Sharp LZ2316AR Dual-power-supply (5 v/12 v) operation 1/3-type ccd area sensors with 270 k pixel Datasheet

LZ2315A/LZ2316AR
Dual-power-supply (5 V/12 V) Operation
1/3-type CCD Area Sensors with 270 k Pixels
LZ2315A/
LZ2316AR
DESCRIPTION
PIN CONNECTIONS
The LZ2315A/LZ2316AR are 1/3-type (6.0 mm)
solid-state image sensors that consist of PN photodiodes and CCDs (charge-coupled devices) driven
by dual-power-supply. With approximately 270 000
pixels (542 horizontal x 492 vertical), the sensor
provides a stable high-resolution color (LZ2315A)/
B/W (LZ2316AR) normal or mirror image.
16-PIN SHRINK-PITCH WDIP
FEATURES
• Number of effective pixels : 512 (H) x 492 (V)
• Number of optical black pixels
– Horizontal : 2 front and 28 rear
• Pixel pitch : 9.6 µm (H) x 7.5 µm (V)
• Mg, G, Cy, and Ye complementary color filters
(For LZ2315A)
• Low fixed-pattern noise and lag
• No burn-in and no image distortion
• Blooming suppression structure
• Built-in output amplifier
• Built-in pulse mix circuit
• Built-in overflow drain voltage circuit and reset
gate voltage circuit
• Variable electronic shutter (1/60 to 1/10 000 s)
• Normal or mirror image output available from
common output pin
• Compatible with NTSC standard (LZ2315A)/
EIA standard (LZ2316AR)
• Package :
16-pin shrink-pitch WDIP [Ceramic]
(WDIP016-N-0500C)
Row space : 12.70 mm
TOP VIEW
ØRS 1
16 T1
RD 2
15 OFD
GND 3
14 ØTG
OS 4
13 ØV2
OD 5
12 ØV1
ØH2B 6
11 ØV4
ØH2 7
10 ØV3
ØH1B 8
9 ØH1
(WDIP016-N-0500C)
PRECAUTIONS
• The exit pupil position of lens should be more
than 25 mm (LZ2315A)/20 mm (LZ2316AR) from
the top surface of the CCD.
• Refer to "PRECAUTIONS FOR CCD AREA
SENSORS" for details.
COMPARISON TABLE
TV standard
LZ2315A
NTSC standard (Color)
Characteristics
LZ2316AR
EIA standard (B/W)
Refer to each following specification.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in
catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
1
LZ2315A/LZ2316AR
PIN DESCRIPTION
RD
SYMBOL
PIN NAME
Reset transistor drain
OD
OS
Output transistor drain
Output signals
ØRS
Reset transistor clock
ØV1, ØV2, ØV3, ØV4
Vertical shift register clock
1
2
ØH1, ØH2, ØH1B, ØH2B
ØTG
Horizontal shift register clock
Transfer gate clock
3
OFD
Overflow drain
1
GND
T1
Ground
NOTE
Test pin
NOTES :
1. ØRS, OFD : Use the circuit parameter indicated in "SYSTEM CONFIGURATION
EXAMPLE", and do not connect to DC voltage directly. When not using electronic shutter,
connect OFD to GND through a 0.1 µF capacitor and a 1 M$ resistor.
2. ØV1-ØV4 : Input the clock through a 0.1 µF capacitor.
3. ØTG : Use the circuit parameter indicated in "SYSTEM CONFIGURATION EXAMPLE".
ABSOLUTE MAXIMUM RATINGS
PARAMETER
Output transistor drain voltage
(TA = +25 ˚C)
NOTE
SYMBOL
VOD
RATING
0 to +15
UNIT
V
Reset transistor drain voltage
VRD
Overflow drain voltage
VOFD
0 to +15
Internal output
V
V
1
Test pin, T1
Reset gate clock voltage
VT1
VØRS
0 to +15
Internal output
V
V
2
Vertical shift register clock voltage
VØV
0 to +7.5
V
–0.3 to +7.5
–0.3 to +15
V
V
–40 to +85
–20 to +70
˚C
˚C
Horizontal shift register clock voltage
VØH
Transfer gate clock voltage
VØTG
Storage temperature
TSTG
Ambient operating temperature
TOPR
NOTES :
1. Do not connect to DC voltage directly. When OFD is connected to GND, connect VOD to GND. Overflow drain clock is
applied below 13 Vp-p.
