noted. LTC2634-L12 (Internal Reference, VFS = 2.5V)
Integral Nonlinearity (INL)
Differential Nonlinearity (DNL)
1.0
1.0
VCC = 3V
VCC = 3V
0.5
DNL (LSB)
INL (LSB)
0.5
0
–0.5
–1.0
0
–0.5
0
1024
2048
CODE
3072
–1.0
4095
1024
0
2048
CODE
3072
2634 G01
INL vs Temperature
Reference Output Voltage vs
Temperature
1.0
0.5
DNL (LSB)
INL (POS)
0
–0.5
1.255
DNL (POS)
0
DNL (NEG)
–0.5
INL (NEG)
0
VCC = 3V
VREF (V)
0.5
–1.0
–50 –25
1.260
VCC = 3V
VCC = 3V
INL (LSB)
2634 G02
DNL vs Temperature
1.0
25 50 75 100 125 150
TEMPERATURE (°C)
1.250
1.245
–1.0
–50 –25
0
25 50 75 100 125 150
TEMPERATURE (°C)
1.240
–50 –25
0
25 50 75 100 125 150
TEMPERATURE (°C)
2634 G04
2634 G03
Settling to ±1LSB Rising
2634 G05
Settling to ±1LSB Falling
CS/LD
5V/DIV
3/4 SCALE TO
1/4 SCALE STEP
VCC = 3V, VFS = 2.5V
RL = 2k, CL = 100pF
AVERAGE OF 256
EVENTS
VOUT
1LSB/DIV
3.1μs
VOUT
1LSB/DIV
4095
4.2μs
1/4 SCALE TO
3/4 SCALE STEP
VCC = 3V, VFS = 2.5V
RL = 2k, CL = 100pF
AVERAGE OF 256
EVENTS
CS/LD
5V/DIV
2μs/DIV
2μs/DIV
2634 G06
2634 G07
2634f
11
LTC2634
TYPICAL PERFORMANCE CHARACTERISTICS
TA = 25°C, unless otherwise noted. LTC2634-H12 (Internal Reference, VFS = 4.096V)
Integral Nonlinearity (INL)
Differential Nonlinearity (DNL)
1.0
1.0
VCC = 5V
VCC = 5V
0.5
DNL (LSB)
INL (LSB)
0.5
0
–0.5
–1.0
0
–0.5
0
1024
2048
CODE
3072
–1.0
4095
0
1024
2048
CODE
3072
2634 G08
INL vs Temperature
2.068
VCC = 5V
INL (POS)
VCC = 5V
0.5
0
INL (NEG)
–0.5
2.058
DNL (POS)
VREF (V)
0.5
INL (LSB)
Reference Output Voltage vs
Temperature
1.0
VCC = 5V
–1.0
–50 –25
2634 G09
DNL vs Temperature
DNL (LSB)
1.0
0
DNL (NEG)
–0.5
0
25 50 75 100 125 150
TEMPERATURE (°C)
2.048
2.038
–1.0
–50 –25
0
2.028
–50 –25
25 50 75 100 125 150
TEMPERATURE (°C)
2634 G10
0
25 50 75 100 125 150
TEMPERATURE (°C)
2634 G11
Settling to ±1LSB Rising
2634 G12
Settling to ±1LSB Falling
CS/LD
5V/DIV
1/4 SCALE TO
3/4 SCALE STEP
VCC = 5V, VFS = 4.095V
RL = 2k, CL = 100pF
AVERAGE OF 256
EVENTS
VOUT
1LSB/DIV
4.8μs
3.8μs
VOUT
1LSB/DIV
4095
1/4 SCALE TO
3/4 SCALE STEP
VCC = 5V, VFS = 4.095V
RL = 2k, CL = 100pF
AVERAGE OF 256
EVENTS
CS/LD
5V/DIV
2μs/DIV
2μs/DIV
2634 G13
2634 G14
2634f
12
LTC2634
TYPICAL PERFORMANCE CHARACTERISTICS TA = 25°C, unless otherwise noted
LTC2634-10
Integral Nonlinearity (INL)
Differential Nonlinearity (DNL)
1.0
1.0
VCC = 3V
VFS = 2.5V
INTERNAL REF
VCC = 3V
VFS = 2.5V
INTERNAL REF
0.5
DNL (LSB)
INL (LSB)
0.5
0
–0.5
–1.0
0
–0.5
256
0
512
CODE
768
–1.0
1023
256
0
512
CODE
768
2634 G15
1023
2634 G16
LTC2634-8
Integral Nonlinearity (INL)
0.50
Differential Nonlinearity (DNL)
0.50
VCC = 3V
VFS = 2.5V
INTERNAL REF
0.25
DNL (LSB)
INL (LSB)
0.25
0
–0.25
–0.50
VCC = 3V
VFS = 2.5V
INTERNAL REF
0
–0.25
0
64
128
CODE
192
–0.50
255
64
0
128
CODE
192
2634 G17
255
2634 G18
LTC2634
Load Regulation
Current Limiting
6
VCC = 5V (LTC2634-H)
VCC = 5V (LTC2634-L)
VCC = 3V (LTC2634-L)
0.15
3
VCC = 5V (LTC2634-H)
VCC = 5V (LTC2634-L)
VCC = 3V (LTC2634-L)
2
0.10
OFFSET ERROR (mV)
8
Offset Error vs Temperature
0.20
10
2
$VOUT (V)
$VOUT (mV)
4
0
–2
–4
0.05
0
–0.05
0
–1
–0.01
–6
INTERNAL REF.
