STMicroelectronics M27C202-80K1TR 2 mbit (128kb x16) uv eprom and otp eprom Datasheet

M27C202
2 Mbit (128Kb x16) UV EPROM and OTP EPROM
■
5V ± 10% SUPPLY VOLTAGE in READ
OPERATION
■
ACCESS TIME: 45ns
■
LOW POWER CONSUMPTION:
– Active Current 50mA at 5MHz
– Standby Current 100µA
■
PROGRAMMING VOLTAGE: 12.75V ± 0.25V
■
PROGRAMMING TIME: 100µs/word
■
ELECTRONIC SIGNATURE
40
40
1
1
FDIP40W (F)
PDIP40 (B)
– Manufacturer Code: 20h
– Device Code: 1Ch
DESCRIPTION
The M27C202 is a 2 Mbit EPROM offered in the
two ranges UV (ultra violet erase) and OTP (one
time programmable). It is ideally suited for microprocessor systems requiring large programs, in
the application where the contents is stable and
needs to be programmed only one time, and is organised as 131,072 by 16 bits.
The FDIP40W (window ceramic frit-seal package)
has a transparent lids which allow the user to expose the chip to ultraviolet light to erase the bit pattern. A new pattern can then be written to the
device by following the programming procedure.
For applications where the content is programmed
only one time and erasure is not required, the
M27C202 is offered in PDIP40, PLCC44 and
TSOP40 (10 x 14 mm) packages.
TSOP40 (N)
10 x 14 mm
PLCC44 (K)
Figure 1. Logic Diagram
VCC
VPP
17
16
A0-A16
P
Q0-Q15
M27C202
E
G
VSS
AI01815
April 1999
1/15
M27C202
Figure 2A. DIP Connections
VPP
E
Q15
Q14
Q13
Q12
Q11
Q10
Q9
Q8
VSS
Q7
Q6
Q5
Q4
Q3
Q2
Q1
Q0
G
40
1
39
2
38
3
37
4
36
5
35
6
34
7
33
8
32
9
31
10
M27C202
30
11
29
12
28
13
27
14
26
15
25
16
17
24
18
23
19
22
20
21
Figure 2B. TSOP Connections
VCC
P
A16
A15
A14
A13
A12
A11
A10
A9
VSS
A8
A7
A6
A5
A4
A3
A2
A1
A0
A9
A10
A11
A12
A13
A14
A15
A16
P
VCC
VPP
E
DQ15
DQ14
DQ13
DQ12
DQ11
DQ10
DQ9
DQ8
1
10
11
40
20
21
AI02784
AI01817B
Table 1. Signal Names
Q13
Q14
Q15
E
VPP
NC
VCC
P
A16
A15
A14
Figure 2C. LCC Connections
1 44
Q12
Q11
Q10
Q9
Q8
VSS
NC
Q7
Q6
Q5
Q4
12
M27C202
34
A13
A12
A11
A10
A9
VSS
NC
A8
A7
A6
A5
Q3
Q2
Q1
Q0
G
NC
A0
A1
A2
A3
A4
23
AI01816
2/15
31
30
M27C202
VSS
A8
A7
A6
A5
A4
A3
A2
A1
A0
G
DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
VSS
A0-A16
Address Inputs
Q0-Q15
Data Outputs
E
Chip Enable
G
Output Enable
P
Program
VPP
Program Supply
VCC
Supply Voltage
VSS
Ground
NC
Not Connected Internally
M27C202
Table 2. Absolute Maximum Ratings (1)
Symbol
Parameter
Value
Unit
Ambient Operating Temperature (3)
–40 to 125
°C
TBIAS
Temperature Under Bias
–50 to 125
°C
TSTG
Storage Temperature
–65 to 150
°C
VIO (2)
Input or Output Voltage (except A9)
–2 to 7
V
Supply Voltage
–2 to 7
V
–2 to 13.5
V
–2 to 14
V
TA
VCC
VA9 (2)
A9 Voltage
Program Supply Voltage
VPP
Note: 1. Except for the rating ”Operating Temperature Range”, stresses above those listed in the Table ”Absolute Maximum Ratings” may
cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions
above those indicated in the Operating sections of this specification is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE Program and other relevant quality documents.
