LINER LTC3675EUFFPBF 7-channel confi gurable high power pmic Datasheet

LTC3675
7-Channel Configurable
High Power PMIC
FEATURES
DESCRIPTION
n
The LTC®3675 is a digitally programmable high efficiency
multioutput power supply plus dual string LED driver IC
optimized for high power single cell Li-Ion/Polymer applications. The DC/DCs consist of four synchronous buck converters (1A/1A/500mA/500mA), one synchronous boost
DC/DC (1A), and one buck-boost DC/DC (1A) all powered
from a 2.7V to 5.5V input. The 40V LED driver can regulate
up to 25mA of current through two LED strings with up to
10 LEDs each. The LED driver may also be configured as
a general purpose high voltage boost converter.
n
n
n
n
n
n
n
n
n
n
n
Four Monolithic Synchronous Buck DC/DCs
(1A/1A/500mA/500mA)
Buck DC/DCs Can Be Paralleled to Deliver Up to
2× Current with a Single Inductor
Independent 1A Boost and 1A Buck-Boost DC/DCs
Dual String I2C Controlled 40V LED Driver
I2C Programmable Output Voltage, Operating
Mode, and Switch Node Slew Rate for All DC/DCs
I2C Read Back of DC/DC, LED Driver, Fault Status
I2C Programmable VIN and Die Temperature
Warnings
Maskable Interrupts to Report DC/DC, VIN and Die
Temperature Faults
Pushbutton ON/OFF/RESET
Always-On 25mA LDO
Low Quiescent Current: 16μA (All DC/DCs Off)
4mm × 7mm × 0.75mm 44-Lead QFN Package
APPLICATIONS
n
n
n
High Power (5W to 10W) Single Cell Li-Ion/Polymer
Applications
Portable Industrial Applications, Handy Terminals,
Portable Instruments
Multioutput Low Voltage Power Supplies
DC/DC enables, output voltages, switch slew rates and
operating modes may all be independently programmed
over I2C or used in standalone mode via simple I/O and
power-up defaults. The buck DC/DCs may be used independently or paralleled to achieve higher output currents
with a shared inductor. LED enable, 60dB brightness control
and up/down gradation are programmed using I2C. Alarm
levels for low VIN and high die temperature may also be
programmed via I2C with a maskable interrupt output to
monitor DC/DC and system faults.
Pushbutton ON/OFF/RESET control and a power-on reset
output provide flexible and reliable power-up sequencing.
The LTC3675 is available in a low profile (0.75mm), thermally enhanced 44-lead 4mm × 7mm QFN package.
L, LT, LTC, LTM, Linear Technology, the Linear logo and Burst Mode are registered trademarks of
Linear Technology Corporation and Hot Swap is a trademark of Linear Technology Corporation. All
other trademarks are the property of their respective owners.
TYPICAL APPLICATION
VIN
2.7V TO 5.5V
3
DIGITAL
CONTROL
I2C
EN1
EN2
EN3
EN4
ENBB
IRQB
RSTB
WAKE
PBSTAT
SW1
SW2
SW3
SW4
LTC3675
SW5
VOUT5
SWAB6
SWCD6
VOUT6
LDO_OUT
0.425V TO VIN, 1A MAX
0.425V TO VIN, 1A MAX
0.425V TO VIN, 500mA MAX
0.425V TO VIN, 500mA MAX
VIN
VIN TO 5.35V, 1A MAX
2.65V TO 5.25V, 1A MAX
0.8V TO VIN, 25mA MAX
VIN
SW7
ONB
PUSH BUTTON
•
•
•
CT
0.01μF
EXPOSED PAD
LED1
LED2
3675 TA01
•
•
•
UP TO 10 LEDS
PER STRING
3675f
1
LTC3675
TABLE OF CONTENTS
Features ............................................................................................................................ 1
Applications ....................................................................................................................... 1
Typical Application ............................................................................................................... 1
Description......................................................................................................................... 1
Absolute Maximum Ratings ..................................................................................................... 3
Order Information ................................................................................................................. 3
Pin Configuration ................................................................................................................. 3
Electrical Characteristics ........................................................................................................ 4
Typical Performance Characteristics .......................................................................................... 8
Pin Functions .....................................................................................................................14
Block Diagram....................................................................................................................16
Operation..........................................................................................................................17
Buck Switching Regulator .................................................................................................................................... 17
Buck Regulators with Combined Power Stages .................................................................................................... 17
Boost Switching Regulator ................................................................................................................................... 18
Buck-Boost Switching Regulator .......................................................................................................................... 18
LED Driver ............................................................................................................................................................ 18
Pushbutton Interface and Power-Up Power-Down Sequencing ............................................................................ 19
Power-Up and Power-Down via Pushbutton ......................................................................................................... 19
Power-Up and Power-Down via Enable Pin or I2C................................................................................................. 21
LED Current Programming ................................................................................................................................... 21
I2C Interface.......................................................................................................................................................... 21
Error Condition Reporting via RSTB and IRQB Pins ............................................................................................. 24
Undervoltage and Overtemperature Functionality ................................................................................................. 25
Applications Information .......................................................................................................26
Switching Regulator Output Voltage and Feedback Network................................................................................. 26
Buck Regulators ................................................................................................................................................... 26
Combined Buck Regulators .................................................................................................................................. 26
Boost Regulator .................................................................................................................................................... 27
Buck-Boost Regulator ........................................................................................................................................... 28
LED Driver ............................................................................................................................................................ 28
Operating the LED Driver As a High Voltage Boost Regulator ............................................................................... 29
Input and Output Decoupling Capacitor Selection................................................................................................. 29
Choosing the CT Capacitor ................................................................................................................................... 30
Programming the UVOT Register ......................................................................................................................... 30
Programming the RSTB and IRQB Mask Registers .............................................................................................. 30
Status Byte Read Back ......................................................................................................................................... 31
PCB Considerations .............................................................................................................................................. 31
Typical Applications .............................................................................................................32
Package Description ............................................................................................................35
Typical Application ..............................................................................................................36
Related Parts .....................................................................................................................36
3675f
2
LTC3675
ABSOLUTE MAXIMUM RATINGS
PIN CONFIGURATION
(Note 1)
TOP VIEW
44 SWCD6
43 SDA
42 VOUT6
41 DVCC
40 VIN
39 SCL
38 SWAB6
VIN, VOUT5, VOUT6 , FB1-6, LED_OV, EN1-4, ENBB,
LED_FS, CT, WAKE, PBSTAT, IRQB, RSTB, ONB,
DVCC, SW5...................................–0.3V to 6V (Static)
LDO_OUT, LDOFB...–0.3V to Lesser of (VIN + 0.3V) or 6V
SCL, SDA .......... –0.3V to Lesser of (DVCC + 0.3V) or 6V
SW1, SW2, SW3, SW4, SWAB6
............................. –0.3V to Lesser of (VIN + 0.3V) or 6V
SWCD6 ............–0.3V to Lesser of (VOUT6 + 0.3V) or 6V
SW7 ........................................................... –0.3V to 45V
ISW1, ISW2 ................................................................ 1.4A
ISW3, ISW4 ............................................................700mA
ISW5, ISWAB6, ISWCD6................................................2.4A
ISW7 ............................................................................2A
Operating Junction Temperature Range (Notes 2, 3)
............................................................... –40°C to 125°C
Junction Temperature (Notes 2, 3)........................ 125°C
Storage Temperature Range .................. –65°C to 125°C
EN1 1
FB1 2
FB2 3
EN2 4
SW1 5
VIN 6
VIN 7
SW2 8
SW3 9
VIN 10
SW4 11
EN3 12
EN4 13
FB4 14
FB3 15
LED_0V 16
LED1 17
SW7 18
SW7 19
SW7 20
LED2 21
CT 22
45
GND
37 ENBB
36 FB6
35 FB5
34 VIN
33 VOUT5
32 SW5
31 VIN
30 LDO_OUT
29 LDOFB
28 ONB
27 LED_FS
26 WAKE
25 PBSTAT
24 IRQB
23 RSTB
UFF PACKAGE
44-LEAD (7mm s 4mm) PLASTIC QFN
TJMAX = 125°C, θJA = 45°C/W
EXPOSED PAD (PIN 45) IS GND, MUST BE SOLDERED TO PCB
ORDER INFORMATION
LEAD FREE FINISH
TAPE AND REEL
PART MARKING
PACKAGE DESCRIPTION
TEMPERATURE RANGE
LTC3675EUFF#PBF
LTC3675EUFF#TRPBF
3675
44-Lead (7mm × 4mm) Plastic QFN
–40°C to 125°C
Consult LTC Marketing for parts specified with wider operating temperature ranges.
Consult LTC Marketing for information on non-standard lead based finish parts.
For more information on lead free part marking, go to: http://www.linear.com/leadfree/
For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/
3675f
3
LTC3675
ELECTRICAL CHARACTERISTICS
The l denotes the specifications which apply over the full operating
junction temperature range, otherwise specifications are at TA = 25°C. VIN = 3.6V.
SYMBOL
PARAMETER
VIN
Input Supply Range
l
2.7
VIN_FALLING
Falling Undervoltage Threshold
l
2.35
VIN_RISING
Rising Undervoltage Threshold
l
2.45
VIN_WARN
Falling Undervoltage Warning Threshold
VIN_HYS
VIN Undervoltage Warning Hysteresis
CONDITIONS
MIN
TYP
MAX
UNITS
5.5
V
2.45
2.55
V
2.55
2.65
V
UV[2], UV[1], UV[0] = 000
2.7
V
UV[2], UV[1], UV[0] = 001
2.8
V
UV[2], UV[1], UV[0] = 010
2.9
V
UV[2], UV[1], UV[0] = 011
3.0
V
UV[2], UV[1], UV[0] = 100
3.1
V
UV[2], UV[1], UV[0] = 101
3.2
V
UV[2], UV[1], UV[0] = 110
3.3
V
UV[2], UV[1], UV[0] = 111
3.4
V
50
mV
l
VIN_WARN(LSB)
Undervoltage Warning Threshold Step Size
OT
Overtemperature Shutdown
85
150
°C
OT_WARN
Overtemperature Warning Threshold; Die
OT[1], OT[0] = 00
Temperature Below OT that Causes IRQB = 0 OT[1], OT[0] = 01
OT[1], OT[0] = 10
OT[1], OT[0] = 11
10
20
30
40
°C
°C
°C
°C
IVIN_ALLOFF
Input Supply Current
16
28
μA
fOSC
Voltage Regulator Switching Frequency
All Voltage Regulators
2.25
2.7
MHz
VPGOOD(RISE)
Rising PGOOD Threshold Voltage
Full-Scale (1,1,1,1) Reference Voltage
VPGOOD(HYS)
PGOOD Hysteresis
All Switching Regulators and LED Driver
in Shutdown, ONB = HIGH; Sum of All VIN
Currents
l
1.8
100
115
mV
93.5
%
All Regulators Except LED Driver
1
%
105
20
200
50
1A Buck Regulator (Buck Regulators 1 and 2)
IVIN1,2
Pulse-Skipping Input Current
Burst Mode® Operation Input Current
VFB1 = VFB2 = 0.85V (Notes 4, 5)
VFB1 = VFB2 = 0.85V (Notes 4, 5)
μA
μA
IFWD1,2
PMOS Current Limit
(Note 6)
2.25
2.8
3.35
A
VFB1,2(HIGH)
Feedback Regulation Voltage
Pulse-Skipping Mode Full-Scale (1,1,1,1)
l
780
800
820
mV
VFB1,2(LOW)
Feedback Regulation Voltage
Pulse-Skipping Mode Full-Scale (0,0,0,0)
l
405
425
445
mV
VLSB1,2
FB1, FB2 Regulation Voltage Step Size
IFB12
Feedback Leakage Current
VFB1= VFB2 = 0.85V
25
DMAX1,2
Maximum Duty Cycle
VFB1= VFB2 = 0V
RPMOS1,2
PMOS On-Resistance
ISW1 = ISW2 = 100mA
265
mΩ
RNMOS1,2
NMOS On-Resistance
ISW1 = ISW2 = –100mA
280
mΩ
ILEAKP1,2
PMOS Leakage Current
EN1 = EN2 = 0
–2
2
μA
ILEAKN1,2
NMOS Leakage Current
EN1 = EN2 = 0
–2
2
μA
RSWPD1,2
Output Pull-Down Resistance in Shutdown
EN1 = EN2 = 0 (I2C Bit Set)
tSS1,2
Soft-Start Time
–50
l
mV
50
100
nA
%
10
kΩ
500
μs
500mA Buck Regulator (Buck Regulators 3 and 4)
IVIN3,4
Pulse-Skipping Input Current
Burst Mode Operation Input Current
VFB3 = VFB4 = 0.85V (Notes 4, 5)
VFB3 = VFB4 = 0.85V (Notes 4, 5)
IFWD3,4
PMOS Current Limit
(Note 6)
0.75
105
20
200
50
μA
μA
1.2
1.65
A
3675f
4
LTC3675
ELECTRICAL CHARACTERISTICS
The l denotes the specifications which apply over the full operating
junction temperature range, otherwise specifications are at TA = 25°C. VIN = 3.6V.
