Maxim MAX2374 Sige, variable iip3, low-noise amplifier in ucsp package Datasheet

19-1614; Rev 0; 6/00
UAL
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FOLLO
SiGe, Variable IIP3, Low-Noise Amplifier
in UCSP Package
Features
♦ +2.7V to +5.5V Single Supply
♦ Low Operating Current
8.5mA for High Linearity
4.5mA for Paging
4.1mA in Low-Gain, High-Linearity Mode
♦ Low Noise Figure: 1.5dB Cellular
♦ Adjustable IIP3
♦ Two Gain Settings
♦ < 1µA Shutdown Mode
♦ Ultra-Small 6-Bump UCSP (1mm x 1.5mm)
The MAX2374 provides two gain modes. High-gain
mode optimizes system sensitivity, while low-gain mode
optimizes system linearity.
Ordering Information
Applications
CDMA Phones
PART
TEMP. RANGE
PINPACKAGE
MAX2374EBT
-40°C to +85°C
6 UCSP*
TDMA Phones
Wireless Local Loop (WLL)
TOP
MARK
AAB
*UCSP reliability is integrally linked to the user’s assembly
methods, circuit board material, and environment. Refer to the
UCSP Reliability Notice in the UCSP Reliability section of this
data sheet for more information.
GSM Handsets
Land Mobile Radio
Wireless Data
Pin Configuration appears at end of data sheet.
Typical Application Circuit
VCC = + 2.75V
100pF
A3
5pF
0.01µF
LNA INPUT
A2
VCC
GND
8.2nH
MAX2374
LNAIN
B3
LNAOUT
2pF
B2
LNA OUTPUT
VCC
A1
6.8nH
GAIN-CONTROL
LOGIC OUTPUT
GAIN
BIAS
B1
RBIAS
________________________________________________________________ Maxim Integrated Products
1
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MAX2374
General Description
The MAX2374 silicon-germanium (SiGe), switchablegain, variable-linearity, low-noise amplifier (LNA) is
designed for cellular-band, code-division multipleaccess (CDMA). It can be used for applications such
as TDMA and PDC or wherever high dynamic range
and low noise are required. This LNA provides a high
intermodulation intercept point (IIP3), which is
adjustable to meet specific system requirements by
selecting an appropriate external resistor. To achieve
high gain and low noise, the LNA is packaged in a tiny
ultra-chip-scale package (UCSP) with six solder
bumps. The LNA operates from a +2.7V to +5.5V single
supply and consumes just 8.5mA while achieving a
+6.2dBm input IIP3. Supply current reduces to less
than 1µA in shutdown mode.
MAX2374
SiGe, Variable IIP3, Low-Noise Amplifier
in UCSP Package
ABSOLUTE MAXIMUM RATINGS
VCC to GND ...........................................................-0.3V to +6.0V
GAIN, BIAS Voltage to GND...................-0.3V to (VCC + 0.3V)
GAIN, BIAS Current ......................................................±10mA
RF Input Power
LNAIN .........................................................................+10dBm
LNAOUT to GND ....................................-0.3V to (VCC + 0.6V)
Continuous Power Dissipation (TA = +85°C) ...................540mW
Operating Temperature Range
MAX2374 .........................................................-40°C to +85°C
Storage Temperature.........................................-65°C to +150°C
Junction Temperature ......................................................+150°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
DC ELECTRICAL CHARACTERISTICS
(VCC = +2.7V to +5.5V, RBIAS = 20kΩ, VGAIN = high, LNAOUT = VCC, no input signals at LNAIN, TA = -40°C to +85°C. Typical values
are at VCC = +2.75V, TA = +25°C, unless otherwise noted.) (Note 1)
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
5.5
V
VCC = 2.75V
8.5
10.5
VCC = 5.5V
10.5
SUPPLY
Supply Voltage
Supply Current
Shutdown Supply Current
2.7
mA
RBIAS = 10kΩ
15
RBIAS = 43kΩ
4.5
GAIN = 0.6V, VCC = 2.75V
4.5
5.5
BIAS = open circuit
0.1
1
µA
GAIN CONTROL INPUT
Input Logic Voltage High
1.5
V
Input Logic Voltage Low
Input Current
-5
0.6
V
5
µA
VCC 1.16
BIAS Pin Voltage (Note 2)
V
AC ELECTRICAL CHARACTERISTICS
(Typical Application Circuit, VCC = +2.7V to +5.5V, PLNAIN = -30dBm, VGAIN = high, fLNAIN = 881MHz, RBIAS = 20kΩ, TA = +25°C.
