Maxim MAX11661 1204 500ksps, low-power,serial 12-/10-/8-bit adc Datasheet

19-5530; Rev 5; 4/12
TION KIT
EVALUA BLE
IL
AVA A
500ksps, Low-Power,
Serial 12-/10-/8-Bit ADCs
The MAX11661−MAX11666 are 12-/10-/8-bit, compact,
low-power, successive approximation analog-to-digital
converters (ADCs). These high-performance ADCs include
a high-dynamic range sample-and-hold and a high-speed
serial interface. These ADCs accept a full-scale input from
0V to the power supply or to the reference voltage.
The MAX11662/MAX11664/MAX11666 feature dual, single-ended analog inputs connected to the ADC core
using a 2:1 MUX. The devices also include a separate
supply input for data interface and a dedicated input
for reference voltage. In contrast, the single-channel
devices generate the reference voltage internally from
the power supply.
These ADCs operate from a 2.2V to 3.6V supply and
consume only 3.3mW. The devices include full powerdown mode and fast wake-up for optimal power management and a high-speed 3-wire serial interface. The
3-wire serial interface directly connects to SPI, QSPIK,
and MICROWIRE® devices without external logic.
Excellent dynamic performance, low voltage, low power,
ease of use, and small package size make these converters ideal for portable battery-powered data-acquisition applications, and for other applications that demand
low-power consumption and minimal space.
These ADCs are available in a 10-pin FMAX® package,
and a 6-pin SOT23 package. These devices operate
over the -40NC to +125NC temperature range.
Features
S 500ksps Conversion Rate, No Pipeline Delay
S 12-/10-/8-Bit Resolution
S 1-/2-Channel, Single-Ended Analog Inputs
S Low-Noise 73dB SNR
S Variable I/O: 1.5V to 3.6V (Dual-Channel Only)
Allows the Serial Interface to Connect Directly
to 1.5V, 1.8V, 2.5V, or 3V Digital Systems
S 2.2V to 3.6V Supply Voltage
S Low Power
3.3mW
Very Low Power Consumption at 8µA/ksps
S External Reference Input (Dual-Channel Devices Only)
S 1.3µA Power-Down Current
S SPI-/QSPI-/MICROWIRE-Compatible Serial
Interface
S 10-Pin, 3mm x 5mm µMAX Package
S 6-Pin, 2.8mm x 2.9mm SOT23 Package
S Wide -40NC to +125NC Operation
Applications
Data Acquisition
Portable Data Logging
Medical Instrumentation
Battery-Operated Systems
Communication Systems
Automotive Systems
Ordering Information
PART
PIN-PACKAGE
BITS
NO. OF CHANNELS
MAX11661AUT+
6 SOT23
8
1
MAX11662AUB+
10 FMAX-EP*
8
2
MAX11663AUT+
6 SOT23
10
1
MAX11664AUB+
10 FMAX-EP*
10
2
MAX11665AUT+
6 SOT23
12
1
MAX11666AUB+
10 FMAX-EP*
12
2
MAX11666AUB/V+
10 FMAX-EP*
12
2
Note: All devices are specified over the -40°C to +125°C operating temperature range.
+Denotes a lead(Pb)-free/RoHS-compliant package.
*EP = Exposed pad.
/V denotes an automotive qualified part.
QSPI is a trademark of Motorola, Inc.
MICROWIRE is a registered trademark of National Semiconductor Corp.
µMAX is a registered trademark of Maxim Integrated Products, Inc.
________________________________________________________________ Maxim Integrated Products 1
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642,
or visit Maxim’s website at www.maxim-ic.com.
MAX11661–MAX11666
General Description
MAX11661–MAX11666
500ksps, Low-Power,
Serial 12-/10-/8-Bit ADCs
ABSOLUTE MAXIMUM RATINGS
VDD to GND..............................................................-0.3V to +4V
REF, OVDD, AIN1, AIN2, AIN to GND.........-0.3V to the lower of
(VDD + 0.3V) and +4V
CS, SCLK, CHSEL, DOUT TO GND.............-0.3V to the lower of
(VOVDD + 0.3V) and +4V
AGND to GND.......................................................-0.3V to +0.3V
Input/Output Current (all pins)............................................50mA
Continuous Power Dissipation (TA = +70NC)
6-Pin SOT23 (derate 8.7mW/NC above +70NC)............696mW
10-Pin FMAX (derate 8.8mW/NC above +70NC)........707.3mW
Operating Temperature Range........................ .-40NC to +125NC
Junction Temperature......................................................+150NC
Storage Temperature Range............................. -65NC to +150NC
Lead Temperature (soldering, 10s).................................+300NC
Soldering Temperature (reflow).......................................+260NC
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS (MAX11666)
(VDD = 2.2V to 3.6V, VREF = VDD, VOVDD = VDD. fSCLK = 8MHz, 50% duty cycle, 500ksps. CDOUT = 10pF, TA = -40NC to +125NC,
unless otherwise noted. Typical values are at TA = +25NC.) (Note 1)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Q1
LSB
Q1
LSB
Q0.3
Q4
LSB
Q1
Q3
LSB
DC ACCURACY
Resolution
12
Integral Nonlinearity
INL
Differential Nonlinearity
DNL
Offset Error
OE
Gain Error
GE
Total Unadjusted Error
TUE
Bits
No missing codes
Excluding offset and reference errors
Q1
LSB
Channel-to-Channel Offset
Matching
Q0.4
LSB
Channel-to-Channel Gain
Matching
Q0.05
LSB
dB
DYNAMIC PERFORMANCE (fAIN = 250kHz)
Signal-to-Noise and Distortion
SINAD
70
72
Signal-to-Noise Ratio
SNR
70.5
72.5
Total Harmonic Distortion
THD
Spurious-Free Dynamic Range
SFDR
Intermodulation Distortion
IMD
-85
75.5
85
dB
-74.5
dB
dB
f1 = 239.8kHz, f2 = 200.2kHz
-84
dB
Full-Power Bandwidth
-3dB point
40
MHz
Full-Linear Bandwidth
SINAD > 68dB
2.5
MHz
Small-Signal Bandwidth
45
MHz
Crosstalk
-90
dB
2 _______________________________________________________________________________________
500ksps, Low-Power,
Serial 12-/10-/8-Bit ADCs
(VDD = 2.2V to 3.6V, VREF = VDD, VOVDD = VDD. fSCLK = 8MHz, 50% duty cycle, 500ksps. CDOUT = 10pF, TA = -40NC to +125NC,
unless otherwise noted. Typical values are at TA = +25NC.) (Note 1)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
500
ksps
CONVERSION RATE
Throughput
5
Conversion Time
1.56
Acquisition Time
tACQ
Aperture Delay
Fs
52
From CS falling edge
ns
4
Aperture Jitter
ns
15
