Maxim MAX3078EAPA 3.3v, â±15kv esd-protected, fail-safe, hot-swap, rs-485/rs-422 transceiver Datasheet

19-2668; Rev 1; 1/03
+3.3V, ±15kV ESD-Protected, Fail-Safe,
Hot-Swap, RS-485/RS-422 Transceivers
Features
♦ 3.3V Operation
The MAX3070E/MAX3071E/MAX3072E feature reduced
slew-rate drivers that minimize EMI and reduce reflections caused by improperly terminated cables, allowing
error-free data transmission up to 250kbps. The
MAX3073E/MAX3074E/MAX3075E also feature slewrate-limited drivers but allow transmit speeds up to
500kbps. The MAX3076E/MAX3077E/MAX3078E driver
slew rates are not limited, making transmit speeds up to
16Mbps possible. The MAX3079E slew rate is pin
selectable for 250kbps, 500kbps, and 16Mbps.
The MAX3072E/MAX3075E/MAX3078E are intended for
half-duplex communications, and the MAX3070E/
MAX3071E/MAX3073E/MAX3074E/MAX3076E/MAX307
7E are intended for full-duplex communications. The
MAX3079E is selectable for half-duplex or full-duplex
operation. It also features independently programmable
receiver and transmitter output phase through
separate pins.
♦ Enhanced Slew-Rate Limiting Facilitates ErrorFree Data Transmission
(MAX3070E–MAX3075E/MAX3079E)
The MAX3070E–MAX3079E transceivers draw 800µA
of supply current when unloaded or when fully loaded
with the drivers disabled. All devices have a 1/8-unit
load receiver input impedance, allowing up to 256
transceivers on the bus.
Applications
Lighting Systems
Industrial Control
Telecom
Security Systems
♦ Electrostatic Discharge (ESD) Protection for
RS-485 I/O Pins
±15kV Human Body Model
♦ True Fail-Safe Receiver While Maintaining
EIA/TIA-485 Compatibility
♦ Hot-Swap Input Structure on DE and RE
♦ Low-Current Shutdown Mode (Except
MAX3071E/MAX3074E/MAX3077E)
♦ Pin-Selectable Full-/Half-Duplex Operation
(MAX3079E)
♦ Phase Controls to Correct for Twisted-Pair
Reversal (MAX3079E)
♦ Allow Up to 256 Transceivers on the Bus
♦ Available in Industry-Standard 8-Pin SO Package
Ordering Information
TEMP RANGE
PIN-PACKAGE
MAX3070EEPD
PART
-40°C to +85°C
14 Plastic DIP
MAX3070EESD
-40°C to +85°C
14 SO
MAX3070EAPD
-40°C to +125°C
14 Plastic DIP
MAX3070EASD
-40°C to +125°C
14 SO
MAX3071EEPA
-40°C to +85°C
8 Plastic DIP
MAX3071EESA
-40°C to +85°C
8 SO
MAX3071EAPA
-40°C to +125°C
8 Plastic DIP
MAX3071EASA
-40°C to +125°C
8 SO
Ordering Information continued at end of data sheet.
Instrumentation
Selector Guide, Pin Configurations, and Typical Operating
Circuits appear at end of data sheet.
________________________________________________________________ Maxim Integrated Products
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
1
MAX3070E–MAX3079E
General Description
The MAX3070E–MAX3079E 3.3V, ±15kV ESD-protected,
RS-485/RS-422 transceivers feature one driver and one
receiver. These devices include fail-safe circuitry, guaranteeing a logic-high receiver output when receiver
inputs are open or shorted. The receiver outputs a logic
high if all transmitters on a terminated bus are disabled
(high impedance). The MAX3070E–MAX3079E include a
hot-swap capability to eliminate false transitions on the
bus during power-up or hot insertion.
MAX3070E–MAX3079E
+3.3V, ±15kV ESD-Protected, Fail-Safe,
Hot-Swap, RS-485/RS-422 Transceivers
ABSOLUTE MAXIMUM RATINGS
(All voltages referenced to GND)
Supply Voltage (VCC).............................................................+6V
Control Input Voltage (RE, DE, SLR,
H/F, TXP, RXP)......................................................-0.3V to +6V
Driver Input Voltage (DI)...........................................-0.3V to +6V
Driver Output Voltage (Z, Y, A, B) .............................-8V to +13V
Receiver Input Voltage (A, B)....................................-8V to +13V
Receiver Input Voltage
Full Duplex (A, B) ..................................................-8V to +13V
Receiver Output Voltage (RO)....................-0.3V to (VCC + 0.3V)
Driver Output Current .....................................................±250mA
Continuous Power Dissipation (TA = +70°C)
8-Pin SO (derate 5.88mW/°C above +70°C) .................471mW
8-Pin Plastic DIP (derate 9.09mW/°C above +70°C) .....727mW
14-Pin SO (derate 8.33mW/°C above +70°C) ...............667mW
14-Pin Plastic DIP (derate 10.0mW/°C above +70°C) ...800mW
Operating Temperature Ranges
MAX307_EE_ _ ................................................-40°C to +85°C
MAX307_EA_ _ ..............................................-40°C to +125°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
DC ELECTRICAL CHARACTERISTICS
(VCC = 3.3V ±10%, TA =TMIN to TMAX, unless otherwise noted. Typical values are at VCC = 3.3V and TA = +25°C.) (Note 1)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
DRIVER
Differential Driver Output
VOD
RL = 100Ω (RS422), Figure 1
2
VCC
RL = 54Ω (RS485), Figure 1
1.5
VCC
VCC
0.2
V
3
V
0.2
V
Change in Magnitude of
Differential Output Voltage
∆VOD
RL = 100Ω or 54Ω, Figure 1 (Note 2)
Driver Common-Mode Output
Voltage
VOC
RL = 100Ω or 54Ω, Figure 1
Change in Magnitude of
Common-Mode Voltage
∆VOC
RL = 100Ω or 54Ω, Figure 1 (Note 2)
Input High Voltage
Input Low Voltage
Input Hysteresis
Input Current
VIH
DE, DI, RE, TXP, RXP, H/F
VIL
DE, DI, RE, TXP, RXP, H/F
VHYS
DE, DI, RE, TXP, RXP, H/F
IIN1
Input Impedance First Transition
Input Current
IIN2
VCC / 2
2
V
0.8
100
DE, DI, RE
µA
1
10
kΩ
10
40
µA
SRL Input Middle Voltage
VCC x 0.4
SRL Input Low Voltage
2
±1
TXP, RXP, H/F internal pulldown
VCC - 0.4
Output Leakage (Y and Z)
Full Duplex
V
VCC x 0.6
0.4
SRL = VCC
75
SRL = GND
IO
V
mV
DE
SRL Input High Voltage
SRL Input Current
V
No load
DE = GND,
VCC = GND or 3.6V
-75
VIN = +12V
VIN = -7V
125
-100
_______________________________________________________________________________________
V
V
µA
µA
+3.3V, ±15kV ESD-Protected, Fail-Safe,
Hot-Swap, RS-485/RS-422 Transceivers
(VCC = 3.3V ±10%, TA =TMIN to TMAX, unless otherwise noted. Typical values are at VCC = 3.3V and TA = +25°C.) (Note 1)
PARAMETER
SYMBOL
Driver Short-Circuit Output
Current
IOSD
Driver Short-Circuit Foldback
Output Current
IOSDF
CONDITIONS
MIN
0 ≤ VOUT ≤ 12V (Note 3)
-7V ≤ VOUT ≤ VCC (Note 3)
(VCC - 1V) ≤ VOUT ≤ 12V (Note 3)
TYP
MAX
40
250
-250
-40
20
-7V ≤ VOUT ≤ 1V (Note 3)
-20
UNITS
mA
mA
Thermal-Shutdown Threshold
TTS
175
°C
Thermal-Shutdown Hysteresis
TTSH
15
°C
Input Current (A and B)
IA, B
DE = GND,
VCC = GND or 3.6
Receiver Differential Threshold
Voltage
VTH
-7V ≤ VCM ≤ 12V
Receiver Input Hysteresis
∆VTH
VA + VB = 0V
RO Output High Voltage
VOH
IO = -1mA
RO Output Low Voltage
VOL
IO = 1mA
0.4
V
Three-State Output Current at
Receiver
IOZR
0 ≤ VO ≤ VCC
±1
µA
Receiver Input Resistance
RIN
-7V ≤ VCM ≤ 12V
Receiver Output Short-Circuit
Current
IOSR
0V ≤ VRO ≤ VCC
VIN = +12V
VIN = -7V
125
-100
µA
RECEIVER
-200
-125
-50
15
mV
mV
VCC - 0.6
V
96
kΩ
±80
mA
SUPPLY CURRENT
Supply Current
ICC
Supply Current in Shutdown
Mode
ISHDN
No load, RE = 0, DE = VCC
0.8
1.5
No load, RE = VCC, DE = VCC
0.8
1.5
No load, RE = 0, DE = 0
0.8
1.5
RE = VCC, DE = GND
0.05
10
Human Body Model
±15
mA
µA
ESD PROTECTION
ESD Protection for Y, Z, A, and B
kV
Note 1: All currents into the device are positive. All currents out of the device are negative. All voltages are referred to device
ground, unless otherwise noted.
