MA-COM MADP-000135-01340W Silicon pin chip Datasheet

Silicon PIN Chips
RoHS Compliant
V15
Features
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Switch & Attenuator Die
Extensive Selection of I-Region Lengths
Hermetic
Glass Passivated CERMACHIP®
Oxide Passivated Planar Chips
Voltage Ratings to 3000V
Fast Switching Speed
Low Loss
High Isolation
RoHS Compliant
Description
M/A-COM offers a comprehensive line of low
capacitance, planar and mesa, silicon PIN diode chips
which use ceramic glass and silicon nitride passivation
technology. The Silicon PIN series of devices cover a
broad spectrum of performance requirements for control
circuit applications. They are available in several choices
of I-region lengths and have been optimally designed to
minimize parametric trade offs when considering low
capacitance, low series resistance, and high breakdown
voltages. Their small size and low parasitics, make them
an ideal choice for broadband, high frequency,
micro-strip hybrid assemblies.
Absolute Maximum Ratings1
TAMB = +25°C (Unless otherwise specified)
Parameter
Absolute Maximum
Value
Forward Current (IF)
Per P/N Rs vs. I Graph
Reverse Voltage (VR)
Per Specification Table
Power Dissipation (W) (175°C –Tplate°C ) / Theta
Operating Temperature
-55°C to +175°C
Storage Temperature
-55°C to +200°C
Junction Temperature
+175°C
Mounting Temperature
+320°C for 10 seconds
1. Exceeding these limits
damage to the chip
may
cause
permanent
Anode
The attenuator line of PIN diode chips are a planar
or mesa construction and because of their thicker
I-regions and predictable Rs vs. I characteristics, they
are well suited for low distortion attenuator and switch
circuits. Incorporated in the chip’s construction is
M/A-COM’s, time proven, hard glass, CERMACHIP® .
The hard glass passivation completely encapsulates the
entire PIN junction area resulting in a hermetically
sealed chip which has been qualified in many military
applications. These CERMACHIP® diodes are available
in a wide variety of voltage ratings, up to 3,000 volts and
are capable of controlling kilowatts of power.
Many of M/A-COM’s silicon PIN diode chips are
also available in several different package styles.
Please consult the “Packaged PIN Diode Datasheet”
for case style availability and specifications. The
datasheet is located on the M/A-COM website at :
www.macomtech.com/DataSheets/packagedpindiodes.pdf
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
Full Area Cathode
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
Silicon PIN Chips
RoHS Compliant
V15
Low Capacitance PIN Specification @ TAMB = +25°C
Nominal Characteristics
Max.
Max.
Max. Rev. Cap. Series Res. Carrier 1
3
1 MHz
500 MHz Lifetime
Volt.
Part Number
VR <10 µA Cj @ -10 V RS @ 10 mA
VDC
pF
Ω
Reverse
Recovery I Region
2
Time
Length Theta
Anode
Dia.
Chip
Size
Chip
Thk.
TL
ηS
TRR
ηS
μm
°C/W
± 0.5
mils
±2
mils
±1
mils
MA4P161-134
100
0.10
1.50
150
15
13
65
3.5
13X13
6
MA4P203-134
100
0.15
1.50
150
25
13
75
3.1
13X13
6
MADP-000165-01340W
200
0.06
2.50
200
20
19
150
1.8
13X13
10
MADP-000135-01340W
200
0.15
1.20
440
44
19
35
3.1
13x13
10
Notes:
1. Nominal carrier life time,TL , specified at IF = + 10mA , IREV = - 6mA.
2. Nominal reverse recovery time specified at IF = + 20mA , IREV = - 200mA.
3. VR ( Reverse Voltage ) is sourced and the resultant reverse leakage current, Ir, is measured to be <10µA.
Attenuator PIN Specification @ TAMB = +25°C
Nominal Characteristics
Max.
Rev.
2
Volt.
Max. Cap.
1MHz
Max.
Series
Res.
100MHz
Part Number VR <10 µA Cj @ -100 V RS @ 10 mA
VDC
pF
Ω
Carrier
1
Lifetime
TL
μS
Series
Res.
100MHz
Series
Res.
100MHz
RS @ 1 mA RS @ 10 μA
Ω
Ω
I Region
Length Theta
mils
°C/W
Anode
Dia.
Chip
Size
Chip
Thk.
± 0.5
mils
±2
mils
±1
mils
3
MA47416-132
200
0.15
6
2
30
2000
4
30
7.5 X7.5
19X19
7
MA47418-134
200
0.15
3
1
15
500
2
25
7.5
13X13
7
Notes:
1. Nominal carrier life time,TL, specified at IF = + 10mA, IREV = - 6mA.
2. VR ( Reverse Voltage ) is sourced and the resultant reverse leakage current, IR, is measured to be <10μA.
3. Anode top contact is square.
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
Silicon PIN Chips
RoHS Compliant
V15
CERMACHIP® PIN Chips Specification @ TAMB = +25°C
Nominal Characteristics
Unless
Unless
otherwise noted otherwise noted
Part Number
Max. Rev.
