STMicroelectronics M25P10-AVME3TP 512 kbit to 32 mbit, low voltage, serial flash memory with 40 mhz or 50 mhz spi bus interface Datasheet

M25PXX
512 Kbit to 32 Mbit, Low Voltage, Serial Flash Memory
With 40 MHz or 50 MHz SPI Bus Interface
DATA BRIEF
FEATURES SUMMARY
■
■
■
■
■
■
■
■
■
■
■
512Kbit to 32Mbit of Flash Memory
Page Program (up to 256 Bytes) in 1.4ms
(typical)
Sector Erase (256 Kbit or 512Kbit)
Bulk Erase (512Kbit to 32Mbit)
2.7 to 3.6V Single Supply Voltage
SPI Bus Compatible Serial Interface
40MHz to 50MHz Clock Rate (maximum)
Deep Power-down Mode 1µA (typical)
Electronic Signatures
– JEDEC Standard Two-Byte Signature
(20xxh)
– RES Instruction, One-Byte, Signature, for
backward compatibility
More than 100000 Erase/Program Cycles per
Sector
More than 20 Year Data Retention
Figure 1. Packages
VDFPN8 (ME)
8x6mm (MLP8)
VDFPN8 (MP)
(MLP8)
Table 1. Product List
Reference
Part Number
M25P32
M25P16
M25P80
M25Pxx
SO16 (MF)
300 mil width
M25P40
M25P20
M25P10-A
M25P05-A
8
1
SO8 (MN)
150 mil width
October 2004
For further information contact your local ST sales office.
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M25PXX
SUMMARY DESCRIPTION
Figure 3. SO8 and VDFPN Connections
The M25Pxx is a 512Kbit to 32Mbit (2M x 8) Serial
Flash Memory, with advanced write protection
mechanisms, accessed by a high speed SPI-compatible bus.
The memory can be programmed 1 to 256 bytes at
a time, using the Page Program instruction.
The memory is organized as a number of sectors,
each containing 256 or 128 pages. Each page is
256 bytes wide.
The whole memory can be erased using the Bulk
Erase instruction, or a sector at a time, using the
Sector Erase instruction.
M25Pxx
S
Q
W
VSS
1
2
3
4
8
7
6
5
VCC
HOLD
C
D
AI10259
Figure 2. Logic Diagram
VCC
D
Q
Note: 1. There is an exposed die paddle on the underside of the
MLP8 package. This is pulled, internally, to V SS, and
must not be allowed to be connected to any other voltage
or signal line on the PCB.
C
S
M25Pxx
Figure 4. SO16 Connections
W
M25Pxx
HOLD
VSS
AI10258
Table 2. Signal Names
C
Serial Clock
D
Serial Data Input
Q
Serial Data Output
S
Chip Select
W
Write Protect
HOLD
Hold
VCC
Supply Voltage
VSS
Ground
HOLD
VCC
DU
DU
DU
DU
S
Q
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
AI10260
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Note: 1. DU = Don’t Use
C
D
DU
DU
DU
DU
VSS
W
M25PXX
Figure 5. Block Diagram
HOLD
W
High Voltage
Generator
Control Logic
S
C
D
I/O Shift Register
Q
Address Register
and Counter
Status
Register
256 Byte
Data Buffer
Top of Address Space
Y Decoder
Size of the
read-only
memory area
00000h
000FFh
256 Bytes (Page Size)
X Decoder
AI10261
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M25PXX
Table 3. Instruction Set
Instruction
Description
One-byte Instruction Code
Dummy
Bytes
Data
Bytes
WREN
Write Enable
0000 0110
06h
0
0
0
WRDI
Write Disable
0000 0100
04h
0
0
0
RDID
Read Identification
1001 1111
9Fh
0
0
1 to 3
RDSR
Read Status Register
0000 0101
05h
0
0
1 to ∞
WRSR
Write Status Register
0000 0001
01h
0
0
1
READ
Read Data Bytes
0000 0011
03h
3
0
1 to ∞
0000 1011
0Bh
3
1
1 to ∞
FAST_READ Read Data Bytes at Higher Speed
PP
Page Program
0000 0010
02h
3
0
1 to 256
SE
Sector Erase
1101 1000
D8h
3
0
0
BE
Bulk Erase
1100 0111
C7h
0
0
0
DP
Deep Power-down
1011 1001
B9h
0
0
0
Release from Deep Power-down,
and Read Electronic Signature
0
3
1010 1011
ABh
1 to ∞
0
0
0
RES
Release from Deep Power-down
Table 4. Status Register Format
b7
SRWD
b0
0
0
BP2
BP1
BP0
WEL
WIP
Status Register
Write Protect
Block Protect Bits
Write Enable Latch Bit
Write In Progress Bit
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Address
Bytes
M25PXX
PART NUMBERING
Table 5. Ordering Information Scheme
Example:
M25P80
–
V MP
6
T
P
Device Type
M25P = Serial Flash Memory for Code Storage
Device Function
32 = 32Mbit (4M x 8)
16 = 16Mbit (2M x 8)
80 = 8Mbit (1M x 8)
40 = 4Mbit (512K x 8)
20 = 2Mbit (256K x 8)
10-A = 1Mbit (128K x 8)
05-A = 512Kbit (64K x 8)
Operating Voltage
V = VCC = 2.7 to 3.6V
Package
ME = VDFPN8 8x6mm (MLP8)
MP = VDFPN8 (MLP8)
MF = SO16 (300 mil width)
MN = SO8 (150 mil width)
Device Grade
6 = Industrial temperature range, –40 to 85 °C.
Device tested with standard test flow
3 = Device tested with High Reliability Certified Flow1.
Automotive temperature range (–40 to 125 °C)
Option
blank = Standard Packing
T = Tape and Reel Packing
Plating Technology
blank = Standard SnPb plating
P = Lead-Free and RoHS compliant
G = Lead-Free, RoHS compliant, Sb2O3-free and TBBA-free
Note: 1. ST strongly recommends the use of the Automotive Grade devices for use in an automotive environment. The High Reliability Certified Flow (HRCF) is described in the quality note QNEE9801. Please ask your nearest ST sales office for a copy.
For a list of available options (speed, package,
etc.) or for further information on any aspect of this
device, please contact your nearest ST Sales Office.
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M25PXX
REVISION HISTORY
Table 6. Document Revision History
Date
Rev.
08-Oct-2004
1.0
6/7
Description of Revision
First release
M25PXX
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by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
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