2. Minimum DC voltage on Input or Output is –0.5V with possible undershoot to –2.0V for a period less than 20ns. Maximum DC
voltage on Output is VCC +0.5V with possible overshoot to VCC +2V for a period less than 20ns.
3. Depends on range.
Table 3. Operating Modes
E
G
P
A9
V PP
Q15-Q0
Read
VIL
V IL
V IH
X
VCC or VSS
Data Output
Output Disable
VIL
VIH
X
X
VCC or VSS
Hi-Z
Program
VIL
X
VIL Pulse
X
V PP
Data Input
Verify
VIL
V IL
V IH
X
V PP
Data Output
Program Inhibit
VIH
X
X
X
V PP
Hi-Z
Standby
VIH
X
X
X
VCC or VSS
Hi-Z
Electronic Signature
VIL
V IL
V IH
VID
VCC
Codes
Mode
Note: X = VIH or VIL, VID = 12V ± 0.5V.
Table 4. Electronic Signature
Identifier
A0
Q7
Q6
Q5
Q4
Q3
Q2
Q1
Q0
Hex Data
Manufacturer’s Code
VIL
0
0
1
0
0
0
0
0
20h
Device Code
VIH
0
0
0
1
1
1
0
0
1Ch
Note: Outputs Q15-Q8 are set to ’0’.
3/15
M27C202
Table 5. AC Measurement Conditions
High Speed
Standard
Input Rise and Fall Times
≤ 10ns
≤ 20ns
Input Pulse Voltages
0 to 3V
0.4V to 2.4V
1.5V
0.8V and 2V
Input and Output Timing Ref. Voltages
Figure 3. AC Testing Input Output Waveform
Figure 4. AC Testing Load Circuit
1.3V
High Speed
1N914
3V
1.5V
3.3kΩ
0V
DEVICE
UNDER
TEST
Standard
2.4V
OUT
CL
2.0V
0.8V
0.4V
AI01822
CL = 30pF for High Speed
CL = 100pF for Standard
CL includes JIG capacitance
AI01823B
Table 6. Capacitance (1) (TA = 25 °C, f = 1 MHz)
Symbol
C IN
COUT
Parameter
Input Capacitance
Output Capacitance
Test Condit ion
Min
Max
Unit
VIN = 0V
6
pF
VOUT = 0V
12
pF
Note: 1. Sampled only, not 100% tested.
DEVICE OPERATION
The operating modes of the M27C202 are listed in
the Operating Modes table. A single power supply
is required in the read mode. All inputs are TTL
levels except for VPP and 12V on A9 for Electronic
Signature.
Read Mode
The M27C202 has two control functions, both of
which must be logically active in order to obtain
data at the outputs. Chip Enable (E) is the power
control and should be used for device selection.
Output Enable (G) is the output control and should
be used to gate data to the output pins, indepen-
4/15
dent of device selection. Assuming that the addresses are stable, the address access time
(tAVQV) is equal to the delay from E to output
(tELQV). Data is available at the output after a delay
of tOE from the falling edge of G, assuming that E
has been low and the addresses have been stable
for at least tAVQV-t GLQV.
Standby Mode
The M27C202 has a standby mode which reduces
the supply current from 50mA to 100µA.
The M27C202 is placed in the standby mode by
applying a TTL high signal to the E input. When in
the standby mode, the outputs are in a high impedance state, independent of the G input.