SYMBOL
PARAMETER
CONDITIONS
VFB3,4(HIGH)
Feedback Regulation Voltage
Pulse-Skipping Mode Full-Scale (1,1,1,1)
VFB3,4(LOW)
Feedback Regulation Voltage
Pulse-Skipping Mode Full-Scale (0,0,0,0)
VLSB3,4
FB3, FB4 Regulation Voltage Step Size
IFB3,4
Feedback Leakage Current
MIN
TYP
MAX
UNITS
l
780
800
820
mV
l
405
425
445
mV
25
VFB3 = VFB4 = 0.85V
–50
l
mV
50
100
nA
DMAX3,4
Maximum Duty Cycle
VFB3 = VFB4 = 0V
RPMOS3,4
PMOS On-Resistance
ISW3 = ISW4 = 100mA
%
RNMOS3,4
NMOS On-Resistance
ISW3 = ISW4 = –100mA
ILEAKP3,4
PMOS Leakage Current
EN3 = EN4 = 0
–1
1
μA
ILEAKN3,4
NMOS Leakage Current
EN3 = EN4 = 0
–1
1
μA
RSWPD3,4
Output Pull-Down Resistance in Shutdown
EN3 = EN4 = 0 (I2C Bit Set)
tSS3,4
Soft-Start Time
500
mΩ
510
mΩ
10
kΩ
500
μs
Buck Regulators Combined
IFWD1+2
PMOS Current Limit
FB2 = VIN (Note 6)
5.6
A
IFWD2+3
PMOS Current Limit
FB3 = VIN (Note 6)
4
A
IFWD3+4
PMOS Current Limit
FB4 = VIN (Note 6)
2.4
A
VFB5 = 0.85V (Notes 4, 5)
VFB5 = 0.85V (Notes 4, 5)
150
35
300
60
μA
μA
5.35
5.55
5.75
V
1A Boost Regulator
IVIN5
PWM Mode
Burst Mode Operation
VOUT5(MAX)
Maximum Regulated Output Voltage
IFWD5
Forward Current Limit
(Note 6)
2.5
3.15
3.9
A
VFB5(HIGH)
Feedback Regulation Voltage
PWM Mode Full-Scale (1,1,1,1)
l
780
800
820
mV
VFB5(LOW)
Feedback Regulation Voltage
PWM Mode Full-Scale (0,0,0,0)
l
405
425
445
mV
VLSB5
FB5 Regulation Voltage Step Size
IFB5
Feedback Leakage Current
VFB5 = 0.85V
NMOS Switch
25
–50
mV
50
nA
DCMAX5
Maximum Duty Cycle
90
%
RPMOS5
PMOS On-Resistance
260
mΩ
RNMOS5
NMOS On-Resistance
275
mΩ
ILEAKP
PMOS Switch Leakage Current
–2
2
μA
ILEAKN
NMOS Switch Leakage Current
–2
2
μA
ROUTPD5
Output Pull-Down Resistance in Shutdown
tSS5
Soft-Start Time
Boost Regulator Off
10
kΩ
500
μs
1A Buck-Boost Regulator
IVIN6
PWM Mode
Burst Mode Operation
VOUT6(LOW)
Minimum Regulated Output Voltage
VOUT6(HIGH)
Maximum Regulated Output Voltage
IFWD6
Forward Current Limit
IPEAK6
IZERO6
VFB6 = 0.85V (Note 4, 5)
VFB6 = 0.85V(Note 4, 5)
220
20
400
40
2.65
2.8
μA
μA
V
5.25
5.65
PWM Mode (Note 6)
2.1
2.65
3.2
A
Peak Current Limit
Burst Mode Operation (Note 6)
200
275
350
mA
Zero Current Limit
Burst Mode Operation
VFB6(HIGH)
Feedback Regulation Voltage
PWM Mode Full-Scale (1,1,1,1)
l
VFB6(LOW)
Feedback Regulation Voltage
PWM Mode Full-Scale (0,0,0,0)
l
VLSB6
FB6 Regulation Voltage Step Size
V
–30
0
30
mA
780
800
820
mV
405
425
445
mV
25
mV
3675f
5
LTC3675
ELECTRICAL CHARACTERISTICS
The l denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. VIN = 3.6V.
SYMBOL
PARAMETER
CONDITIONS
IFB6
Feedback Leakage Current
VFB6 = 0.85V
DC6BUCK(MAX)
Maximum Buck Duty Cycle
Duty Cycle of PMOS Switch A
DC6BOOST(MAX) Maximum Boost Duty Cycle
MIN
TYP
–50
l
MAX
50
100
UNITS
nA
%
Duty Cycle of NMOS Switch C
75
%
RPMOS6
PMOS On-Resistance
Switches A and D
260
mΩ
RNMOS6
NMOS On-Resistance
Switches B and C
275
mΩ
ILEAKP
PMOS Switch Leakage Current
–2
2
μA
ILEAKN
NMOS Switch Leakage Current
–2
2
μA
tSS
Soft-Start Time
ROUTPD6
Output Pull-Down Resistance in Shutdown
ENBB = 0
500
μs
10
kΩ
LED Driver; RLED_FS = 20kΩ
IVIN7
Input Current (MODE0 = MODE1 = 0)
VLED_OV
LED Overvoltage Threshold
Feedback Voltage
VLED_FS
LED Full-Scale Voltage
VLED1,2
LED Pin Regulation Voltage
VLED1,2_CLMP
LED Regulation Voltage Clamp
LED_OV = 0.85V (Notes 4, 5)
Operating in LED Mode
Operating in Boost Mode
l
l
l
700
1000
μA
805
770
825
800
845
830
mV
mV
775
800
825
mV
(Note 7)
300
l
6.0
(Note 6)
mV
8.3
V
ILIM7
Maximum Current Limit
1.6
1.85
2.15
A
ILED_FS
LED Full-Scale Current
l
23.25
25.0
26.75
mA
ILED_2FS
LED Full Current High Current Mode
l
46.5
50
53.5
mA
ILED_MATCH
LED1 and LED2 Current Matching at
Full-Scale
1
%
|I LED1 − I LED2 |
⎛ I LED1 + I LED2 ⎞
⎜⎝
⎟⎠
2
• 100
l
ILED_LSB
LED Current LSB
98
μA
RNMOS7
NMOS On-Resistance
300
mΩ
ILEAK_NMOS7
NMOS Switch Leakage
FLEDOSC
Oscillator Frequency
DCMAX7
Maximum Duty Cycle
VSW7 = 5.5V
–1
l
450
NMOS Switch
562.5
1
μA
675
kHz
97
%
25mA Always-On LDO
VLDOFB
Feedback Regulation Voltage
RDO
Dropout Resistance
l
780
800
820
12
mV
Ω
I2C Port
DVCC
Input Supply Voltage
IDVCC
Input Supply Current
DVCC_UVLO
DVCC UVLO
ADDRESS
LTC3675 I2C Address
l
1.6
SCL/SDA= 0kHz
0.3
5.5
V
1
μA
1
l
V
0001001[R/WB]
VIH
Input High Voltage
SDA/SCL
70
%DVCC
VIL
Input Low Voltage
SDA/SCL
30
%DVCC
IIH
Input High Current
SDA/SCL
–1
0
IIL
Input Low Current
SDA/SCL
–1
0
VOL_SDA
SDA Output Low Voltage
ISDA = 3mA
fSCL
Clock Operating Frequency
1
μA
1
μA
0.4
V
400
kHz
3675f
6
LTC3675
ELECTRICAL CHARACTERISTICS
The l denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. VIN = 3.6V.
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
tBUF
Bus Free Time Between Stop and Start
Condition
1.3
μs
tHD_SDA
Hold Time After Repeated Start Condition
0.6
μs
tSU_STA
Repeated Start Condition Set-Up Time
0.6
μs
tSU_STO
Stop Condition Set-Up Time
0.6
μs
tHD_DAT(O)
Data Hold Time Output
0
tHD_DAT(I)
Data Hold Time Input
0
ns
tSU_DAT
Data Set-Up Time
100
ns
tLOW
SCL Clock Low Period
1.3
μs
tHIGH
SCL Clock High Period
0.6
μs
tf
Clock/Data Fall Time
CB = Capacitance of One Bus Line (pF)
20+0.1CB
300
ns
tr
Clock/Data Rise Time
CB = Capacitance of One Bus Line (pF)
20+0.1CB
300
ns
tSP
Input Spike Suppression Pulse Width
50
ns
1
μA
100
400
mV
800
1200
mV
900
UNITS
ns
Interface Logic Pins (PBSTAT, WAKE, RSTB, IRQB, ONB)
ILK(HIGH)
Output High Leakage Current
3.6V at Pin
VOL
Output Low Voltage
3mA into Pin
VONB(HIGH)
ONB High Threshold
VONB(LOW)
ONB Low Threshold
–1
400
700
400
650
mV
Interface Logic Pins (EN1, EN2, EN3, EN4, ENBB)
VHI_ALLOFF
Enable Rising Threshold
VEN_HYS
Enable Falling Hysteresis
All Regulators and LED Driver Disabled
l
l
1200
60
VHI
Enable Rising Threshold
At Least One Regulator/LED Driver Enabled
IEN
Enable Pin Leakage Current
EN = 3.6V
380
–1
WAKE High
28
280
400
mV
mV
420
mV
1
μA
50
72
ms
400
520
ms
Pushbutton Parameters; CT = 0.01μF
tONB_LO
ONB Low Time to PBSTAT Low
tONB_WAKE
ONB Low Time to WAKE High
tONB_HR
ONB Low to Hard Reset
3.5
5
6.5
sec
tHR
Time for Which All Enabled Regulators are
Disabled
0.7
1
1.3
sec
tPBSTAT_PW
PBSTAT Minimum Pulse Width
28
50
72
ms
tWAKE_ON
WAKE High Time
3.5
5
6.5
sec
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2: The LTC3675 is guaranteed to meet performance specifications
from the 0°C to 125°C operating junction temperature range. Specifications
over the –40°C to 125°C operating junction temperature range are assured
by design, characterization and correlation with statistical process controls.
Note 3: The LTC3675 includes overtemperature protection which protects
the device during momentary overload conditions. Junction temperature
will exceed 125°C when overtemperature protection is active. Continuous
operation above the specified maximum operating junction temperature
may impair device reliability.
Note 4: Static current, switches not switching. Actual current may be
higher due to gate charge losses at the switching frequency.
Note 5: Currents measured at a specific VIN pin. Buck 1 (VIN, Pin 6);
Buck 2 (VIN, Pin 7); Buck 3 and Buck 4 (VIN, Pin 10); Boost and Buck
Boost (VIN, Pin 34); LED driver (VIN, Pin 31).
Note 6: The current limit features of this part are intended to protect the
IC from short term or intermittent fault conditions. Continuous operation
above the maximum specified pin current rating may result in device
degradation over time.
Note 7: With dual string operation, the LED pin with the lower voltage sets
the regulation point.
3675f
7
LTC3675
TYPICAL PERFORMANCE CHARACTERISTICS
Undervoltage Threshold
vs Temperature
Input Supply Current
vs Temperature
2.50
ALL REGULATORS AND LED
45 DRIVER IN SHUTDOWN
IVIN_ALLOFF (μA)
VIN_RISING
2.55
2.50
VIN_FALLING
2.45
40
2.40
35
2.35
30
25
VIN = 3.6V
20
15
2.40
2.35
5
2.30
–55 –35 –15
0
–55 –35 –15
420
ALL REGULATORS AND LED
DRIVER DISABLED, VIN = 3.6V
EN THRESHOLD (mV)
EN THRESHOLD (V)
800
EN RISING
550
EN FALLING
2.00
–55 –35 –15
5 25 45 65 85 105 125
TEMPERATURE (°C)
1A Buck Regulators,
Efficiency vs Load
100
80
410
405
EN RISING
400
EN FALLING
395
70
60
50
40
VIN = 2.7V Burst Mode OPERATION
VIN = 3.6V Burst Mode OPERATION
VIN = 5.5V Burst Mode OPERATION
VIN = 2.7V PULSE SKIPPING-MODE
VIN = 3.6V PULSE SKIPPING-MODE
VIN = 5.5V PULSE SKIPPING-MODE
30
390
20
385
450
10
380
–55 –35 –15
5 25 45 65 85 105 125
TEMPERATURE (°C)
0
5 25 45 65 85 105 125
TEMPERATURE (°C)
1A Buck Regulators,
Load Regulation
1.220
90
1.216
80
1.212
70
1.208
60
1.204
VOUT = 2.5V
VIN = 2.7V Burst Mode OPERATION
30
VIN = 3.6V Burst Mode OPERATION
VIN = 5.5V Burst Mode OPERATION
20
VIN = 2.7V PULSE SKIPPING-MODE
VIN = 3.6V PULSE SKIPPING-MODE
10
VIN = 5.5V PULSE SKIPPING-MODE
0
1
10
100
1000
LOAD CURRENT (mA)
3675 G06
VOUT1 (V)
100
40
10
100
LOAD CURRENT (mA)
1000
3675 G06
1A Buck Regulators,
Line Regulation
1.220
PULSE-SKIPPING MODE
1.216
1.208
VIN = 5.5V
VIN = 2.7V
1.200
VIN = 3.6V
1.196
1.200
1.196
1.192
1.188
1.188
1.184
1.184
1
10
100
LOAD CURRENT (mA)
1000
3675 G08
LOAD = 500mA
1.204
1.192
1.180
PULSE-SKIPPING MODE
1.212
VOUT1 (V)
1A Buck Regulators,
Efficiency vs Load
50
1
3675 G05
3675 G04
EFFICIENCY (%)
VOUT = 1.2V
90
500
400
–55 –35 –15
5 25 45 65 85 105 125
TEMPERATURE (°C)
3675 G03
THRESHOLD MEASURED WITH A
REGULATOR ENABLED, VIN = 3.6V
415
600
VIN = 2.7V
2.10
Enable Pin Precision Threshold
vs Temperature
900
650
2.20
3675 G02
Enable Threshold vs Temperature
700
VIN = 3.6V
2.25
2.05
3675 G01
750
VIN = 5.5V
2.30
2.15
VIN = 2.7V
10
5 25 45 65 85 105 125
TEMPERATURE (°C)
VIN = 5.5V
EFFICIENCY (%)
2.60
2.45
fOSC (MHz)
2.65
UV THRESHOLD (V)
Oscillator Frequency
vs Temperature
50
2.70
850
TA = 25°C, unless otherwise noted.