Note 2: ∆VOD and ∆VOC are the changes in VOD and VOC, respectively, when the DI input changes state.
Note 3: The short-circuit output current applies to peak current just prior to foldback current limiting. The short-circuit foldback output current applies during current limiting to allow a recovery from bus contention.
_______________________________________________________________________________________
3
MAX3070E–MAX3079E
DC ELECTRICAL CHARACTERISTICS (continued)
MAX3070E–MAX3079E
+3.3V, ±15kV ESD-Protected, Fail-Safe,
Hot-Swap, RS-485/RS-422 Transceivers
DRIVER SWITCHING CHARACTERISTICS
MAX3070E/MAX3071E/MAX3072E/MAX3079E with SRL = UNCONNECTED (250kbps)
(VCC = 3.3V ±10%, TA = TMIN to TMAX, unless otherwise noted. Typical values are at VCC = 3.3V and TA = +25°C.)
PARAMETER
Driver Propagation Delay
SYMBOL
tDPLH
tDPHL
CONDITIONS
CL= 50pF, RL= 54Ω, Figures 2 and 3
Driver Differential Output Rise or
Fall Time
tDR , tDF
CL= 50pF, RL= 54Ω, Figures 2 and 3
Differential Driver Output Skew
|tDPLH - tDPHL|
tDSKEW
CL= 50pF, RL= 54Ω, Figures 2 and 3
Maximum Data Rate
MIN
TYP
MAX
UNITS
250
1500
250
1500
350
1600
ns
200
ns
ns
250
kbps
Driver Enable to Output High
tDZH
Figure 4
2500
Driver Enable to Output Low
tDZL
Figure 5
2500
ns
ns
Driver Disable Time from Low
tDLZ
Figure 5
100
ns
Driver Disable Time from High
tDHZ
Figure 4
100
ns
Driver Enable from Shutdown to
Output High
tDZH(SHDN) Figure 4
5500
ns
Driver Enable from Shutdown to
Output Low
tDZL(SHDN) Figure 5
5500
ns
600
ns
Time to Shutdown
tSHDN
50
200
RECEIVER SWITCHING CHARACTERISTICS
MAX3070E/MAX3071E/MAX3072E/MAX3079E with SRL = UNCONNECTED (250kbps)
(VCC = 3.3V ±10%, TA = TMIN to TMAX, unless otherwise noted. Typical values are at VCC = 3.3V and TA = +25°C.)
PARAMETER
Receiver Propagation Delay
Receiver Output Skew
|tRPLH - tRPHL|
SYMBOL
tRPLH
tRPHL
tRSKEW
CONDITIONS
MIN
TYP
200
CL = 15pF, Figures 6 and 7
200
CL = 15pF, Figures 6 and 7
Maximum Data Rate
MAX
30
250
UNITS
ns
ns
kbps
Receiver Enable to Output Low
tRZL
Figure 8
50
ns
Receiver Enable to Output High
tRZH
Figure 8
50
ns
Receiver Disable Time from Low
tRLZ
Figure 8
50
ns
Receiver Disable Time from High
tRHZ
Figure 8
50
ns
Receiver Enable from Shutdown
to Output High
tRZH(SHDN) Figure 8
4000
ns
Receiver Enable from Shutdown
to Output Low
tRZL(SHDN) Figure 8
4000
ns
600
ns
Time to Shutdown
4
tSHDN
50
200
_______________________________________________________________________________________
+3.3V, ±15kV ESD-Protected, Fail-Safe,
Hot-Swap, RS-485/RS-422 Transceivers
MAX3070E–MAX3079E
DRIVER SWITCHING CHARACTERISTICS
MAX3073E/MAX3074E/MAX3075E/MAX3079E with SRL = VCC (500kbps)
(VCC = 3.3V ±10%, TA = TMIN to TMAX, unless otherwise noted. Typical values are at VCC = 3.3V and TA = +25°C.)
PARAMETER
Driver Propagation Delay
SYMBOL
tDPLH
tDPHL
CONDITIONS
CL = 50pF, RL = 54Ω, Figures 2 and 3
Driver Differential Output Rise or
Fall Time
tDR , tDF
CL = 50pF, RL = 54Ω, Figures 2 and 3
Differential Driver Output Skew
|tDPLH - tDPHL|
tDSKEW
CL = 50pF, RL = 54Ω, Figures 2 and 3
Maximum Data Rate
Driver Enable to Output High
MIN
TYP
MAX
UNITS
180
800
180
800
200
800
ns
100
ns
500
ns
kbps
tDZH
Figure 4
2500
ns
Driver Enable to Output Low
tDZL
Figure 5
2500
ns
Driver Disable Time from Low
tDLZ
Figure 5
100
ns
Driver Disable Time from High
tDHZ
Figure 4
100
ns
Driver Enable from Shutdown to
Output High
tDZH(SHDN) Figure 4
4500
ns
Driver Enable from Shutdown to
Output Low
tDZL(SHDN) Figure 5
4500
ns
600
ns
MAX
UNITS
Time to Shutdown
tSHDN
50
200
RECEIVER SWITCHING CHARACTERISTICS
MAX3073E/MAX3074E/MAX3075E/MAX3079E with SRL = VCC (500kbps)
(VCC = 3.3V ±10%, TA = TMIN to TMAX, unless otherwise noted. Typical values are at VCC = 3.3V and TA = +25°C.)