Serial-Clock Frequency
ps
fCLK
0.08
8
MHz
VAIN_
0
VREF
V
Q1
FA
ANALOG INPUT (AIN1, AIN2)
Input Voltage Range
Input Leakage Current
Input Capacitance
IILA
CAIN_
0.002
Track
20
Hold
4
pF
EXTERNAL REFERENCE INPUT (REF)
Reference Input Voltage Range
Reference Input Leakage
Current
Reference Input Capacitance
VREF
IILR
1
Conversion stopped
0.005
CREF
VDD +
0.05
V
Q1
FA
5
pF
DIGITAL INPUTS (SCLK, CS, CHSEL)
Digital Input High Voltage
VIH
Digital Input Low Voltage
VIL
Digital Input Hysteresis
0.75 x
VOVDD
0.25 x
VOVDD
0.15 x
VOVDD
VHYST
Digital Input Leakage Current
IIL
Digital Input Capacitance
CIN
V
Inputs at GND or VDD
0.001
V
V
Q1
2
FA
pF
DIGITAL OUTPUT (DOUT)
Output High Voltage
VOH
ISOURCE = 200FA
Output Low Voltage
VOL
ISINK = 200FA
High-Impedance Leakage
Current
IOL
High-Impedance Output
Capacitance
COUT
0.85 x
VOVDD
V
4
0.15 x
VOVDD
V
Q1.0
FA
pF
_______________________________________________________________________________________ 3
MAX11661–MAX11666
ELECTRICAL CHARACTERISTICS (MAX11666) (continued)
MAX11661–MAX11666
500ksps, Low-Power,
Serial 12-/10-/8-Bit ADCs
ELECTRICAL CHARACTERISTICS (MAX11666) (continued)
(VDD = 2.2V to 3.6V, VREF = VDD, VOVDD = VDD. fSCLK = 8MHz, 50% duty cycle, 500ksps. CDOUT = 10pF, TA = -40NC to +125NC,
unless otherwise noted. Typical values are at TA = +25NC.) (Note 1)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
POWER SUPPLY
Positive Supply Voltage
Digital I/O Supply Voltage
Positive Supply Current
(Full-Power Mode)
Positive Supply Current (FullPower Mode), No Clock
VDD
2.2
3.6
V
VOVDD
1.5
VDD
V
IVDD
VAIN_ = VGND
1.67
IOVDD
VAIN_ = VGND
0.1
IVDD
Power-Down Current
IPD
Line Rejection
1.5
Leakage only
1.3
VDD = 2.2V to 3.6V, VREF = 2.2V
0.7
mA
mA
10
FA
LSB/V
TIMING CHARACTERISTICS (Note 2)
Quiet Time
tQ
(Note 3)
4
ns
CS Pulse Width
t1
(Note 3)
10
ns
CS Fall to SCLK Setup
CS Falling Until DOUT HighImpedance Disabled
t2
(Note 3)
5
ns
t3
(Note 3)
1
ns
Figure 2, VOVDD = 2.2V to 3.6V
15
Figure 2, VOVDD = 1.5V to 2.2V
16.5
Data Access Time After SCLK
Falling Edge
t4
SCLK Pulse Width Low
t5
Percentage of clock period (Note 3)
40
60
%
SCLK Pulse Width High
Data Hold Time From SCLK
Falling Edge
SCLK Falling Until DOUT High
Impedance
Power-Up Time
t6
Percentage of clock period (Note 3)
40
60
%
t7
Figure 3
5
t8
Figure 4 (Note 3)
ns
ns
2.5
Conversion cycle (Note 3)
14
ns
1
Cycle
ELECTRICAL CHARACTERISTICS (MAX11665)
(VDD = 2.2V to 3.6V, fSCLK = 8MHz, 50% duty cycle, 500ksps, CDOUT = 10pF, TA = -40NC to +125NC, unless otherwise noted. Typical
values are at TA = +25NC.) (Note 1)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Q1
LSB
Q1
LSB
Q1.5
Q4
LSB
Q1
Q3
LSB
DC ACCURACY
Resolution
12
Integral Nonlinearity
INL
Differential Nonlinearity
DNL
Offset Error
OE
Gain Error
GE
Total Unadjusted Error
TUE
Bits
No missing codes
Excluding offset and reference errors
Q1.5
LSB
DYNAMIC PERFORMANCE (fAIN = 250kHz)
Signal-to-Noise and Distortion
Signal-to-Noise Ratio
SINAD
70
72.5
dB
SNR
70.5
73
dB
4 _______________________________________________________________________________________
500ksps, Low-Power,
Serial 12-/10-/8-Bit ADCs
(VDD = 2.2V to 3.6V, fSCLK = 8MHz, 50% duty cycle, 500ksps, CDOUT = 10pF, TA = -40NC to +125NC, unless otherwise noted. Typical
values are at TA = +25NC.) (Note 1)
PARAMETER
SYMBOL
Total Harmonic Distortion
THD
Spurious-Free Dynamic Range
SFDR
Intermodulation Distortion
IMD
CONDITIONS
MIN
77
TYP
MAX
UNITS
-85
-76
dB
85
dB
f1 = 239.8kHz, f2 = 200.2kHz
-84
dB
Full-Power Bandwidth
-3dB point
40
MHz
Full-Linear Bandwidth
SINAD > 68dB
2.5
MHz
45
MHz
Small-Signal Bandwidth
CONVERSION RATE
Throughput
5
Conversion Time
Acquisition Time
tACQ
Aperture Delay
ksps
Fs
52
ns
From CS falling edge
Aperture Jitter
Serial Clock Frequency
500
1.56
4
ns
15
ps
fCLK
0.08
8
MHz
Input Voltage Range
VAIN
0
VDD
V
Input Leakage Current
IILA
Q1
FA
ANALOG INPUT
Input Capacitance
CAIN
0.002
Track
20
Hold
4
pF
DIGITAL INPUTS (SCLK, CS, CHSEL)
Digital Input High Voltage
VIH
Digital Input Low Voltage
VIL
Digital Input Hysteresis
0.75 x
VVDD
0.25 x
VVDD
0.15 x
VVDD
VHYST
Digital Input Leakage Current
IIL
Digital Input Capacitance
CIN
V
Inputs at GND or VDD
0.001
V
V
Q1
2
FA
pF
DIGITAL OUTPUT (DOUT)
Output High Voltage
VOH
ISOURCE = 200FA
Output Low Voltage
VOL
ISINK = 200FA
High-Impedance Leakage
Current
IOL
High-Impedance Output
Capacitance
0.85 x
VVDD
COUT
V
0.15 x
VVDD
V
Q1.0
FA
4
pF
POWER SUPPLY
Positive Supply Voltage
VDD
Positive Supply Current
(Full-Power Mode)
IVDD
2.2
VAIN = VGND
3.6
V
1.76
mA
_______________________________________________________________________________________ 5
MAX11661–MAX11666
ELECTRICAL CHARACTERISTICS (MAX11665) (continued)
MAX11661–MAX11666
500ksps, Low-Power,
Serial 12-/10-/8-Bit ADCs
ELECTRICAL CHARACTERISTICS (MAX11665) (continued)
(VDD = 2.2V to 3.6V, fSCLK = 8MHz, 50% duty cycle, 500ksps, CDOUT = 10pF, TA = -40NC to +125NC, unless otherwise noted. Typical
values are at TA = +25NC.) (Note 1)
PARAMETER
Positive Supply Current (FullPower Mode), No Clock
SYMBOL
CONDITIONS
MIN
IVDD
Power-Down Current
IPD
Line Rejection
TYP
MAX
1.48
Leakage only
1.3
VDD = 2.2V to 3.6V
0.7
UNITS
mA
10
FA
LSB/V
TIMING CHARACTERISTICS (Note 2)
Quiet Time
tQ
(Note 3)
4
ns
CS Pulse Width
t1
(Note 3)
10
ns
CS Fall to SCLK Setup
t2
(Note 3)
5
ns
CS Falling Until DOUT HighImpedance Disabled
t3
(Note 3)
1
ns
Data Access Time After SCLK
Falling Edge
t4
Figure 2, VDD = 2.2V to 3.6V
SCLK Pulse Width Low
t5
Percentage of clock period (Note 3)
SCLK Pulse Width High
t6
Percentage of clock period (Note 3)
Data Hold Time From SCLK
Falling Edge
t7
Figure 3
5
SCLK Falling Until DOUT High
Impedance
t8
Figure 4 (Note 3)
Power-Up Time
15
ns
40
60
%
40
60
%
ns
2.5
Conversion cycle (Note 3)
14
ns
1
Cycle
ELECTRICAL CHARACTERISTICS (MAX11664)