Typical values are at VCC = +2.75V, unless otherwise noted.) (Note 2)
PARAMETER
CONDITIONS
Recommended Operating Frequency
Range (Note 3)
Input and Output Return Loss
Reverse Isolation
TYP
750
Input and output ports externally matched to 50Ω
14
VGAIN = high
-20
VGAIN = low
-9
Output 1dB Compression
VCC = 2.75V
Maximum Stable Load VSWR
All modes, f ≤ 6.5GHz
2
MIN
VGAIN = high
6
VGAIN = low
-3.5
10:1
_______________________________________________________________________________________
MAX
UNITS
1000
MHz
dB
dB
dBm
SiGe, Variable IIP3, Low-Noise Amplifier
in UCSP Package
(Typical Application Circuit, VCC = +2.7V to +5.5V, PLNAIN = -30dBm, VGAIN = high, fLNAIN = 881MHz, RBIAS = 18kΩ, TA = +25°C.
Typical values are at VCC = +2.75V, unless otherwise noted.) (Note 2)
PARAMETER
CONDITIONS
MIN
TYP
MAX
TA = +25°C
13.8
15
15.6
TA = -40°C to +85°C
12.5
UNITS
HIGH-GAIN MODE (GAIN = VCC)
Gain
Noise Figure
VCC = 2.75V
1.5
RBIAS = 10kΩ
Input Third-Order Intercept Point (Note 4)
MAX2374
dB
17
1.7
dB
7.2
RBIAS = 20kΩ
4.5
dBm
6.2
RBIAS = 43kΩ
4.2
LOW-GAIN MODE (GAIN = GND)
Gain
TA = -40°C to +85°C
TA = +25°C
0.4
TA = -40°C to +85°C
-1
1.2
Noise Figure
3
RBIAS = 10kΩ
Input Third-Order Intercept Point (Note 4)
MAX2374
dB
3.5
dB
10.5
RBIAS = 20kΩ
5.8
dBm
7.2
RBIAS = 43kΩ
Note 1:
Note 2:
Note 3:
Note 4:
2
3.5
1
Production tested at TA = +25°C. Maximum and minimum limits are guaranteed by design and characterization.
Guaranteed by design and characterization.
Operation over this frequency range is possible with a matching network tuned to the desired operating frequency.
Measured with two-tone test with PLNAIN = -25dBm per tone, f1 = 881MHz, f2 = 881.9MHz.
Typical Operating Characteristics
(Typical Application Circuit, VCC = +2.7V to +5.5V, PLNAIN = -30dBm, fLNAIN = 881MHz, RBIAS = 20kΩ, TA = +25°C, unless otherwise noted.)
S21, S11, S22, S12 vs. FREQUENCY
S21, S11, S22, S12 vs. FREQUENCY
5
10
10
VCC = 2.75V
GAIN = GND
0
8
TA = -40°C
GAIN = VCC
TA = -40°C
TA = +85°C TA = +25°C
6
MAGNITUDE (dB)
S21
MAGNITUDE (dB)
ICC (mA)
VCC = GAIN = 2.75V
MAX2374-04
MAX2374-01
RBIAS = 20kΩ
TA = +85°C TA = +25°C
20
MAX2374-03
ICC vs. VCC AND TEMPERATURE
12
0
S22
S11
-10
S22
S21
-5
-10
S12
GAIN = GND
-20
-15
S11
S12
-30
4
2.5
3.0
3.5
4.0
VCC (V)
4.5
5.0
5.5
-20
750
800
850
900
FREQUENCY (MHz)
950
1000
750
800
850
900
950
1000
FREQUENCY (MHz)
_______________________________________________________________________________________
3
MAX2374
AC ELECTRICAL CHARACTERISTICS (continued)
Typical Operating Characteristics (continued)
(Typical Application Circuit, VCC = +2.7V to +5.5V, PLNAIN = -30dBm, fLNAIN = 881MHz, RBIAS = 20kΩ, TA = +25°C, unless otherwise noted.)