PARAMETER
Receiver Propagation Delay
Receiver Output Skew
|tRPLH - tRPHL|
SYMBOL
tRPLH
tRPHL
tRSKEW
CONDITIONS
MIN
TYP
200
CL = 15pF, Figures 6 and 7
200
CL = 15pF, Figures 6 and 7
Maximum Data Rate
30
500
ns
ns
kbps
Receiver Enable to Output Low
tRZL
Figure 8
50
ns
Receiver Enable to Output High
tRZH
Figure 8
50
ns
Receiver Disable Time from Low
tRLZ
Figure 8
50
ns
Receiver Disable Time from High
tRHZ
Figure 8
50
ns
Receiver Enable from Shutdown
to Output High
tRZH(SHDN) Figure 8
4000
ns
Receiver Enable from Shutdown
to Output Low
tRZL(SHDN) Figure 8
4000
ns
600
ns
Time to Shutdown
tSHDN
50
200
_______________________________________________________________________________________
5
MAX3070E–MAX3079E
+3.3V, ±15kV ESD-Protected, Fail-Safe,
Hot-Swap, RS-485/RS-422 Transceivers
DRIVER SWITCHING CHARACTERISTICS
MAX3076E/MAX3077E/MAX3078E/MAX3079E with SRL = GND (16Mbps)
(VCC = 3.3V ±10%, TA = TMIN to TMAX, unless otherwise noted. Typical values are at VCC = 3.3V and TA = +25°C.)
PARAMETER
Driver Propagation Delay
SYMBOL
tDPLH
tDPHL
CONDITIONS
MIN
TYP
MAX
50
CL = 50pF, RL= 54Ω, Figures 2 and 3
50
UNITS
ns
Driver Differential Output Rise or
Fall Time
tDR , tDF
CL = 50pF, RL= 54Ω, Figures 2 and 3
15
ns
Differential Driver Output Skew
|tDPLH - tDPHL|
tDSKEW
CL = 50pF, RL= 54Ω, Figures 2 and 3
8
ns
Maximum Data Rate
16
Mbps
Driver Enable to Output High
tDZH
Figure 4
150
ns
Driver Enable to Output Low
tDZL
Figure 5
150
ns
Driver Disable Time from Low
tDLZ
Figure 5
100
ns
Driver Disable Time from High
tDHZ
Figure 4
100
ns
Driver Enable from Shutdown to
Output High
tDZH(SHDN) Figure 4
1250
1800
ns
Driver Enable from Shutdown to
Output Low
tDZL(SHDN) Figure 5
1250
1800
ns
200
600
ns
TYP
MAX
UNITS
40
75
40
75
Time to Shutdown
tSHDN
50
RECEIVER SWITCHING CHARACTERISTICS
MAX3076E/MAX3077E/MAX3078E/MAX3079E with SRL = GND (16Mbps)
(VCC = 3.3V ±10%, TA = TMIN to TMAX, unless otherwise noted. Typical values are at VCC = 3.3V and TA = +25°C.)
PARAMETER
Receiver Propagation Delay
Receiver Output Skew
|tRPLH - tRPHL|
SYMBOL
tRPLH
tRPHL
tRSKEW
CONDITIONS
MIN
CL = 15pF, Figures 6 and 7
CL = 15pF, Figures 6 and 7
Maximum Data Rate
8
16
ns
ns
Mbps
Receiver Enable to Output Low
tRZL
Figure 8
50
ns
Receiver Enable to Output High
tRZH
Figure 8
50
ns
Receiver Disable Time from Low
tRLZ
Figure 8
50
ns
Receiver Disable Time from High
tRHZ
Figure 8
50
ns
Receiver Enable from Shutdown
to Output High
tRZH(SHDN) Figure 8
1800
ns
Receiver Enable from Shutdown
to Output Low
tRZL(SHDN) Figure 8
1800
ns
600
ns
Time to Shutdown
6
tSHDN
50
200
_______________________________________________________________________________________
+3.3V, ±15kV ESD-Protected, Fail-Safe,
Hot-Swap, RS-485/RS-422 Transceivers
OUTPUT CURRENT
vs. RECEIVER OUTPUT HIGH VOLTAGE
DE = 0
0.7
0.6
MAX3070E toc02
20
15
10
-25
0
25
50
75
100
20
15
10
0
125
0
0.5
1.0
1.5
2.0
2.5
3.5
3.0
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
OUTPUT HIGH VOLTAGE (V)
OUTPUT HIGH VOLTAGE (V)
RECEIVER OUTPUT HIGH VOLTAGE
vs. TEMPERATURE
RECEIVER OUTPUT LOW VOLTAGE
vs. TEMPERATURE
DRIVER OUTPUT CURRENT
vs. DIFFERENTIAL OUTPUT VOLTAGE
3.15
3.10
0.7
3.05
0.6
0.5
0.4
0.3
90
80
0.2
0
25
50
75
100
50
40
30
0
-50
125
60
10
0
-25
70
20
0.1
3.00
MAX3070E toc06
IO = -1mA
OUTPUT CURRENT (mA)
3.20
100
MAX3070E toc05
3.25
0.8
OUTPUT LOW VOLTAGE (V)
IO = -1mA
MAX3070E toc04
TEMPERATURE (°C)
3.30
-50
25
5
0
-50
-25
0
25
50
75
100
0
125
0.5
1.0
1.5
2.0
2.5
3.0
3.5
TEMPERATURE (°C)
DIFFERENTIAL OUTPUT VOLTAGE (V)
DRIVER DIFFERENTIAL OUTPUT VOLTAGE
vs. TEMPERATURE
OUTPUT CURRENT
vs. TRANSMITTER OUTPUT HIGH VOLTAGE
OUTPUT CURRENT
vs. TRANSMITTER OUTPUT LOW VOLTAGE
2.40
2.30
2.20
2.10
2.00
1.90
140
120
100
80
60
40
20
-50
-25
0
25
50
75
TEMPERATURE (°C)
100
125
140
120
100
80
60
20
0
1.60
160
40
1.80
1.70
180
MAX3070E toc09
2.50
160
OUTPUT CURRENT (mA)
RL = 54Ω
OUTPUT CURRENT (mA)
2.60
XMAX3070E toc07
TEMPERATURE (°C)
MAX3070E toc08
OUTPUT HIGH VOLTAGE (V)
30
5
0.5
DIFFERENTIAL OUTPUT VOLTAGE (V)
35
OUTPUT CURRENT (mA)
DE = VCC
0.8
25
OUTPUT CURRENT (mA)
0.9
SUPPLY CURRENT (mA)
30
MAX3070E toc01
1.0
OUTPUT CURRENT
vs. RECEIVER OUTPUT LOW VOLTAGE
MAX3070E toc03
SUPPLY CURRENT vs. TEMPERATURE
0
-7 -6 -5 -4 -3 -2 -1
0
1
OUTPUT HIGH VOLTAGE (V)
2
3
4
0
2
4
6
8
10
12
OUTPUT LOW VOLTAGE (V)
_______________________________________________________________________________________
7
MAX3070E–MAX3079E
Typical Operating Characteristics
(VCC = 3.3V, TA = +25°C, unless otherwise noted.)
Typical Operating Characteristics (continued)
(VCC = 3.3V, TA = +25°C, unless otherwise noted.)
