19-3361; Rev 2; 3/05 Dual, Quad, and Hex High-Speed Differential ESD-Protection ICs Features The MAX3205E/MAX3207E/MAX3208E low-capacitance, ±15kV ESD-protection diode arrays with an integrated transient voltage suppressor (TVS) clamp are suitable for high-speed and general-signal ESD protection. Low input capacitance makes these devices ideal for ESD protection of signals in HDTV, PC monitors (DVI™, HDMI™), PC peripherals (FireWire®, USB 2.0), server interconnect (PCI Express™, Infiniband ® ), datacom, and interchassis interconnect. Each channel consists of a pair of diodes that steer ESD current pulses to VCC or GND. The MAX3205E/MAX3207E/MAX3208E protect against ESD pulses up to ±15kV Human Body Model, ±8kV Contact Discharge, and ±15kV Air-Gap Discharge, as specified in IEC 61000-4-2. An integrated TVS ensures that the voltage rise seen on VCC during an ESD event is clamped to a known voltage. These devices have a 2pF input capacitance per channel, and a channel-tochannel capacitance variation of only 0.05pF, making them ideal for use on high-speed, single-ended, or differential signals. The MAX3207E is a two-channel device suitable for USB 1.1, USB 2.0 (480Mbps), and USB OTG applications. The MAX3208E is a four-channel device for Ethernet and FireWire applications. The MAX3205E is a six-channel device for cell phone connectors and SVGA video connections. The MAX3205E is available in 9-bump, tiny chip-scale (UCSP™), and 16-pin, 3mm x 3mm, thin QFN packages. The MAX3207E is available in a small 6-pin SOT23 package. The MAX3208E is available in 10-pin µMAX® and 16-pin, 3mm x 3mm TQFN packages. All devices are specified for the -40°C to +125°C automotive operating temperature range. ♦ Low Input Capacitance of 2pF Typical ♦ Low Channel-to-Channel Variation of 0.05pF from I/O to I/O ♦ High-Speed Differential or Single-Ended ESD Protection ±15kV–Human Body Model ±8kV–IEC 61000-4-2, Contact Discharge ±15kV–IEC 61000-4-2, Air-Gap Discharge ♦ Integrated Transient Voltage Suppressor (TVS) ♦ Optimized Pinout for Minimized Stub Instances on Controlled-Impedance Differential-Transmission Line Routing ♦ -40°C to +125°C Automotive Operating Temperature Range ♦ UCSP Packaging Available Applications DVI Input/Output Protection Set-Top Boxes Ordering Information PART TEMP RANGE PINPACKAGE PKG CODE MAX3205EABL-T -40°C to +125°C 9 UCSP-9 MAX3205EATE 16 TQFN-EP* -40°C to +125°C T1633-4 (3mm x 3mm) B9-2 MAX3207EAUT-T -40°C to +125°C 6 SOT23-6 U6-1 MAX3208EAUB -40°C to +125°C 10 µMAX U10-2 MAX3208EATE -40°C to +125°C 16 TQFN-EP* T1633-4 (3mm x 3mm) *EP = Exposed pad. FireWire is a registered trademark of Apple Computer, Inc. PCI Express is a trademark of PCI-SIG Corporation. DVI is a trademark of Digital Display Working Group. HDMI is a trademark of HDMI Licensing, LCC. InfiniBand is a registered trademark of InfiniBand Trade Association. UCSP is a trademark and µMAX is a registered trademark of Maxim Integrated Products, Inc. PDAs/Cell Phones Graphics Controller Cards Selector Guide Displays/Projectors High-Speed, Full-Speed and Low-Speed USB Port Protection PART ESD-PROTECTED I/O PORTS TOP MARK FireWire IEEE 1394 Ports MAX3205EABL-T 6 AES Consumer Equipment MAX3205EATE 6 ACO High-Speed Differential Signal Protection MAX3207EAUT-T 2 ABVG MAX3208EAUB 4 — MAX3208EATE 4 ACN Typical Operating Circuit and Pin Configurations appear at end of data sheet. ________________________________________________________________ Maxim Integrated Products For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at 1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com. 1 MAX3205E/MAX3207E/MAX3208E General Description MAX3205E/MAX3207E/MAX3208E Dual, Quad, and Hex High-Speed Differential ESD-Protection ICs ABSOLUTE MAXIMUM RATINGS VCC to GND ...........................................................