MACOM MA4M1020 Mns microwave chip capacitor Datasheet

MNS Microwave Chip Capacitors
MA4M Series
MA4M Series
MNS Microwave
Chip Capacitors
Features
Case Style
•
Excellent Repeatability
(Wafer-to-Wafer and Lot-to-Lot)
• Small Size
• Low Loss, High Q
• Available with Round or Square Bonding Pads
Description
M/A-COM’s MA4M series of MNS (metal-nitride-silicon) silicon chip capacitors is designed specifically for high reliability and
repeatable performance in microwave circuit applications. These
capacitors are made using a low pressure chemical vapor deposition (LPCVD) that results in dense, uniform nitride layers. These
capacitors exhibit higher capacitance per unit area (resulting in
smaller chip size) than similar MOS, MIS and ceramic capacitors.
Evaporated gold contacts are used to provide an easily bondable
metal pad on the capacitor chip. M/A-COM MNS capacitors have
shown no measurable capacitance change when subjected to the
rated standoff voltage of 150ºC.
350
The MA4M series of chip capacitors is an excellent choice for use
in hybrid microwave circuits up through Ku-band, where low
loss, high reliability, small size and temperature stability are
prime concerns.
These chip capacitors are suited for applications requiring DC
blocks, coupling capacitors, bypass capacitors, capacitive loads
and tuning elements in oscillators, multipliers and filters.
Comparison of M/A-COM MNS Capacitors to Ceramic Chip Capacitors
Characteristics Compared
Operating Temperature Range
Temperature Coefficient
Insertion Loss of a 20 pF Capacitor in a 50 Ω line at 15 GHz
Chip Size
200 pF, 100V
20 pF, 100V
MNS
-55 to +200°C
180 PPM
0.1 dB
Ceramic
-55 to +125°C
1000 PPM
0.2 dB
40 x 40 mils
22 x 22 mils
70 x 70 mils
50 x 50 mils
V3.00
M/A-COM Division of AMP Incorporated ■ North America: Tel. (800) 366-2266, Fax (800) 618-8883 ■ Asia/Pacific: Tel.+85 2 2111 8088, Fax +85 2 2111 8087
■ Europe: Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020
www.macom.com
AMP and Connecting at a Higher Level are trademarks.
Specifications subject to change without notice.
MNS Microwave Chip Capacitors
MA4M Series
Specifications
Chip Capacitors with Round Bonding Pads
Model
Number
Maximum
Standoff
Capactance Voltage
2,5
1,2,3,4
Rating
(pF)
(Volts)
± 10 %
Chip Capacitors with Square Bonding Pads
Chip
Style
Nominal
Top
Contact
Diameter
(mils)
Model
Number
Capactance
1,2,3,4
(pF)
± 10 %
Maximum
Standoff
Voltage
2,5
Rating
(Volts)
Chip
Style
MA4M2002
2
200
132
3.5
MA4M3010
10
200
350
MA4M2005
5
200
132
6.0
MA4M3020
20
200
351
MA4M1010
10
100
132
6.0
MA4M3030
30
200
352
MA4M1020
20
100
132
9.0
MA4M3050
50
200
354
MA4M2020
20
200
132
11.5
MA4M3100
100
50
358
MA4M1030
30
100
132
11.0
MA4M3150
150
50
359
MA4M1050
50
100
132
14.0
MA4M1080
80
100
199
18.0
MA4M1100
100
100
199
20.0
MA4M2100
100
200
200
26.0
MA4M1200
200
100
200
28.0
MA4M1250
250
100
200
32.0
MA4M1300
300
100
201
35.0
MA4M2300
300
200
263
45.0
MA4M1600
600
100
263
48.0
Maximum Ratings
Applied Voltage
Specified standoff voltage
Operating Temperature
-55°C to +200°C
Storage Temperature
-55°C to +200°C
Notes:
1 5% capacitance tolerance is available on request.
2 Other capacitance and standoff voltage values are available on request.
3 Capacitance is measured at 1 MHz.
4 Temperature coefficient of capacitance is nominally 180 PPM/°C.
5 Device failure may occur if standoff voltage ratio is exceeded.
TYPICAL CAPACITANCE CHANGE FOR MNS and
CERAMIC CAPACITOR vs TEMPERATURE
(200 pF CAPACITOR)
+10
%
CAPACITANCE
CHANGE
+8
+6
+4
TEMPERATURE qC
-75
-25
0
25
50
-4
125
150
200
M/A-COM MA4M1200
CAPACITOR
-6
-8
-10
CERAMIC
CAPACITOR
V3.00
M/A-COM Division of AMP Incorporated ■ North America: Tel. (800) 366-2266, Fax (800) 618-8883 ■ Asia/Pacific: Tel.+85 2 2111 8088, Fax +85 2 2111 8087
■ Europe: Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020
www.macom.com
AMP and Connecting at a Higher Level are trademarks.