M27C202
Table 7. Read Mode DC Characteristics (1)
(TA = 0 to 70 °C, –40 to 85 °C or –40 to 125 °C; VCC = 5V ± 10%; VPP = VCC)
Symbol
Parameter
Test Condition
Min
Max
Unit
0V ≤ VIN ≤ VCC
±10
µA
0V ≤ VOUT ≤ VCC
±10
µA
E = VIL , G = VIL,
IOUT = 0mA, f = 5MHz
50
mA
E = VIH
1
mA
E > VCC – 0.2V
100
µA
V PP = VCC
100
µA
ILI
Input Leakage Current
ILO
Output Leakage Current
ICC
Supply Current
ICC1
Supply Current (Standby) TTL
ICC2
Supply Current (Standby) CMOS
IPP
Program Current
VIL
Input Low Voltage
–0.3
0.8
V
VIH (2)
Input High Voltage
2
VCC + 1
V
VOL
Output Low Voltage
0.4
V
VOH
IOL = 2.1mA
Output High Voltage TTL
IOH = –400µA
2.4
V
Output High Voltage CMOS
IOH = –100µA
VCC – 0.7V
V
Note: 1. VCC must be applied simultaneously with or before VPP and removed simultaneously or after V PP.
2. Maximum DC voltage on Output is VCC +0.5V.
Two Line Output Control
Because OTP EPROMs are usually used in larger
memory arrays, this product features a 2 line control function which accommodates the use of multiple memory connection. The two line control
function allows:
a. the lowest possible memory power dissipation,
b. complete assurance that output bus contention
will not occur.
For the most efficient use of these two control
lines, E should be decoded and used as the primary device selecting function, while G should be
made a common connection to all devices in the
array and connected to the READ line from the
system control bus. This ensures that all deselected memory devices are in their low power standby
mode and that the output pins are only active
when data is required from a particular memory
device.
System Considerations
The power switching characteristics of Advanced
CMOS EPROMs require careful decoupling of the
devices. The supply current, I CC, has three segments that are of interest to the system designer:
the standby current level, the active current level,
and transient current peaks that are produced by
the falling and rising edges of E. The magnitude of
transient current peaks is dependent on the capacitive and inductive loading of the device at the
output. The associated transient voltage peaks
can be suppressed by complying with the two line
output control and by properly selected decoupling
capacitors. It is recommended that a 0.1µF ceramic capacitor be used on every device between VCC
and VSS. This should be a high frequency capacitor of low inherent inductance and should be
placed as close to the device as possible. In addition, a 4.7µF bulk electrolytic capacitor should be
used between VCC and VSS for every eight devices. The bulk capacitor should be located near the
power supply connection point.The purpose of the
bulk capacitor is to overcome the voltage drop
caused by the inductive effects of PCB traces.
5/15
M27C202
Table 8. Read Mode AC Characteristics (1)
(TA = 0 to 70 °C, –40 to 85 °C or –40 to 125 °C; VCC = 5V ± 10%; VPP = VCC)
M27C202
Symbol
Alt
Parameter
Test Condition
-45 (3)
Min
tAVQV
tACC
Address Valid to
Output Valid
tELQV
tCE
tGLQV
-70 (3)
Max Min
-80
Max
-100
Min Max
Min
Unit
Max
E = VIL, G = VIL
45
70
80
100
ns
Chip Enable Low to
Output Valid
G = VIL
45
70
80
100
ns
tOE
Output Enable Low
to Output Valid
E = VIL
25
40
40
50
ns
tEHQZ (2)
t DF
Chip Enable High to
Output Hi-Z
G = VIL
0
25
0
30
0
30
0
30
ns
tGHQZ (2)
t DF
Output Enable High
to Output Hi-Z
E = VIL
0
25
0
30
0
30
0
30
ns
tAXQX
tOH
Address Transition to
Output Transition
E = VIL, G = VIL
0
0
0
0
ns
Note: 1. VCC must be applied simultaneously with or before VPP and removed simultaneously or after V PP.
2. Sampled only, not 100% tested.
3. Speed obtained with High Speed AC measurement conditions.
Figure 5. Read Mode AC Waveforms
A0-A16
VALID
tAVQV
VALID
tAXQX
E
tGLQV
tEHQZ
G
tELQV
Q0-Q15
tGHQZ
Hi-Z
AI01818B
6/15
M27C202
Table 9. Programming Mode DC Characteristics (1)
(TA = 25 °C; VCC = 6.25V ± 0.25V; VPP = 12.75V ± 0.25V)
Symbol
Parameter
Test Condition
Min
0 ≤ V IN ≤ VIH
Max
Unit
±10
µA
50
mA
50
mA
ILI
Input Leakage Current
ICC
Supply Current
IPP
Program Current
VIL
Input Low Voltage
–0.3
0.8
V
VIH
Input High Voltage
2
VCC + 0.5
V
VOL
Output Low Voltage
0.4
V
VOH
Output High Voltage TTL
VID
A9 Voltage
E = VIL
IOL = 2.1mA
IOH = –400µA
2.4
V
11.5
12.5
V
Note: 1. VCC must be applied simultaneously with or before VPP and removed simultaneously or after V PP.