(VDD = 2.2V to 3.6V, VREF = VDD, VOVDD = VDD, fSCLK = 8MHz, 50% duty cycle, 500ksps; CDOUT = 10pF, TA = -40NC to +125NC,
unless otherwise noted. Typical values are at TA = +25NC.) (Note 1)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
DC ACCURACY
Resolution
10
Integral Nonlinearity
INL
Differential Nonlinearity
DNL
Offset Error
OE
Gain Error
GE
Total Unadjusted Error
TUE
Bits
No missing codes
Q0.5
0
Excluding offset and reference errors
Q0.5
LSB
Q0.5
LSB
Q1.3
LSB
Q1.3
LSB
Q0.5
LSB
Channel-to-Channel Offset
Matching
Q0.1
LSB
Channel-to-Channel Gain
Matching
Q0.05
LSB
DYNAMIC PERFORMANCE (fAIN = 250kHz)
Signal-to-Noise and Distortion
Signal-to-Noise Ratio
SINAD
60.5
61.6
dB
SNR
60.5
61.6
dB
Total Harmonic Distortion
THD
Spurious-Free Dynamic Range
SFDR
-83
75
6 _______________________________________________________________________________________
-73
dB
dB
500ksps, Low-Power,
Serial 12-/10-/8-Bit ADCs
(VDD = 2.2V to 3.6V, VREF = VDD, VOVDD = VDD, fSCLK = 8MHz, 50% duty cycle, 500ksps; CDOUT = 10pF, TA = -40NC to +125NC,
unless otherwise noted. Typical values are at TA = +25NC.) (Note 1)
PARAMETER
Intermodulation Distortion
SYMBOL
IMD
CONDITIONS
MIN
f1 = 239.8kHz, f2 = 200.2kHz
TYP
MAX
UNITS
-82
dB
Full-Power Bandwidth
-3dB point
40
MHz
Full-Linear Bandwidth
SINAD > 60dB
2.5
MHz
Small-Signal Bandwidth
45
MHz
Crosstalk
-90
dB
CONVERSION RATE
Throughput
5
Conversion Time
500
1.56
Acquisition Time
tACQ
Aperture Delay
Fs
52
ns
4
From CS falling edge
Aperture Jitter
ns
15
Serial-Clock Frequency
ksps
ps
fCLK
0.08
8
MHz
VAIN_
0
VREF
V
Q1
FA
ANALOG INPUT (AIN1, AIN2)
Input Voltage Range
Input Leakage Current
Input Capacitance
IILA
CAIN-_
0.002
Track
20
Hold
4
pF
EXTERNAL REFERENCE INPUT (REF)
Reference Input Voltage Range
Reference Input Leakage
Current
Reference Input Capacitance
VREF
IILR
1
Conversion stopped
0.005
CREF
VDD +
0.05
V
Q1
FA
5
pF
DIGITAL INPUTS (SCLK, CS, CHSEL)
Digital Input High Voltage
VIH
Digital Input Low Voltage
VIL
Digital Input Hysteresis
0.75 x
VOVDD
0.25 x
VOVDD
0.15 x
VOVDD
VHYST
Digital Input Leakage Current
IIL
Digital Input Capacitance
CIN
V
Inputs at GND or VDD
0.001
V
V
Q1
2
FA
pF
DIGITAL OUTPUT (DOUT)
Output High Voltage
VOH
ISOURCE = 200µA
Output Low Voltage
VOL
ISINK = 200µA
High-Impedance Leakage
Current
IOL
High-Impedance Output
Capacitance
COUT
0.85 x
VOVDD
V
4
0.15 x
VOVDD
V
Q1.0
FA
pF
_______________________________________________________________________________________ 7
MAX11661–MAX11666
ELECTRICAL CHARACTERISTICS (MAX11664) (continued)
MAX11661–MAX11666
500ksps, Low-Power,
Serial 12-/10-/8-Bit ADCs
ELECTRICAL CHARACTERISTICS (MAX11664) (continued)
(VDD = 2.2V to 3.6V, VREF = VDD, VOVDD = VDD, fSCLK = 8MHz, 50% duty cycle, 500ksps; CDOUT = 10pF, TA = -40NC to +125NC,
unless otherwise noted. Typical values are at TA = +25NC.) (Note 1)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
POWER SUPPLY
Positive Supply Voltage
Digital I/O Supply Voltage
Positive Supply Current
(Full-Power Mode)
Positive Supply Current
(Full-Power Mode), No Clock
VDD
2.2
3.6
V
VOVDD
1.5
VDD
V
IVDD
VAIN_ = VGND
1.67
IOVDD
VAIN_ = VGND
0.1
IVDD
Power-Down Current
IPD
Line Rejection
1.5
Leakage only
1.3
VDD = 2.2V to 3.6V, VREF = 2.2V
0.17
mA
mA
10
FA
LSB/V
TIMING CHARACTERISTICS (Note 2)
Quiet Time
tQ
(Note 3)
4
ns
CS Pulse Width
t1
(Note 3)
10
ns
CS Fall to SCLK Setup
t2
(Note 3)
5
ns
CS Falling Until DOUT HighImpedance Disabled
t3
(Note 3)
1
ns
Data Access Time After SCLK
Falling Edge (Figure 2)
t4
SCLK Pulse Width Low
t5
Percentage of clock period (Note 3)
40
60
%
SCLK Pulse Width High
t6
Percentage of clock period (Note 3)
40
60
%
Data Hold Time From SCLK
Falling Edge
t7
Figure 3
5
SCLK Falling Until DOUT High
Impedance
t8
Figure 4 (Note 3)
Power-Up Time
VOVDD = 2.2V to 3.6V
15
VOVDD = 1.5V to 2.2V
16.5
ns
ns
2.5
Conversion cycle (Note 3)
14
ns
1
Cycle
ELECTRICAL CHARACTERISTICS (MAX11663)
(VDD = 2.2V to 3.6V. fSCLK = 8MHz, 50% duty cycle, 500ksps. CDOUT = 10pF, TA = -40NC to +125NC, unless otherwise noted. Typical
values are at TA = +25NC.) (Note 1)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Q0.5
LSB
DC ACCURACY
Resolution
10
Integral Nonlinearity
INL
Differential Nonlinearity
DNL
Offset Error
OE
Gain Error
GE
Total Unadjusted Error
TUE
Bits
No missing codes
Excluding offset and reference errors
Q0.5
LSB
Q0.3
Q1.3
LSB
Q0.15
Q1.3
LSB
Q1
8 _______________________________________________________________________________________
LSB
500ksps, Low-Power,
Serial 12-/10-/8-Bit ADCs
(VDD = 2.2V to 3.6V. fSCLK = 8MHz, 50% duty cycle, 500ksps. CDOUT = 10pF, TA = -40NC to +125NC, unless otherwise noted. Typical
values are at TA = +25NC.) (Note 1)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
DYNAMIC PERFORMANCE (fAIN = 250kHz)
Signal-to-Noise and Distortion
SINAD
60.5
61.5
Signal-to-Noise Ratio
SNR
60.5
61.5
Total Harmonic Distortion
THD
Spurious-Free Dynamic Range
SFDR
Intermodulation Distortion
IMD
-85
dB
dB
-73
75
f1 = 239.8kHz, f2 = 200.2kHz
dB
dB
-82
dB
Full-Power Bandwidth
-3dB point
40
MHz
Full-Linear Bandwidth
SINAD > 60dB
2.5
MHz
45
MHz
Small-Signal Bandwidth
CONVERSION RATE
Throughput
5
Conversion Time
500
1.56
Acquisition Time
tACQ
Aperture Delay
Fs
52
ns
4
From CS falling edge
Aperture Jitter
ns
15
Serial Clock Frequency
ksps
ps
fCLK
0.08
8
MHz
Input Voltage Range
VAIN
0
VDD
V
Input Leakage Current
IILA
Q1
FA
ANALOG INPUT (AIN)
Input Capacitance
CAIN
0.002
Track
20
Hold
4
pF
DIGITAL INPUTS (SCLK, CS, CHSEL)
Digital Input High Voltage
VIH
Digital Input Low Voltage
VIL
Digital Input Hysteresis
0.75 x
VVDD
0.25 x
VVDD
0.15 x
VVDD
VHYST
Digital Input Leakage Current
IIL
Digital Input Capacitance
CIN
V
Inputs at GND or VDD
0.001
2
V
V
Q1
FA
pF
_______________________________________________________________________________________ 9
MAX11661–MAX11666