CODE = MID-SCALE
–8
–10
–30
1
–20
–10
0
10
IOUT (mA)
20
30
2634 G19
–2
–0.15
–0.20
–30
INTERNAL REF.
CODE = MID-SCALE
–20
–10
0
10
IOUT (mA)
20
30
2634 G20
–3
–50 –25
0
25 50 75 100 125 150
TEMPERATURE (°C)
2634 G21
2634f
13
LTC2634
TYPICAL PERFORMANCE CHARACTERISTICS TA = 25°C, unless otherwise noted
LTC2634
Large-Signal Response
Mid-Scale Glitch Impulse
Power-On Reset Glitch
LTC2634-L
CS/LD
5V/DIV
VOUT
0.5V/DIV
VCC
2V/DIV
LTC2634-H12, VCC = 5V
3.0nV•s TYP
ZERO SCALE
VOUT
5mV/DIV
VOUT
5mV/DIV
LTC2634-L12, VCC = 3V
2.1nV•s TYP
VFS = VCC = 5V
1/4 SCALE to 3/4 SCALE
2μs/DIV
2μs/DIV
2634 G22
Headroom at Rails vs
Output Current
VCC = 5V
INTERNAL REF
4.0
3.5
VOUT (V)
Power-On Reset to Mid-Scale
LTC2634-H
5V SOURCING
VCC
2V/DIV
CS/LD
2V/DIV
3V (LTC2634-L) SOURCING
3.0
2636 G24
Exiting Power-Down to Mid-Scale
5.0
4.5
200μs/DIV
2634 G23
LTC2634-H
2.5
2.0
VOUT
0.5V/DIV
1.5
5V SINKING
1.0
LTC2634-L
VOUT
0.5V/DIV
3V (LTC2634-L) SINKING
0.5
0
DACs A-C IN
POWER-DOWN
MODE
0
1
2
3
4 5 6
IOUT (mA)
7
8
9
5μs/DIV
10
200μs/DIV
2634 G26
2634 G27
2634 G25
Hardware CLR
Supply Current vs Logic Voltage
1.4
SWEEP SCK, SDI, CS/LD
BETWEEN 0V AND VCC
Hardware CLR to Mid-Scale
VCC = 5V
VREF = 4.096V
CODE = FULL-SCALE
1.2
VOUT
1V/DIV
VCC = 5V
VREF = 4.096V
CODE = FULL-SCALE
ICC (mA)
VOUT
1V/DIV
1.0
VCC = 5V
0.8
VCC = 3V
(LTC2634-L)
0.6
0.4
0
1
3
2
LOGIC VOLTAGE (V)
CLR
5V/DIV
CLR
5V/DIV
4
5
1μs/DIV
1μs/DIV
2634 G29
2634 G30
2634 G28
2634f
14
LTC2634
TYPICAL PERFORMANCE CHARACTERISTICS TA = 25°C, unless otherwise noted
LTC2634
Noise Voltage vs Frequency
500
0
NOISE VOLTAGE (nV/√Hz)
–2
–4
dB
–6
–8
–10
–12
VCC = 5V
VREF(DC) = 2V
VREF(AC) = 0.2VP-P
CODE = FULL-SCALE
–14
–16
–18
1k
10k
100k
FREQUENCY (Hz)
400
Gain Error vs Reference Input
1.0
VCC = 5V
CODE = MID-SCALE
INTERNAL REF
VCC = 5.5V
0.8 GAIN ERROR OF 4 CHANNELS
0.6
GAIN ERROR (%FSR)
Mulitplying Bandwidth
2
300
LTC2634-H
200
LTC2634-L
0.4
0.2
0
–0.2
–0.4
–0.6
100
–0.8
1M
0
100
–1.0
1k
10k
100k
FREQUENCY (Hz)
2636 G31
1M
1
1.5
2 2.5 3 3.5 4 4.5
REFERENCE VOLTAGE (V)
5.5
2634 G33
2636 G32
0.1Hz to 10Hz Voltage Noise
5
DAC-to-DAC Crosstalk (Dynamic)
Gain Error vs Temperature
1.0
VCC = 5V, VFS = 2.5V
CODE = MID-SCALE
INTERNAL REF
GAIN ERROR (%FSR)
CS/LD
5V/DIV
1 DAC
SWITCH 0-FS
2V/DIV
10μV/DIV
VOUT
1mV/DIV
1s/DIV
0
–0.5
LTC2634-H12, VCC = 5V
2.4nV•s TYP
CREF = 0.1μF
2μs/DIV
2634 G34
0.5
2634 G35
–1.0
–50 –25
0
25 50 75 100 125 150
TEMPERATURE (°C)
2634 G36
2634f
15
LTC2634
PIN FUNCTIONS
(QFN/MSOP)
VOUTA to VOUTD (Pins 1-2, 11-12/Pins 2-3, 8-9): DAC
Analog Voltage Outputs.