-0.3V to +6.0V I/O_ to GND ................................................-0.3V to (VCC + 0.3V) Continuous Power Dissipation (TA = +70°C) 6-Pin SOT23 (derate 8.7mW/°C above +70°C)............696mW 9-Pin UCSP (derate 4.7mW/°C above +70°C) .............379mW 10-Pin µMAX (derate 5.6mW/°C above +70°C) ...........444mW 16-Pin Thin QFN (derate 20.8mW/°C above +70°C) .1667mW Operating Temperature Range .........................-40°C to +125°C Storage Temperature Range .............................-65°C to +150°C Junction Temperature .....................................................+150°C Lead Temperature (soldering, 10s) .................................+300°C Bump Temperature (soldering) Infrared (15s) ...............................................................+220°C Vapor Phase (60s) .......................................................+215°C Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS (VCC = +5V, TA = TMIN to TMAX, unless otherwise noted. Typical values are at VCC = +5V and TA = +25°C.) (Note 1) PARAMETER SYMBOL Supply Voltage VCC Supply Current ICC Diode Forward Voltage VF Channel Clamp Voltage (Note 2) VC CONDITIONS MIN TYP MAX 5.5 V 1 100 nA 0.95 V 0.9 IF = 10mA 0.65 TA = +25°C, ±15kV Human Body Model, IF = 10A Positive transients VCC + 25 Negative transients -25 TA = +25°C, ±8kV Contact Discharge (IEC 61000-4-2), IF = 24A Positive transients VCC + 60 Negative transients -60 TA = +25°C, ±15kV Air-Gap Positive transients Discharge (IEC 61000-4-2), Negative transients IF = 45A Channel Leakage Current Channel I/O to I/O Variation in Capacitance VCC = +3.3V, bias of VCC / 2 ∆CIN -100 +0.1 MAX3205EABL-T MAX3207EAUT 2.5 3 MAX3205EATE MAX3208EATE 2.7 3.2 MAX3208EAUB 2.6 3.1 VCC = +3.3V, bias of VCC / 2, CI/O_ to GND V VCC + 100 -0.1 Channel I/O Capacitance UNITS µA pF ±0.05 pF 10 pF 9 V TRANSIENT SUPPRESSOR VCC Capacitance to GND ESD Trigger Voltage dV/dt ≤ 1V/ns (Note 3) Note 1: Parameters are 100% production tested at +25°C. Limits over temperature are guaranteed by design only. Note 2: Idealized clamp voltages. See the Applications Information section for more information. Note 3: Guaranteed by design, not production tested. 2 _______________________________________________________________________________________ Dual, Quad, and Hex High-Speed Differential ESD-Protection ICs LEAKAGE CURRENT vs. TEMPERATURE I/O_ TO VCC 1.1 0.9 0.7 GND TO I/O_ 4 INPUT CAPACITANCE (pF) LEKAGE CURRENT (pA) CLAMP VOLTAGE (V) 1.3 10,000 MAX3205E toc02 MAX3205E toc01 1.5 INPUT CAPACITANCE vs. INPUT VOLTAGE 1000 100 10 MAX3205E toc03 CLAMP VOLTAGE vs. DC CURRENT 3 2 1 0.5 0 1 0.3 10 30 50 70 90 110 130 -40 150 0 40 80 120 0 1 TEMPERATURE (°C) DC CURRENT (mA) 2 3 4 5 INPUT VOLTAGE (V) Pin Description PIN MAX3205E MAX3207E NAME MAX3208E FUNCTION TQFN UCSP SOT23 µMAX TQFN 4, 5, 7, 12, 13, 15 A2, A3, B1, B3, C1, C2 1, 4 1, 4, 6, 9 4, 7, 12, 15 I/O_ ESD-Protected Channel 1, 3, 6, 8, 9, 11, 14, 16 — 3, 6 2, 5, 7, 10 1, 3, 5, 6, 8, 9, 11, 13, 14, 16 N.C. No Connection. Not internally connected. — B2 — — — N.C. No Connection. The solder sphere is omitted from this location (see the Packaging Information section). 