ELECTRICAL CHARACTERISTICS (MAX11663) (continued)
MAX11661–MAX11666
500ksps, Low-Power,
Serial 12-/10-/8-Bit ADCs
ELECTRICAL CHARACTERISTICS (MAX11663) (continued)
(VDD = 2.2V to 3.6V. fSCLK = 8MHz, 50% duty cycle, 500ksps. CDOUT = 10pF, TA = -40NC to +125NC, unless otherwise noted. Typical
values are at TA = +25NC.) (Note 1)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
DIGITAL OUTPUT (DOUT)
Output High Voltage
VOH
ISOURCE = 200µA
Output Low Voltage
VOL
ISINK = 200µA
High-Impedance Leakage
Current
IOL
High-Impedance Output
Capacitance
0.85 x
VVDD
COUT
V
0.15 x
VVDD
V
Q1.0
FA
4
pF
POWER SUPPLY
Positive Supply Voltage
VDD
Positive Supply Current
(Full-Power Mode)
IVDD
Positive Supply Current
(Full-Power Mode), No Clock
IVDD
Power-Down Current
IPD
Line Rejection
2.2
VAIN = VGND
3.6
V
1.76
mA
1.48
Leakage only
1.3
VDD = 2.2V to 3.6V
0.17
mA
10
FA
LSB/V
TIMING CHARACTERISTICS (Note 2)
Quiet Time
tQ
(Note 3)
4
ns
CS Pulse Width
t1
(Note 3)
10
ns
CS Fall to SCLK Setup
t2
(Note 3)
5
ns
CS Falling Until DOUT HighImpedance Disabled
t3
(Note 3)
1
ns
Data Access Time After SCLK
Falling Edge
t4
Figure 2, VDD = 2.2V to 3.6V
SCLK Pulse Width Low
t5
Percentage of clock period (Note 3)
SCLK Pulse Width High
t6
Data Hold Time From SCLK
Falling Edge
SCLK Falling Until DOUT High
Impedance
Power-Up Time
15
ns
40
60
%
Percentage of clock period (Note 3)
40
60
%
t7
Figure 3
5
t8
Figure 4 (Note 3)
2.5
Conversion cycle (Note 3)
10 �������������������������������������������������������������������������������������
ns
14
ns
1
Cycle
500ksps, Low-Power,
Serial 12-/10-/8-Bit ADCs
(VDD = 2.2V to 3.6V, VREF = VDD, VOVDD = VDD, fSCLK = 8MHz, 50% duty cycle, 500ksps, CDOUT = 10pF, TA = -40NC to +125NC,
unless otherwise noted. Typical values are at TA = +25NC.) (Note 1)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Q0.25
LSB
DC ACCURACY
Resolution
8
Integral Nonlinearity
INL
Differential Nonlinearity
DNL
Offset Error
No missing codes
OE
Gain Error
GE
Total Unadjusted Error
TUE
Bits
Excluding offset and reference errors
Q0.25
LSB
0.45
Q0.8
LSB
0
Q0.25
LSB
0.5
LSB
Channel-to-Channel Offset
Matching
0.01
LSB
Channel-to-Channel Gain
Matching
0.01
LSB
DYNAMIC PERFORMANCE (fAIN = 250kHz)
Signal-to-Noise and Distortion
Signal-to-Noise Ratio
SINAD
49
49.7
dB
SNR
49
49.7
dB
Total Harmonic Distortion
THD
Spurious-Free Dynamic Range
SFDR
Intermodulation Distortion
IMD
-75
63
-67
67
dB
dB
f1 = 239.8kHz, f2 = 200.2kHz
-65
dB
Full-Power Bandwidth
-3dB point
40
MHz
Full-Linear Bandwidth
SINAD > 49dB
2.5
MHz
Small-Signal Bandwidth
45
MHz
Crosstalk
-90
dB
CONVERSION RATE
Throughput
5
Conversion Time
500
1.56
Acquisition Time
tACQ
Aperture Delay
Fs
52
ns
4
From CS falling edge
Aperture Jitter
ns
15
Serial-Clock Frequency
fCLK
0.08
VAIN_
0
ksps
ps
8
MHz
ANALOG INPUT (AIN1, AIN2)
Input Voltage Range
Input Leakage Current
Input Capacitance
IILA
CAIN_
0.002
Track
20
Hold
4
VREF
V
Q1
FA
pF
EXTERNAL REFERENCE INPUT (REF)
Reference Input Voltage Range
Reference Input Leakage Current
Reference Input Capacitance
VREF
IILR
CREF
1
Conversion stopped
0.005
5
VDD +
0.05
V
Q1
FA
pF
______________________________________________________________________________________ 11
MAX11661–MAX11666
ELECTRICAL CHARACTERISTICS (MAX11662)
MAX11661–MAX11666
500ksps, Low-Power,
Serial 12-/10-/8-Bit ADCs
ELECTRICAL CHARACTERISTICS (MAX11662) (continued)
(VDD = 2.2V to 3.6V, VREF = VDD, VOVDD = VDD, fSCLK = 8MHz, 50% duty cycle, 500ksps, CDOUT = 10pF, TA = -40NC to +125NC,
unless otherwise noted. Typical values are at TA = +25NC.) (Note 1)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
DIGITAL INPUTS (SCLK, CS)
Digital Input High Voltage
VIH
Digital Input Low Voltage
VIL
Digital Input Hysteresis
0.75 x
VOVDD
0.25 x
VOVDD
0.15 x
VOVDD
VHYST
Digital Input Leakage Current
IIL
Digital Input Capacitance
CIN
V
Inputs at GND or VDD
0.001
V
V
Q1
2
FA
pF
DIGITAL OUTPUT (DOUT)
Output High Voltage
VOH
ISOURCE = 200µA (Note 3)
Output Low Voltage
VOL
ISINK = 200µA (Note 3)
High-Impedance Leakage
Current
High-Impedance Output
Capacitance
POWER SUPPLY
Positive Supply Current
(Full-Power Mode)
Positive Supply Current
(Full-Power Mode), No Clock
Power-Down Current
V
IOL
COUT
Positive Supply Voltage
Digital I/O Supply Voltage
0.85 x
VOVDD
0.15 x
VOVDD
V
Q1.0
FA
4
VDD
2.2
VOVDD
1.5
pF
3.6
V
VDD
V
IVDD
VAIN_ = VGND
1.67
IOVDD
VAIN_ = VGND
0.1
IVDD
IPD
Line Rejection
1.5
Leakage only
1.3
VDD = 2.2V to 3.6V, VREF = 2.2V
0.17
mA
mA
10
FA
LSB/V
TIMING CHARACTERISTICS (Note 2)
Quiet Time
tQ
(Note 3)
4
ns
CS Pulse Width
t1
(Note 3)
10
ns
CS Fall to SCLK Setup
CS Falling Until DOUT HighImpedance Disabled
t2
(Note 3)
5
ns
t3
(Note 3)
1
ns
VOVDD = 2.2V to 3.6V (Note 3)
15
VOVDD = 1.5V to 2.2V (Note 3)
16.5
Data Access Time After SCLK
Falling Edge (Figure 2)
t4
SCLK Pulse Width Low
t5
Percentage of clock period
40
60
%
SCLK Pulse Width High
Data Hold Time From SCLK
Falling Edge
SCLK Falling Until DOUT High
Impedance
Power-Up Time
t6
Percentage of clock period
40
60
%
t7
Figure 3
5
t8
Figure 4 (Note 3)
2.5
Conversion cycle (Note 3)
12 �������������������������������������������������������������������������������������
ns
ns
14
ns
1
Cycle
500ksps, Low-Power,
Serial 12-/10-/8-Bit ADCs
(VDD = 2.2V to 3.6V. fSCLK = 8MHz, 50% duty cycle, 500ksps. CDOUT = 10pF, TA = -40NC to +125NC, unless otherwise noted. Typical
values are at TA = +25NC.) (Note 1)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
DC ACCURACY
Resolution
8
Integral Nonlinearity
INL
Differential Nonlinearity
DNL
Offset Error
OE
Gain Error
GE
Total Unadjusted Error
TUE
Bits
Q0.25
LSB
Q0.25
LSB
Q0.45
Q0.8
LSB
Q0.04
Q0.5
LSB
No missing codes
Excluding offset and reference errors
Q0.75
LSB
dB
DYNAMIC PERFORMANCE (fAIN = 250kHz)
Signal-to-Noise and Distortion
SINAD
49
49.5