LDAC (Pin 3, QFN Only): Asynchronous DAC Update
Pin. If CS/LD is high, a falling edge on LDAC immediately
updates the DAC registers with the contents of the input
registers (similar to a software update). If CS/LD is low
when LDAC goes low, the DAC registers are updated after
CS/LD returns high. A low on the LDAC pin powers up
the DACs. A software power-down command is ignored
if LDAC is low.
CS/LD (Pin 4/Pin 4): Serial Interface Chip Select/Load
Input. When CS/LD is low, SCK is enabled for shifting
data on SDI into the 32-bit shift register. When CS/LD is
taken high, SCK is disabled and the specified command
(see Table 1) is executed.
SCK (Pin 5/Pin 5): Serial Interface Clock Input. CMOS
and TTL compatible.
NC (Pins 6, 15, QFN Only): No Connect. Not internally
connected.
SDO (Pin 7, QFN Only): Serial Interface Data Output. The
serial output of the 32-bit shift register appears at the SDO
pin. The data transferred to the device via the SDI pin is
delayed 32 SCK rising edges before being output at the
next falling edge. This pin is used for daisy-chain operation, it is always driven and never goes high impedance,
even when CS/LD is high. See the Daisy-Chain Operation
section.
SDI (Pin 8/Pin 6): Serial Interface Data Input. Data on
SDI is clocked into the DAC on the rising edge of SCK.
The LTC2634 accepts input word lengths of either 24 or
32 bits.
CLR (Pin 9, QFN Only): Asynchronous Clear Input. A
logic low at this level-triggered input clears all registers
and causes the DAC voltage output to reset to zero
(LTC2634-Z) or mid-scale (LTC2634-MI/-MX). CMOS and
TTL compatible.
REF (Pin 10/Pin 7): Reference Voltage Input or Output.
When external reference mode is selected, REF is an input
(1V ≤ VREF ≤ VCC) where the voltage supplied sets the
full-scale DAC output voltage. When internal reference
is selected, the 10ppm/°C 1.25V (LTC2634-L) or 2.048V
(LTC2634-H) internal reference (half full-scale) is available at REF. This output may be bypassed to GND with up
to 10μF and must be buffered when driving external DC
load current.
REFLO (Pin 13, QFN only): Reference Low Pin. The voltage
at this pin sets the zero-scale voltage of all DACs. This pin
must be tied to GND.
GND (Pin 14/Pin 10): Ground.
VCC (Pin 16/Pin 1): Supply Voltage Input. 2.7V ≤ VCC ≤
5.5V (LTC2634-L) or 4.5V ≤ VCC ≤ 5.5V (LTC2634-H).
Bypass to GND with a 0.1μF capacitor.
Exposed Pad (Pin 17/Pin 11): Ground. Must be soldered
to PCB ground.
2634f
16
LTC2634
BLOCK DIAGRAM
INTERNAL
REFERENCE
GND
REF
SWITCH
VREF
VCC
REGISTER
REGISTER
DAC A
REGISTER
VOUTA
REGISTER
(REFLO)
VOUTD
DAC D
VREF
REGISTER
REGISTER
DAC B
REGISTER
VOUTB
REGISTER
VREF
VOUTC
DAC C
CS/LD
SDI
CONTROL
LOGIC
SCK
SDI
DECODE
POWER-ON
RESET
32-BIT SHIFT REGISTER
(CLR)
(SDO)
(LDAC)
2634 BD
( ) QFN PACKAGE ONLY
TIMING DIAGRAMS
t1
t2
SCK
t3
1
t6
t4
2
3
23
24
t10
SDI
t5
t7
CS/LD
t12
SDO
t11
t9
LDAC
2634 F01a
Figure 1a
CS/LD
t11
LDAC
2634 F01b
Figure 1b
2634f
17
LTC2634
OPERATION
The LTC2634 is a family of quad voltage output DACs in
16-lead QFN and 10-lead MSOP packages. Each DAC can
operate rail-to-rail using an external reference, or with its
full-scale voltage set by an integrated reference. Eighteen
combinations of accuracy (12-, 10- and 8-bit), power-on
reset value (zero-scale, mid-scale in internal reference
mode, or mid-scale in external reference mode), and fullscale voltage (2.5V or 4.096V) are available. The LTC2634
is controlled using a 3-wire SPI/MICROWIRE compatible
interface.
Power-On Reset
The LTC2634-HZ/LTC2634-LZ clear the output to zero-scale
when power is first applied, making system initialization
consistent and repeatable.