Specifications subject to change without notice.
MNS Microwave Chip Capacitors
MA4M Series
Chip
Case Style
MILLIMETERS
Style
DIM.
MIN.
MAX.
MIN.
MAX.
132
A
0.020
0.024
0.51
0.61
B
0.003
0.008
0.08
0.203
A
0.027
0.031
0.69
0.79
B
0.004
0.008
0.10
0.203
A
0.037
0.041
0.94
1.04
B
0.004
0.008
0.10
0.203
A
0.047
0.051
1.19
1.30
B
0.004
0.008
0.10
0.203
A
—
0.060
—
1.52
B
0.004
0.008
0.10
0.203
199
C
INCHES
A
200
201
263
B
Note:
For “C” dimension on above case styles, see specifications.
Chip
MILLIMETERS
Style
DIM.
MIN.
MAX.
MIN.
MAX.
350
A
0.018
0.021
0.46
0.53
B
—
0.008
—
0.203
C
—
0.009
—
0.23
A
0.018
0.021
0.46
0.53
B
—
0.008
—
0.203
C
—
0.012
—
0.30
A
0.018
0.021
0.46
0.53
B
—
0.008
—
0.203
C
—
0.015
—
0.38
A
0.020
0.023
0.51
0.58
B
—
0.008
—
0.203
C
—
0.018
—
0.46
A
0.018
0.021
0.46
0.53
B
—
0.008
—
0.203
C
—
0.013
—
0.33
A
0.018
0.021
0.46
0.53
B
—
0.008
—
0.203
C
—
0.016
—
0.41
351
C
INCHES
A
352
354
B
358
359
V3.00
M/A-COM Division of AMP Incorporated ■ North America: Tel. (800) 366-2266, Fax (800) 618-8883 ■ Asia/Pacific: Tel.+85 2 2111 8088, Fax +85 2 2111 8087
■ Europe: Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020
www.macom.com
AMP and Connecting at a Higher Level are trademarks.
Specifications subject to change without notice.
MNS Microwave Chip Capacitors
MA4M Series
Bonding and Handling Considerations for
MNS Chip Capacitors
Handling
Conductive Epoxy
Normal precautions that are common to the handling of hybrid
semiconductors also apply to MNS chip capacitors. Removal of
chips from waffle packs and subsequent handling should be
done with a vacuum pencil. Pencils equipped with either metallic or nonmetallic tips are acceptable.
Any of the conductive epoxies that are available for semiconductor die attachment are acceptable for MNS chip capacitor
attachment. Follow the manufacturer’s recommendations for
mixing and application carefully. Take care to seat the capacitor
on the substrate using a soft implement.
Surface Preparation
Lead Bonding
Each MNS chip and substrate should be free of oils and other
surface contamination. Such contaminants may result in poor
solder wetting. Cleansing can be done with acetone, alcohol,
freon, TMS or other common microelectronic solvents. Burnishing of MNS capacitor chips is not necessary or recommended.
Ball, ultrasonic, TC or pulse bonding of the wire or ribbon leads
are all acceptable methods. Temperature for the pulse bonder
should not exceed 300ºC. Maximum pressure applied to the
MNS capacitor chips should not exceed 25 grams for any of the
methods used. Proper procedure will result in bond strength that
exceeds MIL-STD-883B Method 2011.2 for gold wire or gold
ribbon.
Solder
Soldering temperatures up to 300ºC are acceptable for a duration
not greater than 5 seconds for MNS chip capacitors. Any of the
common tin-lead-silver, lead-indium, or higher temperature gold
alloy solders are acceptable provided that the 300ºC temperature
is not exceeded. Pure tin or tin-antimony solders are not
recommended. Cleaning of residual flux is required and can be
accomplished with a fluorinated or chlorinated solvent.
V3.00
M/A-COM Division of AMP Incorporated ■ North America: Tel. (800) 366-2266, Fax (800) 618-8883 ■ Asia/Pacific: Tel.+85 2 2111 8088, Fax +85 2 2111 8087
■ Europe: Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020
www.macom.com
AMP and Connecting at a Higher Level are trademarks.
Specifications subject to change without notice.
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