Signal-to-Noise Ratio
SNR
49
49.5
Total Harmonic Distortion
THD
Spurious-Free Dynamic Range
SFDR
Intermodulation Distortion
IMD
-70
63
dB
-67
66
dB
dB
f1 = 239.8kHz, f2 = 200.2kHz
-65
dB
Full-Power Bandwidth
-3dB point
40
MHz
Full-Linear Bandwidth
SINAD > 49dB
2.5
MHz
45
MHz
Small-Signal Bandwidth
CONVERSION RATE
Throughput
5
Conversion Time
500
1.56
Acquisition Time
tACQ
Aperture Delay
Aperture Jitter
Serial-Clock Frequency
Fs
52
From CS falling edge
fCLK
0.08
Input Voltage Range
VAIN
0
Input Leakage Current
IILA
Input Capacitance
CAIN
ksps
ns
4
ns
15
ps
8
MHz
ANALOG INPUT (AIN)
0.002
Track
20
Hold
4
VDD
V
Q1
FA
pF
DIGITAL INPUTS (SCLK, CS)
Digital Input High Voltage
VIH
Digital Input Low Voltage
VIL
Digital Input Hysteresis
0.75 x
VVDD
0.25 x
VVDD
0.15
VVDD
VHYST
Digital Input Leakage Current
IIL
Digital Input Capacitance
CIN
V
Inputs at GND or VDD
0.001
2
V
V
Q1
FA
pF
______________________________________________________________________________________ 13
MAX11661–MAX11666
ELECTRICAL CHARACTERISTICS (MAX11661)
MAX11661–MAX11666
500ksps, Low-Power,
Serial 12-/10-/8-Bit ADCs
ELECTRICAL CHARACTERISTICS (MAX11661) (continued)
(VDD = 2.2V to 3.6V. fSCLK = 8MHz, 50% duty cycle, 500ksps. CDOUT = 10pF, TA = -40NC to +125NC, unless otherwise noted. Typical
values are at TA = +25NC.) (Note 1)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
DIGITAL OUTPUT (DOUT)
Output High Voltage
VOH
ISOURCE = 200µA
Output Low Voltage
VOL
ISINK = 200µA
High-Impedance Leakage
Current
IOL
High-Impedance Output
Capacitance
0.85 x
VVDD
COUT
V
0.15 x
VVDD
V
Q1.0
FA
4
pF
POWER SUPPLY
Positive Supply Voltage
VDD
Positive Supply Current
(Full-Power Mode)
IVDD
Positive Supply Current
(Full-Power Mode), No Clock
IVDD
Power-Down Current
IPD
Line Rejection
2.2
VAIN = VGND
3.6
V
1.76
mA
1.48
Leakage only
1.3
VDD = 2.2V to 3.6V
0.17
mA
10
FA
LSB/V
TIMING CHARACTERISTICS (Note 2)
Quiet Time
tQ
(Note 3)
4
ns
CS Pulse Width
t1
(Note 3)
10
ns
CS Fall to SCLK Setup
t2
(Note 3)
5
ns
CS Falling Until DOUT HighImpedance Disabled
t3
(Note 3)
1
ns
Data Access Time After SCLK
Falling Edge
t4
Figure 2, VDD = 2.2V to 3.6V
SCLK Pulse Width Low
t5
Percentage of clock period (Note 3)
SCLK Pulse Width High
t6
Percentage of clock period (Note 3)
Data Hold Time From SCLK
Falling Edge
t7
Figure 3
5
SCLK Falling Until DOUT High
Impedance
t8
Figure 4 (Note 3)
Power-Up Time
15
ns
40
60
%
40
60
%
2.5
Conversion cycle (Note 3)
Note 1: Limits at TA = -40NC are guaranteed by design and not production tested.
Note 2: All timing specifications given are with a 10pF capacitor.
Note 3: Guaranteed by design in characterization; not production tested.
14 �������������������������������������������������������������������������������������
ns
14
ns
1
Cycle
500ksps, Low-Power,
Serial 12-/10-/8-Bit ADCs
SAMPLE
t1
t6
CS
t5
t2
SCLK
DOUT
16
1
2
0
HIGH
IMPEDANCE
3
D11
4
D10
5
D9
6
7
D8
D7
8
D6
9
10
D5
D4
11
D3
12
D2
13
D1
14
D0
15
0
0
(MSB)
t3
t4
16
t7
1
HIGH
IMPEDANCE
t8 tQUIET
tCONVERT
tACQ
1/fSAMPLE
Figure 1. Interface Signals for Maximum Throughput, 12-Bit Devices
t7
t4
SCLK
SCLK
VIH
DOUT
OLD DATA
NEW DATA
VIL
VIH
DOUT
OLD DATA
NEW DATA
VIL
Figure 3. Hold Time After SCLK Falling Edge
Figure 2. Setup Time After SCLK Falling Edge
t8
SCLK
DOUT
HIGH IMPEDANCE
Figure 4. SCLK Falling Edge DOUT Three-State
______________________________________________________________________________________ 15
MAX11661–MAX11666
SAMPLE
Typical Operating Characteristics
(MAX11665AUT+, TA = +25°C, unless otherwise noted.)
SOT23 TYPICAL OPERATING CHARACTERISTICS
DIFFERENTIAL NONLINEARITY (DNL)
vs. OUTPUT CODE
-0.5
OFFSET ERROR (LSB)
0
3
MAX11661 toc02
0.5
DNL (LSB)
0.5
OFFSET ERROR vs. TEMPERATURE
1.0
MAX11661 toc01
1.0
0
MAX11661 toc03
INTEGRAL NONLINEARITY (INL)
vs. OUTPUT CODE
INL (LSB)
2
1
-0.5
-1.0
-1.0
1000
0
2000
3000
4000
0
DIGITAL OUTPUT CODE (DECIMAL)
1000
2000
3000
0
4000
-40 -25 -10 5 20 35 50 65 80 95 110 125
DIGITAL OUTPUT CODE (DECIMAL)
TEMPERATURE (°C)
SIGNAL-TO-NOISE RATIO (SNR)
vs. ANALOG INPUT FREQUENCY
GAIN ERROR vs. TEMPERATURE
MAX11661 toc05
1
74
SNR (dB)
GAIN ERROR (LSB)
76
MAX11661 toc04
2
0
72
-1
-2
70
-40 -25 -10 5 20 35 50 65 80 95 110 125
0
50
100
150
200
250
TEMPERATURE (°C)
fIN (kHz)
THD vs. ANALOG INPUT FREQUENCY
SPURIOUS-FREE DYNAMIC RANGE (SFDR)
vs. ANALOG INPUT FREQUENCY
MAX11661 toc07
95
MAX11661 toc06
-70
93
SFDR (dB)
-80
THD (dB)
MAX11661–MAX11666
500ksps, Low-Power,
Serial 12-/10-/8-Bit ADCs
91
89
-90
87
85
-100
0
50
100
150
fIN (kHz)
200
250
0
50
100
150
fIN (kHz)
16 �������������������������������������������������������������������������������������
200
250
500ksps, Low-Power,
Serial 12-/10-/8-Bit ADCs
SOT23 TYPICAL OPERATING CHARACTERISTICS
SIGNAL-TO-NOISE AND DISTORTION RATIO
(SINAD) vs. ANALOG INPUT FREQUENCY
SINAD (dB)
72
fIN = 99.4kHz
fS = 500ksps
VDD = 3V
-20
MAGNITUDE (dB)
74
MAX11661 toc09
100kHz SINE-WAVE INPUT
0
MAX11661 toc08
76
-40
-60
AHD2 = - 88dB
-80
-100
70
-120
50
0
100
150
200
250
50
100
150
200
FREQUENCY (kHz)
SUPPLY CURRENT vs. TEMPERATURE
SIGNAL-TO-NOISE RATIO (SNR)
vs. SUPPLY VOLTAGE (VDD)
74
1.4
SNR (dB)
VDD = 3V
VDD = 2.2V
1.3
250
MAX11661 toc11
VDD = 3.6V
1.5
75
MAX11661 toc10
1.6
73
72
1.2
71
-40 -25 -10 5 20 35 50 65 80 95 110 125
2.2
2.4
2.6
TEMPERATURE (°C)
2.8
3.0
3.2
3.4
3.6
VDD (V)
THD vs. INPUT RESISTANCE
HISTOGRAM FOR 30,000 CONVERSIONS
-75
MAX11661 toc12
35,000
30,000
MAX11661 toc13
IVDD (mA)
0
fIN (kHz)
fS = 500ksps
fIN = 250kHz
-80
THD (dB)
CODE COUNT
25,000
20,000
15,000
-85
-90
10,000
-95
5000
-100
0
2046
2047
2048
2049
DIGITAL CODE OUTPUT
2050
0
20
40
60
80
100
RIN (I)
______________________________________________________________________________________ 17
MAX11661–MAX11666
Typical Operating Characteristics (continued)
(MAX11665AUT+, TA = +25°C, unless otherwise noted.)