SHUTDOWN CURRENT
vs. TEMPERATURE
1.2
1.0
0.8
0.6
0.4
tDPLH
tDPHL
800
700
600
MAX3070E toc12
900
500
DRIVER PROPAGATION DELAY (ns)
1.4
MAX3070E toc11
1.6
1000
DRIVER PROPAGATION DELAY (ns)
MAX3070E toc10
1.8
SHUTDOWN CURRENT (µA)
DRIVER PROPAGATION DELAY
vs. TEMPERATURE (500kbps)
DRIVER PROPAGATION DELAY
vs. TEMPERATURE (250kbps)
2.0
450
tDPLH
400
tDPHL
350
300
250
0.2
200
500
0
-25
0
25
50
75
100
-50
125
-25
0
25
50
75
100
-25
0
25
75
100
DRIVER PROPAGATION DELAY
vs. TEMPERATURE (16Mbps)
RECEIVER PROPAGATION DELAY
vs. TEMPERATURE (250kbps AND 500kbps)
RECEIVER PROPAGATION DELAY
vs. TEMPERATURE (16Mbps)
tDPLH
15
tDPHL
10
5
120
90
tDPLH
tDPHL
60
30
0
25
50
75
100
125
60
50
tDPLH
40
tDPHL
30
20
10
0
0
-25
70
RECEIVER PROPAGATION DELAY (ns)
20
MAX3070E toc14
MAX3070E toc13
25
150
-50
-25
TEMPERATURE (°C)
0
25
50
75
100
125
-50
TEMPERATURE (°C)
-25
0
25
50
75
TEMPERATURE (°C)
RECEIVER PROPAGATION DELAY
(250kbps AND 500kbps)
DRIVER PROPAGATION DELAY (250kbps)
MAX3070E toc17
MAX3070E toc16
VA - VB
1V/div
DI
2V/div
VY - V Z
2V/div
1µs/div
125
MAX3070E toc15
TEMPERATURE (°C)
0
8
50
TEMPERATURE (°C)
30
-50
-50
125
TEMPERATURE (°C)
DRIVER PROPAGATION DELAY (ns)
-50
DRIVER PROPAGATION DELAY (ns)
MAX3070E–MAX3079E
+3.3V, ±15kV ESD-Protected, Fail-Safe,
Hot-Swap, RS-485/RS-422 Transceivers
RO
2V/div
200ns/div
_______________________________________________________________________________________
100
125
+3.3V, ±15kV ESD-Protected, Fail-Safe,
Hot-Swap, RS-485/RS-422 Transceivers
DRIVER PROPAGATION DELAY (500kbps)
DRIVER PROPAGATION DELAY (16Mbps)
MAX3070E toc18
RECEIVER PROPAGATION DELAY (16Mbps)
MAX3070E toc19
MAX3070E toc20
VA
1V/div
DI
2V/div
DI
2V/div
VB
1V/div
VZ
1V/div
VY - VZ
2V/div
RO
2V/div
VY
1V/div
400ns/div
10ns/div
20ns/div
Test Circuits and Waveforms
3V
Y
DE
RL/2
Y
VOD
DI
VOC
RL/2
VOD
RL
CL
Z
Z
Figure 1. Driver DC Test Load
Figure 2. Driver Timing Test Circuit
VCC
DI
VCC/2
0
tDPLH
tDPHL
1/2 VO
Z
VO
Y
1/2 VO
VO
VDIFF 0
-VO
VDIFF = V (Y) - V (Z)
10%
90%
90%
10%
tDF
tDR
tSKEW = | tDPLH - tDPHL |
Figure 3. Driver Propagation Delays
_______________________________________________________________________________________
9
MAX3070E–MAX3079E
Typical Operating Characteristics (continued)
(VCC = 3.3V, TA = +25°C, unless otherwise noted.)
+3.3V, ±15kV ESD-Protected, Fail-Safe,
Hot-Swap, RS-485/RS-422 Transceivers
MAX3070E–MAX3079E
Test Circuits and Waveforms (continued)
S1
D
0 OR 3V
OUT
CL
50pF
GENERATOR
RL = 500Ω
50Ω
VCC
DE
VCC / 2
tDZH, tDZH(SHDN)
0
0.25V
OUT
VOH
VOM = (0 + VOH) / 2
0
tDHZ
Figure 4. Driver Enable and Disable Times (tDHZ, tDZH, tDZH(SHDN))
VCC
RL = 500Ω
S1
0 OR 3V
D
OUT
CL
50pF
GENERATOR
50Ω
VCC
DE
VCC / 2
tDZL, tDZL(SHDN)
0
tDLZ
VCC
VOM = (VOL + VCC) / 2
OUT
VOL
Figure 5. Driver Enable and Disable Times (tDZL, tDLZ, tDLZ(SHDN))
10
______________________________________________________________________________________
0.25V
+3.3V, ±15kV ESD-Protected, Fail-Safe,
Hot-Swap, RS-485/RS-422 Transceivers
B
VID
ATE
R
RECEIVER
OUTPUT
A
+1V
B
-1V
tRPLH
VOH
A
tRPHL
1.5V
VOL
RO
THE RISE TIME AND FALL TIME OF INPUTS A AND B < 4ns
Figure 6. Receiver Propagation Delay Test Circuit
Figure 7. Receiver Propagation Delays
S1
+1.5V
S3
VCC
1kΩ
-1.5V
VID
R
CL
15pF
GENERATOR
S2
50Ω
S1 OPEN
S2 CLOSED
S3 = +1.5V
S1 CLOSED
S2 OPEN
S3 = -1.5V
3V
3V
1.5V
RE
RE
0
0
tRZH, tRZH(SHDN)
tRZL, tRZL(SHDN)
VOH
RO
VCC
VOH / 2
(VOL + VCC) / 2
RO
0
S1 OPEN
S2 CLOSED
S3 = +1.5V
VOL
S1 CLOSED
S2 OPEN
S3 = -1.5V
3V
1.5V
1.5V
RE
tRHZ
3V
0
RE
0
tRLZ
VCC
VOH
0.25V
RO
0
RO
0.25V
VOL
Figure 8. Receiver Enable and Disable Times
______________________________________________________________________________________
11
MAX3070E–MAX3079E
Test Circuits and Waveforms (continued)
MAX3070E–MAX3079E
+3.3V, ±15kV ESD-Protected, Fail-Safe,
Hot-Swap, RS-485/RS-422 Transceivers
Pin Description
PIN
MAX3070E
MAX3073E
MAX3076E
MAX3071E
MAX3074E
MAX3077E
FULL-DUPLEX
DEVICES
MAX3079E
HALFDUPLEX
DEVICES
FULLHALFDUPLEX DUPLEX
MODE
MODE
NAME
FUNCTION
—
—
—
1
1
H/F
Half-/Full-Duplex Select Pin. Connect H/F to VCC for halfduplex mode; connect to GND or leave unconnected for
full-duplex mode.
2
2
1
2
2
RO
Receiver Output. When RE is low and if (A - B) ≥ -50mV,
RO is high; if (A - B) ≤ -200mV, RO is low.
RE
Receiver Output Enable. Drive RE low to enable RO; RO is
high impedance when RE is high. Drive RE high and DE
low to enter low-power shutdown mode. RE is a hot-swap
input (see the Hot-Swap Capability section for details).
