TI1 M38510-65701B2A Hex inverter Datasheet

SN54HC04, SN74HC04
www.ti.com
SCLS078E – DECEMBER 1982 – REVISED OCTOBER 2010
HEX INVERTERS
Check for Samples: SN54HC04, SN74HC04
FEATURES
1
Wide Operating Voltage Range of 2 V to 6 V
Outputs Can Drive Up To 10 LSTTL Loads
Low Power Consumption, 20-mA Max ICC
Typical tpd = 8 ns
±4-mA Output Drive at 5 V
Low Input Current of 1 mA Max
3
12
4
11
5
10
6
9
7
8
6A
6Y
5A
5Y
4A
4Y
2A
NC
2Y
NC
3A
3
2
4
20 19
18
5
17
1
6A
VCC
VCC
6
16
7
15
14
8
6Y
NC
5A
NC
5Y
9 10 11 12 13
4Y
13
4A
14
2
1Y
1
3Y
1A
1Y
2A
2Y
3A
3Y
GND
1A
NC
SN54HC04...FK PACKAGE
(TOP VIEW)
SN54HC04...J OR W PACKAGE
SN74HC04...D, DB, N, NS, OR PW PACKAGE
(TOP VIEW)
GND
NC
•
•
•
•
•
•
NC – No internal connection
DESCRIPTION/ORDERING INFORMATION
The ’HC04 devices contain six independent inverters. They perform the Boolean function Y = A in positive logic.
ORDERING INFORMATION
PACKAGE (1)
TA
PDIP – N
SOIC – D
–40°C to 85°C
–55°C to 125°C
(1)
Reel of 1000
SN74HC04N
Reel of 1000
SN74HC04DE4
Reel of 2500
SN74HC04DRG3
Tube of 250
SN74HC04DT
SOP – NS
Reel of 2000
SSOP – DB
Reel of 2000
TSSOP – PW
ODERABLE PART NUMBER
SN74HC04N
SN74HC04NSR
SN74HC04NSRG4
SN74HC04DBR
SN74HC04DBRE4
Tube of 90
SN74HC04PW
Reel of 2000
SN74HC04PWR
Tube of 250
SN74HC04PWT
CDIP – J
Reel of 1000
SNJ54HC04J
CFP – W
Reel of 900
SNJ54HC04W
LCCC –FK
Reel of 2200
SNJ54HC04FK
TOP-SIDE MARKING
HC04
HC04
HC04
HC04
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1982–2010, Texas Instruments Incorporated
SN54HC04, SN74HC04
SCLS078E – DECEMBER 1982 – REVISED OCTOBER 2010
www.ti.com
Table 1. FUNCTION TABLE
(EACH INVERTER)
INPUT
A
OUTPUT
Y
H
L
L
H
LOGIC DIAGRAM (POSITIVE LOGIC)
A
Y
Absolute Maximum Ratings (1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
–0.5
7
UNIT
VCC
Supply voltage range
IIK
Input clamp current (2)
VI < 0 or VI > VCC
±20
mA
IOK
Output clamp current (2)
VO < 0
±20
mA
IO
Continuous output current
VO = 0 to VCC
±25
mA
±50
mA
Continuous current through VCCor GND
qJA
Tstg
(1)
(2)
(3)
Package thermal impedance (3)
D package
86
N package
80
NS package
76
PW package
113
Storage temperature range
–60
V
°C/W
150
°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
The package thermal impedance is calculated in accordance with JESD 51-7.