For some applications, downstream circuits are active
during DAC power-up, and may be sensitive to nonzero
outputs from the DAC during this time. The LTC2634
contains circuitry to reduce the power-on glitch: the
analog output typically rises less than 5mV above zeroscale during power on. In general, the glitch amplitude
decreases as the power supply ramp time is increased.
See “Power-On Reset Glitch” in the Typical Performance
Characteristics section.
The LTC2634-HMI/LTC2634-HMX/LTC2634-LMI/
LTC2634-LMX provide an alternative reset, setting the
output to mid-scale when power is first applied. The
LTC2634-LMI and LTC2634-HMI power up in internal
reference mode, with the output set to a mid-scale voltage of 1.25V and 2.048V, respectively. The LTC2634-LMX
and LTC2634-HMX power up in external reference mode,
with the output set to mid-scale of the external reference.
Default reference mode selection is described in the Reference Modes section.
Power Supply Sequencing
The voltage at REF (Pin 10, QFN/Pin 7, MSOP) must be
kept within the range –0.3V ≤ VREF ≤ VCC + 0.3V (see
Absolute Maximum Ratings). Particular care should be
taken to observe these limits during power supply turnon and turn-off sequences, when the voltage at VCC is in
transition.
Transfer Function
The digital-to-analog transfer function is:
⎛ k ⎞
VOUT(IDEAL) = ⎜ N ⎟ ( VREF – VREFLO ) + VREFLO
⎝2 ⎠
where k is the decimal equivalent of the binary DAC
input code, N is the resolution, and VREF is either 2.5V
(LTC2634-LMI/LTC2634-LMX/LTC2634-LZ) or 4.096V
(LTC2634-HMI/LTC2634-HMX/LTC2634-HZ) when in
internal reference mode, and the voltage at REF when in
external reference mode. The resulting DAC output span
is 0V to VREF , as it is necessary to tie REFLO to GND.
Serial Interface
The CS/LD input is level-triggered. When this input is
taken low, it acts as a chip-select signal, enabling the SDI
and SCK buffers and the input shift register. Data (SDI
input) is transferred at the next 24 rising SCK edges.
The 4-bit command, C3-C0, is loaded first; then the 4-bit
DAC address, A3-A0; and finally the 16-bit data word.
The data word comprises the 12-, 10- or 8-bit input code,
ordered MSB to LSB, followed by 4, 6 or 8 don’t-care
bits (LTC2634-12/LTC2634-10/LTC2634-8 respectively;
see Figure 2). Data can only be transferred to the device
when the CS/LD signal is low, beginning on the first rising
edge of SCK. SCK may be high or low at the falling edge
2634f
18
LTC2634
OPERATION
of CS/LD. The rising edge of CS/LD ends the data transfer
and causes the device to execute the command specified
in the 24-bit input sequence. The complete sequence is
shown in Figure 3a.
The command (C3-C0) and address (A3-A0) assignments
are shown in Tables 1 and 2. The first four commands
in Table 1 consist of write and update operation. A write
operation loads a 16-bit data word from the 24-bit shift
register into the input register of the selected DAC, n. An
update operation copies the data word from the input
register to the DAC register. Once copied into the DAC
register, the data word becomes the active 12-, 10- or
8-bit input code, and is converted to an analog voltage at
the DAC output. Write to and update combines the first
two commands. The update operation also powers up the
DAC if it had been in power-down mode. The data path
and registers are shown in the Block Diagram.
Input Word (LTC2634-12)
COMMAND
C3
C2
C1 C0
ADDRESS
A3
A2
A1
DATA (12 BITS + 4 DON’T CARE BITS)
A0
D11 D10 D9
D8
D7
D6
D5
D4 D3 D2 D1
MSB
D0
X
X
X
X
X
X
X
X
X
X
X
LSB
Input Word (LTC2634-10)
COMMAND
C3
C2
C1 C0
ADDRESS
A3
A2
A1
DATA (10 BITS + 6 DON’T CARE BITS)
A0
D9
D8
D7
D6
D5
D4
D3
D2 D1 D0
MSB
X
X
LSB
Input Word (LTC2634-8)
COMMAND
C3
C2
C1 C0
ADDRESS
A3
A2
A1
DATA (8 BITS + 8 DON’T CARE BITS)
A0
D7
D6
D5
D4
D3
D2
D1
MSB
D0
X
X
X
X
X
2634 F02
LSB
Figure 2. Command and Data Input Format
Table 1. Command Codes
Table 2. Address Codes
COMMAND*
ADDRESS (n)*
C3
C2
C1
C0
A3
A2
A1
A0
0
0
0
0
Write to Input Register n
0
0
0
0
DAC A
0
0
0
1
Update (Power Up) DAC Register n
0
0
0
1
DAC B
0
0
1
0
Write to Input Register n, Update (Power Up) All
0
0
1
0
DAC C
0
0
1
1
Write to and Update (Power Up) DAC Register n
0
0
1
1
DAC D
0
1
0
0
Power-Down DAC n
1
1
1
1
All DACs
0
1
0
1
Power-Down Chip (All DACs and Reference)
0
1
1
0
Select Internal Reference (Power-Up Reference)
0
1
1
1
Select External Reference (Power-Down Internal
Reference)
1
1
1
1
No Operation
* Address codes not shown are reserved and should not be used.