1.180
2.7
LOAD = 100mA
3.1
3.5
3.9 4.3
VIN (V)
4.7
5.1
5.5
3675 G09
3675f
8
LTC3675
TYPICAL PERFORMANCE CHARACTERISTICS
1A Buck Regulators, Transient
Response (Pulse-Skipping Mode)
TA = 25°C, unless otherwise noted.
1A Buck Regulators, No Load
Start-Up Transient
(Pulse-Skipping Mode)
1A Buck Regulators, Transient
Response (Burst Mode Operation)
VIN = 3.6V
VOUT1
100mV/DIV
AC-COUPLED
VOUT1
100mV/DIV
AC-COUPLED
VOUT1
500mV/DIV
INDUCTOR
CURRENT
200mA/DIV
INDUCTOR
CURRENT
200mA/DIV
INDUCTOR
CURRENT
500mA/DIV
0mA
0mA
EN1
2V/DIV
50μs/DIV
LOAD STEP = 100mA TO 700mA
VIN = 3.6V, VOUT1 = 1.2V
3675 G10
1A Buck Regulators, Switch
RDSON vs Temperature
1.25
3.6
PULSE-SKIPPING MODE
1.24 LOAD = 500mA
0.60
3.4
0.55
1.23
3.2
0.50
1.22
3.0
1.20
VIN = 5.5V
VIN = 3.6V
1.19
1.18
2.8
VIN = 3.6V
2.6
VIN = 2.7V
2.4
2.0
1.16
1.8
1.15
–55 –35 –15
1.6
–55 –35 –15
0.05
100
1.830
90
1.825
500mA Buck Regulators,
Line Regulation
1.830
PULSE-SKIPPING MODE
1.825
10
1
10
100
LOAD CURRENT (mA)
1000
3675 G16
1.810
VIN = 5.5V
1.805
VOUT3 (V)
VOUT3 (V)
VOUT3 = 1.8V
VIN = 2.7V Burst Mode OPERATION
VIN = 3.6V Burst Mode OPERATION
VIN = 5.5V Burst Mode OPERATION
VIN = 2.7V PULSE SKIPPING-MODE
VIN = 3.6V PULSE SKIPPING-MODE
VIN = 5.5V PULSE SKIPPING-MODE
1.815
VIN = 3.6V
1.810
50
1.800
VIN = 2.7V
1.795
1.800
1.795
1.790
1.785
1.785
1.780
1.780
1.775
1.775
1
10
100
LOAD CURRENT (mA)
1000
3675 G17
LOAD = 250mA
1.805
1.790
1.770
PULSE-SKIPPING MODE
1.820
1.815
70
5 25 45 65 85 105 125
TEMPERATURE (°C)
3675 G15
1.820
80
0
0
–55 –35 –15
5 25 45 65 85 105 125
TEMPERATURE (°C)
500mA Buck Regulators,
Load Regulation
60
NMOS RDSON, VIN = 5.5V
PMOS RDSON, VIN = 5.5V
3675 G14
500mA Buck Regulators,
Efficiency vs Load
20
0.25
0.10
3675 G13
30
0.30
0.15
1.17
40
0.40 NMOS R
DSON, VIN = 2.7V
0.35
0.20
2.2
5 25 45 65 85 105 125
TEMPERATURE (°C)
PMOS RDSON, VIN = 2.7V
0.45
VIN = 5.5V
RDSON (Ω)
VIN = 2.7V
1.21
3675 G12
25μs/DIV
1A Buck Regulators, PMOS
Current Limit vs Temperature
IFWD1, 2 (A)
VOUT1 (V)
1A Buck Regulators,
VOUT1 vs Temperature
EFFICIENCY (%)
3675 G11
50μs/DIV
LOAD STEP = 100mA TO 700mA
VIN = 3.6V, VOUT1 = 1.2V
1.770
2.7
LOAD = 50mA
3.1
3.5
3.9 4.3
VIN (V)
4.7
5.1
5.5
3675 G18
3675f
9
LTC3675
TYPICAL PERFORMANCE CHARACTERISTICS
500mA Buck Regulators Transient
Response (Pulse-Skipping Mode)
TA = 25°C, unless otherwise noted.
500mA Buck Regulators No Load
Start-Up Transient
(Pulse-Skipping Mode)
500mA Buck Regulators Transient
Response (Burst Mode Operation)
VIN = 3.6V
VOUT3
100mV/DIV
AC-COUPLED
VOUT3
100mV/DIV
AC-COUPLED
INDUCTOR
CURRENT
100mA/DIV
INDUCTOR
CURRENT
100mA/DIV
VOUT3
500mV/DIV
3675 G20
50μs/DIV
500mA Buck Regulators,
VOUT3 vs Temperature
500mA Buck Regulators, PMOS
Current Limit vs Temperature
PULSE-SKIPPING MODE, LOAD = 250mA
1.88
1.50
1.0
1.45
0.9
1.78
1.76
VIN = 3.6V
1.25
VIN = 5.5V
1.20
1.15
VIN = 3.6V
1.10
VIN = 2.7V
0.95
1.70
–55 –35 –15
0.90
–55 –35 –15
90
5.20
90
5.15
70
65
PULSE-SKIPPING MODE
60
5.10
60
50
VOUT5 = 5V
VIN = 2.7V Burst Mode OPERATION
VIN = 3.6V Burst Mode OPERATION
VIN = 1.2V Burst Mode OPERATION
VIN = 2.7V PWM MODE
VIN = 3.6V PWM MODE
VIN = 4.2V PWM MODE
40
30
55
20
50
10
45
1
10
100
1000
LOAD CURRENT (mA)
10000
3675 G25
PWM MODE
70
0
1
10
100
LOAD CURRENT (mA)
1000
3675 G26
VOUT5 (V)
EFFICIENCY (%)
EFFICIENCY (%)
Boost Regulator, Load Regulation
100
80
85
Burst Mode OPERATION
5 25 45 65 85 105 125
TEMPERATURE (°C)
3675 G24
Boost Regulator,
Efficiency vs Load
VIN = 3.6V, VOUT1 = 1.2V
75
PMOS RDSON, VIN = 5.5V
3675 G23
Ganged Buck Regulators 1 and 2,
Efficiency vs Load
80
NMOS RDSON, VIN = 5.5V
0
–55 –35 –15
5 25 45 65 85 105 125
TEMPERATURE (°C)
3675 G22
95
0.4
0.1
1.72
100
0.5
0.2
1.00
5 25 45 65 85 105 125
TEMPERATURE (°C)
0.6
0.3
VIN = 2.7V
1.05
1.74
RDSON (Ω)
IFWD3,4 (A)
1.80
NMOS RDSON, VIN = 2.7V
0.7
1.30
VIN = 5.5V
PMOS RDSON, VIN = 2.7V
0.8
1.35
1.84
40
500mA Buck Regulators, Switch
RDSON vs Temperature
1.40
1.86
1.82
3675 G21
25μs/DIV
LOAD STEP = 50mA to 300mA
VIN = 3.6V, VOUT3 = 1.8V
LOAD STEP = 50mA to 300mA
VIN = 3.6V, VOUT3 = 1.8V
VOUT3 (V)
EN
2V/DIV
3675 G19
50μs/DIV
1.90
INDUCTOR
CURRENT
500mA/DIV
VIN = 3.6V
5.05
VIN = 4.2V
5.00
4.95
VIN = 2.7V
4.90
4.85
4.80
1
10
100
LOAD CURRENT (mA)
1000
3675 G27
3675f
10
LTC3675
TYPICAL PERFORMANCE CHARACTERISTICS
Boost Regulator Transient
Response (PWM Mode)
Boost Regulator, Line Regulation
5.020
PWM MODE
5.016
VOUT5
100mV/DIV
AC-COUPLED
5.012
VOUT5 (V)
5.008
LOAD = 500mA
5.004
5.000
LOAD = 100mA
INDUCTOR
CURRENT
200mA/DIV
4.996
4.992
4.988
200μs/DIV
4.984
4.980
2.7
3.1
3.5
3.9 4.3
VIN (V)
4.7
5.1
3675 G29
LOAD STEP = 100mA to 600mA
VIN = 3.6V, VOUT5 = 5V
5.5
3675 G28
Boost Regulator Transient
Response (Burst Mode Operation)
Boost Regulator, No Load
Start-Up Transient, PWM Mode
VIN = 3.6V
VOUT5
100mV/DIV
AC-COUPLED
VOUT5
2V/DIV
INDUCTOR
CURRENT
500mA/DIV
INDUCTOR
CURRENT
500mA/DIV
0mA
3675 G30
50μs/DIV
50μs/DIV
3675 G31
LOAD STEP = 100mA to 600mA
VIN = 3.6V, VOUT5 = 5V
Boost Regulator,
VOUT5 vs Temperature
5.10
Boost Regulator, Forward Current
Limit vs Temperature
PWM MODE, LOAD = 500mA
5.08
5.06
VIN = 3.6V
5.02
IFWD5 (A)
VOUT5 (V)
5.04
5.00
4.98
4.96
4.94
VIN = 2.7V
VIN = 4.2V
4.92
4.90
–55 –35 –15
5 25 45 65 85 105 125
TEMPERATURE (°C)
3675 G32
3.50
3.45
3.40
3.35
3.30
VIN = 3.6V
3.25
3.20
VIN = 4.2V
3.15
3.10
VIN = 2.7V
3.05
3.00
2.95
2.90
2.85
2.80
–55 –35 –15 5 25 45 65 85 105 125
TEMPERATURE (°C)
3675 G33
3675f
11
LTC3675
TYPICAL PERFORMANCE CHARACTERISTICS
Buck-Boost Regulator,
Load Regulation
Buck-Boost Regulator,
Efficiency vs Load
100
3.35
90
3.34
3.33
70
VIN = 3.6V
VIN = 2.7V
60
3.32
VOUT6 (V)
EFFICIENCY (%)
80
VIN = 5.5V
50
40
30
VIN = 4.2V
3.31
3.30
VIN = 2.7V
3.29
VIN = 3.6V
3.28
20
Burst Mode OPERATION
3.27
10
PWM MODE
3.26
0
PWM MODE
1
10
100
LOAD CURRENT (mA)
3.25
1000
1
1000
10
100
LOAD CURRENT (mA)
3675 G34
3675 G35
Buck-Boost Regulator Transient
Response (PWM Mode)
Buck-Boost Regulator,
Line Regulation
3.40
PWM MODE
VOUT6
200mV/DIV
AC-COUPLED
3.38
3.36
VOUT6 (V)
3.34
3.32
LOAD = 500mA
3.30
LOAD = 100mA
INDUCTOR
CURRENT
200mA/DIV
3.28
3.26
3.24
3675 G37
200μs/DIV
3.22
3.20
2.7
3.1
3.5
3.9 4.3
VIN (V)
4.7
LOAD STEP = 100mA to 600mA
VIN = 3.6V, VOUT6 = 3.3V
5.5
5.1
3675 G36
Buck-Boost Regulator No Load
Start-Up (PWM Mode)
Buck-Boost Regulator, Reduction
in Load Current Deliverability
400
PWM MODE
350 VOUT6 = 3.3V
REDUCTION BELOW 1A (mA)
VIN = 3.6V
VOUT6
1V/DIV
INDUCTOR
CURRENT
500mA/DIV
EN6
2V/DIV
100μs/DIV
3675 G38
300
250
200
150
100
50
0
2.7
3
3.3
3.6
VIN (V)
3.9
4.2
3675 G39
3675f
12
LTC3675
TYPICAL PERFORMANCE CHARACTERISTICS
Buck-Boost Regulator, Forward
Current Limit vs Temperature
Buck-Boost Regulator,
VOUT6 vs Temperature
2.90
0.60
3.38
2.85
0.55
3.36
2.80
3.34
2.75
VIN = 5.5V
3.32
3.30
VIN = 3.6V
3.28
VIN = 2.7V
3.26
0.50
0.40
2.70
VIN = 2.7V
VIN = 3.6V
2.65
2.60
VIN = 4.2V
3.24
2.50
3.22
2.45
3.20
–55 –35 –15
2.40
–55 –35 –15
90
LED Driver, Forward Current Limit
vs Temperature
2.05
2.00
VIN = 2.7V
70
1.95
60
IFWD6 (A)
70
50
40
1.85
30
20
20
1.70
10
10
0
1000
10
100
DAC CODE (DECIMAL)
1
10.25
SINGLE LED STRING CURRENT
MODE0 = MODE1 = 0
1.220
90
1.215
10.10
70
VIN = 5.5V
VIN = 2.7V
EFFICIENCY (%)
80
10.05
40
9.85
20
9.80
10
0
3675 G46
1.210
VIN = 3.6V
50
30
5 25 45 65 85 105 125
TEMPERATURE (°C)
VIN = 5.5V
VIN = 2.7V
60
9.90
9.75
–55 –35 –15
Always-On LDO, Load Regulation
100
10.15
9.95
3675 G45
High Voltage Boost Regulator,
Efficiency vs Load
VIN = 3.6V
5 25 45 65 85 105 125
TEMPERATURE (°C)
3675 G44
LED Driver, LED Current
vs Temperature
10.00
1.60
–55 –35 –15
1000
10
100
DAC CODE (DECIMAL)
3675 G43
10.20
1.65
RLED_FS = 20kΩ
VOUT (V)
1
VIN = 5.5V
1.80
1.75
RLED_FS = 20kΩ
VIN = 3.6V
VIN = 2.7V
1.90
30
0
5 25 45 65 85 105 125
TEMPERATURE (°C)
3675 G42
VIN = 4.2V
80
EFFICIENCY (%)
EFFICIENCY (%)
0
–55 –35 –15
5 25 45 65 85 105 125
TEMPERATURE (°C)
2.10
90
VIN = 4.2V
40
NMOS RDSON, VIN = 4.2V
0.05
100
VIN = 2.7V
PMOS RDSON, VIN = 4.2V
0.10
LED Driver, Dual String Efficiency,
4 LEDs per String
100
50
0.25
3675 G41
LED Driver, Dual String Efficiency,
10 LEDs per String
60
0.30
0.15
3675 G40
80
PMOS RDSON, VIN = 2.7V
0.35
0.20
2.55
5 25 45 65 85 105 125
TEMPERATURE (°C)
NMOS RDSON, VIN = 2.7V
0.45
RDSON (Ω)
PWM MODE, LOAD = 500mA
IFWD6 (A)
VOUT6 (V)
3.40
ILED (mA)
Buck-Boost Regulator, Switch
RDSON vs Temperature
1.205
1.200
1.195
VIN = 2.7V
VIN = 5.5V
VIN = 3.6V
1.190
1.185
MODE1 = 1, MODE0 = 0
VOUT = 12V
1
10
100
LOAD CURRENT (mA)
1000
3675 G47
1.180
0.1
1
10
LOAD CURRENT (mA)
100
3675 G48
3675f
13
LTC3675
PIN FUNCTIONS
EN1 (Pin 1): Buck Regulator 1 Enable Input. Active
high.