Recommended Operating Conditions (1)
SN54HC04
VCC
Supply voltage
VIH
High-level input voltage
VCC = 2 V
VCC = 4.5 V
VCC = 6 V
SN74HC04
MIN
NOM
MAX
MIN
NOM
MAX
2
5
6
2
5
6
1.5
1.5
3.15
3.15
4.2
4.2
VCC = 2 V
VIL
Low-level input voltage
VCC = 4.5 V
VCC = 6 V
VI
Input voltage
VO
Output voltage
0
0
VCC = 2 V
Δt/Δv Input transition rise or fall rate
(1)
2
Operating free-air temperature
0.5
1.35
1.8
1.8
VCC
0
V
VCC
V
1000
500
500
VCC = 4.5 V
400
–55
125
V
VCC
1000
VCC = 6 V
TA
0.5
0
V
V
1.35
VCC
UNIT
ns
400
–40
85
°C
All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
Submit Documentation Feedback
Copyright © 1982–2010, Texas Instruments Incorporated
Product Folder Link(s): SN54HC04, SN74HC04
SN54HC04, SN74HC04
www.ti.com
SCLS078E – DECEMBER 1982 – REVISED OCTOBER 2010
Electrical Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
IOH = –20 mA
VI = VIH or
VIL
VOH
IOH = –4 mA
IOH = –5.2 mA
II
SN54HC04
MAX
MIN
SN74HC04
MAX
MIN
2V
1.9
1.998
1.9
1.9
4.5 V
4.4
4.499
4.4
4.4
6V
5.9
5.999
5.9
5.9
4.5 V
3.98
4.3
3.7
3.84
6V
5.48
5.8
5.2
UNIT
MAX
V
5.34
0.002
0.1
0.1
0.1
IOL = 20 mA
4.5 V
0.001
0.1
0.1
0.1
6V
0.001
0.1
0.1
0.1
IOL = 4 mA
4.5 V
0.17
0.26
0.4
0.33
6V
0.15
0.26
0.4
0.33
VI = VCC or 0
6V
±0.1
±100
±1000
±1000
nA
VI = VCC or 0, IO = 0
6V
2
40
20
mA
10
10
10
pF
IOL = 5.2 mA
ICC
TYP
2V
VI = VIH or
VIL
VOL
TA = 25°C
MIN
Ci
2 V to 6 V
3
V
Switching Characteristics
over operating free-air temperature range, CL = 50 pF (unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
VCC
tpd
A
Y
tt
Y
TA = 25°C
MIN
SN54HC04
MIN
SN74HC04
TYP
MAX
MAX
MIN
2V
45
95
125
120
4.5 V
9
19
29
24
6V
8
16
25
20
2V
38
75
110
95
4.5 V
8
15
22
19
6V
6
13
19
16
UNIT
MAX
ns
ns
Operating Characteristics
TA = 25°C
Cpd
PARAMETER
TEST CONDITIONS
Power dissipation capacitance per inverter
No load
Copyright © 1982–2010, Texas Instruments Incorporated
Product Folder Link(s): SN54HC04, SN74HC04
TYP
20
UNIT
pF
Submit Documentation Feedback
3
SN54HC04, SN74HC04
SCLS078E – DECEMBER 1982 – REVISED OCTOBER 2010
www.ti.com
PARAMETER MEASURMENT INFORMATION
From Output
Under Test
Test
Point
Input
0V
CL = 50 pF
(see Note A)
50%
10%
90%
In-Phase
Output
90%
tr
tPHL
tPLH
LOAD CIRCUIT
Input
VCC
50%
50%
0V
90%
tPHL
VOH
50%
10%
Out-of-Phase
Output
VOL
tf
tPLH
90%
50%
10%
tf
VOLTAGE WAVEFORMS
INPUT RISE AND FALL TIMES
90%
tr
VCC
50%
10%
50%
10%
50%
10%
90%
tf
VOH
VOL
tr
VOLTAGE WAVEFORMS
PROPAGATION DELAY AND OUTPUT TRANSITION TIMES
NOTES: A. CL includes probe and test-fixture capacitance.
B. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following
characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns.
