ON M74VHC1GT126DF2G Noninverting buffer / cmos logic level shifter with lsttl.compatible input Datasheet

MC74VHC1GT126
Noninverting Buffer /
CMOS Logic Level Shifter
with LSTTL−Compatible Inputs
http://onsemi.com
MARKING
DIAGRAMS
5
5
1
SC−88A / SOT−353 / SC−70
DF SUFFIX
CASE 419A
M
The MC74VHC1GT126 is a single gate noninverting 3−state buffer
fabricated with silicon gate CMOS technology. It achieves high speed
operation similar to equivalent Bipolar Schottky TTL while maintaining
CMOS low power dissipation.
The MC74VHC1GT126 requires the 3−state control input (OE) to be
set Low to place the output into the high impedance state.
The device input is compatible with TTL−type input thresholds and
the output has a full 5 V CMOS level output swing. The input
protection circuitry on this device allows overvoltage tolerance on the
input, allowing the device to be used as a logic−level translator from
3 V CMOS logic to 5 V CMOS Logic or from 1.8 V CMOS logic to
3 V CMOS Logic while operating at the high−voltage power supply.
The MC74VHC1GT126 input structure provides protection when
voltages up to 7 V are applied, regardless of the supply voltage. This
allows the MC74VHC1GT126 to be used to interface 5 V circuits to
3 V circuits. The output structures also provide protection when
VCC = 0 V. These input and output structures help prevent device
destruction caused by supply voltage − input/output voltage mismatch,
battery backup, hot insertion, etc.
W3 M G
G
1
5
5
W3 M G
G
1
TSOP−5 / SOT−23 / SC−59
DT SUFFIX
CASE 483
1
Features
•
•
•
•
•
•
•
•
•
•
High Speed: tPD = 3.5 ns (Typ) at VCC = 5 V
Low Power Dissipation: ICC = 1 mA (Max) at TA = 25°C
W3
M
G
TTL−Compatible Inputs: VIL = 0.8 V; VIH = 2 V
CMOS−Compatible Outputs: VOH > 0.8 VCC; VOL < 0.1 VCC @Load
Power Down Protection Provided on Inputs and Outputs
= Device Code
= Date Code*
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or position may vary
depending upon manufacturing location.
Balanced Propagation Delays
Pin and Function Compatible with Other Standard Logic Families
Chip Complexity: FETs = 62; Equivalent Gates = 16
NLV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
These Devices are Pb−Free and are RoHS Compliant
OE
1
IN A
2
GND
3
2
IN A
3
GND
4
OUT Y
5
VCC
FUNCTION TABLE
4 OUT Y
OE
OUT Y
IN A
A Input
OE Input
Y Output
L
H
X
H
H
L
L
H
Z
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
Figure 2. Logic Symbol
May, 2012 − Rev. 15
OE
5 VCC
Figure 1. Pinout (Top View)
© Semiconductor Components Industries, LLC, 2012
PIN ASSIGNMENT
1
1
Publication Order Number:
MC74VHC1GT126/D
MC74VHC1GT126
MAXIMUM RATINGS
Symbol
Value
Unit
VCC
DC Supply Voltage
Characteristics
−0.5 to +7.0
V
VIN
DC Input Voltage
−0.5 to +7.0
V
VOUT
DC Output Voltage
−0.5 to VCC + 0.5
V
IIK
Input Diode Current
−20
mA
IOK
Output Diode Current
+20
mA
IOUT
DC Output Current, per Pin
+25
mA
ICC
DC Supply Current, VCC and GND
PD
Power Dissipation in Still Air
qJA
Thermal Resistance
TL
VOUT < GND; VOUT > VCC
+50
mA
SC−88A, TSOP−5
200
mW
SC−88A, TSOP−5
333
°C/W
Lead Temperature, 1 mm from Case for 10 s
260
°C
TJ
Junction Temperature Under Bias
+150
°C
Tstg
Storage Temperature
−65 to +150
°C
> 2000
> 200
N/A
V
±500
mA
VESD
ESD Withstand Voltage
ILatchup
Human Body Model (Note 1)
Machine Model (Note 2)
Charged Device Model (Note 3)
Latchup Performance
Above VCC and Below GND at 125°C (Note 4)