2 A1 2 3 2 GND Ground. Connect GND with a low-impedance connection to the ground plane. 10 C3 5 8 10 VCC Power-Supply Input. Bypass VCC to GND with a 0.1µF ceramic capacitor as close to the device as possible. EP — — — EP EP Exposed Pad. Connect EP to GND. _______________________________________________________________________________________ 3 MAX3205E/MAX3207E/MAX3208E Typical Operating Characteristics (VCC = +5V, TA = +25°C, unless otherwise noted.) MAX3205E/MAX3207E/MAX3208E Dual, Quad, and Hex High-Speed Differential ESD-Protection ICs Detailed Description The MAX3205E/MAX3207E/MAX3208E low-capacitance, ±15kV ESD-protection diode arrays with an integrated transient voltage suppressor (TVS) clamp are suitable for high-speed and general-signal ESD protection. Low input capacitance makes these devices ideal for ESD protection of signals in HDTV, PC monitors (DVI, HDMI), PC peripherals (FireWire, USB 2.0), Server Interconnect (PCI Express, Infiniband), Datacom, and Inter-Chassis Interconnect. Each channel consists of a pair of diodes that steer ESD current pulses to V CC or GND. The MAX3205E, MAX3207E, and MAX3208E are two, four, and six channels (see the Functional Diagram). The MAX3205E/MAX3207E/MAX3208E are designed to work in conjunction with a device’s intrinsic ESD protection. The MAX3205E/MAX3207E/MAX3208E limit the excursion of the ESD event to below ±25V peak voltage when subjected to the Human Body Model waveform. When subjected to the IEC 61000-4-2 waveform, the peak voltage is limited to ±60V when subjected to Contact Discharge. The peak voltage is limited to ±100V when subjected to Air-Gap Discharge. The device protected by the MAX3205E/MAX3207E/ MAX3208E must be able to withstand these peak voltages, plus any additional voltage generated by the parasitic of the board. A TVS is integrated into the MAX3205E/MAX3207E/ MAX3208E to help clamp ESD to a known voltage. This helps reduce the effects of parasitic inductance on the VCC rail by clamping VCC to a known voltage during an ESD event. For the lowest possible clamp voltage during an ESD event, placing a 0.1µF capacitor as close to VCC as possible is recommended. Functional Diagram MAX3207E MAX3208E MAX3205E VCC VCC VCC I/O1 I/O2 GND 4 I/O1 I/O3 I/O2 GND I/O4 I/O1 I/O2 I/O4 I/O3 GND _______________________________________________________________________________________ I/O5 I/O6 Dual, Quad, and Hex High-Speed Differential ESD-Protection ICs Design Considerations Maximum protection against ESD damage results from proper board layout (see the Layout Recommendations section). A good layout reduces the parasitic series inductance on the ground line, supply line, and protected signal lines. The MAX3205E/MAX3207E/MAX3208E ESD diodes clamp the voltage on the protected lines during an ESD event and shunt the current to GND or VCC. In an ideal circuit, the clamping voltage (VC) is defined as the forward voltage drop (VF) of the protection diode, plus any supply voltage present on the cathode. For positive ESD pulses: VC = VCC + VF For negative ESD pulses: VC = -VF The effect of the parasitic series inductance on the lines must also be considered (Figure 1). For positive ESD pulses: d(IESD ) ⎞ ⎛ d(IESD ) ⎞ ⎛ VC = VCC + VF(D1) + ⎜ L1 x ⎟ ⎟ + ⎜ L2 x ⎝ dt ⎠ ⎝ dt ⎠ For negative ESD pulses: ⎛ d(IESD ) ⎞ ⎛ d(IESD ) ⎞ ⎞ ⎛ VC = − ⎜ VF(D2 ) + ⎜ L1 x ⎟ + ⎜ L3 x ⎟ ⎝ ⎠ ⎝ dt dt ⎠ ⎟⎠ ⎝ During an ESD event, the current pulse rises