3
12
MAX3072E
MAX3075E
MAX3078E
—
2
3
3
4
—
3
4
4
DE
Driver Output Enable. Drive DE high to enable driver
outputs. These outputs are high impedance when DE is
low. Drive RE high and DE low to enter low-power
shutdown mode. DE is a hot-swap input (see the HotSwap Capability section for details).
5
3
4
5
5
DI
Driver Input. With DE high, a low on DI forces noninverting
output low and inverting output high. Similarly, a high on DI
forces noninverting output high and inverting output low.
Slew-Rate Limit Selector Pin. Connect SRL to ground for
16Mbps communication rate; connect to VCC for 500kbps
communication rate. Leave unconnected for 250kbps
communication rate.
—
—
—
6
6
SRL
6, 7
4
5
7
7
GND
Ground
Transmitter Phase. Connect TXP to ground or leave
floating for normal transmitter phase/polarity. Connect to
VCC to invert the transmitter phase/polarity.
—
—
—
8
8
TXP
9
5
—
9
—
Y
Noninverting Driver Output
—
—
—
—
9
Y
Noninverting Driver Output and Noninverting Receiver
Input*
10
6
—
10
—
Z
Inverting Driver Output
—
—
—
—
10
Z
Inverting Driver Output and Inverting Receiver Input*
11
7
—
11
—
B
Inverting Receiver Input
—
—
—
—
11
B
Receiver Input Resistors*
—
—
7
—
—
B
Inverting Receiver Input and Inverting Driver Output
______________________________________________________________________________________
+3.3V, ±15kV ESD-Protected, Fail-Safe,
Hot-Swap, RS-485/RS-422 Transceivers
PIN
MAX3070E
MAX3073E
MAX3076E
MAX3071E
MAX3074E
MAX3077E
FULL-DUPLEX
DEVICES
MAX3072E
MAX3075E
MAX3078E
MAX3079E
HALFDUPLEX
DEVICES
FULLHALFDUPLEX DUPLEX
MODE
MODE
NAME
FUNCTION
12
8
—
12
—
A
Noninverting Receiver Input
—
—
—
—
12
A
Receiver Input Resistors*
—
—
6
—
—
A
Noninverting Receiver Input and Noninverting Driver
Output
—
—
—
13
13
RXP
Receiver Phase. Connect RXP to GND or leave
unconnected for normal transmitter phase/polarity.
Connect to VCC to invert receiver phase/polarity.
14
1
8
14
14
VCC
Positive Supply VCC = 3.3V ±10%. Bypass VCC to GND
with a 0.1µF capacitor.
1, 8, 13
—
—
—
—
N.C.
No Connect. Not internally connected. Can be connected
to GND.
*MAX3079E only. In half-duplex mode, the driver outputs serve as receiver inputs. The full-duplex receiver inputs (A and B) still have a
1/8-unit load, but are not connected to the receiver.
Function Tables
MAX3070E/MAX3073E/MAX3076E
MAX3071E/MAX3074E/MAX30767E
TRANSMITTING
TRANSMITTING
INPUTS
INPUT
OUTPUTS
OUTPUTS
RE
DE
DI
Z
Y
DI
Z
Y
X
1
1
0
1
1
0
1
X
1
0
1
0
0
1
0
0
0
X
High-Z
1
0
X
High-Z
RECEIVING
Shutdown
RECEIVING
INPUTS
OUTPUT
A, B
RO
1
OUTPUT
≥ -50mV
RE
DE
A, B
RO
≤ -200mV
0
0
X
≥ -50mV
1
Open/shorted
1
0
X
≤ -200mV
0
0
X
Open/
shorted
1
1
1
X
High-Z
1
0
X
Shutdown
INPUTS
______________________________________________________________________________________
13
MAX3070E–MAX3079E
Pin Description (continued)
MAX3070E–MAX3079E
+3.3V, ±15kV ESD-Protected, Fail-Safe,
Hot-Swap, RS-485/RS-422 Transceivers
Function Tables (continued)
MAX3072E/MAX3075E/MAX3078E
RECEIVING
TRANSMITTING
INPUTS
RE
X
INPUTS
OUTPUTS
DE
DI
1
1
B/Z
OUTPUTS
A/Y
RE
DE
A-B
RO
1
0
X
≥ -50mV
1
0
X
≤ -200mV
0
0
X
Open/
shorted
1
1
1
X
High-Z
1
0
X
Shutdown
0
X
1
0
1
0
0
0
X
High-Z
High-Z
1
0
X
Shutdown
MAX3079E
TRANSMITTING
INPUTS
OUTPUTS
TXP
RE
DE
DI
Z
Y
0
X
1
1
0
1
0
X
1
0
1
0
1
X
1
1
1
0
1
X
1
0
0
1
X
0
0
X
High-Z
High-Z
X
1
0
X
Shutdown
RECEIVING
INPUTS
OUTPUTS
H/F
RXP
RE
DE
A, B
Y, Z
RO
0
0
0
X
> -50mV
X
1
0
0
0
X
< -200mV
X
0
0
1
0
X
> -50mV
X
0
0
1
0
X
< -200mV
X
1
1
0
0
0
X
> -50mV
1
1
0
0
0
X
< -200mV
0
1
1
0
0
X
> -50mV
0
1
1
0
0
X
< -200mV
1
0
0
0
X
Open/shorted
X
1
1
0
0
0
X
Open/shorted
1
0
0
1
0
X
Open/shorted
X
1
1
0
0
X
Open/shorted
0
X
X
1
1
X
X
High-Z
X
X
1
0
X
X
Shutdown
X = Don’t care; shutdown mode, driver and receiver outputs are high impedance.
14
______________________________________________________________________________________
+3.3V, ±15kV ESD-Protected, Fail-Safe,
Hot-Swap, RS-485/RS-422 Transceivers
The MAX3070E–MAX3079E high-speed transceivers for
RS-485/RS-422 communication contain one driver and
one receiver. These devices feature fail-safe circuitry,
which guarantees a logic-high receiver output when the
receiver inputs are open or shorted, or when they are
connected to a terminated transmission line with all drivers disabled (see the Fail-Safe section). The
MAX3070E/MAX3072E/MAX3073E/MAX3075E/
MAX3076E/MAX3078E/MAX3079E also feature a hotswap capability allowing line insertion without erroneous data transfer (see the Hot Swap Capability
section). The MAX3070E/MAX3071E/MAX3072E feature
reduced slew-rate drivers that minimize EMI and
reduce reflections caused by improperly terminated
cables, allowing error-free data transmission up to
250kbps. The MAX3073E/MAX3074E/MAX3075E also
offer slew-rate limits allowing transmit speeds up to
500kbps. The MAX3076E/MAX3077E/MAX3078Es’ driver slew rates are not limited, making transmit speeds
up to 16Mbps possible. The MAX3079E’s slew rate is
selectable between 250kbps, 500kbps, and 16Mbps
by driving a selector pin with a three-state driver.
The MAX3072E/MAX3075E/MAX3078E are half-duplex
transceivers, while the MAX3070E/MAX3071E/
MAX3073E/MAX3074E/MAX3076E/MAX3077E are fullduplex transceivers. The MAX3079E is selectable
between half- and full-duplex communication by driving
a selector pin (SRL) high or low, respectively.
