MA4GP907 GaAs Flip Chip PIN Diode M/A-COM Products Features ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ Rev. V6 RoHS Compliant Chip Dimensions Low Series Resistance Ultra Low Capacitance Millimeter Wave Switching & Cutoff Frequency 2 Nanosecond Switching Speed Can be Driven by a Buffered TTL Silicon Nitride Passivation Polyimide Scratch Protection RoHS Compliant Description M/A-COM's MA4GP907 is Gallium Arsenide (GaAs) flip-chip PIN diode. It is fabricated using an OMCVD epitaxial wafer with a process designed for high device uniformity and extremely low parasitics. The diode exhibits an extremely low RC product, (0.1ps) and 2-3nS switching characteristics. They are fully passivated with silicon nitride and have an added polymer layer for scratch protection. The protective coating prevents damage to the junction and the anode air-bridge during handling and assembly. Applications The ultra low capacitance of the MA4GP907 allows for operation up to millimeter frequencies for RF switches and switched phase shifter applications. The diode is designed for use in pulsed or CW applications, where single digit nS switching speed is required. The low capacitance of the MA4GP907 makes it for use in microwave multi-throw switch assemblies, where the series capacitance of each “off” port adversely loads the input and affects VSWR. Absolute Maximum Ratings TAMB = +25°C (unless otherwise specified) Parameter Absolute Maximum Reverse Voltage 50V Operating Temperature -55°C to +125°C Storage Temperature -55°C to +150°C Junction Temperature +175°C Dissipated Power 50mW ( RF & DC ) C.W. Incident Power +23 dBm Mounting Temperature +280°C for 10 seconds Notes: 1. Gold Pads 14µM thick. 2. Yellow areas indicate ohmic gold mounting pads. Inches DIM Millimeters MIN. MAX. MIN. MAX. A 0.026 0.027 0.6604 0.6858 B 0.0135 0.0145 0.3429 0.3683 C 0.0065 0.0075 0.1651 0.1905 D 0.0043 0.0053 0.1092 0.1346 E 0.0068 0.0073 0.1727 0.1854 F 0.0182 0.0192 0.4623 0.4877 ADVANCED: Data Sheets contain information regarding a product M/A-COM is • North America Tel: 800.366.2266 / Fax: 978.366.2266 considering for development. Performance is based on target specifications, • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 simulated results, and/or prototype measurements. Commitment to develop is not • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make under development. Performance is based on engineering tests. Specifications are changes to the product(s) or information contained herein without notice. typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. MA4GP907 M/A-COM Products GaAs Flip Chip PIN Diode Rev. V6 RoHS Compliant Electrical Specifications @ TAMB = +25°C Parameter Symbol Conditions Units Typ. Max. Total Capacitance CT -10V,1MHz pF 0.025 0.030 Total Capacitance 1 CT -10V,10GHz pF 0.025 —— Series Resistance RS +10mA, 1MHz Ω 5.2 7.0 Series Resistance 2 RS +10mA, 10GHz Ω 4.2 —— Forward Voltage VF +10mA V 1.33 1.45 Reverse Voltage Current 3 IR VR = -50V μA —— 10 Switching Speed 4 TRISE TFALL 10GHz nS 2 —— Notes: 1) Capacitance is determined by measuring the isolation of a single series diode in a 50Ω transmission line at 10GHz. 2) Series resistance is determined by measuring the insertion loss of a single series diode in a 50Ω transmission line at 10GHz. 3) The max rated VR( Reverse Voltage ) is sourced and the resultant reverse leakage current, Ir, is measured to be <10μA 4) Switching speed is measured between 10% and 90% or 90% to 10% RF voltage for a single series mounted diode. Driver delay is not included. ADVANCED: Data Sheets contain information regarding a product M/A-COM is • North America Tel: 800.366.2266 / Fax: 978.366.2266 considering for development. Performance is based on target specifications, • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 simulated results, and/or prototype measurements. Commitment to develop is not • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make under development. Performance is based on engineering tests. Specifications are changes to the product(s) or information contained herein without notice. typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. MA4GP907 M/A-COM Products GaAs Flip Chip PIN Diode Rev. V6 RoHS Compliant Typical RF