EN4 (Pin 13): Buck Regulator 4 Enable Input. Active
high.
FB1 (Pin 2): Buck Regulator 1 Feedback Pin. Receives feedback by a resistor divider connected across the output.
FB4 (Pin 14): Buck Regulator 4 Feedback Pin. Receives
feedback by a resistor divider connected across the output.
Connecting FB4 to VIN combines buck regulator 4 with
buck regulator 3 for higher current.
FB2 (Pin 3): Buck Regulator 2 Feedback Pin. Receives
feedback by a resistor divider connected across the output.
Connecting FB2 to VIN combines buck regulator 2 with
buck regulator 1 for higher current.
EN2 (Pin 4): Buck Regulator 2 Enable Input. Active
high.
SW1 (Pin 5): Buck Regulator 1 Switch Node. External
inductor connects to this pin.
VIN (Pin 6): Buck Regulator 1 Input Supply. A 10μF decoupling capacitor to GND is recommended. Must be connected
to all other VIN supply pins (Pins 7, 10, 31, 34, 40).
VIN (Pin 7): Buck Regulator 2 Input Supply. A 10μF decoupling capacitor to GND is recommended. Must be connected
to all other VIN supply pins (Pins 6, 10, 31, 34, 40).
SW2 (Pin 8): Buck Regulator 2 Switch Node. External
inductor connects to this pin.
SW3 (Pin 9): Buck Regulator 3 Switch Node. External
inductor connects to this pin.
VIN (Pin 10): Buck Regulators 3 and 4 Input Supply. A
10μF decoupling capacitor to GND is recommended.
Must be connected to all other VIN supply pins (Pins 6,
7, 31, 34, 40).
SW4 (Pin 11): Buck Regulator 4 Switch Node. External
inductor connects to this pin.
EN3 (Pin 12): Buck Regulator 3 Enable Input. Active
high.
FB3 (Pin 15): Buck Regulator 3 Feedback Pin. Receives
feedback by a resistor divider connected across the output.
Connecting FB3 to VIN combines buck regulator 3 with
buck regulator 2 for higher current.
LED_OV (Pin 16): Overvoltage Protection Pin for LED
Driver.
LED1 (Pin 17): Connect a string of up to 10 LEDs to this
pin.
SW7 (Pins 18, 19, 20): LED Driver Switch Node. External
inductor connects to these pins.
LED2 (Pin 21): Connect a string of up to 10 LEDs to this
pin.
CT (Pin 22): Timing Capacitor Pin. A capacitor connected
to GND sets a time constant which is scaled for use by
the WAKE, RSTB and IRQB pins.
RSTB (Pin 23): Reset Pin. Open drain output. When the
regulated output voltage of any enabled switching regulator is more than 6.5% below its programmed level, this
pin is driven LOW. Assertion delay is scaled by the CT
capacitor.
IRQB (Pin 24): Interrupt Pin. Open drain output. When
undervoltage, overtemperature, or an unmasked error
condition is detected, this pin is driven LOW. Assertion
delay is scaled by the CT capacitor.
3675f
14
LTC3675
PIN FUNCTIONS
PBSTAT (Pin 25): Pushbutton Status Pin. Open drain
output. This pin provides a debounced and glitch free
status of the ONB pin.
WAKE (Pin 26): Open Drain Output. When the ONB pin
is pressed and released, the signal is debounced and the
WAKE signal is held HIGH for a minimum time period that
is scaled by the CT capacitor.
FB5 (Pin 35): Boost Regulator Feedback Pin. Receives feedback by a resistor divider connected across the output.
FB6 (Pin 36): Buck-Boost Regulator Feedback Pin. Receives feedback by a resistor divider connected across
the output.
ENBB (Pin 37): Buck-Boost Regulator Enable Input. Active high.
LED_FS (Pin 27): A resistor connected from this pin to
GND programs full-scale LED current.
SWAB6 (Pin 38): Buck-Boost Regulator Switch Pin. External inductor connects to this pin and SWCD6.
ONB (Pin 28): Pushbutton Input. Active low.
SCL (Pin 39): Clock Line for I2C Port.
LDOFB (Pin 29): LDO Feedback Pin. A resistor divider
from LDO_OUT to GND provides feedback.
VIN (Pin 40): Buck-Boost Regulator Input Supply. A 10μF
decoupling capacitor to GND is recommended. Must be
connected to all other VIN supply pins (Pins 6, 7, 10, 31,
34).
LDO_OUT (Pin 30): Output of Always-On LDO. Decouple
with a 10μF capacitor to GND.
VIN (Pin 31): Quiet Input Supply Used to Power NonSwitching Control Circuitry. A 2.2μF decoupling capacitor
to GND is recommended. Must be connected to all other
VIN supply pins (Pins 6, 7, 10, 34, 40).
SW5 (Pin 32): Boost Regulator Switch Node. External
inductor connects to this pin.
VOUT5 (Pin 33): Boost Regulator Output. Connect two
22μF capacitors to GND.
VIN (Pin 34): Quiet Input Supply Used to Power NonSwitching Control Circuitry. A 2.2μF decoupling capacitor
to GND is recommended. Must be connected to all other
VIN supply pins (Pins 6, 7, 10, 31, 40).
DVCC (Pin 41): Supply Pin for I2C Port.
VOUT6 (Pins 42): Buck-Boost Regulator Output. Connect
a 22μF capacitor to GND.
SDA (Pin 43): Serial Data Line for I2C Port. Open drain
output during readback.
SWCD6 (Pin 44): Buck-Boost Regulator Switch Pin. External inductor connects to this pin and SWAB6.
GND (Exposed Pad Pin 45): Ground for Entire Chip. Must
be soldered to PCB for electrical contact and rated thermal
performance.
3675f
15
LTC3675
BLOCK DIAGRAM
34 VIN
VIN
33 VOUT5
BOOST REGULATOR
32 SW5
35 FB5
VIN
6
SW1
5
FB1
2
EN1
1
BUCK-BOOST REGULATOR
40 VIN
BUCK REGULATOR 1
1A
42 VOUT6
A
D
MODULATION
CONTROL
MASTER/SLAVE LINES
38 SWAB6
B
44 SWCD6
C
VIN
7
SW2
8
FB2
3
EN2
4
BUCK REGULATOR 2
1A
36 FB6
VIN
REF, CLK
37 ENBB
17 LED1
MASTER/SLAVE LINES
BANDGAP,
OSCILLATOR,
UV, OT
21 LED2
MODULATION
CONTROL
SW7
18,19,
20
27 LED_FS
SW3
9
FB3 15
LED DRIVER
BUCK REGULATOR 3
500mA
31 VIN
LDO
EN3 12
VIN 10
16 LED_OV
–
+
VIN
30 LDO_OUT
MASTER/SLAVE LINES
29 LDOFB
DAC BITS, SLEW CONTROL,
GRADATION, STATUS BITS
TOP LOGIC,
CT OSCILLATOR,
TIMING
SW4 11
FB4 14
BUCK REGULATOR 4
500mA
EN4 13
41 DVCC
I2C
39 SCL
43 SDA
23 RSTB
24 IRQB
25 PBSTAT
26 WAKE
22 CT
GND
28 ONB
45
3675 BD
3675f
16
LTC3675
OPERATION
The LTC3675 has six monolithic synchronous switching
regulators and a dual string boost LED driver and is designed
to operate from a single Li-Ion battery. All of the switching
regulators and the LED driver are internally compensated
and need only external feedback resistors for regulation.
The switching regulators also offer two operating modes:
Burst Mode operation for higher efficiency at light loads
and pulse-skipping/PWM mode. In Burst Mode operation
at light loads, the output capacitor is charged to a voltage
slightly higher than its regulation point. The regulator then
goes into sleep, during which the output capacitor provides
the load current. In sleep most of the regulator’s circuitry
is powered down, helping conserve battery power. When
the output capacitor droops below its programmed value,
the circuitry is powered on and another burst cycle begins.
The sleep time decreases as load current increases.
All switching regulators and LED driver may be configured
via I2C, providing the user with the flexibility to operate the
LTC3675 in the most efficient manner. I2C commands can
also be read back via the I2C port, to ensure a command
was not corrupted during a transmission.
All the regulators can be enabled via I2C commands. The
buck regulators and the buck-boost regulator may also be
enabled via enable pins. The enable pins have two different
enable threshold voltages that depend on the operating
state of the LTC3675. With all regulators disabled, the enable pin threshold is at 650mV. If any regulator is enabled
either by its enable pin or an I2C command, then the enable pin thresholds are at 400mV. A precision comparator
detects a voltage greater than 400mV on the enable pin
and turns that regulator on. This precision threshold may
be used to sequentially enable regulators. If all regulators
are disabled, all the command registers are set in their
default state.
There are also 2 bytes of data that report any fault conditions on the LTC3675 via I2C read back.
The buck regulators can operate in either of two modes. In
pulse-skipping mode, the regulator will skip pulses at light
loads but will operate at a constant frequency of 2.25MHz
at higher loads. In Burst Mode operation, the regulator will
burst at light loads whereas at higher loads it will operate
at constant frequency PWM mode of operation, much the
same as pulse-skipping mode at high load. In shutdown,
an I2C control bit provides the flexibility to either keep the
SW node in a high impedance state or pull the SW node
to GND through a 10k resistor.