Table 10. Programming Mode AC Characteristics (1)
(TA = 25 °C; VCC = 6.25V ± 0.25V; VPP = 12.75V ± 0.25V)
Symbol
Alt
Parameter
Test Condition
Min
Max
tAVPL
tAS
Address Valid to Program Low
2
µs
tQVPL
tDS
Input Valid to Program Low
2
µs
tVPHPL
tVPS
VPP High to Program Low
2
µs
t VCHPL
tVCS
VCC High to Program Low
2
µs
tELPL
tCES
Chip Enable Low to Program Low
2
µs
tPLPH
tPW
Program Pulse Width
95
tPHQX
tDH
Program High to Input Transition
2
µs
tQXGL
tOES
Input Transition to Output Enable Low
2
µs
tGLQV
tOE
Output Enable Low to Output Valid
tGHQZ (2)
tDFP
Output Enable High to Output Hi-Z
0
tGHAX
tAH
Output Enable High to Address
Transition
0
105
Unit
µs
100
ns
130
ns
ns
Note: 1. VCC must be applied simultaneously with or before VPP and removed simultaneously or after V PP.
2. Sampled only, not 100% tested.
Programming
When delivered (and after each ‘1’s erasure for UV
EPROM), all bits of the M27C202 are in the ’1’
state. Data is introduced by selectively programming ’0’s into the desired bit locations. Although
only ’0’s will be programmed, both ’1’s and ’0’s can
be present in the data word. The only way to
change a ‘0’ to a ‘1’ is by die exposure to ultraviolet
light (UV EPROM). The M27C202 is in the programming mode when V PP input is at 12.75V, E is
at V IL and P is pulsed to VIL. The data to be programmed is applied to 16 bits in parallel, to the
data output pins. The levels required for the address and data inputs are TTL. VCC is specified to
be 6.25V ± 0.25V.
7/15
M27C202
Figure 6. Programming and Verify Modes AC Waveforms
VALID
A0-A15
tAVPL
Q0-Q15
DATA IN
tQVPL
DATA OUT
tPHQX
VPP
tGLQV
tVPHPL
tGHQZ
VCC
tVCHPL
tGHAX
E
tELPL
P
tPLPH
tQXGL
G
PROGRAM
VERIFY
AI00706
Figure 7. Programming Flowchart
VCC = 6.25V, VPP = 12.75V
n =0
P = 100µs Pulse
NO
++n
= 25
YES
FAIL
NO
VERIFY
++ Addr
YES
Last
Addr
NO
YES
CHECK ALL WORDS
1st: VCC = 6V
2nd: VCC = 4.2V
AI00707C
8/15
PRESTO II Programming Algorithm
PRESTO II Programming Algorithm allows programming of the whole array with a guaranteed
margin, in a typical time of 13 seconds. Programming with PRESTO II consists of applying a sequence of 100µs program pulses to each word
until a correct verify occurs (see Figure 7). During
programming and verify operation, a MARGIN
MODE circuit is automatically activated in order to
guarantee that each cell is programmed with
enough margin. No overprogram pulse is applied
since the verify in MARGIN MODE provides necessary margin to each programmed cell.
Program Inhibit
Programming of multiple M27C202s in parallel
with different data is also easily accomplished. Except for E, all like inputs including G of the parallel
M27C202 may be common. A TTL low level pulse
applied to a M27C202’s P input, with E low and
VPP at 12.75V, will program that M27C202. A high
level E input inhibits the other M27C202s from being programmed.