Performance @ TAMB = +25°C Insertion Loss vs. Frequency I. Loss @5mA I. Loss @15mA I. Loss @50mA Insertion Loss (dB) 0.0 -0.2 -0.4 -0.6 -0.8 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 Frequency (GHz) Return Loss vs. Frequency R. Loss @5mA R. Loss @15mA R. Loss @50mA 0.0 -5.0 Return Loss (dB) -10.0 -15.0 -20.0 -25.0 -30.0 -35.0 -40.0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 Frequency (GHz) ADVANCED: Data Sheets contain information regarding a product M/A-COM is • North America Tel: 800.366.2266 / Fax: 978.366.2266 considering for development. Performance is based on target specifications, • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 simulated results, and/or prototype measurements. Commitment to develop is not • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make under development. Performance is based on engineering tests. Specifications are changes to the product(s) or information contained herein without notice. typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. MA4GP907 M/A-COM Products GaAs Flip Chip PIN Diode Rev. V6 RoHS Compliant Typical RF Performance @ TAMB = +25°C Isolation vs. Frequency Isolation @ -10V Isolation @ 0V 0.0 -5.0 Isolation (dB) -10.0 -15.0 -20.0 -25.0 -30.0 -35.0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 Frequency ( GHz ) ADVANCED: Data Sheets contain information regarding a product M/A-COM is • North America Tel: 800.366.2266 / Fax: 978.366.2266 Frequency (Hz) considering for development. Performance is based on target specifications, • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 simulated results, and/or prototype measurements. Commitment to develop is not • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make under development. Performance is based on engineering tests. Specifications are changes to the product(s) or information contained herein without notice. typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. MA4GP907 M/A-COM Products GaAs Flip Chip PIN Diode Rev. V6 RoHS Compliant Device Installation Guidelines Cleanliness This device should be handled in a clean environment. The chip is resistant to solvents and may cleaned using approved industry standard practices. Static Sensitivity Gallium Arsenide PIN diodes are ESD sensitive and can be damaged by static electricity. Proper ESD handling techniques should be used. These devices are rated Class 0, ( 0-199V )per HBM MIL-STD-883, method 3015.7 should be handled in a static-free environment. General Handling The die has a polymer layer which provides scratch protection for the junction area and the anode air bridge. Die can be handled with plastic tweezers or picked and placed with a #27 tip vacuum pencil. Assembly Requirements using Electrically Conductive Silver Epoxy and Solder The MA4GP907 is designed to be inserted onto hard or soft substrates with the junction/pad side down. It may be mounted onto a silk-screened circuit using electrically conductive silver epoxy, approximately 1-2 mils in thickness and cured at approximately 90°C to 150°C per manufacturer’s schedule. For extended cure times, > 30 minutes, temperatures must be kept below 200°C. Eutectic Die Attached Tin rich solders ( >30% Sn by weight ) are not recommended as they will scavenge gold from the contact pads exposing the tungsten metallization beneath and creating a poor solder connection. Indalloy or 80Au/20Sn type solders are acceptable. Maximum soldering temperature must be kept below 280°C for less than 10 seconds. Circuit Pad Layout 0.013” Ordering Information Part Number Packaging MA4GP907 MADP-000907-13050P Waffle Pack Pocket Tape 0.012” (2) PL 0.008” (2) PL ADVANCED: Data Sheets contain information regarding a product M/A-COM is • North America Tel: 800.366.2266 / Fax: 978.366.2266 considering for development. Performance is based on target specifications, • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 simulated results, and/or prototype measurements. Commitment to develop is not • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make under development. Performance is based on engineering tests. Specifications are changes to the product(s) or information contained herein without notice. typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed.