TI LVC244A Octal buffer/driver with 3-state output Datasheet

SN74LVC244A
OCTAL BUFFER/DRIVER
WITH 3-STATE OUTPUTS
www.ti.com
SCAS414X – NOVEMBER 1992 – REVISED MARCH 2005
•
•
•
1
20
2
19
3
18
4
5
17
16
6
15
7
14
8
13
9
12
11
10
VCC
2OE
1Y1
2A4
1Y2
2A3
1Y3
2A2
1Y4
2A1
RGY PACKAGE
(TOP VIEW)
1A1
2Y4
1A2
2Y3
1A3
2Y2
1A4
2Y1
DESCRIPTION/ORDERING INFORMATION
This octal buffer/line driver is operational at 1.5-V to
3.6-V VCC, but is designed specifically for 1.65-V to
3.6-V VCC operation.
VCC
•
1OE
1A1
2Y4
1A2
2Y3
1A3
2Y2
1A4
2Y1
GND
1
20
3
4
19 2OE
18 1Y1
17 2A4
5
6
16 1Y2
15 2A3
7
8
14 1Y3
13 2A2
9
12 1Y4
2
10
11
2A1
•
DB, DGV, DW, N, NS, OR PW PACKAGE
(TOP VIEW)
1OE
•
•
Operates From 1.65 V to 3.6 V
Inputs Accept Voltages to 5.5 V
Specified From –40°C to 85°C and –40°C to
125°C
Max tpd of 5.9 ns at 3.3 V
Typical VOLP (Output Ground Bounce) < 0.8 V
at VCC = 3.3 V, TA = 25°C
Typical VOHV (Output VOH Undershoot) > 2 V
at VCC = 3.3 V, TA = 25°C
Supports Mixed-Mode Signal Operation on All
Ports (5-V Input/Output Voltage With
3.3-V VCC)
Ioff Supports Partial-Power-Down Mode
Operation
Latch-Up Performance Exceeds 250 mA Per
JESD 17
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
GND
FEATURES
•
•
•
ORDERING INFORMATION
PACKAGE (1)
TA
QFN – RGY
–40°C to 85°C
VFBGA – GQN
VFBGA – ZQN (Pb-Free)
PDIP – N
SN74LVC244AGQNR
SN74LVC244AZQNR
TOP-SIDE MARKING
LC244A
LC244A
SN74LVC244AN
Tube of 25
SN74LVC244ADW
Reel of 2000
SN74LVC244ADWR
SOP – NS
Reel of 2000
SN74LVC244ANSR
LVC244A
SSOP – DB
Reel of 2000
SN74LVC244ADBR
LC244A
Tube of 70
SN74LVC244APW
Reel of 2000
SN74LVC244APWR
Reel of 250
SN74LVC244APWT
Reel of 2000
SN74LVC244ADGVR
TSSOP – PW
TVSOP – DGV
(1)
Reel of 1000
ORDERABLE PART NUMBER
SN74LVC244ARGYR
Tube of 20
SOIC – DW
–40°C to 125°C
Reel of 1000
SN74LVC244AN
LVC244A
LC244A
LC244A
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1992–2005, Texas Instruments Incorporated
SN74LVC244A
OCTAL BUFFER/DRIVER
WITH 3-STATE OUTPUTS
www.ti.com
SCAS414X – NOVEMBER 1992 – REVISED MARCH 2005
DESCRIPTION/ORDERING INFORMATION (CONTINUED)
The SN74LVC244A is organized as two 4-bit line drivers with separate output-enable (OE) inputs. When OE is
low, the device passes data from the A inputs to the Y outputs. When OE is high, the outputs are in the
high-impedance state.