Program Verify
A verify (read) should be performed on the programmed bits to determine that they were correctly programmed. The verify is accomplished with E
and G at VIL, P at VIH, VPP at 12.75V and VCC at
6.25V.
M27C202
On-Board Programming
The M27C202 can be directly programmed in the
application circuit. See the relevant Application
Note AN620.
Electronic Signature
The Electronic Signature (ES) mode allows the
reading out of a binary code from an EPROM that
will identify its manufacturer and type. This mode
is intended for use by programming equipment to
automatically match the device to be programmed
with its corresponding programming algorithm.
The ES mode is functional in the 25°C ± 5°C ambient temperature range that is required when programming the M27C202. To activate the ES
mode, the programming equipment must force
11.5V to 12.5V on address line A9 of the M27C202
with VPP = VCC = 5V. Two identifier bytes may
then be sequenced from the device outputs by toggling address line A0 from VIL to VIH. All other address lines must be held at VIL during Electronic
Signature mode. Byte 0 (A0 = VIL) represents the
manufacturer code and byte 1 (A0 = VIH) the device identifier code. For the STMicroelectronics
M27C202, these two identifier bytes are given in
Table 4 and can be read-out on outputs Q7 to Q0.
ERASURE OPERATION (applies to UV EPROM)
The erasure characteristics of the M27C202 is
such that erasure begins when the cells are exposed to light with wavelengths shorter than approximately 4000 Å. It should be noted that
sunlight and some type of fluorescent lamps have
wavelengths in the 3000-4000 Å range. Research
shows that constant exposure to room level fluorescent lighting could erase a typical M27C202 in
about 3 years, while it would take approximately 1
week to cause erasure when exposed to direct
sunlight. If the M27C202 is to be exposed to these
types of lighting conditions for extended periods of
time, it is suggested that opaque labels be put over
the M27C202 window to prevent unintentional erasure. The recommended erasure procedure for
the M27C202 is exposure to short wave ultraviolet
light which has wavelength 2537 Å. The integrated
dose (i.e. UV intensity x exposure time) for erasure
should be a minimum of 15 W-sec/cm2. The erasure time with this dosage is approximately 15 to
20 minutes using an ultraviolet lamp with
12000µW/cm 2 power rating. The M27C202 should
be placed within 2.5 cm (1 inch) of the lamp tubes
during the erasure. Some lamps have a filter on
their tubes which should be removed before erasure.
9/15
M27C202
Table 11. Ordering Information Scheme
Example:
M27C202
-80 K
1
TR
Device Type
M27
Supply Voltage
C = 5V ±10%
Device Function
202 = 2 Mbit (128Kb x16)
Speed
-45 (1) = 45 ns
-70 (1) = 70 ns
-80 = 80 ns
-100 = 100 ns
Not For New Design (2)
-120 = 120 ns
-150 = 150 ns
-200 = 200 ns
Package
F = FDIP40W
B = PDIP40
K = PLCC44
N = TSOP40: 10 x 14 mm
Temperature Range
1 = 0 to 70 °C
3 = –40 to 125 °C
6 = –40 to 85 °C
Optio ns
TR = Tape & Reel Packing
Note: 1. High Speed, see AC Characteristics section for further information.
2. These speeds are replaced by the 100ns.
For a list of available options (Speed, Package, etc...) or for further information on any aspect of this device, please contact the STMicroelectronics Sales Office nearest to you.
10/15
M27C202
Table 12. FDIP40W - 40 lead Ceramic Frit-seal DIP with window, Package Mechanical Data
Symb
mm
Typ
inches
Min
Max
A
Typ
Min
5.72
Max
0.225
A1
0.51
1.40
0.020
0.055
A2
3.91
4.57
0.154
0.180
A3
3.89
4.50
0.153
0.177
0.41
0.56
0.016
0.022
–
–
–
–
0.23
0.30
0.009
0.012
51.79
52.60
2.039
2.071
–
–
1.900
–
–
0.600
B
B1
1.45
C
D
D2
48.26
E
15.24
E1
e
2.54
eA
14.99
eB
0.057
–
–
13.06
13.36
–
–
0.100
–
–
0.590
16.18
18.03
–
–
0.514
0.526
–
–
–
–
0.637
0.710
L
3.18
–
0.125
–
S
1.52
2.49
0.060
0.098
∅
–
–
α
8.13
4°
11°
N
40
0.320
–
–
4°
11°
40
Figure 8. FDIP40W - 40 lead Ceramic Frit-seal DIP with window, Package Outline
A2
A3
A1
B1
B
A
L
e
α
eA
D2
C
eB
D
S
N
∅
E1
E
1
FDIPW-a
Drawing is not to scale.