2. Do not connect to DC voltage directly. When ØRS is connected to GND, connect VOD to GND. Reset gate clock is
applied below 8 Vp-p.
2
LZ2315A/LZ2316AR
RECOMMENDED OPERATING CONDITIONS
PARAMETER
Ambient operating temperature
SYMBOL
TOPR
MIN.
TYP.
25.0
MAX.
UNIT
˚C
Output transistor drain voltage
VOD
12.0
12.5
13.0
V
12.0
12.5
13.0
V
Reset transistor drain voltage
Overflow drain clock
Ground
VRD
VØOFD
p-p level
GND
Test pin, T1
Transfer gate clock
Vertical shift register
clock
Horizontal shift register
clock
LOW level
HIGH level
p-p level
LOW level
0.0
VOD
0.0
0.05
V
V
VØTGH
12.0
12.5
13.0
V
VØV1, VØV2
VØV3, VØV4
4.7
5.0
5.5
V
VØH1L, VØH2L
VØH1BL, VØH2BL
–0.05
0.0
0.05
V
4.7
5.0
5.5
V
4.5
5.0
5.5
V
VØRS
fØV1, fØV2
Vertical shift register clock frequency
fØV3, fØV4
Horizontal shift register clock frequency
fØH1, fØH2
fØH1B, fØH2B
Reset gate clock frequency
tw1, tw2
15.73
kHz
9.53
MHz
9.53
fØRS
Horizontal shift register clock phase
5.0
10.0
1
V
–0.05
VØH1BH, VØH2BH
p-p level
V
VT1
VØTGL
VØH1H, VØH2H
HIGH level
Reset gate clock
VOD
NOTE
1
1
MHz
18.0
ns
2
NOTES :
1. Use the circuit parameter indicated in "SYSTEM CONFIGURATION EXAMPLE", and do not connect to DC voltage directly.
2.
ØH1, ØH2
ØH1B, ØH2B : Normal image output mode
ØH1B, ØH2B : Mirror image output mode
tw1
tw2
* To apply power, first connect GND and then turn on VOD and then turn on other powers and pulses. Do not connect the
device to or disconnect it from the plug socket while power is being applied.
3
LZ2315A/LZ2316AR
CHARACTERISTICS FOR LZ2315A (Drive method : Field accumulation)
(TA = +25 ˚C, Operating conditions : The typical values specified in "RECOMMENDED OPERATING CONDITIONS".
Color temperature of light source : 3 200 K, IR cut-off filter (CM-500, 1 mmt) is used.)
PARAMETER
Standard output voltage
SYMBOL
VO
Photo response non-uniformity
Saturation output voltage
PRNU
VSAT
Dark output voltage
VDARK
Dark signal non-uniformity
Sensitivity
DSNU
R
Smear ratio
Image lag
SMR
AI
Blooming suppression ratio
ABL
Output transistor drain current
IOD
Output impedance
RO
MIN.
TYP.
150
MAX.
15
650
420
UNIT
mV
NOTE
2
%
3
mV
4
0.5
mV
1, 5
0.5
600
mV
mV
1, 6
7
8
9
–110
–90
1.0
dB
%
4.0
400
8.0
mA
$
Vector breakup
Line crawling
10.0
3.0
˚, %
%
11
12
Luminance flicker
2.0
%
13
1 000
10
NOTES :
• Within the recommended operating conditions of VOD,
VOFD of the internal output satisfies with ABL larger than
1 000 times exposure of the standard exposure conditions,
and VSAT larger than 650 mV.