The buck regulators have forward and reverse current
limiting, soft-start to limit inrush current during start-up,
short-circuit protection and slew rate control for lower
radiated EMI.
Each buck regulator may be enabled via its enable pin or
I2C. The mode of operation, the feedback regulation voltage and switch slew rate can all be controlled via I2C. For
applications that require higher power, buck regulators
may be combined together.
BUCK REGULATORS WITH COMBINED POWER STAGES
Two adjacent buck regulators may be combined in a
master-slave configuration by connecting their SW pins
together and connecting the higher numbered buck’s FB
pin to the input supply. The lower numbered buck is always
the master. In Figure 1, buck regulator 1 is the master. The
feedback network connected to the FB1 pin programs the
VIN
L1
SW1
COUT
BUCK REGULATOR 1
(MASTER)
EN1
1.2V
2A
VOUT
400k
FB1
800k
VIN
SW2
BUCK SWITCHING REGULATOR
The LTC3675 contains four buck regulators. Two of the
buck regulators are designed to deliver up to 1A load
current each while the other two regulators can deliver
up to 500mA each.
BUCK REGULATOR 2
(SLAVE)
FB2
EN2
VIN
3675 F01
Figure 1. Buck Regulators Configured as Master-Slave
3675f
17
LTC3675
OPERATION
output voltage to 1.2V. The FB2 pin is tied to VIN, which
configures buck regulator 2 as the slave. The SW1 and
SW2 pins must be tied together. The register contents of
the master program the combined buck regulator’s behavior and the register contents of the slave are ignored.
The slave buck control circuitry draws no current. The
enable of the master buck (EN1) controls the operation
of the combined bucks, the enable of the slave regulator
(EN2) is ignored.
Buck regulators 2 and 3 may be configured as combined
buck regulators capable of delivering up to 1.5A load
current with buck regulator 2 being the master. Buck
regulators 3 and 4 may be configured as combined buck
regulators capable of delivering up to 1A load current with
buck regulator 3 being the master.
BOOST SWITCHING REGULATOR
The boost regulator is capable of delivering up to 1A load
current for a programmed output voltage of up to 5V. The
boost regulator may be enabled only via I2C. The mode
of operation, feedback regulation voltage and switch slew
rate can all be controlled via I2C.
The boost regulator can operate in either PWM mode or
in Burst Mode operation. In PWM operating mode, the
regulator operates at a constant frequency of 2.25MHz
and provides a low noise solution. For light loads, Burst
Mode operation offers improved efficiency. The boost
regulator has forward and reverse current limiting, softstart to limit inrush current during start-up, short-circuit
protection and slew rate control for lower radiated EMI.
The boost regulator also features true output disconnect
when in shutdown. In shutdown, an internal 10k resistor
pulls the output to GND.
BUCK-BOOST SWITCHING REGULATOR
The buck-boost regulator is a 2.25MHz voltage mode
regulator. The buck-boost regulator is capable of delivering
up to 1A load current for a programmed output voltage of
3.3V. The regulator can be enabled via its enable pin or via
I2C. The mode of operation, feedback regulation voltage
and switch slew rate can all be controlled via I2C.
The buck-boost regulator can operate in either PWM
mode or in Burst Mode operation. The PWM operating
mode provides a low noise solution. For light loads, Burst
Mode operation offers improved efficiency. The buck-boost
regulator has forward current limiting, soft-start to limit
inrush current during start-up, short-circuit protection
and slew rate control for lower radiated EMI.
When the output voltage is below 2.65V (typical) during
start-up, Burst Mode operation is disabled and switch D is
turned off. The forward current is carried by the switch D
well diode and there is no reverse current flowing in this
condition. In shutdown, an internal 10k resistor pulls the
output to GND.
LED DRIVER
The LED driver uses a constant frequency, current mode
boost converter to supply power to up to two strings of 10
series LEDs. The series string of LEDs is connected from
the output of the boost converter to an LED pin. The LED
pin is a programmable constant current sink. The boost
converter will regulate its output to force the LED pin to
300mV. The percentage of full-scale current sunk by the
LED pin is programmed via I2C.
The LED boost converter is designed for very high duty
cycle operation and can boost from below 3V to 40V out
at up to 55mA. The LED boost also features an overvoltage protection feature to limit the output voltage in case
of an open circuit in an LED string. The boost converter
will operate in either continuous conduction mode, discontinuous conduction mode or pulse-skipping mode
depending on the inductor current required for regulation.
The boost converter may also be configured to operate
as an independent high voltage boost regulator via I2C.
The LED driver may also be configured as a single string
LED driver. When driving a single string, LED1 and LED2
should be tied together.
The LED driver features a fully automatic gradation circuit.
This circuit allows the current to ramp up or down at a
controlled rate between any two current levels. On power-up
the LED DAC register is set to 0. To enable the LED driver
a non-zero value must be programmed into this register.
The gradation circuit will then ramp the current to the
3675f
18
LTC3675
OPERATION
programmed value at a rate determined by the gradation
rate bits. Once the LED driver reaches this value it will
regulate that current until programmed otherwise. If a
new value is programmed in the LED brightness register,
the LED driver’s current will ramp up or down at the programmed rate until that current is reached. To disable the
LED driver, a code of zero is programmed in the LED DAC
register. The gradation circuit will then ramp the current
down at the programmed rate. Once the current reaches
zero the gradation circuit will disable the boost and the
entire LED driver will enter shutdown mode.
The LED driver is protected by the LED_OV pin. This pin
acts as a secondary feedback path that limits the voltage
on the output capacitor. A feedback divider is placed from
the LED boost’s output to the LED_OV pin. Values for this
divider are selected to limit the output voltage similarly to
the feedback dividers discussed in “Switching Regulator
Output Voltage and Feedback Network” in the Applications
Information section. The LED driver begins to transition
to LED_OV control at 800mV and is fully controlled by
the LED_OV pin by 825mV. During this transition the LED
pins will begin to drop out of regulation. For this reason
during normal operation the voltage on this pin should be
kept below 800mV.
The LED driver is also designed to limit the maximum voltage on the LED1 and LED2 pins to no more than 8V. The
boost regulates the minimum voltage on either LED pin.
If one of the LED pins is shorted to ground the boost will
only drive the other LED pin up to the voltage clamp, or
the LED_OV voltage, whichever is lower. If one LED string
is shorted, or partially shorted, this clamp will prevent the
boost from damaging the LED pin.
PUSHBUTTON INTERFACE AND POWER-UP POWERDOWN SEQUENCING
The LTC3675 provides pushbutton functionality to either
power up or power down the part. The ONB, WAKE and
PBSTAT pins provide the user with flexibility to power up or
power down the part in addition to having I2C control. All
PB timing parameters are scaled using the CT pin. Times
described below apply to a nominal CT of 0.01μF.
The LTC3675 is in an off state when it is powered up with
all regulators in shutdown. The WAKE pin is LOW in the off
state. The WAKE pin will go HIGH either if ONB is pulled
LOW for 400ms or a regulator is enabled via its enable
pin or an I2C command. The WAKE pin stays in its HIGH
state for 5 seconds and then gets pulled low. WAKE will
not go HIGH again if a second regulator is subsequently
enabled. The LTC3675 is in an on state if either the WAKE
pin is HIGH or a regulator is enabled.
The PBSTAT pin reflects the status of the ONB when
the LTC3675 is in an on state. Once in the on state, the
LTC3675 can be powered down by holding ONB LOW for
at least 5 seconds. All enabled regulators will be turned
off for 1 second and the contents of the program registers
are reset to their default state. This manner of power-down
is called a hard reset. A hard reset may also be generated
by using an I2C command.
POWER-UP AND POWER-DOWN VIA PUSHBUTTON
The LTC3675 may be turned on and off using the WAKE
pin as shown in Figures 2a and 2b. In Figures 2a and 2b,
pressing ONB low at time t1, causes the WAKE pin to go
high at time t2 and stay high for 5 seconds, after which
WAKE is pulled low. WAKE going HIGH at t2 causes buck
regulator 1 to power up, which sequentially powers up
the other buck regulators. The RSTB pin gets pulled HIGH
200ms after the last enabled buck is in its PGOOD state.
An application showing sequential regulator start-up is
shown in the Typical Applications section (Figure 7).
If an I2C command is written before the 5 second WAKE
period t3 to keep the buck regulators enabled, the regulators stay enabled as shown in Figure 2b. Otherwise, when
WAKE gets pulled low at t3, the buck regulators will also
power down sequentially as shown in Figure 2a.
In Figure 2b, ONB is held LOW at instant t4 for 5 seconds.
This causes a hard reset to be generated and at t5, all
regulators are powered down.
3675f
19
LTC3675
OPERATION
ONB
5 sec
WAKE
(TIED TO EN1)
PBSTAT
(Hi-Z)
SEQUENCE UP
SEQUENCE DOWN
BUCKS 1–4
RSTB
3675 F02a
t3 (BUCK REGULATOR’S ENABLE IS NOT
REINFORCED BY I2C BEFORE t3)
t1 t2
Figure 2a. Power-Up Using WAKE (Sequenced Power-Up, Figure 7)
ONB
5 sec
WAKE
PBSTAT
SEQUENCE UP
BUCKS 1–4
RSTB
3675 F02b
t1 t2
t3
t4
t5
(BUCK REGULATOR 1 IS
ENABLED VIA I2C, BEFORE t3)
Figure 2b. Power-Up Using WAKE and Power-Down Due to Hard Reset (Sequenced Power-Up, Figure 7)
ONB
(Hi-Z)
WAKE
PBSTAT
(Hi-Z)
EN1
BUCK 1
3675 F02c
RSTB
t1
t2
t3
t4
Figure 2c. Power-Up Using an Enable Pin and Power-Down Due to I2C Generated Hard Reset
3675f
20
LTC3675
OPERATION
POWER-UP AND POWER-DOWN VIA ENABLE PIN OR I2C
code of 64h will result in a LED current of 19.6mA and
a full-scale setting of FFh will result in an LED current of
50mA. The 2xFS mode is only intended for use when the
output voltage is below 20V.
With the LTC3675 in its off state, a regulator can be enabled
either via its enable pin or I2C. In Figure 2c, buck regulator 1
is enabled via its enable pin at time t1. The WAKE pin goes
HIGH for 5 seconds and at t2 is pulled LOW. The buck
regulator stays enabled until time t3 when a hard reset
command is issued via I2C. The buck regulator powers
down and stays off for 1 second. At time t4, the LTC3675
exits from the power down state. Since the buck regulator 1 is still enabled via its enable pin, it powers back up.
WAKE also gets pulled HIGH for 5 seconds. The RSTB
pin gets pulled HIGH 200ms after the buck regulator 1 is
in its PGOOD state.
I2C INTERFACE
The LTC3675 may communicate with a bus master using
the standard I2C 2-wire interface. The timing diagram
(Figure 2) shows the relationship of the signals on the
bus. The two bus lines, SDA and SCL, must be high
when the bus is not in use. External pull-up resistors or
current sources, such as the LTC1694 SMBus accelerator,
are required on these lines. The LTC3675 is both a slave
receiver and slave transmitter. The I2C control signals,
SDA and SCL are scaled internally to the DVCC supply.
DVCC should be connected to the same power supply as
the bus pull-up resistors.
LED CURRENT PROGRAMMING
The LED current is primarily controlled through the LED
DAC register at I2C sub-address 8. This register controls
an 8 bit current DAC. A 20k resistor placed between the
LED_FS pin and ground provides a current reference for the
DAC which results in 98μA of programmed LED current per
LSB. For example, programming a LED DAC register code
of 64h will result in a LED current of 9.8mA and a full-scale
setting of FFh will result in a LED current of 25mA.
The I2C port has an undervoltage lockout on the DVCC pin.
When DVCC is below 1V, the I2C serial port is cleared and the
LTC3675 registers are set to their default configurations.
I2C Bus Speed
The I2C port is designed to be operated at speeds of up
to 400kHz. It has built-in timing delays to ensure correct
operation when addressed from an I2C compliant master
device. It also contains input filters designed to suppress
glitches should the bus become corrupted.
The 2xFS bit which is bit 3 of the LED configuration register at sub-address 7 effectively doubles the programmed
LED current. With a 20k resistor from LED_FS to ground
each LSB will be 196μA. Programming a LED DAC register
DATA BYTE A
ADDRESS
DATA BYTE B
WR
A7
0
0
0
1
0
0
1
0
SDA
0
0
0
1
0
0
1
0
ACK
SCL
1
2
3
4
5
6
7
8
9
A6
A5
A4
A3
A2
A1
A0
B7
B6
B5
B4
B3
B2
B1
B0
START
STOP
ACK
1
2
3
4
5
6
7
8
9
ACK
1
2
3
4
5
6
7
8
9
SDA
tSU, STA
tSU, DAT
tLOW
tHD, STA
tHD, DAT
tBUF
tSU, STO
3675 F03
SCL
tHIGH
tHD, STA
START
CONDITION
tr
tSP
tf
REPEATED START
CONDITION
STOP
CONDITION
START
CONDITION
Figure 3. I2C Bus Operation
3675f
21
LTC3675
OPERATION
I2C Start and Stop Conditions
I2C Slave Address
A bus master signals the beginning of communications
by transmitting a START condition. A START condition is
generated by transitioning SDA from HIGH to LOW while
SCL is HIGH. The master may transmit either the slave
write or the slave read address. Once data is written to the
LTC3675, the master may transmit a STOP condition which
commands the LTC3675 to act upon its new command set.