TA = +85°C
MAX2374-05
TA = -40°C
20
TA = +25°C
A
= VGAIN = GND
B
= VGAIN = VCC
15
15
TA = +85°C
10
IIP3 (dBm)
GAIN (dB)
GAIN = VCC
VCC = 2.75V
VCC = 2.75V,
f = 881MHz, 882MHz
MAX2374-06
IIP3 vs. RBIAS AND TEMPERATURE
GAIN vs. RBIAS AND TEMPERATURE
20
TA = +25°C
TA = -40°C
A
10
TA = -40°C
B
GAIN = GND
TA = +85°C
5
TA = +25°C
B
TA = +25°C
TA = +85°C
0
0
5
15
25
35
0
45
20
60
CURRENT vs. VOLTAGE AND RBIAS
NOISE FIGURE vs. FREQUENCY
20
MAX2374-07
4.5
4.0
RBIAS = 10kΩ, GAIN = VCC
15
3.5
40
RBIAS (kΩ)
RBIAS (kΩ)
MAX2374-08
TA = -40°C
5
VCC = 2.75V
RBIAS = 10kΩ, GAIN = GND
RBIAS = 20kΩ, GAIN = VCC
3.0
ICC (mA)
NOISE FIGURE (dB)
MAX2374
SiGe, Variable IIP3, Low-Noise Amplifier
in UCSP Package
2.5
2.0
10
RBIAS = 43kΩ, GAIN = VCC
5
GAIN = VCC
RBIAS = 20kΩ, GAIN = GND
1.5
RBIAS = 43kΩ, GAIN = GND
1.0
0
750
800
850
900
950
2.5
1000
FREQUENCY (MHz)
3.0
3.5
4.0
4.5
5.0
5.5
VCC (V)
Pin Description
4
PIN
NAME
FUNCTION
A3
GND
A2
LNAIN
LNA Input Port. Blocking capacitor is required, which may be used as part of the matching network.
A1
GAIN
Gain-Control Logic Input. Drive high for high-gain mode. Drive low for low-gain mode.
B1
BIAS
LNA Bias Setting Pin. For nominal bias, connect 20kΩ resistor to VCC. Adjust the resistor value to alter the
linearity of the LNA.
B2
LNAOUT
B3
VCC
Ground
LNA Output Port. This port requires an external pullup inductor, which may be used as part of the matching
network.
Supply Voltage Input. Bypass with a 100pF capacitor to GND.
_______________________________________________________________________________________
SiGe, Variable IIP3, Low-Noise Amplifier
in UCSP Package
MAX2374
Table 1a. S-Parameters (VCC = VGAIN = 2.75V)
FREQ (MHz)
S11
MAGNITUDE
50
0.929
250
S21
ANGLE
MAGNITUDE
-11.89
12.84
0.728
-49
500
0.571
S12
S22
ANGLE
MAGNITUDE
ANGLE
MAGNITUDE
-151.3
0.007
123.5
0.908
78.8
9.83
122.73
0.026
69
0.842
-20.2
-77.5
6.19
79.42
0.041
47.6
0.728
-54.8
ANGLE
750
0.524
-101
4.21
49.35
0.053
33.3
0.68
-81
1000
0.529
-123.7
3.12
24.18
0.06
21
0.671
-105
1250
0.568
-145.2
2.38
1
0.063
11.19
0.68
-128
1500
0.612
-165
1.77
-19.2
0.057
5.042
0.704
-150
1750
0.639
176
1.46
-35
0.061
15
0.732
-171
2000
0.652
163
1.07
-51
0.094
17
0.697
162
2250
0.664
149
1.01
-60.5
0.161
-12.9
0.626
158.7
2500
0.691
139
0.892
-77
0.1
-45.4
0.689
146.5
2750
0.716
125
0.781
-91.7
0.078
-37
0.693
128
3000
0.72
111.5
0.662
-104
0.074
-33.3
0.686
110
ANGLE
MAGNITUDE
ANGLE
Table 1b. S-Parameters (VCC = 2.75V, VGAIN = GND)
FREQ (MHz)
S11
S21
S12
MAGNITUDE
ANGLE
MAGNITUDE
ANGLE
MAGNITUDE
S22
50
0.987
-8.93
1.25
-148.7
0.01
127
0.374
85.8
250
0.916
-42.4
1.21
128.8
0.06
85.7
0.471
1.23
500
0.8
-77
1
72.4
0.14
52.2
0.596
-42
750
0.75
-106
0.772
28.18
0.189
19.6
0.659
-82
1000
0.754
-132.7
0.583
-6.87
0.2
-9.33
0.689
-117.3
1250
0.782
-158
0.429
-34.5
0.184
-30.7
0.694
-147.5
1500
0.803
180
0.301
-54
0.146
-47
0.695
-173
1750
0.811
159.5
0.228
-66
0.117
-53.4
0.681
164.6
2000
0.797
141.5
0.148
-66
0.096
-42.5
0.629
141.7
2250
0.739
126.3
0.196
-62
0.175
-47
0.534
140
2500
0.745
112
0.156
-89
0.123
-77.2
0.623
126.35
2750
0.701
92.4
0.096
-83
0.082
-63.3
0.6
103.2
3000
0.591
73
0.112
-73.48
0.103
-62.8
0.566
85.8
_______________________________________________________________________________________
5
SiGe, Variable IIP3, Low-Noise Amplifier
in UCSP Package
MAX2374
Pin Configuration
TOP VIEW
(BUMPS ON BOTTOM)
MAX2374
GND
A3
B3
VCC
LNAIN
A2
B2
LNAOUT
GAIN
A1
B1
BIAS
UCSP
Detailed Description
The MAX2374 SiGe LNA is packaged in a UCSP package in order to deliver high gain, high linearity, and low
noise in the smallest package possible. The special
feature of this LNA is that its linearity is adjusted by an
external resistor, RBIAS. The LNA has two digitally controllable gain modes to increase system dynamic
range. Digital high at GAIN selects the high-gain mode,
and digital low selects the low-gain mode.