C. The outputs are measured one at a time with one input transition per measurement.
D. tPLH and tPHL are the same as tpd.
Figure 1. Load Circuit and Voltage Waveforms
4
Submit Documentation Feedback
Copyright © 1982–2010, Texas Instruments Incorporated
Product Folder Link(s): SN54HC04, SN74HC04
PACKAGE OPTION ADDENDUM
www.ti.com
24-Jan-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package Qty
Drawing
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
(4)
5962-8409801VCA
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
5962-8409801VC
A
SNV54HC04J
5962-8409801VDA
ACTIVE
CFP
W
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
5962-8409801VD
A
SNV54HC04W
84098012A
ACTIVE
LCCC
FK
20
1
TBD
Call TI
Call TI
-55 to 125
84098012A
SNJ54HC
04FK
8409801CA
ACTIVE
CDIP
J
14
1
TBD
Call TI
Call TI
-55 to 125
8409801CA
SNJ54HC04J
8409801DA
ACTIVE
CFP
W
14
1
TBD
Call TI
Call TI
-55 to 125
8409801DA
SNJ54HC04W
JM38510/65701B2A
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
JM38510/
65701B2A
JM38510/65701BCA
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510/
65701BCA
JM38510/65701BDA
NRND
CFP
W
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510/
65701BDA
M38510/65701B2A
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
JM38510/
65701B2A
M38510/65701BCA
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510/
65701BCA
M38510/65701BDA
NRND
CFP
W
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510/
65701BDA
SN54HC04J
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
SN54HC04J
SN74HC04D
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC04
SN74HC04DBR
ACTIVE
SSOP
DB
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC04
SN74HC04DBRE4
ACTIVE
SSOP
DB
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC04
SN74HC04DBRG4
ACTIVE
SSOP
DB
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC04
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
24-Jan-2013
Orderable Device
Status
(1)
Package Type Package Pins Package Qty
Drawing
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
(4)
SN74HC04DE4
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC04
SN74HC04DG4
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC04
SN74HC04DR
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC04
SN74HC04DRE4
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC04
SN74HC04DRG3
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
HC04
SN74HC04DRG4
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC04
SN74HC04DT
ACTIVE
SOIC
D
14
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC04
SN74HC04DTE4
ACTIVE
SOIC
D
14
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC04
SN74HC04DTG4
ACTIVE
SOIC
D
14
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC04
SN74HC04N
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
-40 to 85
SN74HC04N
SN74HC04N3
OBSOLETE
PDIP
N
14
TBD
Call TI
Call TI
-40 to 85
SN74HC04NE4
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
-40 to 85
SN74HC04N
SN74HC04NSR
ACTIVE
SO
NS
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC04
SN74HC04NSRG4
ACTIVE
SO
NS
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC04
SN74HC04PW
ACTIVE
TSSOP
PW
14
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC04
SN74HC04PWE4
ACTIVE
TSSOP
PW
14
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC04
SN74HC04PWG4
ACTIVE
TSSOP
PW
14
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC04
SN74HC04PWLE
OBSOLETE
TSSOP
PW
14
TBD
Call TI
Call TI
-40 to 85
SN74HC04PWR
ACTIVE
TSSOP
PW
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
Addendum-Page 2
HC04
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
24-Jan-2013
Orderable Device
Status
(1)
Package Type Package Pins Package Qty
Drawing
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
(4)
SN74HC04PWRE4
ACTIVE
TSSOP
PW
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC04
SN74HC04PWRG4
ACTIVE
TSSOP
PW
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC04
SN74HC04PWT
ACTIVE
TSSOP
PW
14
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC04
SN74HC04PWTE4
ACTIVE
TSSOP
PW
14
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC04
SN74HC04PWTG4
ACTIVE
TSSOP
PW
14
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC04
SNJ54HC04FK
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
84098012A
SNJ54HC
04FK
SNJ54HC04J
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
8409801CA
SNJ54HC04J
SNJ54HC04W
ACTIVE
CFP
W
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
8409801DA
SNJ54HC04W
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Only one of markings shown within the brackets will appear on the physical device.
Addendum-Page 3
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
24-Jan-2013
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN54HC04, SN54HC04-SP, SN74HC04 :
• Catalog: SN74HC04, SN54HC04
• Automotive: SN74HC04-Q1, SN74HC04-Q1
• Military: SN54HC04
• Space: SN54HC04-SP
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
• Military - QML certified for Military and Defense Applications
• Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application
Addendum-Page 4
PACKAGE MATERIALS INFORMATION
www.ti.com
8-Apr-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
SN74HC04DBR
SSOP
DB
14
2000
330.0
16.4
8.2
6.6
2.5
12.0
16.0
Q1
SN74HC04DR
SOIC
D
14
2500
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
SN74HC04DR
SOIC
D
14
2500
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
SN74HC04DRG4
SOIC
D
14
2500
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
SN74HC04DRG4
SOIC
D
14
2500
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
SN74HC04DT
SOIC
D
14
250
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
SN74HC04PWR
TSSOP
PW
14
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
SN74HC04PWT
TSSOP
PW
14
250
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
8-Apr-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74HC04DBR
SSOP
DB
14
2000
367.0
367.0
38.0
SN74HC04DR
SOIC
D
14
2500
367.0
367.0
38.0
SN74HC04DR
SOIC
D
14
2500
333.2
345.9
28.6
SN74HC04DRG4
SOIC
D
14
2500
367.0
367.0
38.0
SN74HC04DRG4
SOIC
D
14
2500
333.2
345.9
28.6
SN74HC04DT
SOIC
D
14
250
367.0
367.0
38.0
SN74HC04PWR
TSSOP
PW
14
2000
367.0
367.0
35.0
SN74HC04PWT
TSSOP
PW
14
250
367.0
367.0
35.0
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated
Similar pages