500ksps, Low-Power,
Serial 12-/10-/8-Bit ADCs
MAX11661–MAX11666
Pin Configurations
TOP VIEW
AIN1
1
AIN2
2
AGND
3
REF
4
VDD
5
TOP VIEW
+
MAX11662
MAX11664
MAX11666
EP*
10
SCLK
9
DOUT
8
OVDD
7
CHSEL
6
CS
VDD 1 +
GND 2
MAX11661
MAX11663
MAX11665
AIN 3
µMAX
6
CS
5
DOUT
4
SCLK
SOT23
*CONNECT EP TO GROUND PLANE. DEVICES DO NOT OPERATE WHEN EP IS NOT CONNECTED TO GROUND!
Pin Description
PIN
NAME
FUNCTION
µMAX
SOT23
1
—
AIN1
Analog Input Channel 1. Single-ended analog input with respect to AGND with range of 0V to
VREF.
2
—
AIN2
Analog Input Channel 2. Single-ended analog input with respect to AGND with range of 0V to
VREF.
—
3
AIN
Analog Input Channel. Single-ended analog input with respect to GND with range of 0V to VDD.
—
2
GND
Ground. Connect GND to the GND ground plane.
3
—
AGND
4
—
REF
External Reference Input. REF defines the signal range of the input signal AIN1/AIN2: 0V to VREF.
The range of VREF is 1V to VDD. Bypass REF to AGND with 10FF || 0.1FF capacitor.
5
1
VDD
Positive Supply Voltage. Bypass VDD with a 10FF || 0.1FF capacitor to GND. VDD range is 2.2V
to 3.6V. For the SOT23 package, VDD also defines the signal range of the input signal AIN: 0V to
VDD.
6
6
CS
Active-Low Chip-Select Input. The falling edge of CS samples the analog input signal, starts a
conversion, and frames the serial-data transfer.
7
—
CHSEL
Channel Select. Set CHSEL high to select AIN2 for conversion. Set CHSEL low to select AIN1 for
conversion.
8
—
OVDD
Digital Interface Supply for SCLK, CS, DOUT, and CHSEL. The OVDD range is 1.5V to VDD.
Bypass OVDD with a 10FF || 0.1FF capacitor to GND.
9
5
DOUT
Three-State Serial-Data Output. ADC conversion results are clocked out on the falling edge of
SCLK, MSB first. See Figure 1.
10
4
SCLK
Serial-Clock Input. SCLK drives the conversion process. DOUT is updated on the falling edge of
SCLK. See Figures 2 and 3.
—
—
EP
Analog Ground. Connect AGND directly the GND ground plane.
Exposed Pad (µMAX Only). Connect EP directly to a solid ground plane. Devices do not operate
when EP is not connected to ground!
18 �������������������������������������������������������������������������������������
500ksps, Low-Power,
Serial 12-/10-/8-Bit ADCs
VDD
CS
SCLK
CONTROL
LOGIC
SAR
OVDD
VDD
MAX11662
MAX11664
MAX11666
OUTPUT
BUFFER
CS
SCLK
DOUT
CONTROL
LOGIC
MAX11661
MAX11663
MAX11665
OUTPUT
BUFFER
SAR
DOUT
CHSEL
AIN1
AIN2
AIN
MUX
CDAC
CDAC
VREF = VDD
REF
AGND
GND (EP)
GND
Typical Operating Circuit
VDD
OVDD
VOVDD
+3V
AIN1
ANALOG
INPUTS
AIN2
MAX11662
MAX11664
MAX11666
AGND
SCK
CPU
DOUT
REF
+2.5V
SCLK
CS
MISO
SS
CHSEL
GND (EP)
VDD
+3V
GND
ANALOG
INPUT
AIN
MAX11661
MAX11663
MAX11665
SCLK
SCK
DOUT
MISO
CS
CPU
SS
______________________________________________________________________________________ 19
MAX11661–MAX11666
Functional Diagrams
MAX11661–MAX11666
500ksps, Low-Power,
Serial 12-/10-/8-Bit ADCs
Detailed Description
throughput rates. The wake-up and power-down feature
is controlled by using the SPI interface as described in
the Operating Modes section.
The MAX11661–MAX11666 are fast, 12-/10-/8-bit, lowpower, single-supply ADCs. The devices operate from
a 2.2V to 3.6V supply and consume only 2.98mW
(VDD = 2.2V) or 4.37mW (VDD = 3V). These devices
are capable of sampling at full rate when driven by
an 8MHz clock. The dual-channel devices provide a
separate digital supply input (OVDD) to power the digital interface enabling communication with 1.5V, 1.8V,
2.5V, or 3V digital systems.
Serial Interface
The devices feature a 3-wire serial interface that directly
connects to SPI, QSPI, and MICROWIRE devices without
external logic. Figures 1 and 5 show the interface signals for a single conversion frame to achieve maximum
throughput.
The falling edge of CS defines the sampling instant.
Once CS transitions low, the external clock signal
(SCLK) controls the conversion.
The conversion result appears at DOUT, MSB first, with a
leading zero followed by the 12-bit, 10-bit, or 8-bit result.
A 12-bit result is followed by two trailing zeros, a 10-bit
result is followed by four trailing zeros, and an 8-bit result
is followed by six trailing zeros. See Figures 1 and 5.
The SAR core successively extracts binary-weighted bits
in every clock cycle. The MSB appears on the data bus
during the 2nd clock cycle with a delay outlined in the
timing specifications. All extracted data bits appear successively on the data bus with the LSB appearing during
the 13th/11th/9th clock cycle for 12-/10-/8-bit operation.
The serial data stream of conversion bits is preceded by
a leading “zero” and succeeded by trailing “zeros.” The
data output (DOUT) goes into a high-impedance state
during the 16th clock cycle.
The dual-channel devices feature a dedicated reference input (REF). The input signal range for AIN1/AIN2
is defined as 0V to VREF with respect to AGND. The
single-channel devices use VDD as the reference. The
input signal range of AIN is defined as 0V to VDD with
respect to GND.
These ADCs include a power-down feature allowing
minimized power consumption at 2.5FA/ksps for lower
SAMPLE
SAMPLE
CS
SCLK
DOUT
16
1
2
D9
0
HIGH
IMPEDANCE
3
4
D8
5
D7
6
D6
7
D5
8
D4
9
D3
10
D2
11
D1
12
D0
13
0
14
0
15
0
16
1
0
HIGH
IMPEDANCE
SAMPLE
SAMPLE
CS
SCLK
DOUT
16
HIGH
IMPEDANCE
1
2
0
3
D7
4
D6
5
D5
6
D4
7
D3
8
D2
9
D1
10
D0
11
0
12
0
13
0
14
0
15
0
Figure 5. 10-/8-Bit Timing Diagrams
20 �������������������������������������������������������������������������������������
16
0
HIGH
IMPEDANCE
1
500ksps, Low-Power,
Serial 12-/10-/8-Bit ADCs
The source impedance of the external driving stage in
conjunction with the sampling switch resistance affects
the settling performance. The THD vs. Input Resistance
graph in the Typical Operating Characteristics shows
THD sensitivity as a function of the signal source impedance. Keep the source impedance at a minimum for
high-dynamic-performance applications. Use a highperformance op amp such as the MAX4430 to drive the
analog input, thereby decoupling the signal source and
the ADC.
Analog Input
The devices produce a digital output that corresponds to
the analog input voltage within the specified operating
range of 0V to VREF for the dual-channel devices and 0V
to VDD for the single-channel devices.