1. TA = +60 ˚C
2. The average output voltage under uniform illumination.
The standard exposure conditions are defined as when
Vo is 150 mV.
3. The image area is divided into 10 x 10 segments under
the standard exposure conditions. Each segment's
voltage is the average output voltage of all pixels within
the segment. PRNU is defined by (Vmax – Vmin)/Vo,
where Vmax and Vmin are the maximum and minimum
values of each segment's voltage respectively.
4. The image area is divided into 10 x 10 segments. Each
segment's voltage is the average output voltage of all
pixels within the segment. VSAT is the minimum
segment's voltage under 10 times exposure of the
standard exposure conditions.
5. The average output voltage under non-exposure
conditions.
6. The image area is divided into 10 x 10 segments under
non-exposure conditions. DSNU is defined by (Vdmax –
Vdmin), where Vdmax and Vdmin are the maximum and
minimum values of each segment's voltage respectively.
7. The average output voltage when a 1 000 lux light
source with a 90% reflector is imaged by a lens of F4,
f50 mm.
8. The sensor is exposed only in the central area of V/10
square with a lens at F4, where V is the vertical image
size. SMR is defined by the ratio of the output voltage
detected during the vertical blanking period to the
maximum output voltage in the V/10 square.
9. The sensor is exposed at the exposure level
corresponding to the standard conditions. AI is defined
by the ratio of the output voltage measured at the 1st
field during the non-exposure period to the standard
output voltage.
10. The sensor is exposed only in the central area of V/10
square, where V is the vertical image size. ABL is
defined by the ratio of the exposure at the standard
conditions to the exposure at a point where blooming is
observed.
11. Observed with a vector scope when the color bar chart
is imaged under the standard exposure conditions.
12. The difference between the average output voltage of the
(Mg + Ye), (G + Cy) line and that of the (Mg + Cy), (G +
Ye) line under the standard exposure conditions.
13. The difference between the average output voltage of
the odd field and that of the even field under the
standard exposure conditions.
4
LZ2315A/LZ2316AR
CHARACTERISTICS FOR LZ2316AR (Drive method : Field accumulation)
(TA = +25 ˚C, Operating conditions : The typical values specified in "RECOMMENDED OPERATING CONDITIONS".
Color temperature of light source : 3 200 K, IR cut-off filter (CM-500, 1 mmt) is used.)
PARAMETER
Standard output voltage
SYMBOL
VO
Photo response non-uniformity
Saturation output voltage
PRNU
VSAT
Dark output voltage
VDARK
Dark signal non-uniformity
Sensitivity
DSNU
R
Smear ratio
Image lag
SMR
AI
Blooming suppression ratio
ABL
Output transistor drain current
IOD
Output impedance
RO
MIN.
TYP.
150
MAX.
15
650
700
UNIT
mV
NOTE
2
%
3
mV
4
0.5
mV
1, 5
0.5
1 000
mV
mV
1, 6
7
8
9
–110
–90
1.0
dB
%
4.0
400
8.0
mA
$
1 000
10
NOTES :
• Within the recommended operating conditions of VOD,
VOFD of the internal output satisfies with ABL larger than
1 000 times exposure of the standard exposure conditions,
and VSAT larger than 650 mV.
1. TA = +60 ˚C
2. The average output voltage under uniform illumination.
The standard exposure conditions are defined as when
Vo is 150 mV.
3. The image area is divided into 10 x 10 segments under
the standard exposure conditions. Each segment's
voltage is the average output voltage of all pixels within
the segment. PRNU is defined by (Vmax – Vmin)/Vo,
where Vmax and Vmin are the maximum and minimum
values of each segment's voltage respectively.
4. The image area is divided into 10 x 10 segments. Each
segment's voltage is the average output voltage of all
pixels within the segment. VSAT is the minimum
segment's voltage under 10 times exposure of the
standard exposure conditions.
5. The average output voltage under non-exposure
conditions.
6. The image area is divided into 10 x 10 segments under
non-exposure conditions. DSNU is defined by (Vdmax –
Vdmin), where Vdmax and Vdmin are the maximum and
minimum values of each segment's voltage respectively.
7. The average output voltage when a 1000 lux light
source with a 90% reflector is imaged by a lens of F4,
f50 mm.
8. The sensor is exposed only in the central area of V/10
square with a lens at F4, where V is the vertical image
size. SMR is defined by the ratio of the output voltage
detected during the vertical blanking period to the
maximum output voltage in the V/10 square.
9. The sensor is exposed at the exposure level
corresponding to the standard conditions. AI is defined
by the ratio of the output voltage measured at the 1st
field during the non-exposure period to the standard
output voltage.
10. The sensor is exposed only in the central area of V/10
square, where V is the vertical image size. ABL is
defined by the ratio of the exposure at the standard
conditions to the exposure at a point where blooming is
observed.
5
LZ2315A/LZ2316AR
PIXEL STRUCTURE
yy
,,
,,
yy
,,
yy
,,
yy
,,
yy
,,
yy
yyy
,,,
,,,
yyy
,,,
yyy
,,,
yyy
,,,
yyy
,,,
yyy
OPTICAL BLACK
(2 PIXELS)
512 (H) x 492 (V)
COLOR FILTER ARRAY (FOR LZ2315A)
(1, 492)
ODD
field
OPTICAL BLACK
(28 PIXELS)
(512, 492)
Ye
Cy
Ye
Cy
Ye
Cy
Ye
Cy
Ye
Cy
G
Mg
G
Mg
G
Mg
G
Mg
G
Mg
Ye
Cy
Ye
Cy
Ye
Cy
Ye
Cy
Ye
Cy
Mg
G
Mg
G
Mg
G
Mg
G
Mg
G
Ye
Cy
Ye
Cy
Ye
Cy
Ye
Cy
Ye
Cy
G
Mg
G
Mg
G
Mg
G
Mg
G
Mg
Ye
Cy
Ye
Cy
Ye
Cy
Ye
Cy
Ye
Cy
Mg
G
Mg
G
Mg
G
Mg
G
Mg
G
Ye
Cy
Ye
Cy
Ye
Cy
Ye
Cy
Ye
Cy
G
Mg
G
Mg
G
Mg
G
Mg
G
Mg
Ye
Cy
Ye
Cy
Ye
Cy
Ye
Cy
Ye
Cy
Mg
G
Mg
G
Mg
G
Mg
G
Mg
G
(1, 1)
EVEN
field
(512, 1)
6
LZ2315A/LZ2316AR
TIMING CHART
VERTICAL TRANSFER TIMING <NORMAL OUTPUT>
(ODD FIELD)
525 1
10
17
19
HD
VD
ØV1
ØV2
ØV3
ØV4
ØTG
484 486 488 490 492
+
+
+
+
485 487 489 491
1
+
2
3
+
4
5
+
6
7
+
8
9
+
10
11
+
12
4
+
5
6
+
7
8
+
9
10
+
11
OS
(EVEN FIELD)
263
272
279
282
HD
VD
ØV1
ØV2
ØV3
ØV4
ØTG
483 485 487 489 491
+
+
+
+
+
484 486 488 490 492
1
2
+
3
OS
HORIZONTAL TRANSFER TIMING <NORMAL OUTPUT>
HD
606, 1
60
24
ØH1
84.5
ØH2
ØRS
OS
π512
PRESCAN (4)
OB (2)
OUTPUT (512) 1ππππππππππ
OB (28)
29
49
ØV1
39
59
ØV2
24
54
ØV3
34
64
ØV4
62
ØOFD
7
72
LZ2315A/LZ2316AR
READOUT TIMING <NORMAL OUTPUT>
(ODD FIELD)
HD
1
606, 1
60
60
29 49
ØV1
39 59
ØV2
24
ØV3
54
34
ØV4
242
ØTG
25.36 µs (242 bits)
64
338
10.06 µs (96 bits)
63.5 µs (606 bits)
(EVEN FIELD)
HD
60
1
606, 1
60
29 49
ØV1
39
59
ØV2
24
54
ØV3
34
64
ØV4
242
338
ØTG
25.36 µs (242 bits)
10.06 µs (96 bits)
63.5 µs (606 bits)
8
LZ2315A/LZ2316AR
VERTICAL TRANSFER TIMING <MIRROR OUTPUT>
(ODD FIELD)
525 1
17
10
19
HD
VD
ØV1
ØV2
ØV3
ØV4
ØTG
482 484 486 488 490 492
+
+
+
+
+
483 485 487 489 491
1
+
2
3
+
4
5
+
6
7
+
8
9
+
10
2
+
3
4
+
5
6
+
7
8
+
9
OS
(EVEN FIELD)
272
263
279
282
HD
VD
ØV1
ØV2
ØV3
ØV4
ØTG
481 483 485 487 489 491
+
+
+
+
+
+
482 484 486 488 490 492
1
OS
HORIZONTAL TRANSFER TIMING <MIRROR OUTPUT>
606, 1
60
HD
4
58.5
ØH1
ØH2
ØRS
OS
ππππ1
PRESCAN (4)
OB (2)
9
29
ØV1
19
39
ØV2
4
34
ØV3
14
44
ØV4
42
ØOFD
9
52
OB (28)
OUTPUT (512) 512πππππππππ
LZ2315A/LZ2316AR
READOUT TIMING <MIRROR OUTPUT>
(ODD FIELD)
1
606, 1
60
HD
60
9 29
ØV1
19 39
ØV2
ØV3
4
34
14
ØV4
222
ØTG
23.27 µs (222 bits)
44
318
10.06 µs (96 bits)
63.5 µs (606 bits)
(EVEN FIELD)
HD
1
606, 1
60
60
9 29
ØV1
19
39
ØV2
4
34
ØV3
14
44
ØV4
222
318
ØTG
23.27 µs (222 bits)
10.06 µs (96 bits)
63.5 µs (606 bits)
10
OFD
T1
• Example of drive circuit with LR38580 driver IC.
11
8
7
6
5
OD
4
OS
3
GND
2
RD
1
(*1)
LZ2315A
or
LZ2316AR
9
ØH2B
ØRS
1 k$
2SC4627
ØV2
ØH2
CCD
OUT
ØTG
ØH1B
VOD
ØV1
16 15 14 13 12 11 10
(*1) (*3)
(*2)
ØV4
1 M$
1 M$
ØV3
0.01 µF
1 000 pF
0.47 µF 10 $
0.1 µF
0.1 µF
0.1 µF
0.1 µF
ØH1
ØRS
TGX
OFDX
10 $
ØH1
ØH1B
ØH2
ØH2B
(*1) ØRS, OFD :
Use the circuit parameter indicated in
this circuit example, and do not connect
to DC voltage directly.
When not using electronic shutter,
connect OFD to GND through a 0.1 µF
capacitor and a 1 M$ resistor.
(*2) ØV1-ØV4 :
Input the clock through a 0.1 µF
capacitor.
(*3) ØTG :
Use the circuit parameter indicated in
this circuit example.
ØV3
ØV2
ØV1
ØV4
LZ2315A/LZ2316AR
SYSTEM CONFIGURATION EXAMPLE
PACKAGES FOR CCD AND CMOS DEVICES
PACKAGE
(Unit : mm)
16 WDIP (WDIP016-N-0500C)
θ
CCD
Glass Lid
1.66±0.10
6.20±0.15
16
12.40±0.15
0.60±0.60
1.40±0.60
11.20±0.10 (◊)
Center of effective imaging area
and center of package
(◊ : Lid's size)
9
7.00±0.15
CCD
Package (Cerdip)
0.04
Cross Section A-A'
8
Rotation error of die : ¬ = 1.5˚MAX.
A
P-1.78TYP.
A'
0.46TYP.
0.90TYP.
0.25
M
2.63TYP.
1.05MIN.
3.90±0.30
1.27±0.25
2.60±0.20
14.00±0.15
5.24MAX.
3.42±0.25
11.20±0.10 (◊)
0.80±0.05 (◊)
1
0.25±0.10
12.70±0.25
12
PRECAUTIONS FOR CCD AREA SENSORS
PRECAUTIONS FOR CCD AREA SENSORS
(In the case of plastic packages)
– The leads of the package are fixed with
package body (plastic), so stress added to a
lead could cause a crack in the package
body (plastic) in the jointed part of the lead.
1. Package Breakage
In order to prevent the package from being broken,
observe the following instructions :
1) The CCD is a precise optical component and
the package material is ceramic or plastic.
Therefore,
ø Take care not to drop the device when
mounting, handling, or transporting.
ø Avoid giving a shock to the package.
Especially when leads are fixed to the socket
or the circuit board, small shock could break
the package more easily than when the
package isn’t fixed.
2) When applying force for mounting the device or
any other purposes, fix the leads between a
joint and a stand-off, so that no stress will be
given to the jointed part of the lead. In addition,
when applying force, do it at a point below the
stand-off part.
Glass cap
Package
Lead
Fixed
Stand-off
3) When mounting the package on the housing,
be sure that the package is not bent.
– If a bent package is forced into place
between a hard plate or the like, the package may be broken.
4) If any damage or breakage occurs on the surface of the glass cap, its characteristics could
deteriorate.
Therefore,
ø Do not hit the glass cap.
ø Do not give a shock large enough to cause
distortion.
ø Do not scrub or scratch the glass surface.
– Even a soft cloth or applicator, if dry, could
cause dust to scratch the glass.
(In the case of ceramic packages)
– The leads of the package are fixed with low
melting point glass, so stress added to a
lead could cause a crack in the low melting
point glass in the jointed part of the lead.
Low melting point glass
Lead
2. Electrostatic Damage
As compared with general MOS-LSI, CCD has
lower ESD. Therefore, take the following anti-static
measures when handling the CCD :
1) Always discharge static electricity by grounding
the human body and the instrument to be used.
To ground the human body, provide resistance
of about 1 M$ between the human body and
the ground to be on the safe side.
2) When directly handling the device with the
fingers, hold the part without leads and do not
touch any lead.
Fixed
Stand-off
13
PRECAUTIONS FOR CCD AREA SENSORS
ø The contamination on the glass surface
should be wiped off with a clean applicator
soaked in Isopropyl alcohol. Wipe slowly and
gently in one direction only.
– Frequently replace the applicator and do not
use the same applicator to clean more than
one device.
◊ Note : In most cases, dust and contamination
are unavoidable, even before the device
is first used. It is, therefore, recommended
that the above procedures should be
taken to wipe out dust and contamination
before using the device.
3) To avoid generating static electricity,
a. do not scrub the glass surface with cloth or
plastic.
b. do not attach any tape or labels.
c. do not clean the glass surface with dustcleaning tape.
4) When storing or transporting the device, put it in
a container of conductive material.
3. Dust and Contamination
Dust or contamination on the glass surface could
deteriorate the output characteristics or cause a
scar. In order to minimize dust or contamination on
the glass surface, take the following precautions :
1) Handle the CCD in a clean environment such
as a cleaned booth. (The cleanliness level
should be, if possible, class 1 000 at least.)
2) Do not touch the glass surface with the fingers.
If dust or contamination gets on the glass
surface, the following cleaning method is
recommended :
ø Dust from static electricity should be blown
off with an ionized air blower. For antielectrostatic measures, however, ground all
the leads on the device before blowing off
the dust.
4. Other
1) Soldering should be manually performed within
5 seconds at 350 °C maximum at soldering iron.
2) Avoid using or storing the CCD at high temperature or high humidity as it is a precise
optical component. Do not give a mechanical
shock to the CCD.
3) Do not expose the device to strong light. For
the color device, long exposure to strong light
will fade the color of the color filters.
14
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