All devices operate from a single 3.3V supply. Drivers are
output short-circuit current limited. Thermal-shutdown circuitry protects drivers against excessive power dissipation. When activated, the thermal-shutdown circuitry
places the driver outputs into a high-impedance state.
Receiver Input Filtering
The receivers of the MAX3070E–MAX3075E, and the
MAX3079E when operating in 250kbps or 500kbps
mode, incorporate input filtering in addition to input
hysteresis. This filtering enhances noise immunity with
differential signals that have very slow rise and fall
times. Receiver propagation delay increases by 25%
due to this filtering.
Fail-Safe
The MAX3070E family guarantees a logic-high receiver
output when the receiver inputs are shorted or open, or
when they are connected to a terminated transmission
line with all drivers disabled. This is done by setting the
receiver input threshold between -50mV and -200mV. If
the differential receiver input voltage (A - B) is greater
than or equal to -50mV, RO is logic high. If A - B is less
than or equal to -200mV, RO is logic low. In the case of
a terminated bus with all transmitters disabled, the
receiver’s differential input voltage is pulled to 0V by
the termination. With the receiver thresholds of the
MAX3070E family, this results in a logic high with a
50mV minimum noise margin. Unlike previous fail-safe
devices, the -50mV to -200mV threshold complies with
the ±200mV EIA/TIA-485 standard.
Hot-Swap Capability
(Except MAX3071E/MAX3074E/MAX3077E)
Hot-Swap Inputs
When circuit boards are inserted into a hot, or powered, backplane, differential disturbances to the data
bus can lead to data errors. Upon initial circuit board
insertion, the data communication processor undergoes its own power-up sequence. During this period,
the processor’s logic-output drivers are high impedance and are unable to drive the DE and RE inputs of
these devices to a defined logic level. Leakage currents up to ±10µA from the high-impedance state of the
processor’s logic drivers could cause standard CMOS
enable inputs of a transceiver to drift to an incorrect
logic level. Additionally, parasitic circuit board capacitance could cause coupling of V CC or GND to the
enable inputs. Without the hot-swap capability, these
factors could improperly enable the transceiver’s driver
or receiver.
When VCC rises, an internal pulldown circuit holds DE
low and RE high. After the initial power-up sequence,
the pulldown circuit becomes transparent, resetting the
hot-swap tolerable input.
Hot-Swap Input Circuitry
The enable inputs feature hot-swap capability. At the
input there are two NMOS devices, M1 and M2
(Figure 9). When VCC ramps from zero, an internal 10µs
timer turns on M2 and sets the SR latch, which also
turns on M1. Transistors M2, a 500µA current sink, and
M1, a 100µA current sink, pull DE to GND through a
5kΩ resistor. M2 is designed to pull DE to the disabled
state against an external parasitic capacitance up to
100pF that can drive DE high. After 10µs, the timer
deactivates M2 while M1 remains on, holding DE low
against three-state leakages that can drive DE high. M1
remains on until an external source overcomes the
required input current. At this time, the SR latch resets
and M1 turns off. When M1 turns off, DE reverts to a
standard, high-impedance CMOS input. Whenever VCC
drops below 1V, the hot-swap input is reset.
For RE there is a complementary circuit employing two
PMOS devices pulling RE to VCC.
______________________________________________________________________________________
15
MAX3070E–MAX3079E
Detailed Description
MAX3070E–MAX3079E
+3.3V, ±15kV ESD-Protected, Fail-Safe,
Hot-Swap, RS-485/RS-422 Transceivers
operation. Drive H/F high for half-duplex operation. In
full-duplex mode, the pin configuration of the driver and
receiver is the same as that of a MAX3070E. In halfduplex mode, the receiver inputs are switched to the
driver outputs, connecting outputs Y and Z to inputs A
and B, respectively. In half-duplex mode, the internal
full-duplex receiver input resistors are still connected to
pins 11 and 12.
VCC
10µs
TIMER
SR LATCH
TIMER
±15kV ESD Protection
5kΩ
DE
(HOT SWAP)
DE
100µA
500µA
M1
M2
Figure 9. Simplified Structure of the Driver Enable Pin (DE)
MAX3079E Programming
The MAX3079E has several programmable operating
modes. Transmitter rise and fall times are programmable, resulting in maximum data rates of 250kbps,
500kbps, and 16Mbps. To select the desired data rate,
drive SRL to one of three possible states by using a
three-state driver: V CC , GND, or unconnected. For
250kbps operation, set the three-state device in highimpedance mode or leave SRL unconnected. For
500kbps operation, drive SRL high or connect it to VCC.
For 16Mbps operation, drive SRL low or connect it to
GND. SRL can be changed during operation without
interrupting data communications.
Occasionally, twisted-pair lines are connected backward
from normal orientation. The MAX3079E has two pins that
invert the phase of the driver and the receiver to correct
this problem. For normal operation, drive TXP and RXP
low, connect them to ground, or leave them unconnected (internal pulldown). To invert the driver phase, drive
TXP high or connect it to VCC. To invert the receiver
phase, drive RXP high or connect it to VCC. Note that the
receiver threshold is positive when RXP is high.
The MAX3079E can operate in full- or half-duplex
mode. Drive the H/F pin low, leave it unconnected
(internal pulldown), or connect it to GND for full-duplex
16
As with all Maxim devices, ESD-protection structures
are incorporated on all pins to protect against electrostatic discharges encountered during handling and
assembly. The driver outputs and receiver inputs of the
MAX3070E family of devices have extra protection
against static electricity. Maxim’s engineers have developed state-of-the-art structures to protect these pins
against ESD of ±15kV without damage. The ESD structures withstand high ESD in all states: normal operation,
shutdown, and powered down. After an ESD event, the
MAX3070E–MAX3079E keep working without latchup or
damage.
ESD protection can be tested in various ways. The
transmitter outputs and receiver inputs of the
MAX3070E–MAX3079E are characterized for protection
to the following limits:
• ±15kV using the Human Body Model
• ±6kV using the Contact Discharge method specified
in IEC 1000-4-2
ESD Test Conditions
ESD performance depends on a variety of conditions.
Contact Maxim for a reliability report that documents
test setup, test methodology, and test results.
Human Body Model
Figure 10a shows the Human Body Model, and Figure
10b shows the current waveform it generates when discharged into a low impedance. This model consists of a
100pF capacitor charged to the ESD voltage of interest,
which is then discharged into the test device through a
1.5kΩ resistor.
IEC 1000-4-2
The IEC 1000-4-2 standard covers ESD testing and
performance of finished equipment. However, it does
not specifically refer to integrated circuits. The
MAX3070E family of devices helps you design equipment to meet IEC 1000-4-2, without the need for additional ESD-protection components.