*Command codes not shown are reserved and should not be used.
2634f
19
LTC2634
OPERATION
While the minimum input sequence is 24 bits, it may
optionally be extended to 32 bits to accommodate microprocessors that have a minimum word width of 16 bits
(2 bytes). To use the 32-bit width, 8 don’t care bits
must be transferred to the device first, followed by the
24-bit sequence described. Figure 3b shows the 32-bit
sequence.
The 16-bit data word is ignored for all commands that do
not include a write operation.
Daisy-Chain Operation (QFN Package)
The serial output of the shift register appears at the SDO
pin on the QFN package. Data transferred to the device
from the SDI input is delayed 32 SCK rising edges before
being output at the next SCK falling edge, therefore, daisy
chaining multiple LTC2634 DACs requires 32-bit data
write cycles.
The SDO output can be used to facilitate control of multiple
serial devices from a single 3-wire serial port (i.e., SCK,
SDI and CS/LD). Such a “daisy-chain” series is configured
by connecting SDO of each upstream device to SDI of the
next device in the chain. The shift registers of the devices
are thus connected in series, effectively forming a single
input shift register which extends through the entire chain.
Because of this, the devices can be addressed and controlled
individually by simply concatenating their input words;
the first instruction addresses the last device in the chain
and so forth. The SCK and CS/LD signals are common to
all devices in the series. Figure 5 shows a block diagram
for daisy-chain operation.
In use, CS/LD is first taken low. Then the concatenated
input data is transferred to the chain, using SDI of the
first device as the data input. When the data transfer is
complete, CS/LD is taken high, completing the instruction
sequence for all devices simultaneously. A single device
can be controlled by using the no-operation command
(1111) for the other devices in the chain.
Reference Modes
For applications where an accurate external reference is
either not available, or not desirable due to limited space,
the LTC2634 has a low noise, user-selectable, integrated
reference. The integrated reference voltage is internally
amplified by 2x to provide the full-scale DAC output voltage range. The LTC2634-LMI/LTC2634-LMX/LTC2634-LZ
provides a full-scale DAC output of 2.5V. The LTC2634HMI/LTC2634-HMX/LTC2634-HZ provides a full-scale
DAC output of 4.096V. The internal reference can be
useful in applications where the supply voltage is poorly
regulated. Internal Reference mode can be selected by
using command 0110b, and is the power-on default for
LTC2634-HZ/LTC2634-LZ, as well as for LTC2634-HMI/
LTC2634-LMI.
The 10ppm/°C, 1.25V (LTC2634-LMI/LTC2634-LMX/
LTC2634-LZ) or 2.048V (LTC2634-HMI/LTC2634-HMX/
LTC2634-HZ) internal reference is available at the REF pin.
Adding bypass capacitance to the REF pin will improve
noise performance; 0.1μF is recommended, and up to 10μF
can be driven without oscillation. The REF output must be
buffered when driving an external DC load current.
Alternatively, the DAC can operate in external reference
mode using command 0111b. In this mode, an input voltage
supplied externally to the REF pin provides the reference
(1V ≤ VREF ≤ VCC) and the supply current is reduced. The
external reference voltage supplied sets the full-scale DAC
output voltage. External reference mode is the power-on
default for LTC2634-HMX/LTC2634-LMX.
The reference mode of LTC2634-HZ/LTC2634-LZ/
LTC2634-HMI/LTC2634-LMI (internal reference power-on
default), can be changed by software command after power
up. The same is true for LTC2634-HMX/-LMX (external
reference power-on default).
The LTC2634’s QFN package offers a REFLO pin for the
negative reference. REFLO must be connected to GND.
2634f
20
LTC2634
OPERATION
Power-Down Mode
For power-constrained applications, power-down mode can
be used to reduce the supply current whenever less than
four DAC outputs are needed. When in power down, the
buffer amplifiers, bias circuits, and integrated reference
circuits are disabled, and draw essentially zero current.
The DAC outputs are put into a high impedance state, and
the output pins are passively pulled to ground through
individual 200k resistors. Input- and DAC-register contents
are not disturbed during power down.
Any DAC channel or combination of channels can be put
into power-down mode by using command 0100b in
combination with the appropriate DAC address, (n). The
supply current is reduced approximately 20% for each DAC
powered down. The integrated reference is automatically
powered down when external reference is selected using
command 0111b. In addition, all the DAC channels and
the integrated reference together can be put into powerdown mode using power-down chip command 0101b.
When the integrated reference and all DAC channels are
in power-down mode, the REF pin becomes high impedance (typically > 1GΩ). For all power-down commands
the 16-bit data word is ignored.
