LIGITEK LUR2043-TBS-X And box round type led lamp Datasheet

LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
TAPE AND BOX ROUND TYPE LED LAMPS
LUR2043/TBS-X
DATA SHEET
DOC. NO :
QW0905-LUR2043/TBS-X
REV.
:
A
DATE
:
23 - Mar. - 2005
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LUR2043/TBS-X
Page 1/5
Package Dimensions
ΔH
P2
W2
H2
H1
L W0
W1 W3
D
P1
F
P
T
LUR2043
3.0
4.0
4.2
5.2
1.5MAX
25.0MIN
□0.5
TYP
1.0MIN
2.54TYP
Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted.
2.Specifications are subject to change without notice.
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Property of Ligitek Only
PART NO. LUR2043/TBS-X
Page 2/5
Absolute Maximum Ratings at Ta=25 ℃
Ratings
Symbol
Parameter
UNIT
UR
Forward Current
IF
40
mA
Peak Forward Current
Duty 1/10@10KHz
IFP
120
mA
Power Dissipation
PD
120
mW
Reverse Current @5V
Ir
10
μA
Operating Temperature
Topr
-40 ~ +85
℃
Storage Temperature
Tstg
-40 ~ +100
℃
Soldering Temperature
Tsol
Max 260 ℃ for 5 sec Max
(2mm from body)
Typical Electrical & Optical Characteristics (Ta=25 ℃)
PART NO
COLOR
MATERIAL
Emitted
LUR2043/TBS-X
GaAlAs
Red
Forward
Peak Spectral
voltage
wave halfwidth
length △λ nm @20mA(V)
λPnm
Lens
Water Clear
660
20
Luminous
intensity
@20mA(mcd)
Min. Max. Min.
Typ.
1.5
900
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.
2. The luminous intensity data did not including ± 15% testing tolerance.
2.4
550
Viewing
angle
2θ 1/2
(deg)
30
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LUR2043/TBS-X
Page 3/5
•Dimensions Symbol Information
SPECIFICATIONS
OPTION
SYMBOL
CODE
SYMBOL ITEMS
Minimum
Maximum
mm
inch
mm
inch
Tape Feed Hole Diameter
-------
D
3.8
0.15
4.2
0.17
Component Lead Pitch
-------
F
2.3
0.09
3.0
0.12
Front-To-Rear Deflection
-------
△H
-------
-------
2.0
0.08
TRS-1
TRS-2
TRS-3
TRS-4
TRS-5
TRS-6
TRS-7
TRS-8
TRS-9
TRS-10
H1
17.5
21.5
25.5
27.5
22.5
19.9
24.0
24.5
19.0
18.4
0.69
0.85
1.0
1.08
0.89
0.78
0.94
0.96
0.75
0.72
-------
H2
-------
-------
18.5
22.5
26.5
28.5
23.5
20.9
25.0
25.5
20.0
19.4
36
0.73
0.89
1.04
1.12
0.93
0.82
0.98
1.0
0.79
0.76
1.42
Lead Length After Component Height
-------
L
11.0
0.43
Feed Hole Pitch
-------
P
12.4
0.49
13.0
0.51
Lead Location
-------
P1
4.4
0.17
5.8
0.23
Center Of Component Location
-------
P2
5.1
0.2
7.7
0.3
Overall Taped Package Thickness
-------
T
-------
-------
1.42
0.06
Feed Hole Location
-------
W0
8.5
0.33
9.75
0.38
Adhesive Tape Width
-------
W1
14.5
0.57
15.5
0.61
Adhesive Tape Position
-------
W2
0
0
4.0
0.16
Tape Width
-------
W3
17.5
0.69
19.0
0.75
Feed Hole To Bottom Of Component
Feed Hole To Overall Component Height
W0
REMARK:TBS=Tape And Box Straight Leads
• Package Dimensions
• Dimensions Symbol Information
Specification
Description
Symbol
minimum
maxmum
W
mm
inch
mm
inch
Overall Length
L
330
13.0
340
13.4
Overall Width
W
265
10.4
275
10.8
Overall Thickness
H
50
1.97
60
2.4
Quantity/Box
2500PCS
L
H
LIGITEK ELECTRONICS CO.,LTD.
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Page4/5
PART NO. LUR2043/TBS-X
Typical Electro-Optical Characteristics Curve
UR CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
3.0
Relative Intensity
Normalize @20mA
Forward Current(mA)
1000
100
10
1
01
2.5
2.0
1.5
1.0
0.5
0.0
1.0
2.0
3.0
4.0
1
5.0
10
Fig.3 Forward Voltage vs. Temperature
Fig.4 Relative Intensity vs. Temperature
Relative Intensity@20mA
Normalize @25 ℃
Forward Voltage@20mA
Normalize @25 ℃
1.2
1.1
1.0
0.9
0.8
-20
0
20
40
60
80
100
3.0
2.5
2.0
1.5
1.0
0.5
0.0
-40
-20
0
20
40
60
80
Ambient Temperature( ℃)
Ambient Temperature( ℃)
Fig.5 Relative Intensity vs. Wavelength
Relative Intensity@20mA
1000
Forward Current(mA)
Forward Voltage(V)
-40
100
Fig.6 Directivity Radiation
0°
1.0
-30°
30°
-60°
-60°
0.5
100% 75% 50%
0.0
600
650
700
Wavelength (nm)
750
25%
0
25% 50% 75% 100%
100
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LUR2043/TBS-X
Page 5/5
Reliability Test:
Test Item
Test Condition
Description
Reference
Standard
Operating Life Test
1.Under Room Temperature
2.If=20mA
3.t=1000 hrs (-24hrs, +72hrs)
This test is conducted for the purpose
of detemining the resisance of a part
in electrical and themal stressed.
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
High Temperature
Storage Test
1.Ta=105 ℃±5 ℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of
the device which is laid under ondition
of hogh temperature for hours.
MIL-STD-883:1008
JIS C 7021: B-10
Low Temperature
Storage Test
1.Ta=-40 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
High Temperature
High Humidity Test
1.Ta=65 ℃±5℃
2.RH=90 %~95 %
3.t=240hrs ±2hrs
The purpose of this test is the resistance
of the device under tropical for hous.
1.Ta=105 ℃±5℃&-40 ℃±5℃
(10min) (10min)
2.total 10 cycles
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
Solder Resistance
Test
1.T.Sol=260 ℃±5℃
2.Dwell time= 10 ±1sec.
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
Solderability Test
1.T.Sol=230 ℃±5℃
2.Dwell time=5 ±1sec
This test intended to see soldering well
performed or not.
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
Thermal Shock Test
JIS C 7021: B-12
MIL-STD-202:103B
JIS C 7021: B-11
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