A STOP condition is sent by the master by transitioning
SDA from LOW to HIGH while SCL is HIGH. The bus is
then free for communication with another I2C device.
The LTC3675 responds to a 7-bit address which has been
factory programmed to b’0001001[R/WB]’. The LSB of
the address byte, known as the read/write bit, should be 0
when writing data to the LTC3675 and 1 when reading data
from it. Considering the address as an 8-bit word, the write
address is 12h and the read address is 13h. The LTC3675
will acknowledge both its read and write address.
I2C Byte Format
Each byte sent to or received from the LTC3675 must
be 8 bits long followed by an extra clock cycle for the
acknowledge bit. The data should be sent to the LTC3675
most significant bit (MSB) first.
I2C Acknowledge
The acknowledge signal is used for handshaking between
the master and the slave. When the LTC3675 is written
to (write address), it acknowledges its write address as
well as the subsequent two data bytes. When it is read
from (read address), the LTC3675 acknowledges its read
address only. The bus master should acknowledge receipt
of information from the LTC3675.
An acknowledge (active LOW) generated by the LTC3675
lets the master know that the latest byte of information was
received. The acknowledge related clock pulse is generated
by the master. The master releases the SDA line (HIGH)
during the acknowledge clock cycle. The LTC3675 pulls
down the SDA line during the write acknowledge clock
pulse so that it is a stable LOW during the HIGH period
of this clock pulse.
When the LTC3675 is read from, it releases the SDA line
so that the master may acknowledge receipt of the data.
Since the LTC3675 only transmits one byte of data during
a read cycle, a master not acknowledging the data sent
by the LTC3675 has no I2C specific consequence on the
operation of the I2C port.
I2C Sub-Addressed Writing
The LTC3675 has twelve command registers for control
input. They are accessed by the I2C port via a sub-addressed writing system.
A single write cycle of the LTC3675 consists of exactly three
bytes except when a clear interrupt command is written.
The first byte is always the LTC3675’s write address. The
second byte represents the LTC3675’s sub-address. The
sub-address is a pointer which directs the subsequent
data byte within the LTC3675. The third byte consists of
the data to be written to the location pointed to by the
sub-address. The LTC3675 contains 11 control registers
which can be written to.
I2C Bus Write Operation
The master initiates communication with the LTC3675
with a START condition and the LTC3675’s write address.
If the address matches that of the LTC3675, the LTC3675
returns an acknowledge. The master should then deliver
the sub-address. Again the LTC3675 acknowledges and
the cycle is repeated for the data byte. The data byte is
transferred to an internal holding latch upon the return of
its acknowledge by the LTC3675. This procedure must be
repeated for each sub-address that requires new data. After
one or more cycles of [ADDRESS][SUB-ADDRESS][DATA],
the master may terminate the communication with a STOP
condition. Multiple sub addresses may be written to with
a single address command using a [ADDRESS][SUBADDRESS][DATA][SUB-ADDRESS][DATA] sequence.
Alternatively, a REPEAT-START condition can be initiated
by the master and another chip on the I2C bus can be
addressed. This cycle can continue indefinitely and the
LTC3675 will remember the last input of valid data that it
3675f
22
LTC3675
OPERATION
Table 1. Summary of I2C Sub-Addresses and Byte Formats. Bits A7, A6, A5, A4 of Sub-Address Need to Be 0 to Access Registers
SUB-ADDRESS
OPERA7A6A5A4A3A2A1A0 ATION ACTION
0000 0000 (00h)
Write No Register
Selected
0000 0001 (01h)
Read/ Buck1 Register
Write
0000 0010 (02h)
Read/ Buck2 Register
Write
0000 0011 (03h)
Read/ Buck3 Register
Write
0000 0100 (04h)
Read/ Buck4 Register
Write
0000 0101 (05h)
Read/ Boost Register
Write
0000 0110 (06h)
Read/ Buck-Boost
Write Register
0000 0111 (07h)
Read/ LED
Write Configuration
Register
0000 1000 (08h)
Read/ LED DAC
Write Register
0000 1001 (09h)
Read/ UVOT Register
Write
0000 1010 (0Ah)
Read/ RSTB Mask
Write Register
0000 1011 (0Bh)
Read/ IRQB Mask
Write Register
0000 1100 (0Ch)
Read Status Register
(Real Time)
0000 1101 (0Dh)
Read Status Register
(Latched)
0000 1111 (0Fh)
Write Clear Interrupt
BYTE FORMAT
D7D6D5D4D3D2D1D0
Enable, OUT_Hi-Z, Mode, Slow, DAC[3],
DAC[2], DAC[1], DAC[0]
Enable, OUT_Hi-Z, Mode, Slow, DAC[3],
DAC[2], DAC[1], DAC[0]
Enable, OUT_Hi-Z, Mode, Slow, DAC[3],
DAC[2], DAC[1], DAC[0]
Enable, OUT_Hi-Z, Mode, Slow, DAC[3],
DAC[2], DAC[1], DAC[0]
Enable, Unused, Mode, Slow, DAC[3],
DAC[2], DAC[1], DAC[0]
Enable, Unused, Mode, Slow, DAC[3],
DAC[2], DAC[1], DAC[0]
Unused, Mode[1], Mode[0], Slow, 2XFS,
GRAD[2], GRAD[1], GRAD[0]
DAC[7], DAC[6], DAC[5], DAC[4], DAC[3],
DAC[2], DAC[1], DAC[0]
RESET_ALL, UV[2], UV[1], UV[0], UNUSED,
UNUSED, OT[1], OT[0]
UNUSED, PGOOD[7], PGOOD[6], PGOOD[5],
PGOOD[4], PGOOD[3], PGOOD[2], PGOOD[1]
UNUSED, PGOOD[7], PGOOD[6], PGOOD[5],
PGOOD[4], PGOOD[3], PGOOD[2], PGOOD[1]
UNUSED, UNUSED, PGOOD[6], PGOOD[5],
PGOOD[4], PGOOD[3], PGOOD[2], PGOOD[1]
UV, OT, PGOOD[6], PGOOD[5], PGOOD[4],
PGOOD[3], PGOOD[2], PGOOD[1]
received. Once all chips on the bus have been addressed
and sent valid data, a global STOP can be sent and the
LTC3675 will update its command latches with the data
that it had received.
It is important to understand that until a STOP signal is
transmitted, data written to the LTC3675 command registers is not acted on by the LTC3675. Only once a STOP
signal is issued is the data transferred to the command latch
and acted on. The one exception is when sub-address 0Fh
is written to clear an interrupt. To clear an interrupt, sub
address OFh must be written, followed by sub address 00h.
A complete clear interrupt cycle would have the following
write sequence: 12h, 0Fh, STOP, 12h, 00h, STOP.
DEFAULT
D7D6D5D4D3D2D1D0 COMMENTS
Used in the Clear Interrupt
Operation.
01101111
01101111
01101111
01101111
00001111
00001111
00001111
00000000
00000000 = LED Driver Disabled
11111111 = 25mA per String
00000000
11111111
00000000
Fault will pull RSTB low if the
corresponding bit is ‘1’
Fault will pull IRQB low if the
corresponding bit is ‘1’
Read Back
Read Back
Clears the Interrupt Bit,
Status Latches are Unlatched
I2C Bus Read Operation
The LTC3675 has eleven command registers and two
status registers. The contents of any of these registers
may be read back via I2C.
To read the data of a register, that register’s sub-address
must be provided to the LTC3675. The bus master reads
the status of the LTC3675 with a START condition followed
by the LTC3675 write address followed by the first data
byte (the sub-address of the register whose data needs
to be read) which is acknowledged by the LTC3675. After
receiving the acknowledge signal from the LTC3675 the
bus master initiates a new START condition followed by
the LTC3675 read address. The LTC3675 acknowledges
the read address and then returns a byte of read back
3675f
23
LTC3675
OPERATION
RSTB MASK REGISTER
VIN
EXTERNAL PULL-UP RESISTOR
RSTB
VOUT
AND1
REGULATOR
92.5% OF PROGRAMMED VOUT
OTHER UNMASKED
PGOOD OUTPUTS
+
–
PGOOD
COMPARATOR
AND2
UNMASKED
PGOOD OUTPUTS
VIN
EXTERNAL PULL-UP RESISTOR
UNMASKED
ERROR
IRQB
SET
OTHER UNMASKED
ERRORS
CLRINT
CLR
LATCHED STATUS REGISTER
IRQB MASK REGISTER
REAL TIME STATUS REGISTER
3675 F04
Figure 4. Simplified Schematic Showing RSTB and IRQB Signal Path
data from the selected register. A STOP command is not
required for the bus read operation.
Immediately after writing data to a register, the contents of
that register may be read back if the bus master issues a
START condition followed by the LTC3675 read address.
ERROR CONDITION REPORTING VIA
RSTB AND IRQB PINS
Error conditions are reported back via the IRQB and RSTB
pins. After an error condition is detected, status data can
be read back to a microprocessor via I2C to determine the
exact nature of the error condition.
Figure 4 is a simplified schematic showing the signal path
for reporting errors via the RSTB and IRQB pins.
All the switching regulators and the LED driver have an
internal power good (PGOOD) signal. When the regulated
output voltage of an enabled switcher rises above 93.5%
of its programmed value, the PGOOD signal will transition
high. When the regulated output voltage falls below 92.5%
of its programmed value, the PGOOD signal is pulled low.
If that PGOOD is not masked and stays low for greater than
50μs, then it pulls the RSTB and IRQB pins low, indicating
to a microprocessor that an error condition has occurred.
The 50μs filter time prevents the pins from being pulled
low due to a transient.
The LED driver has a PGOOD signal (PGOOD[7]) that
is used to indicate output voltage status only when it is
configured as a high voltage boost regulator. In all other
operating modes, PGOOD[7] is disabled.
An error condition that pulls the RSTB pin low is not
latched. When the error condition goes away, the RSTB
pin is released and is pulled high if no other error condition exists.
In addition to the PGOOD signals of the regulators, the
IRQB pin also indicates the status of the overtemperature
and undervoltage flags. The undervoltage and overtemperature faults cannot be masked. A fault that causes
the IRQB pin to be pulled low is latched. When the fault
condition is cleared, the IRQB pin is still maintained in its
low state. The user needs to clear the interrupt by using
a CLRINT command.
3675f
24
LTC3675
OPERATION
On start-up, all PGOOD outputs are unmasked and a poweron reset will cause RSTB to be pulled low. Once all enabled
regulators have their output PGOOD for 200ms typical
(CT = 0.01μF) the RSTB output goes Hi-Z.
By masking a PGOOD signal, the RSTB or IRQB pin will
remain Hi-Z even though the output voltage of a regulator
may be below its PGOOD threshold. However, when the
status register is read back, the true condition of PGOOD
is reported.
UNDERVOLTAGE AND OVERTEMPERATURE
FUNCTIONALITY
The undervoltage (UV) circuit monitors the input supply
voltage and shuts down all enabled regulators if the input
voltage falls below 2.45V. The LTC3675 also provides a
user with an undervoltage warning, which indicates to the
user that the input supply voltage is approaching the UV
threshold. The undervoltage warning threshold is user
programmable as shown in Table 2.
Table 2. UV Warning Thresholds
UV[2], UV[1], UV[0]
FALLING VIN WARNING THRESHOLD
000 (Default)
2.7V
001
2.8V
010
2.9V
011
3.0V
100
3.1V
101
3.2V
110
3.3V
111
3.4V
To prevent thermal damage to the LTC3675 and its surrounding components, the LTC3675 incorporates an
overtemperature (OT) function. When the LTC3675 die
temperature reaches 150°C all enabled regulators are shut
down and remain in shutdown until the die temperature falls
to 135°C. The LTC3675 also has an overtemperature warning function which warns a user that the die temperature
is approaching the OT threshold which allows the user to
take any corrective action. The OT warning threshold is
user programmable as shown in Table 3.
Table 3. OT Warning Thresholds
OT[1], OT[0]
OT WARNING THRESHOLD
00 (Default)
10° Below OT
01
20° Below OT
10
30° Below OT
11
40° Below OT
A UV or OT warning is reported to the user when the IRQB
pin is in its high impedance state. The UV and OT warning
flags are not maskable by the user.
RESET_ALL Functionality: The RESET_ALL bit shuts down
all enabled regulators (enabled either via its enable pin or
I2C) for 1 second. All command registers are cleared and
put in their default state.