While the ADC is in conversion mode, the sampling
switch is open presenting a pin capacitance, CP (CP
= 5pF), to the driving stage. See the Applications
Information section for information on choosing an
appropriate buffer for the ADC.
Figure 6 shows an equivalent circuit for the analog input
AIN (for single-channel devices) and AIN1/AIN2 (for
dual-channel devices). Internal protection diodes D1/D2
confine the analog input voltage within the power rails
(VDD, GND). The analog input voltage can swing from
GND - 0.3V to VDD + 0.3V without damaging the device.
ADC Transfer Function
The output format is straight binary. The code transitions midway between successive integer LSB values
such as 0.5 LSB, 1.5 LSB, etc. The LSB size for singlechannel devices is VDD/2n and for dual-channel devices
is VREF/2n, where n is the resolution. The ideal transfer
characteristic is shown in Figure 10.
The electric load presented to the external stage driving the analog input varies depending on which mode
the ADC is in: track mode vs. conversion mode. In track
mode, the internal sampling capacitor CS (16pF) has to
be charged through the resistor R (R = 50I) to the input
voltage. For faithful sampling of the input, the capacitor
voltage on CS has to settle to the required accuracy during the track time.
VDD
SWITCH CLOSED IN TRACK MODE
SWITCH OPEN IN CONVERSION MODE
D1
Normal Mode
In normal mode, the devices are powered up at all times,
thereby achieving their maximum throughput rates.
Figure 7 shows the timing diagram of these devices in
normal mode. The falling edge of CS samples the analog
input signal, starts a conversion, and frames the serialdata transfer.
CS
R
AIN1/AIN2
AIN
CP
Operating Modes
The ICs offer two modes of operation: normal mode and
power-down mode. The logic state of the CS signal
during a conversion activates these modes. The powerdown mode can be used to optimize power dissipation
with respect to sample rate.
D2
Figure 6. Analog Input Circuit
KEEP CS LOW UNTIL AFTER THE 10TH SCLK FALLING EDGE
PULL CS HIGH AFTER THE 10TH SCLK FALLING EDGE
CS
SCLK
DOUT
1
2
3
4
5
6
7
8
VALID DATA
HIGH
IMPEDANCE
9
10
11
12
13
14
15
16
HIGH
IMPEDANCE
Figure 7. Normal Mode
______________________________________________________________________________________ 21
MAX11661–MAX11666
To sustain the maximum sample rate, all devices have to
be resampled immediately after the 16th clock cycle. For
lower sample rates, the CS falling edge can be delayed
leaving DOUT in a high-impedance condition. Pull CS
high after the 10th SCLK falling edge (see the Operating
Modes section).
MAX11661–MAX11666
500ksps, Low-Power,
Serial 12-/10-/8-Bit ADCs
PULL CS HIGH AFTER THE 2ND AND BEFORE THE 10TH SCLK FALLING EDGE
CS
SCLK
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
DOUT
HIGH
IMPEDANCE
INVALID
DATA
INVALID DATA OR HIGH IMPEDANCE
HIGH IMPEDANCE
Figure 8. Entering Power-Down Mode
CS
1
SCLK
2
3
4
DOUT
5
6
7
8
9
10
11
12
13
14
15
16
INVALID DATA (DUMMY CONVERSION)
HIGH
IMPEDANCE
N
1
HIGH
IMPEDANCE
2
3
4
5
6
7
8
9
10
11
12
VALID DATA
13
14
15
16
HIGH
IMPEDANCE
Figure 9. Exiting Power-Down Mode
OUTPUT CODE
However, pulling CS high before the 10th SCLK falling
edge terminates the conversion, DOUT goes into highimpedance mode, and the device enters power-down
mode. See Figure 8.
FS - 1.5 x LSB
111...111
Power-Down Mode
In power-down mode, all bias circuitry is shut down
drawing typically only 1.3FA of leakage current. To save
power, put the device in power-down mode between
conversions. Using the power-down mode between
conversions is ideal for saving power when sampling the
analog input infrequently.
111...110
111...101
000...010
000...001
000...000
0
1
2
3
2n-2 2n-1 2n
ANALOG
INPUT (LSB)
FULL SCALE (FS):
AIN1/AIN2 = REF (TDFN, µMAX)
AIN = VDD (SOT23)
n = RESOLUTION
Figure 10. ADC Transfer Function
To remain in normal mode, keep CS low until the falling
edge of the 10th SCLK cycle. Pulling CS high after the
10th SCLK falling edge keeps the part in normal mode.
Entering Power-Down Mode
To enter power-down mode, drive CS high between the
2nd and 10th falling edges of SCLK (see Figure 8). By
pulling CS high, the current conversion terminates and
DOUT enters high impedance.
Exiting Power-Down Mode
To exit power-down mode, implement one dummy conversion by driving CS low for at least 10 clock cycles
(see Figure 9). The data on DOUT is invalid during this
dummy conversion. The first conversion following the
dummy cycle contains a valid conversion result.
The power-up time equals the duration of the dummy
cycle, and is dependent on the clock frequency. The
power-up time for 500ksps operation (8MHz SCLK) is 2Fs.
22 �������������������������������������������������������������������������������������
500ksps, Low-Power,
Serial 12-/10-/8-Bit ADCs
is never powered down. The user can also power down
the ADC between conversions by using the power-down
mode. Figure 12 shows for the 500ksps device that as
the sample rate is reduced, the device remains in the
power-down state longer and the average supply current (IVDD) drops accordingly.
SUPPLY CURRENT vs. SAMPLING RATE
SUPPLY CURRENT vs. SAMPLING RATE
2.0
1.5
VDD = 3V
fSCLK = VARIABLE
16 CYCLES/CONVERSIONS
1.5
VDD = 3V
fSCLK = 8MHz
IVDD (mA)
IVDD (mA)
1.0
1.0
0.5
0.5
0
0
0
100
200
300
400
500
SAMPLING RATE (ksps)
Figure 11. Supply Current vs. Sample Rate (Normal Operating
Mode)
0
20
40
60
80
100 120 140 160
SAMPLING RATE (ksps)
Figure 12. Supply Current vs. Sample Rate (Device Powered
Down Between Conversions)
______________________________________________________________________________________ 23
MAX11661–MAX11666
Supply Current vs. Sampling Rate
For applications requiring lower throughput rates, the
user can reduce the clock frequency (fSCLK) to lower
the sample rate. Figure 11 shows the typical supply
current (IVDD) as a function of sample rate (fS) for the
500ksps devices. The part operates in normal mode and
MAX11661–MAX11666
500ksps, Low-Power,
Serial 12-/10-/8-Bit ADCs
Applications Information
Dual-Channel Operation
The MAX11662/MAX11664/MAX11666 feature dual-input
channels. These devices use a channel-select (CHSEL)
input to select between analog input AIN1 (CHSEL = 0)
or AIN2 (CHSEL = 1). As shown in Figure 13, the CHSEL
signal is required to change between the 2nd and 12th
clock cycle within a regular conversion to guarantee
proper switching between channels.
Layout, Grounding, and Bypassing
For best performance, use PCBs with a solid ground
plane. Ensure that digital and analog signal lines are
separated from each other. Do not run analog and digital
(especially clock) lines parallel to one another or digital
lines underneath the ADC package. Noise in the VDD
power supply, OVDD, and REF affects the ADC’s performance. Bypass the VDD, OVDD, and REF to ground with
0.1FF and 10FF bypass capacitors. Minimize capacitor
lead and trace lengths for best supply-noise rejection.
14-Cycle Conversion Mode
The ICs can operate with 14 cycles per conversion.
Figure 14 shows the corresponding timing diagram.
Observe that DOUT does not go into high-impedance
mode. Also, observe that tACQ needs to be sufficiently
long to guarantee proper settling of the analog input
voltage. See the Electrical Characteristics table for tACQ
requirements and the Analog Input section for a description of the analog inputs.