The major difference between tests done using the
Human Body Model and IEC 1000-4-2 is higher peak
______________________________________________________________________________________
+3.3V, ±15kV ESD-Protected, Fail-Safe,
Hot-Swap, RS-485/RS-422 Transceivers
RD
1500Ω
CHARGE-CURRENTLIMIT RESISTOR
HIGHVOLTAGE
DC
SOURCE
Cs
100pF
IP 100%
90%
DISCHARGE
RESISTANCE
STORAGE
CAPACITOR
Ir
DEVICE
UNDER
TEST
Figure 10a. Human Body ESD Test Model
36.8%
10%
0
HIGHVOLTAGE
DC
SOURCE
Cs
150pF
tDL
CURRENT WAVEFORM
Figure 10b. Human Body Current Waveform
I
100%
90%
RD
330Ω
DISCHARGE
RESISTANCE
STORAGE
CAPACITOR
TIME
tRL
IPEAK
CHARGE-CURRENTLIMIT RESISTOR
PEAK-TO-PEAK RINGING
(NOT DRAWN TO SCALE)
AMPS
0
RC
50MΩ TO 100MΩ
MAX3070E–MAX3079E
RC
1MΩ
DEVICE
UNDER
TEST
10%
tr = 0.7ns TO 1ns
t
30ns
60ns
Figure 10c. IEC 1000-4-2 ESD Test Model
current in IEC 1000-4-2, because series resistance is
lower in the IEC 1000-4-2 model. Hence, the ESD withstand voltage measured to IEC 1000-4-2 is generally
lower than that measured using the Human Body Model.
Figure 10c shows the IEC 1000-4-2 model, and Figure
10d shows the current waveform for IEC 1000-4-2 ESD
Contact Discharge test.
The air-gap test involves approaching the device with a
charged probe. The contact-discharge method connects
the probe to the device before the probe is energized.
Machine Model
The machine model for ESD tests all pins using a
200pF storage capacitor and zero discharge resistance. The objective is to emulate the stress caused
when I/O pins are contacted by handling equipment
during test and assembly. Of course, all pins require
this protection, not just RS-485 inputs and outputs.
Figure 10d. IEC 1000-4-2 ESD Generator Current Waveform
Applications Information
256 Transceivers on the Bus
The standard RS-485 receiver input impedance is 12kΩ
(1-unit load), and the standard driver can drive up to 32unit loads. The MAX3070E family of transceivers has a
1/8-unit load receiver input impedance (96kΩ), allowing
up to 256 transceivers to be connected in parallel on one
communication line. Any combination of these devices
as well as other RS-485 transceivers with a total of 32unit loads or fewer can be connected to the line.
Reduced EMI and Reflections
The MAX3070E/MAX3071E/MAX3072E feature reduced
slew-rate drivers that minimize EMI and reduce reflections caused by improperly terminated cables, allowing
error-free data transmission up to 250kbps. The
MAX3073E/MAX3074E/MAX3075E offer higher driver
output slew-rate limits, allowing transmit speeds up to
500kbps. The MAX3079E with SRL = VCC or unconnected, are slew-rate limited. With SRL unconnected,
the MAX3079E error-free data transmission is up to
250kbps; with SRL connected to VCC the data transmit
speeds up to 500kbps.
______________________________________________________________________________________
17
MAX3070E–MAX3079E
+3.3V, ±15kV ESD-Protected, Fail-Safe,
Hot-Swap, RS-485/RS-422 Transceivers
Low-Power Shutdown Mode (Except
MAX3071E/MAX3074E/MAX3077E)
Low-power shutdown mode is initiated by bringing both
RE high and DE low. In shutdown, the devices typically
draw only 50nA of supply current.
RE and DE can be driven simultaneously; the parts are
guaranteed not to enter shutdown if RE is high and DE
is low for less than 50ns. If the inputs are in this state
for at least 600ns, the parts are guaranteed to enter
shutdown.
Enable times t ZH and t ZL (see the Switching
Characteristics section) assume the part was not in a
low-power shutdown state. Enable times tZH(SHDN) and
tZL(SHDN) assume the parts were shut down. It takes
drivers and receivers longer to become enabled from
low-power shutdown mode (tZH(SHDN), tZL(SHDN)) than
from driver/receiver-disable mode (tZH, tZL).
A
R
Line Length
The RS-485/RS-422 standard covers line lengths up to
4000ft. For line lengths greater than 4000ft, use the
repeater application shown in Figure 11.
Typical Applications
The MAX3072E/MAX3075E/MAX3078E/MAX3079E
transceivers are designed for bidirectional data communications on multipoint bus transmission lines. Figures
12 and 13 show typical network applications circuits.
To minimize reflections, terminate the line at both ends
in its characteristic impedance, and keep stub lengths
off the main line as short as possible. The slew-rate-limited MAX3072E/MAX3075E and the two modes of the
MAX3079E are more tolerant of imperfect termination.
MAX3070E/MAX3071E/MAX3073E/
MAX3074E/MAX3076E/MAX3077E/
MAX3079E (FULL-DUPLEX)
RO
RE
Driver Output Protection
Two mechanisms prevent excessive output current and
power dissipation caused by faults or by bus contention.
The first, a foldback current limit on the output stage,
provides immediate protection against short circuits over
the whole common-mode voltage range (see the Typical
Operating Characteristics). The second, a thermal-shutdown circuit, forces the driver outputs into a high-impedance state if the die temperature becomes excessive.
DATA IN
B 120Ω
DE
Chip Information
Z
DI
D
TRANSISTOR COUNT: 1228
PROCESS: BiCMOS
DATA OUT
Y 120Ω
Figure 11. Line Repeater for MAX3070E/MAX3071E/MAX3073E/
MAX3074E/MAX3076E/MAX3077E/MAX3079E in Full-Duplex
Mode
120Ω
120Ω
DI
DE
B
B
D
D
DI
DE
RO
A
B
A
B
A
A
R
R
R
MAX3072E
MAX3075E
MAX3078E
MAX3079E (HALF-DUPLEX)
R
D
D
DI
DE
RO RE
DI
DE
RO RE
Figure 12. Typical Half-Duplex RS-485 Network
18
RO
RE
RE
______________________________________________________________________________________
+3.3V, ±15kV ESD-Protected, Fail-Safe,
Hot-Swap, RS-485/RS-422 Transceivers
R
RO
RE
DE
Y
120Ω
120Ω
D
B
DI
Z
Z
120Ω
D
DI
DE
RE
RO
B
120Ω
R
Y
A
Y
Z
B
A
Y
Z
B
R
D
DI
A
MAX3070E
MAX3071E
MAX3073E
MAX3074E
MAX3076E
MAX3077E
MAX3079E (FULL-DUPLEX)
R
D
DE RE RO
DI
DE RE RO
NOTE: RE AND DE ON MAX3070E/MAX3073E/MAX3076E/MAX3079E ONLY.
Figure 13. Typical Full-Duplex RS-485 Network
Selector Guide
PART
HALF/FULL
DUPLEX
DATA RATE
(Mbps)
SLEW-RATE
LIMITED
LOW-POWER
SHUTDOWN
RECEIVER/
DRIVER
ENABLE
MAX3070E
Full
0.250
Yes
Yes
MAX3071E
Full
0.250
Yes
No
MAX3072E
Half
0.250
Yes
MAX3073E
Full
0.5
Yes
MAX3074E
Full
0.5
Yes
No
MAX3075E
Half
0.5
Yes
MAX3076E
Full
16
No
MAX3077E
Full
16
No
No
TRANSCEIVERS
ON BUS
PINS
Yes
256
14
No
256
8
Yes
Yes
256
8
Yes
Yes
256
14
No
256
8
Yes
Yes
256
8
Yes
Yes
256
14
No
256
8
MAX3078E
Half
16
No
Yes
Yes
256
8
MAX3079E
Selectable
Selectable
Selectable
Yes
Yes
256
14
______________________________________________________________________________________
19
MAX3070E–MAX3079E
A
+3.3V, ±15kV ESD-Protected, Fail-Safe,
Hot-Swap, RS-485/RS-422 Transceivers
MAX3070E–MAX3079E
Pin Configurations and Typical Operating Circuits
VCC
DE
14 VCC
N.C. 1
RO
RE
0.1µF
14
4
2
3
12 A
DE 4
11 B
DI 5
10 Z
D
GND 6
9 Y
GND 7
8 N.C.
VCC RE
Y
9
5
DI
13 N.C.
R
MAX3070E
MAX3073E
MAX3076E
Rt
D
RO
R
10
Z
12
2
RO
N.C.