Inputs can be driven from either 3.3-V or 5-V devices. This feature allows the use of this device as a translator in
a mixed 3.3-V/5-V system environment.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
GQN OR ZQN PACKAGE
(TOP VIEW)
1
2
3
4
A
B
C
D
E
TERMINAL ASSIGNMENTS
1
2
3
4
A
1A1
1OE
VCC
2OE
B
1A2
2A4
2Y4
1Y1
C
1A3
2Y3
2A3
1Y2
D
1A4
2A2
2Y2
1Y3
E
GND
2Y1
2A1
1Y4
FUNCTION TABLE
(EACH BUFFER)
INPUTS
2
OE
A
OUTPUT
Y
L
H
H
L
L
L
H
X
Z
SN74LVC244A
OCTAL BUFFER/DRIVER
WITH 3-STATE OUTPUTS
www.ti.com
SCAS414X – NOVEMBER 1992 – REVISED MARCH 2005
LOGIC DIAGRAM (POSITIVE LOGIC)
1OE
1A1
1A2
1A3
1A4
1
2OE
2
18
4
16
6
14
8
12
1Y1
2A1
1Y2
2A2
1Y3
2A3
1Y4
2A4
19
11
9
13
7
15
5
17
3
2Y1
2Y2
2Y3
2Y4
Pin numbers shown are for the DB, DGV, DW, N, NS, PW, and RGY packages.
Absolute Maximum Ratings (1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
VCC
Supply voltage range
–0.5
6.5
V
VI
Input voltage range (2)
–0.5
6.5
V
–0.5
6.5
V
–0.5
VCC + 0.5
state (2)
UNIT
VO
Voltage range applied to any output in the high-impedance or power-off
VO
Voltage range applied to any output in the high or low state (2) (3)
IIK
Input clamp current
VI < 0
–50
mA
IOK
Output clamp current
VO < 0
–50
mA
IO
Continuous output current
±50
mA
±100
mA
Continuous current through VCC or GND
θJA
Package thermal impedance
DB package (4)
70
DGV package (4)
92
DW package (4)
58
GQN/ZQN package (4)
78
package (4)
69
NS package (4)
60
PW package (4)
83
N
RGY
Tstg
Storage temperature range
Ptot
Power dissipation
(1)
(2)
(3)
(4)
(5)
(6)
(7)
package (5)
°C/W
37
–65
TA = –40°C to 125°C (6) (7)
V
150
°C
500
mW
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
The value of VCC is provided in the recommended operating conditions table.
The package thermal impedance is calculated in accordance with JESD 51-7.
The package thermal impedance is calculated in accordance with JESD 51-5.
For the DW package: above 70°C the value of Ptot derates linearly with 8 mW/K.
For the DB, DGV, N, NS, and PW packages: above 60°C the value of Ptot derates linearly with 5.5 mW/K.
3
SN74LVC244A
OCTAL BUFFER/DRIVER
WITH 3-STATE OUTPUTS
www.ti.com
SCAS414X – NOVEMBER 1992 – REVISED MARCH 2005
Recommended Operating Conditions (1)
TA = 25°C
VCC Supply voltage
VIH
VIL
High-level
input voltage
Low-level
input voltage
VI
Input voltage
VO
Output voltage
IOH
High-level
output current
Operating
Data retention only
VCC = 1.65 V to 1.95 V
(1)
4
Low-level
output current
–40 TO 125°C
MIN
MAX
MIN
MAX
MIN
MAX
1.65
3.6
1.65
3.6
1.65
3.6
1.5
1.5
1.5
0.65 × VCC
0.65 × VCC
0.65 × VCC
VCC = 2.3 V to 2.7 V
1.7
1.7
1.7
VCC = 2.7 V to 3.6 V
2
2
2
VCC = 1.65 V to 1.95 V
UNIT
V
V
0.35 × VCC
0.35 × VCC
0.35 × VCC
VCC = 2.3 V to 2.7 V
0.7
0.7
0.7
VCC = 2.7 V to 3.6 V
0.8
0.8
0.8
V
0
5.5
0
5.5
0
5.5
V
0
VCC
0
VCC
0
VCC
V
VCC = 1.65 V
–4
–4
–4
VCC = 2.3 V
–8
–8
–8
VCC = 2.7 V
–12
–12
–12
VCC = 3 V
–24
–24
–24
4
4
4
VCC = 1.65 V
IOL
–40 TO 85°C
VCC = 2.3 V
8
8
8
VCC = 2.7 V
12
12
12
VCC = 3 V
24
24
24
All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
mA
mA
SN74LVC244A
OCTAL BUFFER/DRIVER
WITH 3-STATE OUTPUTS
www.ti.com
SCAS414X – NOVEMBER 1992 – REVISED MARCH 2005
Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
IOH = –100 µA
VOH
MIN
–40 TO 125°C
MAX
MIN
VCC –
0.2
VCC –
0.2
VCC –
0.3
1.65 V
1.29
1.2
1.05
IOH = –8 mA
2.3 V
1.9
1.7
1.55
2.7 V
2.2
2.2
2.05
2.25
V
3V
2.4
2.4
IOH = –24 mA
3V
2.3
2.2
IOL = 100 µA
1.65 V to 3.6 V
0.1
0.2
IOL = 4 mA
1.65 V
0.24
0.45
0.6
IOL = 8 mA
2.3 V
0.3
0.7
0.75
IOL = 12 mA
2.7 V
0.4
0.4
0.6
3V
VI = 5.5 V or GND
UNIT
MAX
2
0.3
V
0.55
0.55
0.8
3.6 V
±1
±5
±20
µA
Ioff
VI or VO = 5.5 V
0
±1
±10
±20
µA
IOZ
VO = 0 to 5.5 V
3.6 V
±1
±10
±20
µA
1
10
40
1
10
40
500
500
5000
ICC
∆ICC
(1)
–40 TO 85°C
TYP MAX
IOH = –4 mA
IOL = 24 mA
II
MIN
1.65 V to 3.6 V
IOH = –12 mA
VOL
TA = 25°C
VCC
VI = VCC or GND
3.6 V ≤ VI ≤ 5.5 V (1)
IO = 0
One input at VCC – 0.6 V,
Other inputs at VCC or GND
3.6 V
2.7 V to 3.6 V
µA
µA
Ci
VI = VCC or GND
3.3 V
4
pF
Co
VO = VCC or GND
3.3 V
5.5
pF
This applies in the disabled state only.
Switching Characteristics
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1)
PARAMETER
tpd
FROM
(INPUT)
A
TO
(OUTPUT)
Y
VCC
OE
Y
OE
Y
TYP
MAX
MIN
MAX
MIN
MAX
1
7
14.4
1
14.9
1
16.4
1
5.9
10.4
1
10.9
1
12.4
2.5 V ± 0.2 V
1
4.2
7.4
1
7.9
1
10
2.7 V
1
4.2
6.7
1
6.9
1
8.2
1.5
3.9
5.7
1.5
5.9
1.5
7.2
1.5 V
1
8.3
17.8
1
18.3
1
19.8
1.8 V ± 0.15 V
1
6.4
12.1
1
12.6
1
14.1
2.5 V ± 0.2 V
1
4.6
9.1
1
9.6
1
11.7
2.7 V
1
5
8.4
1
8.6
1
10.3
1.5
4.5
7.4
1.5
7.6
1.5
9.4
1.5 V
1
7.2
15.6
1
16.1
1
17.6
1.8 V ± 0.15 V
1
5.8
11.6
1
12.1
1
13.6
2.5 V ± 0.2 V
1
3.7
7.3
1
7.8
1
9.9
2.7 V
1
3.8
6.6
1
6.8
1
8.6
1.5
3.8
6.3
1.5
6.5
1.5
8
3.3 V ± 0.3 V
tsk(o)
–40 TO 125°C
1.5 V
3.3 V ± 0.3 V
tdis
MIN
–40 TO 85°C
1.8 V ± 0.15 V
3.3 V ± 0.3 V
ten
TA = 25°C
3.3 V ± 0.3 V
1
1.5
UNIT
ns
ns
ns
ns
5
SN74LVC244A
OCTAL BUFFER/DRIVER
WITH 3-STATE OUTPUTS
www.ti.com
SCAS414X – NOVEMBER 1992 – REVISED MARCH 2005
Operating Characteristics
TA = 25°C
PARAMETER
TEST CONDITIONS
Outputs enabled
Cpd
Power dissipation capacitance per buffer/driver
Outputs disabled
6
f = 10 MHz
f = 10 MHz
VCC
TYP
1.8 V
43
2.5 V
43
3.3 V
44
1.8 V
1
2.5 V
1
3.3 V
2
UNIT
pF
SN74LVC244A
OCTAL BUFFER/DRIVER
WITH 3-STATE OUTPUTS
www.ti.com
SCAS414X – NOVEMBER 1992 – REVISED MARCH 2005
PARAMETER MEASUREMENT INFORMATION
VLOAD
S1
RL
From Output
Under Test
CL
(see Note A)
Open
GND
RL
TEST
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open
VLOAD
GND
LOAD CIRCUIT
INPUTS
VCC
1.5 V
1.8 V ± 0.15 V
2.5 V ± 0.2 V
2.7 V
3.3 V ± 0.3 V
VI
tr/tf
VCC
VCC
VCC
2.7 V
2.7 V
≤2 ns
≤2 ns
≤2 ns
≤2.5 ns
≤2.5 ns
VM
VLOAD
CL
RL
V∆
VCC/2
VCC/2
VCC/2
1.5 V
1.5 V
2 × VCC
2 × VCC
2 × VCC
6V
6V
15 pF
30 pF
30 pF
50 pF
50 pF
2 kΩ
1 kΩ
500 Ω
500 Ω
500 Ω
0.1 V
0.15 V
0.15 V
0.3 V
0.3 V
VI
Timing Input
VM
0V
tw
tsu
VI
Input
VM
VM
th
VI
Data Input
VM
VM
0V
0V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VI
VM
Input
VM
0V
tPLH
VM
VM
VOL
tPHL
VM
VM
0V
Output
Waveform 1
S1 at VLOAD
(see Note B)
tPLH
tPLZ
VLOAD/2
VM
tPZH
VOH
Output
VM
tPZL
tPHL
VOH
Output
VI
Output
Control
VM
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
Output
Waveform 2
S1 at GND
(see Note B)
VOL + V∆
VOL
tPHZ
VM
VOH − V∆
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω.