Choosing an Input Amplifier
It is important to match the settling time of the input
amplifier to the acquisition time of the ADC. The conversion results are accurate when the ADC samples the
input signal for an interval longer than the input signal’s
worst-case settling time. By definition, settling time is
the interval between the application of an input voltage
step and the point at which the output signal reaches
CS
SCLK
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
CHSEL
DOUT
DATA CHANNEL AIN1
DATA CHANNEL AIN2
Figure 13. Channel Select Timing Diagram
SAMPLE
SAMPLE
CS
SCLK
DOUT
1
2
0
3
D11
4
D10
5
D9
6
D8
7
D7
8
D6
9
D5
10
D4
11
D3
12
D2
13
D1
(MSB)
14
D0
0
tACQ
1/fSAMPLE
tCONVERT
Figure 14. 14-Clock Cycle Operation
24 �������������������������������������������������������������������������������������
1
0
500ksps, Low-Power,
Serial 12-/10-/8-Bit ADCs
Figure 15 shows a typical application circuit. The
MAX4430, offering a settling time of 37ns at 16 bits, is
an excellent choice for this application. See the THD
vs. Input Resistance graph in the Typical Operating
Characteristics.
Choosing a Reference
For devices using an external reference, the choice of
the reference determines the output accuracy of the
ADC. An ideal voltage reference provides a perfect initial
accuracy and maintains the reference voltage independent of changes in load current, temperature, and time.
Considerations in selecting a reference include initial
voltage accuracy, temperature drift, current source,
sink capability, quiescent current, and noise. Figure 15
shows a typical application circuit using the MAX6126
to provide the reference voltage. The MAX6033 and
MAX6043 are also excellent choices.
+5V
10µF
0.1µF
VOVDD
3V
100pF C0G
VDD
500I
AIN1
500I
0.1µF
AIN1
470pF
C0G CAPACITOR
-5V
3
0.1µF
2
MAX11662
MAX11664
MAX11666
AIN2
0.1µF
470pF
C0G CAPACITOR
10µF
0.1µF
4
5
10I
1
MAX4430
VDC
SS
CPU
+5V
6
500I
4
MISO
EP
7
AIN2
DOUT
10µF
100pF C0G
500I
SCK
CHSEL
10µF
0.1µF
SCLK
CS
REF
+5V
10µF
AGND
10I
1
MAX4430
VDC
10µF
5
4
OVDD
3
OUTF
IN
2
1µF
OUTS
MAX6126
GNDS
GND
NR
0.1µF
1
0.1µF
-5V
3
2
0.1µF
10µF
Figure 15. Typical Application Circuit
______________________________________________________________________________________ 25
MAX11661–MAX11666
and stays within a given error band centered on the
resulting steady-state amplifier output level. The ADC
input sampling capacitor charges during the sampling
cycle, referred to as the acquisition period. During this
acquisition period, the settling time is affected by the
input resistance and the input sampling capacitance.
This error can be estimated by looking at the settling of
an RC time constant using the input capacitance and
the source impedance over the acquisition time period.
MAX11661–MAX11666
500ksps, Low-Power,
Serial 12-/10-/8-Bit ADCs
Definitions
Integral Nonlinearity
Integral nonlinearity (INL) is the deviation of the values
on an actual transfer function from a straight line. For
these devices, the straight line is a line drawn between
the end points of the transfer function after offset and
gain errors are nulled.
Differential Nonlinearity
Differential nonlinearity (DNL) is the difference between
an actual step width and the ideal value of 1 LSB. A DNL
error specification of ±1 LSB or less guarantees no missing codes and a monotonic transfer function.
Offset Error
The deviation of the first code transition (00 . . . 000) to
(00 . . . 001) from the ideal, that is, AGND + 0.5 LSB.
Gain Error
The deviation of the last code transition (111 . . . 110) to
(111 . . . 111) from the ideal after adjusting for the offset
error, that is, VREF - 1.5 LSB.
Signal-to-Noise Ratio and Distortion
(SINAD)
SINAD is a dynamic figure of merit that indicates the
converter’s noise and distortion performance. SINAD
is computed by taking the ratio of the RMS signal to
the RMS noise plus distortion. RMS noise plus distortion includes all spectral components to the Nyquist
frequency excluding the fundamental and the DC offset:
.


SIGNAL RMS
SINAD(dB)
= 20 × log 

NOISE + DISTORTION) RMS 
 (

Total Harmonic Distortion
Total harmonic distortion (THD) is the ratio of the RMS
sum of the first five harmonics of the input signal to the
fundamental itself. This is expressed as:


V 2 + V32 + V42 + V52 
THD
= 20 × log 2


V1


Aperture Jitter
where V1 is the fundamental amplitude and V2–V5 are
the amplitudes of the 2nd- through 5th-order harmonics.
Aperture Delay
SFDR is a dynamic figure of merit that indicates the lowest usable input signal amplitude. SFDR is the ratio of
the RMS amplitude of the fundamental (maximum signal
component) to the RMS value of the next largest spurious component, excluding DC offset. SFDR is specified
in decibels with respect to the carrier (dBc).
Aperture jitter (tAJ) is the sample-to-sample variation in
the time between the samples.
Aperture delay (tAD) is the time between the falling edge
of sampling clock and the instant when an actual sample
is taken.
Signal-to-Noise Ratio (SNR)
SNR is a dynamic figure of merit that indicates the converter’s noise performance. For a waveform perfectly
reconstructed from digital samples, the theoretical maximum SNR is the ratio of the full-scale analog input (RMS
value) to the RMS quantization error (residual error).
The ideal, theoretical minimum analog-to-digital noise
is caused by quantization error only and results directly
from the ADC’s resolution (N bits):
SNR (dB) (MAX) = (6.02 x N + 1.76) (dB)
In reality, there are other noise sources such as thermal
noise, reference noise, and clock jitter that also degrade
SNR. SNR is computed by taking the ratio of the RMS
signal to the RMS noise. RMS noise includes all spectral
components to the Nyquist frequency excluding the
fundamental, the first five harmonics, and the DC offset.
Spurious-Free Dynamic Range (SFDR)
Full-Power Bandwidth
Full-power bandwidth is the frequency at which the input
signal amplitude attenuates by 3dB for a full-scale input.
Full-Linear Bandwidth
Full-linear bandwidth is the frequency at which the
signal-to-noise ratio and distortion (SINAD) is equal to a
specified value.
Intermodulation Distortion
Any device with nonlinearities creates distortion products when two sine waves at two different frequencies
(f1 and f2) are applied into the device. Intermodulation
distortion (IMD) is the total power of the IM2 to IM5 intermodulation products to the Nyquist frequency relative to
the total input power of the two input tones, f1 and f2. The
individual input tone levels are at -6dBFS.
26 �������������������������������������������������������������������������������������
500ksps, Low-Power,
Serial 12-/10-/8-Bit ADCs
PROCESS: CMOS
Package Information
For the latest package outline information and land patterns
(footprints), go to www.maxim-ic.com/packages. Note that a
“+”, “#”, or “-” in the package code indicates RoHS status only.
Package drawings may show a different suffix character, but
the drawing pertains to the package regardless of RoHS status.
PACKAGE
TYPE
PACKAGE
CODE
OUTLINE
NO.
LAND
PATTERN
NO.
10 µMAX
U10E+3
21-0109
90-0148
6 SOT23
U6+1
21-0058
90-0175
______________________________________________________________________________________ 27
MAX11661–MAX11666
Chip Information
500ksps, Low-Power,
Serial 12-/10-/8-Bit ADCs
MAX11661–MAX11666
Revision History
REVISION
NUMBER
REVISION
DATE
0
11/10
Initial release
1
1/11
Released the MAX11663 and updated Figures 11 and 12.
1, 23
2
6/11
Released the MAX11662/MAX11664/MAX11666. Updated the Electrical
Characteristics.
1–14
3
11/11
Updated the Electrical Characteristics, Figures 13 and 15.
4
1/12
Updated Ordering Information.
1
5
4/12
Corrected the Aperture Delay in the Electrical Characteristics
3
DESCRIPTION
PAGES
CHANGED
—
4, 5, 6, 8, 10,
12, 14, 24, 25
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied.
Maxim reserves the right to change the circuitry and specifications without notice at any time. The parametric values (min and max limits) shown in the Electrical
Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance.
28
©
Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600
2012 Maxim Integrated Products
Maxim is a registered trademark of Maxim Integrated Products, Inc.
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