5
Volt.
Max. Cap.
1 MHz
VR < 10 µA
VDC
CJ @ -100 V
pF
Max. Series Res. Carrier
Lifetime
100 MHz
RS @ 100 mA
Ω
2
4
I Region
Length Theta
Anode
Dia.
Chip
size
± 0.5 mil ± 2 mils
Chip
Thk.
μS
μm
°C/W
± 1 mil
0.3
20
30
3.0
13X13
10.0
MA4P303-134
200
0.15 @ 10 V
1.5 @ 50 mA
MA4P404-132
250
0.20 @ 50 V
0.70 @ 50 mA
0.6
30
20
6.8
20X20
7.0
MA4P504-132
500
0.20
0.60
1
50
15
6.8
20X20
12.0
MA4P505-131
500
0.35
0.45
2
50
14
13.0
27X27
11.0
MA4P506-131
500
0.70
0.30
3
50
11
15.8
27X27
12.0
MADP-000488-13740W
900
0.16 @ 50V
1.6 @ 50 mA
4
140
45
12.2
23X23
13.5
MA4P604-131
1000
0.30
1.00
3
90
10
17.0
27X27
13.5
MA4P606-131
1000
0.60
0.70
4
90
8
21.0
32X32
14.0
MA4P607-212
1000
1.30
0.40
5
127
4
37.0
62X62
18.5
2000
2.40
0.20 @ 500 mA
3
10
230
2
72.0
111X111
21.0
3000
2.90
0.25 @ 500 mA
3
40
350
1.5
85.0
172X172
28.0
MA4PK2000-223
1
MA4PK3000-1252
1
2
Notes:
1. Upon completion of installation into a circuit, the chip must be covered with a dielectric conformal
®
coating such as SYLGARD 539 to prevent voltage arcing.
2. Test Frequency = 500 MHz.
3. Test Frequency = 4 MHz.
4. Nominal carrier lifetime, TL, specified at IF = + 10 mA , IREV = - 6 mA.
5. Minimum specified VR (Reverse Voltage) is sourced and the resultant reverse leakage current, IREV,
is measured to be < 10 μA.
Anode
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
Silicon PIN Chips
RoHS Compliant
V15
Typical Series Resistance vs. Forward Current Performance
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
Silicon PIN Chips
RoHS Compliant
V15
MA4PK2000 & MA4PK3000 (2kV & 3kV) Chips
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
Silicon PIN Chips
RoHS Compliant
V15
Die Handling and Mounting Information
Handling: All semiconductor chips should be handled with care to avoid damage or contamination
from perspiration, salts, and skin oils. The use of plastic tipped tweezers or vacuum pickup is
strongly recommended for the handling and placing of individual components. Bulk handling should
ensure that abrasion and mechanical shock are minimized.
Die Attach Surface: Die can be mounted with an 80Au/Sn20, eutectic solder preform, RoHS
compliant solders or electrically conductive silver epoxy. The metal RF and D.C. ground plane
mounting surface must be free of contamination and should have a surface flatness of < ±0.002”.
Eutectic Die Attachment Using Hot Gas Die Bonder: A work surface temperature of 255oC is
recommended. When hot forming gas (95%N/5%H) is applied, the work area temperature should be
approximately 290oC. The chip should not be exposed to temperatures greater than 320oC for more
than 10 seconds.
Eutectic Die Attachment Using Reflow Oven: Refer to pages 5-7 of Application Note M538,
“Surface Mounting Instructions” at www.macom.com for recommended time-temperature profile.
Electrically Conductive Epoxy Die Attachment: A controlled amount of electrically conductive,
silver epoxy, approximately 1–2 mils in thickness, should be used to minimize ohmic and thermal
resistance. A thin epoxy fillet should be visible around the perimeter of the chip after placement to
ensure full area coverage. Cure conductive epoxy per manufacturer’s schedule. Typically 150°C for
1 hour.
Wire and Ribbon Bonding: The die anode bond pads have a Ti-Pt-Au metallization scheme, with a
final gold thickness of 1.0 micron. Thermo-compression or thermo-sonic wedge bonding of either
gold wire or ribbon is recommended. A bonder heat stage temperature setting of 200oC, tool tip
temperature of 150°C and a force of 18 to 50 grams is suggested. Ultrasonic energy may also be
used but should be adjusted to the minimum amplitude required to achieve an acceptable bond.
Excessive energy may cause the anode metallization to separate from the chip. Automatic ball or
wedge bonding may also be used.
For more detailed handling and assembly instructions, see Application Note M541,
“Bonding and Handling Procedures for Chip Diode Devices” at www.macom.com.
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
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