Normal operation resumes after executing any command
that includes a DAC update, (as shown in Table 1) or pulling the asynchronous LDAC pin low. The selected DAC
is powered up as its voltage output is updated. When
a DAC which is in a powered-down state is powered up
and updated, normal settling is delayed. If less than four
DACs are in a powered-down state prior to the update
command, the power-up delay time is 10μs. However, if
all four DACs and the integrated reference are powered
down, then the main bias generation circuit block has been
automatically shut down in addition to the DAC amplifiers
and reference buffers. In this case, the power-up delay time
is 12μs. The power-up of the integrated reference depends
on the command that powered it down. If the reference is
powered down using the select external reference command (0111b), then it can only be powered back up using
select internal reference command (0110b). However, if
the reference was powered down using power-down chip
command (0101b), then in addition to select internal
reference command (0110b), any command (in software
or using the LDAC pin) that powers up the DACs will also
power up the integrated reference.
Voltage Output
The LTC2634’s integrated rail-to-rail amplifier has guaranteed load regulation when sourcing or sinking up to 10mA
at 5V, and 5mA at 3V.
Load regulation is a measure of the amplifier’s ability to
maintain the rated voltage accuracy over a wide range of
load current. The measured change in output voltage per
change in forced load current is expressed in LSB/mA.
DC output impedance is equivalent to load regulation, and
may be derived from it by simply calculating a change in
units from LSB/mA to ohms. The amplifier’s DC output
impedance is 0.1Ω when driving a load well away from
the rails.
When drawing a load current from either rail, the output
voltage headroom with respect to that rail is limited by
the 50Ω typical channel resistance of the output devices
(e.g., when sinking 1mA, the minimum output voltage is
50Ω • 1mA, or 50mV). See the graph “Headroom at Rails
vs Output Current” in the Typical Performance Characteristics section.
The amplifier is stable driving capacitive loads of up to
500pF.
2634f
21
LTC2634
OPERATION
Rail-to-Rail Output Considerations
In any rail-to-rail voltage output device, the output is limited
to voltages within the supply range.
Since the analog output of the DAC cannot go below ground,
it may limit for the lowest codes as shown in Figure 4b.
Similarly, limiting can occur near full-scale when the REF
pin is tied to VCC. If VREF = VCC and the DAC full-scale error
(FSE) is positive, the output for the highest codes limits
at VCC, as shown in Figure 4c. No full-scale limiting can
occur if VREF is less than VCC – FSE.
Offset and linearity are defined and tested over the region
of the DAC transfer function where no output limiting can
occur.
Board Layout
The PC board should have separate areas for the analog and
digital sections of the circuit. A single, solid ground plane
should be used, with analog and digital signals carefully
routed over separate areas of the plane. This keeps digital
signals away from sensitive analog signals and minimizes
the interaction between digital ground currents and the
analog section of the ground plane. The resistance from
the LTC2634 GND pin to the ground plane should be as
low as possible. Resistance here will add directly to the
effective DC output impedance of the device (typically
0.1Ω). Note that the LTC2634 is no more susceptible to
this effect than any other parts of this type; on the contrary, it allows layout-based performance improvements
to shine rather than limiting attainable performance with
excessive internal resistance.
Another technique for minimizing errors is to use a separate power ground return trace on another board layer.
The trace should run between the point where the power
supply is connected to the board and the DAC ground pin.
Thus the DAC ground pin becomes the common point for
analog ground, digital ground, and power ground. When
the LTC2634 is sinking large currents, this current flows
out the ground pin and directly to the power ground trace
without affecting the analog ground plane voltage.
It is sometimes necessary to interrupt the ground plane
to confine digital ground currents to the digital portion of
the plane. When doing this, make the gap in the plane only
as long as it needs to be to serve its purpose and ensure
that no traces cross over the gap.