3675f
25
LTC3675
APPLICATIONS INFORMATION
Buck Regulators
Switching Regulator Output Voltage and Feedback
Network
All four buck regulators are designed to be used with
2.2μH inductors. Tables 4 and 5 show the recommended
inductors for the 500mA and 1A buck regulators.
The output voltage of the switching regulators is programmed by a resistor divider connected from the switching
regulator’s output to its feedback pin and is given by VOUT
= VFB (1 + R2/R1) as shown in Figure 5. Typical values for
R1 range from 40kΩ to 1MΩ. The buck regulator transient
response may improve with optional capacitor CFF that
helps cancel the pole created by the feedback resistors
and the input capacitance of the FB pin. Experimentation
with capacitor values between 2pF and 22pF may improve
transient response.
The input supply needs to be decoupled with a 10μF
capacitor while the output needs to be decoupled with
a 22μF capacitor for a 1A buck regulator and 10μF for a
500mA buck regulator. Refer to Capacitor Selection in the
Applications Information section for details on selecting
a proper capacitor.
Each buck regulator can be programmed via I2C. To program
buck regulator 1 (1A) use sub-address 01h, buck regulator 2
(1A) sub-address 02h, buck regulator 3 (500mA) subaddress 03h and buck regulator4 (500mA) sub-address
04h. The bit format is explained in Table 6.
VOUT
SWITCHING
REGULATOR
(BUCK, BOOST,
BUCK-BOOST) FB
+
R2
CFF
COUT
Combined Buck Regulators
(OPTIONAL)
R1
A single 2A buck regulator is available by combining both 1A
buck regulators together. Both the 500mA buck regulators
may also be combined together to form a 1A buck regulator.
Tables 4 and 7 show the recommended inductors.
3675 F05
Figure 5. Feedback Components
The input supply needs to be decoupled with a 22μF
capacitor while the output needs to be decoupled with
Table 4. Recommended Inductors for 1A Buck Regulators and Ganged Buck 3, Buck 4 Application
PART NUMBER
L(μH)
MAX IDC (A)
MAX DCR (mΩ)
SIZE IN mm (L × W × H)
MANUFACTURER
LPS4018-222
2.2
2.8
70
4 × 4 × 1.8
Coilcraft
www.coilcraft.com
XFL4022-222
2.2
3.5
21.35
4×4×2
Coilcraft
www.coilcraft.com
LTF5022-2R2
2.2
3.2
36
5 × 5.2 × 2.2
LPS3015-222
2.2
2.0
110
3 × 3 × 1.5
Coilcraft
www.coilcraft.com
TDK
www.tdk.com
Table 5. Recommended Inductors for 500mA Buck Regulators
PART NUMBER
L(μH)
MAX IDC (A)
MAX DCR (mΩ)
SIZE IN mm (L × W × H)
MANUFACTURER
LPS3015-222
2.2
2.0
110
3 × 3 × 1.5
Coilcraft
www.coilcraft.com
MLPS3015-2R2
2.2
1.4
110
3 × 3 × 1.5
Maglayers
www.maglayers.com
MDT2520-CR2R2
2.2
1.35
90
2.5 × 2 × 1
Toko
www.toko.com
LQM2HPN2R2
2.2
1.0
120
2.5 × 2 × 1.1
Murata
www.murata.com
3675f
26
LTC3675
APPLICATIONS INFORMATION
a 47μF capacitor for a 2A combined buck regulator and
22μF for a 1A combined buck regulator. Refer to “Capacitor Selection” in the Applications Information section for
details on selecting a proper capacitor.
The input supply needs to be decoupled with a 10μF
capacitor while the output needs to be decoupled with
two 22μF capacitors. Refer to Capacitor Selection in the
Applications Information section for details on selecting
a proper capacitor.
Boost Regulator
The boost regulator can be programmed via I2C. To program the boost regulator, use sub-address 05h. The bit
format is explained in Table 9.
The boost regulator is designed to be used with a 2.2μH
inductor. Table 8 provides a list of recommended inductors.
Table 6. Buck Regulator Program Register Bit Format
Bit7
Enable
Default is '0' which disables the part. A buck regulator can also be enabled via its enable pin.
When enabled via pin, the contents of the I2C register program its functionality.
Bit6
OUT_Hi-Z
Default is ‘1’ in which the SW node remains in a high impedance state when the regulator is in shutdown.
A ‘0’ pulls the SW node to GND through a 10k resistor.
Bit5
Mode
Default is ‘1’ which is Burst Mode operation. A ‘0’ programs the regulator to operate in pulse-skipping mode.
Bit4
Slow Edge
This bit controls the slew rate of the switch node. Default is '0' which enables the switch node to slew at a
faster rate, than if the bit were programmed a '1'.
Bit3(DAC3)
Bit2(DAC2)
Bit1(DAC1)
Bit0(DAC0)
DAC Control
These bits are used to program the feedback regulation voltage. Default is '1111' which programs a full-scale
voltage of 800mV. Bits '0000' program the lowest feedback regulation of 425mV. A LSB (DAC0) has a bit
weight of 25mV.
Table 7. Recommended Inductors for 2A Combined Buck Regulator
L(μH)
MAX IDC (A)
MAX DCR (mΩ)
SIZE IN mm (L × W × H)
MANUFACTURER
XFL4022-222
2.2
3.5
21.35
4×4×2
Coilcraft
www.coilcraft.com
LPS6225-222
2.2
4
45
6 × 6 × 2.5
Coilcraft
www.coilcraft.com
FDV0530-2R2
2.2
5.3
17.3
6.2 × 5.8 × 3
PART NUMBER
Toko
www.toko.com
Table 8. Recommended Inductors for Boost Regulator and Buck-Boost Regulator
L(μH)
MAX IDC (A)
MAX DCR (mΩ)
SIZE IN mm (L × W × H)
MANUFACTURER
XFL4022-222
2.2
3.5
21.35
4×4×2
Coilcraft
www.coilcraft.com
LTF5022-2R2
2.2
3.2
36
5 × 5.2 × 2.2
PART NUMBER
TDK
www.tdk.com
Table 9. Boost Regulator Program Register Bit Format
Bit7
Enable
Default is ‘0’ which disables the boost.
Bit6
x
Unused
Bit5
Mode
Mode = 0 is PWM mode, Mode = 1 is Burst Mode operation
Bit4
Slow Edge
This bit controls the slew rate of the switch node. Default is ‘0’ which enables the switch node
to slew at a faster rate than if the bit were programmed a ‘1.’
Bit3(DAC3)
Bit2(DAC2)
Bit1(DAC1)
Bit0(DAC0)
DAC Control
These bits are used to program the feedback regulation voltage. Default is ‘1111’ which
programs a full-scale voltage of 800mV. Bits ‘0000’ program the lowest feedback regulation of
425mV. A LSB (DAC0) has a bit weight of 25mV.
3675f
27
LTC3675
APPLICATIONS INFORMATION
Optional capacitor CFF is not needed and may compromise
loop stability.
To ensure loop stability, feedback resistor R1 in Figure 5
should be no greater than 105kΩ. Optional capacitor CFF
is not needed and may compromise loop stability.
Buck-Boost Regulator
The buck-boost regulator is an internally compensated
voltage mode regulator that is designed to be used with
a 2.2μH inductor. Recommended inductors are listed in
the Table 8.
LED Driver
The input supply needs to be decoupled with a 10μF
capacitor while the output needs to be decoupled with
a 22μF capacitor. Refer to “Capacitor Selection” in the
Applications Information section for details on selecting
a proper capacitor.
The LED driver also needs a rectifier diode. Recommended
schottky diodes are listed in Table 12.
For proper operation the LED driver boost circuit needs
a 10μH inductor. Recommended inductors are listed in
Table 11.
The LED driver has two registers that can be programmed
via I2C. One of the registers is accessed at sub-address
07h and the bit format is as shown in Table 13.
The buck-boost regulator can be programmed via I2C. To
program the buck-boost regulator, use sub-address 06h.
The bit format is explained in Table 10.
The rate at which the gradation circuit ramps the LED current is set by GRAD[2:0]. GRAD[2:0] sets the time the LED
driver will take to transition through one LSB of LED current.
Table 10. Buck-Boost Regulator Program Register Bit Format
Bit7
Enable
Default is ‘0’ which disables the buck-boost. The buck-boost regulator can alternately be enabled via its enable pin.
When enabled via pin, the contents of the I2C register program its functionality.
Bit6
x
Unused
Bit5
Mode
Mode = 0 is PWM mode, Mode = 1 is Burst Mode operation. Default is ‘0.’
Bit4
Slow edge
This bit controls the slew rate of the switch node. Default is ‘0’ which enables the switch node to slew at a faster rate
than if the bit were programmed a ‘1.’
Bit3(DAC3)
Bit2(DAC2)
Bit1(DAC1)
Bit0(DAC0)
DAC control
These bits are used to program the feedback regulation voltage. Default is ‘1111’ which programs a full-scale voltage of
800mV. Bits ‘0000’ program the lowest feedback regulation of 425mV. A LSB (DAC0) has a bit weight of 25mV.
Table 11. Recommended Inductors for LED Driver
PART NUMBER
L(μH)
MAX IDC (A)
MAX DCR (mΩ)
SIZE IN mm (L × W × H)
MANUFACTURER
LPS6225-103M
10
2.1
105
6 × 6 × 2.5
Coilcraft
www.coilcraft.com
IHLP2020BZER10RM01
10
4
184
5.2 × 5.5 × 2
Vishay
www.vishay.com
Table 12. Recommended Schottky Diodes for LED Driver
PART NUMBER
IF (A)
MANUFACTURER
PD3S140
1.0
Diodes Inc.
www.diodes.com
ZLLS1000
1.16
Diodes Inc./Zetex
www.diodes.com
CTLSH1-40M322
1.0
Central Semiconductor
www.centralsemi.com
3675f
28
LTC3675
APPLICATIONS INFORMATION
Table 13. LED Driver Regulator Program Register 1 Bit Format
Bit7
x
Unused
Bit6
Bit5
Mode1
Mode0
Mode1 = Mode0 = 0 is default; both LED pins are regulated.
Mode1 = 0 Mode0 = 1; Only LED1 is regulated. (Single string application).
Mode1 = 1 Mode0 = 0; LED driver is configured as a high voltage boost regulator.
Mode1 = Mode0 = 1; Both LED pins are regulated, but boost is not powered up. In this mode an external
voltage is needed to drive the LED’s.
Bit4
Slow Edge
This bit controls the slew rate of the switch node. Default is ‘0’ which enables the switch node to slew at a
faster rate than if the bit were programmed a ‘1.’
Bit3
2xFS
This bit doubles the full-scale programmed LED current. Default is ‘1.’
Bit2(GRAD2)
Bit1(GRAD1)
Bit0(GRAD0)
DAC Control
LED current gradation timing bits. Default is ‘111.’ See Table 14.
These times are shown in Table 14. The default state of
000 in GRAD[2:0] results in a very fast ramp time that
cannot be visually perceived.
Table 14. LED Gradation Bits
GRAD2, GRAD1, GRAD0
GRADATION STEP TIME
000
0.056 ms
001
0.912 ms
010
1.824 ms
011
3.648 ms
100
7.296 ms
101
14.592 ms
110
29.184 ms
111 (Default)
58.368 ms
The LED DAC register is at sub-address 08h. All 8 bits in
this register are used to control LED current. The default
state of this register is 00h which disables the LED driver.
See Table 1.
Operating the LED Driver As a High Voltage Boost
Regulator
The LED driver may be configured as a high voltage boost
regulator capable of producing an output voltage up to
40V. The boost mode may be programmed via I2C. In
this mode, the LED_OV pin serves as the feedback pin.
The feedback resistors are selected as discussed in the
Switching Regulator Output voltage and Feedback Network
section. The LED_FS pins must be tied to the input supply
in this mode. When configured as a high voltage boost,
the LED DAC register is ignored.
To maintain stability, the average inductor current must
be maintained below 750mA. This limits the deliverable
output current at low input supply voltages. Figure 8 gives
an example of the LED driver configured as a high voltage
boost regulator.
Input and Output Decoupling Capacitor Selection
The LTC3675 has multiple input supply pins and output
pins. Each of these pins must be decoupled with low ESR
capacitors to GND. These capacitors must be placed as
close to the pins as possible. Ceramic dielectric capacitors
are a good compromise between high dielectric constant
and stability versus temperature and DC bias. Note that the
capacitance of a capacitor deteriorates at higher DC bias.
It is important to consult manufacturer data sheets and
obtain the true capacitance of a capacitor at the DC bias
voltage it will be operated at. For this reason, avoid the
use of Y5V dielectric capacitors. The X5R/X7R dielectric
capacitors offer good overall performance.
The input supply voltage pins 6, 7, 10 and 40 all need
to be decoupled with at least 10μF capacitors. The input
supply pins 31 and 34 and the DVCC pin 41 need to be
decoupled with 2.2μF capacitors. The outputs of the 1A
buck regulators need 22μF capacitors, while the outputs
of the 500mA buck regulators need 10μF capacitors. The
buck-boost output regulator needs a 22μF decoupling
capacitor. The boost regulator needs two 22μF output
decoupling capacitors. The LED driver output pin should
be decoupled with a 4.7μF capacitor.