A
Rt
R
DI
D
11
B
1, 8, 13
GND
6, 7
3
GND DE
RE
TYPICAL FULL-DUPLEX OPERATING CIRCUIT
DIP/SO
0.1µF
MAX3071E
MAX3074E
MAX3077E
VCC 1
VCC 1
R
RO 2
DI 3
D
GND 4
8
A
7
B
6
Z
5
Y
Y
5
3
DI
VCC
Rt
D
6
RO
R
Z
8
2
RO
A
Rt
R
DI
D
7
B
DIP/SO
GND
4
GND
TYPICAL FULL-DUPLEX OPERATING CIRCUIT
0.1µF
RO 1
8
R
VCC
RO
RE 2
7
B
RE
DE 3
6
A
DE
5
GND
DI
DI 4
D
1
R
8
2
7
3
6
4
VCC
MAX3072E
MAX3075E
MAX3078E
D
A
B
5
Rt
B
GND
RO
R
RE
DIP/SO
TYPICAL HALF-DUPLEX OPERATING CIRCUIT
NOTE: PIN LABELS Y AND Z ON TIMING, TEST, AND WAVEFORMS DIAGRAMS.
REFER TO PINS A AND B WHEN DE IS HIGH.
20
DI
A
Rt
D
DE
______________________________________________________________________________________
+3.3V, ±15kV ESD-Protected, Fail-Safe,
Hot-Swap, RS-485/RS-422 Transceivers
VCC
RE
MAX3079E
A
RO
TOP VIEW
H/F 1
14 VCC
RO 2
13 RXP
RE 3
DE 4
B
RXP
12 A
MAX3079E
11 B
DI 5
10 Z
SRL 6
9 Y
GND 7
8 TXP
H/F
Z
TXP
Y
DIP/SO
DI
NOTE: SWITCH POSITIONS
INDICATED FOR H/F = GND.
GND
DE
SRL
______________________________________________________________________________________
21
MAX3070E–MAX3079E
Pin Configurations and Typical Operating Circuits (continued)
MAX3070E–MAX3079E
+3.3V, ±15kV ESD-Protected, Fail-Safe,
Hot-Swap, RS-485/RS-422 Transceivers
Ordering Information (continued)
TEMP RANGE
PIN-PACKAGE
TEMP RANGE
PIN-PACKAGE
MAX3072EEPA
-40°C to +85°C
8 Plastic DIP
MAX3076EEPD
-40°C to +85°C
14 Plastic DIP
MAX3072EESA
-40°C to +85°C
8 SO
MAX3076EESD
-40°C to +85°C
14 SO
MAX3072EAPA
-40°C to +125°C
8 Plastic DIP
MAX3076EAPD
-40°C to +125°C
14 Plastic DIP
MAX3072EASA
-40°C to +125°C
8 SO
MAX3076EASD
-40°C to +125°C
14 SO
PART
PART
MAX3073EEPD
-40°C to +85°C
14 Plastic DIP
MAX3077EEPA
-40°C to +85°C
8 Plastic DIP
MAX3073EESD
-40°C to +85°C
14 SO
MAX3077EESA
-40°C to +85°C
8 SO
MAX3073EAPD
-40°C to +125°C
14 Plastic DIP
MAX3077EAPA
-40°C to +125°C
8 Plastic DIP
MAX3073EASD
-40°C to +125°C
14 SO
MAX3077EASA
-40°C to +125°C
8 SO
MAX3074EEPA
-40°C to +85°C
8 Plastic DIP
MAX3078EEPA
-40°C to +85°C
8 Plastic DIP
MAX3074EESA
-40°C to +85°C
8 SO
MAX3078EESA
-40°C to +85°C
8 SO
8 Plastic DIP
MAX3078EAPA
-40°C to +125°C
8 Plastic DIP
MAX3074EAPA
-40°C to +125°C
MAX3074EASA
-40°C to +125°C
8 SO
MAX3078EASA
-40°C to +125°C
8 SO
MAX3075EEPA
-40°C to +85°C
8 Plastic DIP
MAX3079EEPD
-40°C to +85°C
14 Plastic DIP
MAX3075EESA
-40°C to +85°C
8 SO
MAX3079EESD
-40°C to +85°C
14 SO
MAX3075EAPA
-40°C to +125°C
8 Plastic DIP
MAX3079EAPD
-40°C to +125°C
14 Plastic DIP
MAX3075EASA
-40°C to +125°C
8 SO
MAX3079EASD
-40°C to +125°C
14 SO
22
______________________________________________________________________________________
+3.3V, ±15kV ESD-Protected, Fail-Safe,
Hot-Swap, RS-485/RS-422 Transceivers
9LUCSP, 3x3.EPS
______________________________________________________________________________________
23
MAX3070E–MAX3079E
Package Information
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,
go to www.maxim-ic.com/packages.)
Package Information (continued)
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,
go to www.maxim-ic.com/packages.)
PDIPN.EPS
MAX3070E–MAX3079E
+3.3V, ±15kV ESD-Protected, Fail-Safe,
Hot-Swap, RS-485/RS-422 Transceivers
24
______________________________________________________________________________________
+3.3V, ±15kV ESD-Protected, Fail-Safe,
Hot-Swap, RS-485/RS-422 Transceivers
N
E
H
INCHES
MILLIMETERS
MAX
MIN
0.069
0.053
0.010
0.004
0.014
0.019
0.007
0.010
0.050 BSC
0.150
0.157
0.228
0.244
0.016
0.050
MAX
MIN
1.35
1.75
0.10
0.25
0.35
0.49
0.19
0.25
1.27 BSC
3.80
4.00
5.80
6.20
0.40
SOICN .EPS
DIM
A
A1
B
C
e
E
H
L
1.27
VARIATIONS:
1
INCHES
TOP VIEW
DIM
D
D
D
MIN
0.189
0.337
0.386
MAX
0.197
0.344
0.394
MILLIMETERS
MIN
4.80
8.55
9.80
MAX
5.00
8.75
10.00
N MS012
8
AA
14
AB
16
AC
D
C
A
B
e
0 -8
A1
L
FRONT VIEW
SIDE VIEW
PROPRIETARY INFORMATION
TITLE:
PACKAGE OUTLINE, .150" SOIC
APPROVAL
DOCUMENT CONTROL NO.
21-0041
REV.
B
1
1
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________ 25
© 2003 Maxim Integrated Products
Printed USA
is a registered trademark of Maxim Integrated Products.
MAX3070E–MAX3079E
Package Information (continued)
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,
go to www.maxim-ic.com/packages.)
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