2634f
22
X
X
SDI
SDO
SCK
CS/LD
1
X
X
2
X
X
3
X
4
X
X
DON’T CARE
X
5
C3
SDI
C2
2
C1
3
X
X
6
X
X
7
4
7
A1
ADDRESS
A2
6
A0
8
D11
9
D10
10
D9
D8
12
D7
13
D6
14
24-BIT INPUT WORD
11
D5
15
D3
17
DATA WORD
D4
16
D2
18
D1
C3
C3
C2
10
C1
11
C2
C1
COMMAND WORD
9
C0
C0
A3
A3
A2
14
A1
15
A2
A1
ADDRESS WORD
13
A0
A0
16
17
D11
D11
PREVIOUS 32-BIT INPUT WORD
12
D10
D10
18
t2
t4
t12
D5
D5
23
PREVIOUS D11
t3
17
D6
D6
22
SDO
t1
D7
D7
21
D11
D8
D8
20
SDI
SCK
D9
D9
19
D3
25
X
21
D10
D4
18
D3
DATA WORD
D4
24
D0
20
PREVIOUS D10
19
Figure 3a. LTC2634-12 24-Bit Load Sequence (Minimum Input Word)
LTC2634-10 SDI Data Word: 10-Bit Input Code + 6 Don’t Care Bits
LTC2634-8 SDI Data Word: 8-Bit Input Code + 8 Don’t Care Bits
A3
5
D2
D2
26
X
22
D1
D1
27
X
23
D0
D0
28
X
24
X
X
29
2634 F03a
X
X
30
X
X
31
X
X
2634 F03b
CURRENT
32-BIT
INPUT WORD
32
OPERATION
Figure 3b. LTC2634-12 32-Bit Load Sequence (Required for Daisy-Chain Operation)
LTC2634-10 SDI Data Word: 10-Bit Input Code + 6 Don’t Care Bits
LTC2634-8 SDI Data Word: 8-Bit Input Code + 8 Don’t Care Bits
X
8
C0
X
COMMAND WORD
1
SCK
CS/LD
LTC2634
2634f
23
LTC2634
OPERATION
POSITIVE
FSE
VREF = VCC
VREF = VCC
OUTPUT
VOLTAGE
OUTPUT
VOLTAGE
INPUT CODE
2634 F04
(4c)
OUTPUT
VOLTAGE
0V
0
2,048
INPUT CODE
4,095
(4a)
0V
NEGATIVE
OFFSET
INPUT CODE
(4b)
Figure 4. Effects of Rail-to-Rail Operation on a DAC Transfer Curve (Shown in 12 Bits)
(4a) Overall Transfer Function
(4b) Effect of Negative Offset for Codes Near Zero
(4c) Effect of Postitive Full-Scale Error for Codes Near Full-Scale
SCK
CS/LD
SDI
4
CS/LD
5
SCK
6
SDI
LTC2634UD
SDO
7
4
CS/LD
5
SCK
6
SDI
4
CS/LD
5
SCK
6
SDI
LTC2634UD
SDO
7
LTC2634UD
SDO
7
DATA OUTPUT
• • •
2634 F05
Figure 5. Daisy-Chain Operation (QFN Only)
2634f
24
0.1μF
7
0.1μF
+
30k
–15V
–
OUTC
–15V
4
1/2 LT1469
8
6
5
+
–
0.1μF
VDD
62 REFA
DAC C
DAC D
63 RCOM1
64 RIN1
61 ROFSA
15
RFBA 60
GND
19
RVOSA 58
IOUT2A 2
IOUT1A 59
DAC B
DAC A
LTC2755
+
–
5V
8
15V
30k
OUTB
–15V
4
1/2 LT1469
–15V
3
2
+
15V
–
0.1μF
OUTA
30k SERIAL
BUS
–15V
0.1μF
1
0.1μF
6
5
4
3
2
7
SDI
SCK
CS/LD
REF
DAC B
DAC A
DAC C
DAC D
LTC2634MSE-LMI12
GND
VCC
10
8
9
1
LTC2634 DACs Adjusts LTC2755-16 Offsets, Amplified with LT1991 PGA to ±5V
2634 TA02
0.1μF
5V
1k
2k
15V
–15V
0.1μF
0.1μF
8
7
M9
9
M3 VCC
10
M1
6
OUT
LT1991
1
REF
P1
2
P3 VEE
5
3
4
P9
0.1μF
VOUT
±5V
LTC2634
TYPICAL APPLICATION
2634f
25
LTC2634
PACKAGE DESCRIPTION
UD Package
16-Lead Plastic QFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1691)
0.70 p0.05
3.50 p 0.05
1.45 p 0.05
2.10 p 0.05 (4 SIDES)
PACKAGE OUTLINE
0.25 p0.05
0.50 BSC
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
3.00 p 0.10
(4 SIDES)
BOTTOM VIEW—EXPOSED PAD
PIN 1 NOTCH R = 0.20 TYP
OR 0.25 s 45o CHAMFER
R = 0.115
TYP
0.75 p 0.05
15
PIN 1
TOP MARK
(NOTE 6)
16
0.40 p 0.10
1
1.45 p 0.10
(4-SIDES)
2
(UD16) QFN 0904
0.200 REF
0.00 – 0.05
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION (WEED-2)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
0.25 p 0.05
0.50 BSC
2634f
26
LTC2634
PACKAGE DESCRIPTION
MSE Package
10-Lead Plastic MSOP, Exposed Die Pad
(Reference LTC DWG # 05-08-1664 Rev C)
BOTTOM VIEW OF
EXPOSED PAD OPTION
2.794 p 0.102
(.110 p .004)
5.23
(.206)
MIN
0.889 p 0.127
(.035 p .005)
1
0.05 REF
10
DETAIL “B”
CORNER TAIL IS PART OF
DETAIL “B” THE LEADFRAME FEATURE.
