LIGITEK LVIR9033-TR2 Surface mount led tape and reel Datasheet

LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
SURFACE MOUNT LED TAPE AND REEL
Pb
Lead-Free Parts
LVIR9033/TR2
DATA SHEET
QW0905-L VIR9033/TR2
DOC. NO
:
REV.
: C
DATE
: 04 - Aug - 2005
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 1/7
PART NO. LVIR9033/TR2
Package Dimensions
Cathode
2.5
0.4±0.1
2.0
0.5±0.1
5.8±0.5
ψ1.9
3.05±0.5
1.4
2.8
0.7
4.3± 0.5
Note : 1.All dimension are in millimeter tolerance is ±0.2mm unless otherwise noted.
2.Specifications are subject to change without notice.
Carrier Type Dimensions
4.0
0.3
6.43
9.3
12±0.3
5.5
Polarity
1.75
2.0
4.0
Note : The tolerances unless mentioned is ±0.2mm,Angle ± 0.5. Unit=mm.
ψ1.55
3.05
LIGITEK ELECTRONICS CO.,LTD.
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Page 2/7
PART NO. LVIR9033/TR2
Reel Dimensions
16.0±1.0
ψ178±2.0
14.2±1.0
74.0±1.5
Description
Quantity/Reel
12.0mm tape,7"reel
1500 devices
Features:
1. High radiant intensity.
2. Suitable for pulsed applications.
3. Low average degradation.
Descriptions:
The LVIR9033/TR2 series are super-high efficiency Gallium Aluminum Arsenide infrared
emitting diodes encapsulated in water clear plastic T-1 3/4 package individually
Device Selection Guide:
PART NO
MATERIAL
LENS COLOR
LVIR9033/TR2
GaAIAs
Water Clear
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LVIR9033/TR2
Page 3/7
Absolute Maximum Ratings at Ta=25 ℃
Ratings
Parameter
Symbol
UNIT
VIR
Power Dissipation
PD
100
mW
Peak Forward Current
(300PPS,1 μs Pulse)
IFP
3
A
Forward Current
IF
50
mA
Reverse Voltage
Vr
5
V
Electrostatic Discharge
ESD
2000
V
Operating Temperature
Topr
-55 ~ +100
℃
Storage Temperature
Tstg
-55 ~ +100
℃
Soldering Temperature
Tsol
Max 260 ℃ for 5 sec Max
(2mm from body)
Electrical Optical Characteristics (Aa=25℃)
SYMBOL
Min.
Typ.
Radiant Intensity
Le
1.6
Aperture Radiant Incidence
Ee
0.2
Peak Emission Wavelength
Max.
UNIT
TEST CONDITION
2.7
mW/sr
IF=20mA
0.4
mW/cm
IF=20mA
λpeak
940
nm
IF=20mA
△λ
50
nm
IF=20mA
Forward Voltage
VF
1.2
1.6
V
IF=20mA
Reverse Current
IR
100
μA
VR=5V
PARAMETER
Spectral Line Half Width
Viewing Angle
2θ1/2
2
20
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.
2. The radiant intensity data did not including ±15% testing tolerance.
deg
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Page 4/7
PART NO. LVIR9033/TR2
Typical Electro-Optical Characteristics Curve
Relative Radiant Intensity
Normalize @20mA
VIR CHIP
Forward Current [mA]
1000
100
10
1.0
0.1
0.5
1.0
1.5
2.0
2.5
3.0
3.5
1.0
0.5
0.0
4.0
800
850
1100
Fig.4 Relative Radiant Power
vs. Forward Peak Current
10.0
10.0
Relative Radiant Power
Normalized @ 100 mA
Fig 3. Relative Radiant Power
vs. Forward Peak Current
1.0
0.1
1.0
10
1.0
0.1
100
10
100
Fig.6 Relative Radiant Power vs. Temperature
1.2
1.1
1.0
0.9
0.8
-20
0
20
40
60
80
Ambient Temperature [ ℃]
100
Relative Radiant Power
@ 20mA, Normalize @ 25 ℃
Fig.5 Forward DC Voltage vs. Temperature
-40
1000
IFPK [mA]
IFDC [mA]
Forw ard DC Voltage @ 20 mA
Normalize @ 25 ℃
1000 1050
Wavelength[nm]
Forward Voltage[V]
Relative Radiant Power
Normalized @ 20mA
900 950
3.0
2.5
2.0
1.5
1.0
0.5
0
-40
-20
0
20
40
60
80
Ambient Temperature [ ℃]
100
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LVIR9033/TR2
Page 5/7
Recommended Soldering Conditions
1. Hand Solder
Basic spec is ≦ 280℃ 3 sec one time only.
2. Wave Solder
Soldering heat Max. 260 ℃
245±5℃ within 5 sec
Preheat
120 ~ 150℃
120 ~ 180 sec
3-1. LEAD Reflow Solder
Temp.
(℃)
240
Cooling
-5 ℃/sec
Rising
+5℃ /sec
Preheat
150
120
60 ~ 120 sec
Time
5sec
3-2 PB-Free Reflow Solder
1~5° C/sec
Preheat
180~200° C
1~5° C/sec
260° C MaX.
10sec.Max
Above 220° C
60 sec.Max.
120 sec.Max.
Reflow Soldering should not be done more than two times.
LIGITEK ELECTRONICS CO.,LTD.
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PART NO. LVIR9033/TR2
Page 6/7
Precautions For Use:
Storage time:
1.The operation of Temperatures and RH are : 5 ℃~35℃,RH60%.
2.Once the package is opened, the products should be used within a week.
Otherwise, they should be kept in a damp proof box with descanting agent.
Considering the tape life, we suggest our customers to use our products within
a year(from production date).
3.If opened more than one week in an atmosphere 5 ℃ ~ 35℃,RH60%,
they should be treated at 60 ℃± 5 ℃fo r 15hrs.
Drive Method:
LED is a current operated device, and therefore, requirer some kind of current limiting incorporated into
the driver circuit. This current limiting typically takes the form of a current limiting resistor placed in series
with the LED.
Consider worst case voltage variations than could occur across the current limiting resistor. The forwrd
current should not be allowed to change by more than 40 % of its desired value.
Circuit model A
Circuit model B
LED
LED
(A) Recommended circuit.
(B) The difference of brightness between LED could be found due to the VF-IF characteristics of LED.
Cleaning:
Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED.
ESD(Electrostatic Discharge):
Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic
glove is recommended when handing these LED. All devices, equipment and machinery must be properly
grounded.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LVIR9033/TR2
Page 7/7
Reliability Test:
Test Item
Test Condition
Description
Reference
Standard
Operating Life Test
1.Under Room Temperature
2.If=20mA
3.t=1000 hrs (-24hrs, +72hrs)
This test is conducted for the purpose
of detemining the resisance of a part
in electrical and themal stressed.
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
High Temperature
Storage Test
1.Ta=105 ℃±5 ℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of
the device which is laid under ondition
of high temperature for hours.
MIL-STD-883:1008
JIS C 7021: B-10
Low Temperature
Storage Test
1.Ta=-40 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
High Temperature
High Humidity Test
1.Ta=65 ℃±5℃
2.RH=90 %~95 %
3.t=240hrs ±2hrs
The purpose of this test is the resistance
of the device under tropical for hous.
1.Ta=105 ℃±5 ℃&-40 ℃±5℃
(10min) (10min)
2.total 10 cycles
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
Solder Resistance
Test
1.T.Sol=260 ℃±5℃
2.Dwell time= 10 ±1sec.
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
Solderability Test
1.T.Sol=230 ℃±5℃
2.Dwell time=5 ±1sec
This test intended to see soldering well
performed or not.
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
Thermal Shock Test
JIS C 7021: B-12
MIL-STD-202:103B
JIS C 7021: B-11
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