LIGITEK LUE2643-1-PF

LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
SUPER BRIGHT ROUND TYPE LED LAMPS
Pb
Lead-Free Parts
LUE2643-1-PF
DATA SHEET
DOC. NO :
QW0905- LUE2643-1-PF
REV.
:
A
DATE
:
17 - May.- 2005
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 1/5
PART NO. LUE2643-1-PF
Package Dimensions
2.9
3.3
3.1
4.3
1.5MAX
25.0MIN
□0.5
TYP
1.0MIN
2.54TYP
Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted.
2.Specifications are subject to change without notice.
Directivity Radiation
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 2/5
PART NO. LUE2643-1-PF
Absolute Maximum Ratings at Ta=25 ℃
Ratings
Symbol
Parameter
UNIT
UE
Forward Current
IF
50
mA
Peak Forward Current
Duty 1/10@10KHz
IFP
90
mA
Power Dissipation
PD
120
mW
Reverse Current @5V
Ir
10
μA
Electrostatic Discharge
ESD
2000
V
Operating Temperature
Topr
-40 ~ +85
℃
Storage Temperature
Tstg
-40 ~ +100
℃
Soldering Temperature
Tsol
Max 260 ℃ for 5 sec Max
(2mm from body)
Typical Electrical & Optical Characteristics (Ta=25 ℃)
PART NO
COLOR
MATERIAL
Emitted
LUE2643-1-PF AlGaInP
Forward
Dominant Spectral
voltage
wave
halfwidth
@
20mA(V)
length
△λ nm
λDnm
Lens
Orange Water Clear
620
17
Luminous
intensity
@20mA(mcd)
Min. Max. Min.
Typ.
2.6
900
1.7
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.
2. The luminous intensity data did not including ± 15% testing tolerance.
450
Viewing
angle
2θ1/2
(deg)
40
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 3/5
PART NO. LUE2643-1-PF
Typical Electro-Optical Characteristics Curve
UE CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
3.0
Relative Intensity
Normalize @20mA
Forward Current(mA)
1000
100
10
1.0
0.1
2.5
2.0
1.5
1.0
0.5
0
2.0
1.0
3.0
4.0
5.0
1.0
10
Forward Current(mA)
Forward Voltage(V)
Fig.4 Relative Intensity vs. Temperature
1.2
1.1
1.0
0.9
0.8
-20
0
20
40
60
80
100
Fig.5 Relative Intensity vs. Wavelength
Relative Intensity @20mA
1.0
0.5
0
600
650
Wavelength (nm)
3.0
2.5
2.0
1.5
1.0
0.5
0
-40
-20
0
20
40
60
80
Ambient Temperature( ℃)
Ambient Temperature(℃)
550
Relative Intensity @20mA
Normalize @25 ℃
Forward Voltage@20mA
Normaliz @25 ℃
Fig.3 Forward Voltage vs. Temperature
-40
1000
100
700
100
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LUE2643-1-PF
Page 4/5
Wave soldering Profile
Temp(°C)
245° C 5sec Max
245°
5° /sec
max
120°
25°
3° /sec
max
Soldering
Soldering Iron:30W Max
Temperature 300 ° C Max
Soldering Time:3 Seconds Max
Distance:2mm Min(From solder joint to case)
Dip Soldering
Preheat: 120° C Max
Time(sec)
Preheat time: 120 seconds Max
Ramp-up
3° C/sec(max)
Ramp-Down:-5 ° C/sec(max)
Solder Bath:245 ° C Max
Dipping Time:5 seconds Max
Distance:2mm Min(From solder joint to case)
Preheat
120 Seconds Max
Wave Soldering Profile (Pb Free)
Temp(°C)
265° C 5sec Max
265°
5° /sec
max
140°
25°
Soldering
Soldering Iron:30W Max
Temperature:350 ° CMax
Soldering Time:3seconds Max
Distance:2mm Min(From solder joint to case)
3° /sec
max
Preheat
120 Seconds Max
Dip Soldering
Preheat: 140 ° C Max
Preheat time: 120seconds Max
Time(sec) Ramp-up
3° C/sec(max)
Ramp-Down:-5 ° C/sec(max)
Solder Bath:265 ° C Max
Dipping Time:5 seconds Max
Distance:2mm Min(From solder joint to case)
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 5/5
PART NO. LUE2643-1-PF
Reliability Test:
Test Item
Test Condition
Description
Reference
Standard
Operating Life Test
1.Under Room Temperature
2.If=20mA
3.t=1000 hrs (-24hrs, +72hrs)
This test is conducted for the purpose
of detemining the resisance of a part
in electrical and themal stressed.
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
High Temperature
Storage Test
1.Ta=105 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of
the device which is laid under ondition
of high temperature for hours.
MIL-STD-883:1008
JIS C 7021: B-10
Low Temperature
Storage Test
1.Ta=-40 ℃±5 ℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
High Temperature
High Humidity Test
1.Ta=65 ℃±5 ℃
2.RH=90 %~95%
3.t=240hrs ±2hrs
The purpose of this test is the resistance
of the device under tropical for hous.
1.Ta=105 ℃±5℃&-40 ℃±5℃
(10min) (10min)
2.total 10 cycles
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
Solder Resistance
Test
1.T.Sol=260 ℃±5 ℃
2.Dwell time= 10 ±1sec.
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
Solderability Test
1.T.Sol=230 ℃±5 ℃
2.Dwell time=5 ±1sec
This test intended to see soldering well
performed or not.
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
Thermal Shock Test
JIS C 7021: B-12
MIL-STD-202:103B
JIS C 7021: B-11