FOR REFERENCE ONLY
NO MEASUREMENT PURPOSE
3.00 p 0.102
(.118 p .004)
(NOTE 3)
10 9 8 7 6
DETAIL “A”
0o – 6o TYP
1 2 3 4 5
GAUGE PLANE
0.53 p 0.152
(.021 p .006)
DETAIL “A”
0.18
(.007)
0.497 p 0.076
(.0196 p .003)
REF
3.00 p 0.102
(.118 p .004)
(NOTE 4)
4.90 p 0.152
(.193 p .006)
0.254
(.010)
0.29
REF
1.83 p 0.102
(.072 p .004)
2.083 p 0.102 3.20 – 3.45
(.082 p .004) (.126 – .136)
0.50
0.305 p 0.038
(.0197)
(.0120 p .0015)
BSC
TYP
RECOMMENDED SOLDER PAD LAYOUT
2.06 p 0.102
(.081 p .004)
SEATING
PLANE
0.86
(.034)
REF
1.10
(.043)
MAX
0.17 – 0.27
(.007 – .011)
TYP
0.50
(.0197)
BSC
0.1016 p 0.0508
(.004 p .002)
MSOP (MSE) 0908 REV C
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
2634f
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
27
LTC2634
RELATED PARTS
PART NUMBER
DESCRIPTION
COMMENTS
LTC1660/LTC1665
Octal 10/8-Bit VOUT DACs in 16-Pin Narrow SSOP
VCC = 2.7V to 5.5V, Micropower, Rail-to-Rail Output
LTC1663
Single 10-Bit VOUT DAC in SOT-23
VCC = 2.7V to 5.5V, 60μA, Internal Reference, SMBus Interface
LTC1664
Quad 10-Bit VOUT DAC in 16-Pin Narrow SSOP
VCC = 2.7V to 5.5V, Micropower, Rail-to-Rail Output
LTC1669
Single 10-Bit VOUT DAC in SOT-23
VCC = 2.7V to 5.5V, 60μA, Internal reference, I2C Interface
LTC1821
Parallel 16-Bit Voltage Output DAC
Precision 16-Bit Settling in 2μs for 10V Step
LTC2600/LTC2610/
LTC2620
Octal 16-/14-/12-Bit VOUT DACs in 16-Lead Narrow
SSOP
250μA per DAC, 2.5V to 5.5V Supply Range, Rail-to-Rail Output,
SPI Serial Interface
LTC2601/LTC2611/
LTC2621
Single 16-/14-/12-Bit VOUT DACs in 10-Lead DFN
300μA per DAC, 2.5V to 5.5V Supply Range, Rail-to-Rail Output,
SPI Serial Interface
LTC2602/LTC2612/
LTC2622
Dual 16-/14-/12-Bit VOUT DACs in 8-Lead MSOP
300μA per DAC, 2.5V to 5.5V Supply Range, Rail-to-Rail Output,
SPI Serial Interface
LTC2604/LTC2614/
LTC2624
Quad 16-/14-/12-Bit VOUT DACs in 16-Lead SSOP
250μA per DAC, 2.5V to 5.5V Supply Range, Rail-to-Rail Output,
SPI Serial Interface
LTC2605/LTC2615/
LTC2625
Octal 16-/14-/12-Bit VOUT DACs with I2C Interface
250μA per DAC, 2.7V to 5.5V Supply Range, Rail-to-Rail Output,
I2C Interface
LTC2606/LTC2616/
LTC2626
Single 16-/14-/12-Bit VOUT DACs with I2C Interface
270μA per DAC, 2.7V to 5.5V Supply Range, Rail-to-Rail Output,
I2C Interface
LTC2609/LTC2619/
LTC2629
Quad 16-/14-/12-Bit VOUT DACs with I2C Interface
250μA per DAC, 2.7V to 5.5V Supply Range, Rail-to-Rail Output with
Separate VREF Pins for Each DAC
LTC2630
Single 12-/10-/8-Bit VOUT DACs with 10pmm/°C
Reference in SC70
180μA per DAC, 2.7V to 5.5V Supply Range, 10pmm/°C Reference,
Rail-to-Rail Output, SPI Serial Interface
LTC2631
Single 12-/10-/8-Bit I2C VOUT DACs with 10pmm/°C
Reference in ThinSOT™
180μA per DAC, 2.7V to 5.5V Supply Range, 10pmm/°C Reference,
External REF Mode, Rail-to-Rail Output, I2C Interface
LTC2636
Octal 12-/10-/8-Bit VOUT DACs with 10pmm/°C
Reference
125μA per DAC, 2.7V to 5.5V Supply Range, 10pmm/°C Reference,
External REF Mode, Rail-to-Rail Output, SPI Interface
LTC2640
Single 12-/10-/8-Bit VOUT DACs with 10pmm/°C
Reference in ThinSOT
180μA per DAC, 2.7V to 5.5V Supply Range, 10pmm/°C Reference,
External REF Mode, Rail-to-Rail Output, SPI Interface
ThinSOT is a trademark of Linear Technology Corporation
2634f
28 Linear Technology Corporation
LT 0309 • PRINTED IN USA
1630 McCarthy Blvd., Milpitas, CA 95035-7417
(408) 432-1900 ● FAX: (408) 434-0507
●
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© LINEAR TECHNOLOGY CORPORATION 2009
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