Adjust the LNA bias current to control the amplifier’s linearity. The resistor RBIAS connected between BIAS and
VCC controls the LNA current. The amplifier’s linearity is
directly related to the operating current. Increasing the
bias current of the LNA increases the IIP3. VBIAS is
approximately constant at VCC - 1.16V. Connecting a
resistor from BIAS to VCC results in a supply current
that can be calculated as follows:
VCC = (High Gain) ~
– (150 - 1.16V) / RBIAS
IBIAS can be set by a fixed resistor to VCC as described
above, or it can be generated with a switched network.
To operate the LNA in high-gain/high-linearity mode,
set RBIAS = 20kΩ and drive GAIN high. Do this in the
presence of a transmit signal to minimize cross-modulation. To operate the LNA in low-gain/low-linearity
mode, set RBIAS = 43kΩ and drive GAIN high. This
mode draws less current and should be used in the
absence of a transmit signal (paging mode). Shutdown
of the IC is accomplished by switching RBIAS to open
circuit.
Layout Issues
Design the layout for the IC to be as compact as possible to minimize the parasitics. The chip-scale IC package uses a bump pitch of 0.5mm (19.7mil) and bump
diameter of 0.3mm (~12mil). Therefore, lay out the solder-pad spacing on 0.5mm (19.7mil) centers, using a
6
pad size of 0.25mm (~10mil) and a solder mask opening of 0.33mm (13mil). Round or square pads are permissible. Connect multiple vias from the ground plane
as close to the ground pins as possible.
Install capacitors as close as possible to the IC supply
voltage pin and supply end of the series inductor.
Place the ground end of these capacitors near the IC
GND pins to provide a low-impedance return path for
the signal current.
Prototype Chip Installation
Alignment keys on the PC board around the area where
the chip is located will be helpful in the prototype
assembly process. It is better to align the chip on the
board before any other components are placed, and
then place the board on a hot plate or hot surface until
the solder starts melting. Remove the board from the
hot plate without disturbing the position of the chip, and
let it cool down to room temperature before processing
the board further.
UCSP Reliability
The ultra-chip-scale package (UCSP) represents a
unique packaging form factor that may not perform
equally well as a packaged product through traditional
mechanical reliability tests. UCSP reliability is integrally
linked to the user’s assembly methods, circuit board
material, and usage environment. The user should
closely review these areas when considering use of a
UCSP package.
Performance through operating-life test and moisture
resistance remains uncompromised as it is primarily
determined by the wafer-fabrication process.
Mechanical stress performance is a greater consideration for UCSP packages. UCSPs are attached through
direct solder contact to the user’s PC board, foregoing
the inherent stress relief of a packaged product lead
frame. Solder joint contact integrity must be considered. Comprehensive reliability tests have been performed and are available upon request. In conclusion,
the UCSP performs reliably through environmental
stresses.
Marking Information
A A A
A A A
ORIENTATION
PRODUCT ID CODE
LOT CODE
Chip Information
TRANSISTOR COUNT: 296
_______________________________________________________________________________________
SiGe, Variable IIP3, Low-Noise Amplifier
in UCSP Package
6L,UCSP.EPS
_______________________________________________________________________________________
7
MAX2374
Package Information
MAX2374
SiGe, Variable IIP3, Low-Noise Amplifier
in UCSP Package
NOTES
8
_______________________________________________________________________________________