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Tested to EIA/JESD22−A114−A
2. Tested to EIA/JESD22−A115−A
3. Tested to JESD22−C101−A
4. Tested to EIA/JESD78
RECOMMENDED OPERATING CONDITIONS
Symbol
Characteristics
Min
Max
Unit
VCC
DC Supply Voltage
3.0
5.5
V
VIN
DC Input Voltage
0.0
5.5
V
DC Output Voltage
0.0
VCC
V
−55
+125
°C
0
20
ns/V
VOUT
TA
Operating Temperature Range
tr, tf
Input Rise and Fall Time
VCC = 5.0 V ± 0.5 V
90
419,300
47.9
100
178,700
20.4
110
79,600
9.4
120
37,000
4.2
130
17,800
2.0
140
8,900
1.0
TJ = 80 ° C
117.8
TJ = 90 ° C
1,032,200
TJ = 100 ° C
80
FAILURE RATE OF PLASTIC = CERAMIC
UNTIL INTERMETALLICS OCCUR
TJ = 110° C
Time, Years
TJ = 120° C
Time, Hours
TJ = 130 ° C
Junction
Temperature °C
NORMALIZED FAILURE RATE
Device Junction Temperature versus
Time to 0.1% Bond Failures
1
1
10
100
1000
TIME, YEARS
Figure 3. Failure Rate vs. Time Junction Temperature
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2
MC74VHC1GT126
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DC ELECTRICAL CHARACTERISTICS
Min
1.4
2.0
2.0
Symbol
Parameter
VIH
Minimum High−Level
Input Voltage
3.0
4.5
5.5
VIL
Maximum Low−Level
Input Voltage
3.0
4.5
5.5
VOH
Minimum High−Level
Output Voltage
VIN = VIH or VIL
VOL
Maximum Low−Level
Output Voltage
VIN = VIH or VIL
Test Conditions
TA = 25°C
VCC
(V)
Typ
TA ≤ 85°C
Max
Min
0.53
0.8
0.8
VIN = VIH or VIL
IOH = − 50 mA
3.0
4.5
2.9
4.4
VIN = VIH or VIL
IOH = − 4 mA
IOH = − 8 mA
3.0
4.5
2.58
3.94
VIN = VIH or VIL
IOL = 50 mA
3.0
4.5
VIN = VIH or VIL
IOL = 4 mA
IOL = 8 mA
Max
1.4
2.0
2.0
3.0
4.5
0.0
0.0
−55 ≤ TA ≤ 125°C
Min
Max
1.4
2.0
2.0
0.53
0.8
0.8
V
0.53
0.8
0.8
2.9
4.4
2.9
4.4
2.48
3.80
2.34
3.66
Unit
V
V
0.1
0.1
0.1
0.1
0.1
0.1
3.0
4.5
0.36
0.36
0.44
0.44
0.52
0.52
V
IIN
Maximum Input Leakage Current
VIN = 5.5 V or GND
0 to
5.5
± 0.1
± 1.0
± 1.0
mA
ICC
Maximum Quiescent
Supply Current
VIN = VCC or GND
5.5
1.0
20
40
mA
ICCT
Quiescent Supply
Current
Input: VIN = 3.4 V
Other Input: VCC or GND
5.5
1.35
1.50
1.65
mA
IOPD
Output Leakage
Current
VOUT = 5.5 V
0.0
0.5
5.0
10
mA
Maximum 3−State
Leakage Current
VIN = VIH or VIL
VOUT = VCC or GND
5.5
± 0.25
± 2.5
± 2.5
mA
IOZ
AC ELECTRICAL CHARACTERISTICS Input tr = tf = 3.0 ns
TA = 25°C
Symbol
tPLH,
tPHL
tPZL,
tPZH
tPLZ,
tPHZ
−55 ≤ TA ≤ 125°C
Max
Min
Max
CL = 15pF
CL = 50pF
5.6
8.1
8.0
11.5
1.0
1.0
9.5
13.0
12.0
16.0
VCC = 5.0 ± 0.5 V
CL = 15pF
CL = 50pF
3.8
5.3
5.5
7.5
1.0
1.0
6.5
8.5
8.5
10.5
Maximum Output
Enable TIme,OE to Y
(Figures 4 and 5)
VCC = 3.3 ± 0.3 V
RL = RI = 500 W
CL = 15pF
CL = 50pF
5.4
7.9
8.0
11.5
1.0
1.0
9.5
13.0
11.5
15.0
VCC = 5.0 ± 0.5 V
RL = RI = 500 W
CL = 15pF
CL = 50pF
3.6
5.1
5.1
7.1
1.0
1.0
6.0
8.0
7.5
9.5
Maximum Output
Disable Time,OE to Y
(Figures 4 and 5)
VCC = 3.3 ± 0.3 V
RL = RI = 500 W
CL = 15pF
CL = 50pF
6.5
8.0
9.7
13.2
1.0
1.0
11.5
15.0
14.5
18.0
VCC = 5.0 ± 0.5 V
RL = RI = 500 W
CL = 15pF
CL = 50pF
4.8
7.0
6.8
8.8
1.0
1.0
8.0
10.0
10.0
12.0
10
10
10
VCC = 3.3 ± 0.3 V
Min
TA ≤ 85°C
Typ
Parameter
Maximum Propagation
Delay, A to Y
(Figures 3 and 5)
Test Conditions
Cin
Maximum Input
Capacitance
4
Cout
Maximum Three−State
Output Capacitance
(Output in High
Impedance State)
6
CPD
Power Dissipation Capacitance (Note 5)
Min
Max
Unit
ns
ns
ns
pF
pF
Typical @ 25°C, VCC = 5.0 V
14
pF
5. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC / 4 (per buffer). CPD is used to determine the
no−load dynamic power consumption; PD = CPD VCC2 fin + ICC VCC.