D. The outputs are measured one at a time, with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
H. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
7
PACKAGE OPTION ADDENDUM
www.ti.com
6-Dec-2006
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
SN74LVC244ADBLE
OBSOLETE
SSOP
DB
20
SN74LVC244ADBR
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC244ADBRE4
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC244ADBRG4
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC244ADGVR
ACTIVE
TVSOP
DGV
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC244ADGVRE4
ACTIVE
TVSOP
DGV
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC244ADW
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC244ADWE4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC244ADWR
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC244ADWRE4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC244AGQNR
ACTIVE
GQN
20
1000
TBD
SNPB
Level-1-240C-UNLIM
SN74LVC244AN
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74LVC244ANE4
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74LVC244ANSR
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC244ANSRE4
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC244APW
ACTIVE
TSSOP
PW
20
70
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC244APWE4
ACTIVE
TSSOP
PW
20
70
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC244APWG4
ACTIVE
TSSOP
PW
20
70
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC244APWLE
OBSOLETE
TSSOP
PW
20
SN74LVC244APWR
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC244APWRE4
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC244APWRG4
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC244APWT
ACTIVE
TSSOP
PW
20
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC244APWTE4
ACTIVE
TSSOP
PW
20
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC244ARGYR
ACTIVE
QFN
RGY
20
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1YEAR
BGA MI
CROSTA
R JUNI
OR
Pins Package Eco Plan (2)
Qty
TBD
TBD
Addendum-Page 1
Lead/Ball Finish
Call TI
Call TI
MSL Peak Temp (3)
Call TI
Call TI
PACKAGE OPTION ADDENDUM
www.ti.com
6-Dec-2006
Orderable Device
Status (1)
Package
Type
Package
Drawing
SN74LVC244ARGYRG4
ACTIVE
QFN
RGY
20
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1YEAR
SN74LVC244AZQNR
ACTIVE
ZQN
20
1000 Green (RoHS &
no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
BGA MI
CROSTA
R JUNI
OR
Pins Package Eco Plan (2)
Qty
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
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Addendum-Page 2
MECHANICAL DATA
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000
DGV (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
24 PINS SHOWN
0,40
0,23
0,13
24
13
0,07 M
0,16 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
0°–8°
1
0,75
0,50
12
A
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,08
14
16
20
24
38
48
56
A MAX
3,70
3,70
5,10
5,10
7,90
9,80
11,40
A MIN
3,50
3,50
4,90
4,90
7,70
9,60
11,20
DIM
4073251/E 08/00
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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