3675f
29
LTC3675
APPLICATIONS INFORMATION
Choosing the CT Capacitor
The CT capacitor may be used to program the timing
parameters associated with the pushbutton. For a given
CT capacitor the timing parameters may be calculated as
below. CT is in units of μF.
tONB_LO = 5000 × CT ms
tPBSTAT_PW = 5000 × CT ms
tONB_WAKE = 40000 × CT ms
tWAKE_ON = 500 × CT seconds
tONB_HR = 500 × CT seconds
tHR = 100 × CT seconds
Programming the UVOT Register
The UV/OT warning byte (default 0000 0000) structure
is as below:
BIT7
BIT6
BIT5
BIT4
BIT3
BIT2
BIT1
BIT0
RESET_ALL
UV[2]
UV[1]
UV[0]
Unused
Unused
OT[1]
OT[0]
Programming the RSTB and IRQB Mask Registers
The RSTB mask register can be programmed by the user
at sub-address 0Ah and its format is as below.
BIT7
BIT6
BIT5
BIT4
BIT3
BIT2
BIT1
BIT0
Unused
PGOOD7
PGOOD6
PGOOD5
PGOOD4
PGOOD3
PGOOD2
PGOOD1
If a bit is set to ‘0,’ then the corresponding regulator’s
PGOOD will pull RSTB low if a PGOOD fault were to occur.
The default for this register is FFh.
The IRQB mask register has the same bit format as the
RSTB mask register. The IRQB mask register is located at
sub-address 0Bh and its default contents are 00h.
PGOOD7 is used only when the LED driver is configured
as a high voltage boost regulator.
3675f
30
LTC3675
APPLICATIONS INFORMATION
Status Byte Read Back
When either the RSTB or IRQB pin is pulled low, it indicates
to the user that a fault condition has occurred. To find out
the exact nature of the fault, the user can read the status registers. There are two status registers. One register provides
real time fault condition reporting while a second register
latches data when an interrupt has occurred. Figure 4
shows the operation of the real time and latched status
registers. The contents of the latched status register are
cleared when a CLRINT signal is issued. A PGOOD bit is
a ‘0’ if that regulator’s output voltage is more than 7.5%
below its programmed value.
The sub-address for the real time status register is 0Ch
and its format is as follows:
BIT7
BIT6
BIT5
BIT4
BIT3
BIT2
BIT1
BIT0
Unused
Unused
PGOOD6
PGOOD5
PGOOD4
PGOOD3
PGOOD2
PGOOD1
The sub-address for the latched status register is 0Dh and
its format is as follows:
BIT7
BIT6
BIT5
BIT4
BIT3
BIT2
BIT1
BIT0
UV
OT
PGOOD6
PGOOD5
PGOOD4
PGOOD3
PGOOD2
PGOOD1
A write operation cannot be performed to either of the
status registers.
PCB Considerations
When laying out the printed circuit board, the following
list should be followed to ensure proper operation of the
LTC3675:
1. The exposed pad of the package (pin 45) should connect
directly to a large ground plane to minimize thermal and
electrical impedance.
2. All the input supply pins must be tied together and each
supply pin should have a decoupling capacitor.
3. The switching regulator input supply pins and their respective decoupling capacitors should be kept as short
as possible. The GND side of these capacitors should
connect directly to the ground plane of the part. These
capacitors provide the AC current to the internal power
MOSFETs and their drivers. It’s important to minimize
inductance from these capacitors to the VIN pins of the
LTC3675.
4. The switching power traces connecting SW1, SW2,
SW3, SW4, SW5, SWAB6, SWCD6 and SW7 to their
respective inductors should be minimized to reduce
radiated EMI and parasitic coupling. Due to the large
voltage swing of the switching nodes, high input impedance sensitive nodes such as the feedback nodes
and LED_OV node should be kept far away or shielded
from the switching nodes or poor performance could
result.
5. The GND side of the switching regulator output capacitors should connect directly to the thermal ground plane
of the part. Minimize the trace length from the output
capacitor to the inductor(s)/pin(s).
6. In a combined buck regulator application the trace length
of switch nodes to the inductor must be kept equal to
ensure proper operation.
3675f
31
LTC3675
TYPICAL APPLICATIONS
Li-Ion
CELL
2.7V
TO 4.2V
VIN
1μF
1.2V
25mA
VIN
10μF
2.2μH
LDO_OUT
10μF
SW1
324k
22μF
324k
LDOFB
FB1
649k
649k
VIN
VIN
1μF
10μF
2.2μH
2.2μH
SW2
SW5
VOUT5
5V, 1A
22μF
22μF
22μF
22μF
655k
2.5V
1A
FB2
1.05M
309k
FB5
200k
LTC3675
VIN
2.2μH
3.3V, 1A
10μF
2.2μH
SWAB6
SWCD6
VOUT6
10μF
1.2V
1A
SW3
590k
322k
10μF
1.8V
500mA
FB3
FB6
475k
105k
2.2μH
SW4
DVCC
I2C
CONTROL
10μF
511k
1μF
1.6V
500mA
FB4
511k
SCL
SDA
10μF
10μH
IRQB
RSTB
WAKE
PBSTAT
EN1
EN2
EN3
EN4
EN6
CT
MICROPROCESSOR
CONTROL
SW7
4.7μF
50V
UP TO •
10 LEDS ••
0.01μF
ONB
PUSH BUTTON
EXPOSED PAD
LED1
LED2
LED_OV
LED_FS
•
•
•
1.96M
20k
42.2k
3675 F06
Figure 6. Detailed Front Page Application Circuit
3675f
32
LTC3675
TYPICAL APPLICATIONS
Li-Ion CELL
2.7V TO 4.2V
VIN
VIN
1μF
10μF
1.2V
25mA
2.2μH
LDO_OUT
10μF
1.2V
1A
SW1
324k
324k
LDOFB
22μF
FB1
649k
649k
VIN
VIN
10μF
10μF
2.2μH
SW5
VOUT5
5V, 1A
22μF
22μF
22μF
655k
FB5
200k
309k
LTC3675
VIN
2.2μH
10μF
2.2μH
SWAB6
SWCD6
VOUT6
10μF
22μF
FB2
1.05M
3.3V, 1A
2.5V
1A
SW2
2.2μH
SW3
590k
332k
10μF
1.8V
500mA
FB3
FB6
475k
105k
2.2μH
SW4
DVCC
I2C
CONTROL
511k
1μF
10μF
1.6V
500mA
FB4
511k
SCL
SDA
10μF
IRQB
RSTB
WAKE
PBSTAT
EN1
EN2
EN3
EN4
ENBB
CT
MICROPROCESSOR
CONTROL
10μH
SW7
4.7μF
50V
UP TO •
10 LEDS ••
LED1
LED2
0.01μF
LED_OV
LED_FS
ONB
PUSH BUTTON
1.96M
EXPOSED PAD
20k
42.2k
3675 F07
Figure 7. Buck Regulators with Sequenced Start-Up and a Single String of LEDs.
Buck Regulators Power-Up in the Sequence Buck1, Buck2 and Buck3
3675f
33
LTC3675
TYPICAL APPLICATIONS
Li-Ion
CELL
2.7V
TO 4.2V
VIN
VIN
1μF
10μF
1.2V
25mA
LDO_OUT
10μF
2.2μH
324k
2.5V
2A
SW1
LDOFB
SW2
649k
655k
22μF
22μF
FB1
VIN
309k
1μF
2.2μH
VIN
SW5
VOUT5
5V, 1A
22μF
22μF
22μF
1.05M
FB5
200k
LTC3675
VIN
10μF
2.2μH
2.2μH
SWAB6
SWCD6
VOUT6
3.3V, 1A
10μF
10μF
FB2
SW3
22μF
332k
1.2V
1A
324k
SW4
FB6
FB3
105k
649k
DVCC
I2C
CONTROL
1μF
FB4
SCL
SDA
LED_FS
10μF
10μH
IRQB
RSTB
WAKE
PBSTAT
EN1
EN2
EN3
EN4
ENBB
CT
MICROPROCESSOR
CONTROL
SW7
10μF
20V
1.87M
LED_OV
LED1
LED2
0.01μF
ONB
PUSH BUTTON
12V
150mA
133k
EXPOSED PAD
3675 F08
Figure 8. Combined Buck Regulators and a High Voltage Boost Regulator
3675f
34
LTC3675
PACKAGE DESCRIPTION
UFFMA Package
44-Lead Plastic QFN (4mm × 7mm)
(Reference LTC DWG # 05-08-1762 Rev A)
1.48 ±0.05
0.70 ±0.05
1.70 ±0.05
2.56 ±0.05
4.50 ±0.05
3.10 ±0.05
2.40 REF
2.02 ±0.05
2.76 ±0.05
2.64 ±0.05
0.98 ±0.05
PACKAGE
OUTLINE
0.20 ±0.05
5.60 REF
6.10 ±0.05
7.50 ±0.05
0.40 BSC
RECOMMENDED SOLDER PAD LAYOUT
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
4.00 p0.10
0.75 p0.05
PIN 1 NOTCH
R = 0.30 TYP
OR 0.35 s 45o
CHAMFER
2.40 REF
43
0.00 – 0.05
44
0.40 p0.10
1
2
PIN 1
TOP MARK
(SEE NOTE 6)
2.64
±0.10
2.56
±0.10
7.00 p0.10
5.60 REF
1.70
±0.10
2.76
±0.10
R = 0.10
TYP
0.74 ±0.10
R = 0.10 TYP
0.74 ±0.10
(UFF44MA) QFN REV A 0410
0.200 REF
R = 0.10 TYP
0.98 ±0.10
0.20 p0.05
0.40 BSC
BOTTOM VIEW—EXPOSED PAD
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
3675f
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
35
LTC3675
TYPICAL APPLICATION
Li-Ion
CELL
2.7V
TO 4.2V
VIN
VIN
1μF
10μF
2.2μH
1.2V
25mA
LDO_OUT
10μF
SW1
324k
22μF
324k
LDOFB
FB1
649k
649k
VIN
VIN
1μF
10μF
2.2μH
2.2μH
SW2
SW5
VOUT5
5V, 1A
22μF
22μF
22μF
22μF
655k
2.5V
1A
FB2
1.05M
309k
FB5
200k
LTC3675
VIN
2.2μH
3.3V, 1A
10μF
2.2μH
SWAB6
SWCD6
VOUT6
10μF
1.2V
1A
SW3
590k
332k
10μF
1.8V
500mA
FB3
FB6
475k
105k
2.2μH
SW4
DVCC
1μF
I 2C
CONTROL
10μF
511k
1.6V
500mA
FB4
511k
SCL
SDA
10μF
10μH
IRQB
RSTB
WAKE
PBSTAT
EN1
EN2
EN3
EN4
EN6
CT
MICROPROCESSOR
CONTROL
SW7
4.7μF
50V
UP TO •
10 LEDS ••
0.01μF
ONB
PUSH BUTTON
EXPOSED PAD
LED1
LED2
LED_OV
LED_FS
•
•
•
1.96M
20k
42.2k
3675 TA02
RELATED PARTS
PART NUMBER DESCRIPTION
LTC3569
Triple Buck Regulator with 1.2A and
Two 600mA Outputs and Individual
Programmable References
LTC3577/
Highly Integrated Portable/Navigation PMIC
LTC3577-1/
LTC3577-3/
LTC3577-4
LTC3586/
LTC3586-1
Switching USB Power Manager with Li-Ion/
Polymer Charger, 1A Buck-Boost + Dual
Sync Buck Converter + Boost + LDO
COMMENTS
Triple, Synchronous, 100% Duty Cycle, PGOOD Pin, Programmable VFB Servo Voltage
PMIC: Linear Power Manager and Three Buck Regulators, 10-LED Boost Regulator,
Synchronous Bucks ADJ at 800mA/500mA/500mA, PB Control, I2C Interface, 2× 150mA
LDOs, OVP Charge Current Programmable Up to 1.5A from Wall Adapter Input, Thermal
Regulation, 4mm × 7mm QFN-44 Package; "-1" and "-4" Versions Have 4.1V VFLOAT, "-3"
Version for SiRF Atlas IV Processors
PMIC: Switching Power Manager, 1A Buck-Boost + 2 Bucks ADJ to 0.8V at 400mA/
400mA + 800mA Boost + LDO, Charge Current Programmable Up to 1.5A from Wall
Adapter Input, 4mm × 6mm QFN-38 Package; "-1" Version Has 4.1V VFLOAT
3675f
36 Linear Technology Corporation
LT 0810 • PRINTED IN USA
1630 McCarthy Blvd., Milpitas, CA 95035-7417
(408) 432-1900 ● FAX: (408) 434-0507
●
www.linear.com
© LINEAR TECHNOLOGY CORPORATION 2010
Similar pages