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3
MC74VHC1GT126
SWITCHING WAVEFORMS
VCC
OE
50%
VCC
GND
50%
A
tPZL
GND
tPHL
tPLH
tPLZ
HIGH
IMPEDANCE
50% VCC
Y
50% VCC
tPZH
VOL + 0.3V
tPHZ
Y
VOH - 0.3V
50% VCC
Y
Figure 4. Switching Waveforms
Figure 5.
TEST POINT
TEST POINT
OUTPUT
DEVICE
UNDER
TEST
HIGH
IMPEDANCE
DEVICE
UNDER
TEST
CL*
*Includes all probe and jig capacitance
OUTPUT
1 kW
CL *
CONNECT TO VCC WHEN
TESTING tPLZ AND tPZL.
CONNECT TO GND WHEN
TESTING tPHZ AND tPZH.
*Includes all probe and jig capacitance
Figure 6. Test Circuit
Figure 7. Test Circuit
INPUT
Figure 8. Input Equivalent Circuit
ORDERING INFORMATION
Device
Package
M74VHC1GT126DF1G
SC−88A / SOT−353 / SC−70
(Pb−Free)
M74VHC1GT126DF2G
SC−88A / SOT−353 / SC−70
(Pb−Free)
M74VHC1GT126DT1G
TSOP−5 / SOT−23 / SC−59
(Pb−Free)
NLVVHC1GT126DF1G*
SC−88A / SOT−353 / SC−70
(Pb−Free)
NLVVHC1GT126DF2G*
SC−88A / SOT−353 / SC−70
(Pb−Free)
NLVVHC1GT126DT1G*
TSOP−5 / SOT−23 / SC−59
(Pb−Free)
Shipping†
3000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
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4
MC74VHC1GT126
PACKAGE DIMENSIONS
SC−88A (SC−70−5/SOT−353)
CASE 419A−02
ISSUE K
A
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419A−01 OBSOLETE. NEW STANDARD
419A−02.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
G
5
4
−B−
S
1
2
DIM
A
B
C
D
G
H
J
K
N
S
3
D 5 PL
0.2 (0.008)
M
B
M
N
J
C
H
K
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5
INCHES
MIN
MAX
0.071
0.087
0.045
0.053
0.031
0.043
0.004
0.012
0.026 BSC
--0.004
0.004
0.010
0.004
0.012
0.008 REF
0.079
0.087
MILLIMETERS
MIN
MAX
1.80
2.20
1.15
1.35
0.80
1.10
0.10
0.30
0.65 BSC
--0.10
0.10
0.25
0.10
0.30
0.20 REF
2.00
2.20
MC74VHC1GT126
PACKAGE DIMENSIONS
TSOP−5
CASE 483−02
ISSUE H
D
NOTE 5
2X
0.10 T
2X
0.20 T
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
5. OPTIONAL CONSTRUCTION: AN
ADDITIONAL TRIMMED LEAD IS ALLOWED
IN THIS LOCATION. TRIMMED LEAD NOT TO
EXTEND MORE THAN 0.2 FROM BODY.
5X
0.20 C A B
M
5
1
4
2
L
3
B
S
K
DETAIL Z
G
A
DIM
A
B
C
D
G
H
J
K
L
M
S
DETAIL Z
J
C
0.05
SEATING
PLANE
H
T
MILLIMETERS
MIN
MAX
3.00 BSC
1.50 BSC
0.90
1.10
0.25
0.50
0.95 BSC
0.01
0.10
0.10
0.26
0.20
0.60
1.25
1.55
0_
10 _
2.50
3.00
SOLDERING FOOTPRINT*
0.95
0.037
1.9
0.074
2.4
0.094
1.0
0.039
0.7
0.028
SCALE 10:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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