11/15
M27C202
Table 13. PDIP40 - 40 pin Plastic DIP, 600 mils width, Package Mechanical Data
mm
Symb
inches
Typ
Min
Max
Typ
Min
Max
A
4.45
–
–
0.175
–
–
A1
0.64
0.38
–
0.025
0.015
–
A2
3.56
3.91
0.140
0.154
B
0.38
0.53
0.015
0.021
B1
1.14
1.78
0.045
0.070
C
0.20
0.31
0.008
0.012
D
51.78
52.58
2.039
2.070
–
–
–
–
E
14.80
16.26
0.583
0.640
E1
13.46
13.99
0.530
0.551
–
D2
48.26
1.900
e1
2.54
–
–
0.100
–
eA
15.24
–
–
0.600
–
eB
15.24
17.78
0.600
0.700
L
3.05
3.81
0.120
0.150
S
1.52
2.29
0.060
0.090
α
0°
15°
0°
15°
N
40
40
Figure 9. PDIP40 - 40 lead Plastic DIP, 600 mils width, Package Outline
A2
A1
B1
B
A
L
e1
α
eA
D2
C
eB
D
S
N
E1
E
1
PDIP
Drawing is not to scale.
12/15
M27C202
Table 14. PLCC44 - 44 lead Plastic Leaded Chip Carrier, Package Mechanical Data
mm
inches
Symb
Typ
Min
Max
A
4.20
A1
Min
Max
4.70
0.165
0.185
2.29
3.04
0.090
0.120
A2
–
0.51
–
0.020
B
0.33
0.53
0.013
0.021
B1
0.66
0.81
0.026
0.032
D
17.40
17.65
0.685
0.695
D1
16.51
16.66
0.650
0.656
D2
14.99
16.00
0.590
0.630
E
17.40
17.65
0.685
0.695
E1
16.51
16.66
0.650
0.656
E2
14.99
16.00
0.590
0.630
–
–
–
–
0.00
0.25
0.000
0.010
–
–
–
–
e
1.27
F
R
0.89
N
Typ
0.050
0.035
44
44
CP
0.10
0.004
Figure 10. PLCC44 - 44 lead Plastic Leaded Chip Carrier, Package Outline
D
D1
A1
A2
1 N
B1
E1 E
Ne
e
D2/E2
F
B
0.51 (.020)
1.14 (.045)
A
Nd
R
CP
PLCC
Drawing is not to scale.
13/15
M27C202
Table 15. TSOP40 - 40 lead Plastic Thin Small Outline, 10 x 14 mm, Package Mechanical Data
mm
inches
Symb
Typ
Min
Max
A
Typ
Min
1.20
Max
0.047
A1
0.05
0.15
0.002
0.006
A2
0.95
1.05
0.037
0.041
B
0.17
0.27
0.007
0.011
C
0.10
0.21
0.004
0.008
D
13.80
14.20
0.543
0.559
D1
12.30
12.50
0.484
0.492
E
9.90
10.10
0.390
0.398
–
–
–
–
L
0.50
0.70
0.020
0.028
α
0°
5°
0°
5°
N
40
e
0.50
0.020
40
CP
0.10
0.004
Figure 11. TSOP40 - 40 lead Plastic Thin Small Outline, 10 x 14 mm, Package Outline
A2
1
N
e
E
B
N/2
D1
A
CP
D
DIE
C
TSOP-a
Drawing is not to scale.
14/15
A1
α
L
M27C202
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