from zero to peak value in nanoseconds (Figure 2). For example, in a 15kV IEC-61000 Air-Gap Discharge ESD event, the pulse current rises to approximately 45A in 1ns (di/dt = 45 x 109). An inductance of only 10nH adds an additional 450V to the clamp voltage, and represents approximately 0.5in of board trace. Regardless of the device’s specified diode clamp voltage, a poor layout with parasitic inductance significantly increases the effective clamp voltage at the protected signal line. Minimize the effects of parasitic inductance by placing the MAX3205E/MAX3207E/MAX3208E as close to the connector (or ESD contact point) as possible. A low-ESR 0.1µF capacitor is recommended between VCC and GND in order to get the maximum ESD protection possible. This bypass capacitor absorbs the charge transferred by a positive ESD event. Ideally, the supply rail (VCC) would absorb the charge caused by a positive ESD strike without changing its regulated value. All power supplies have an effective output impedance on their positive rails. If a power supply’s effective output impedance is 1Ω, then by using V = I x R, the clamping voltage of VC increases by the equation VC = IESD x ROUT. A +8kV IEC 61000-4-2 ESD event generates a current spike of 24A. The clamping voltage increases by VC = 24A x 1Ω, or VC = 24V. Again, a poor layout without proper bypassing increases the clamping voltage. A ceramic chip capacitor mounted as close as possible to the MAX3205E/ MAX3207E/MAX3208E VCC pin is the best choice for this application. A bypass capacitor should also be placed as close to the protected device as possible. where, IESD is the ESD current pulse. POSITIVE SUPPLY RAIL I 100% 90% D1 L1 IPEAK L2 I/O_ PROTECTED LINE D2 10% tR = 0.7ns to 1ns L3 t 30ns 60ns GROUND RAIL Figure 1. Parasitic Series Inductance Figure 2. IEC 61000-4-2 ESD Generator Current Waveform _______________________________________________________________________________________ 5 MAX3205E/MAX3207E/MAX3208E Applications Information MAX3205E/MAX3207E/MAX3208E Dual, Quad, and Hex High-Speed Differential ESD-Protection ICs ±15kV ESD Protection ESD protection can be tested in various ways. The MAX3205E/MAX3207E/MAX3208E are characterized for protection to the following limits: • ±15kV using the Human Body Model • ±8kV using the Contact Discharge Method specified in IEC 61000-4-2 • ±15kV using the IEC 61000-4-2 Air-Gap Discharge Method ESD Test Conditions ESD performance depends on a number of conditions. Contact Maxim for a reliability report that documents test setup, methodology, and results. Human Body Model Figure 3 shows the Human Body Model, and Figure 4 shows the current waveform it generates when discharged into a low impedance. This model consists of a 100pF capacitor charged to the ESD voltage of interest, which is then discharged into the device through a 1.5kΩ resistor. IEC 61000-4-2 The IEC 61000-4-2 standard covers ESD testing and performance of finished equipment. The MAX3205E/ MAX3207E/MAX3208E help users design equipment that meets Level 4 of IEC 61000-4-2. The main difference between tests done using the Human Body Model RC 1MΩ CHARGE-CURRENTLIMIT RESISTOR HIGHVOLTAGE DC SOURCE Cs 100pF IP 100% 90% 10% 0 0 tRL TIME tDL CURRENT WAVEFORM Figure 4. Human Body Model Current Waveform RC 50Ω to 100Ω CHARGE-CURRENTLIMIT RESISTOR DEVICE UNDER TEST PEAK-TO-PEAK RINGING (NOT DRAWN TO SCALE) 36.8% DISCHARGE RESISTANCE STORAGE CAPACITOR Ir AMPERES RD 1.5kΩ Figure 3. Human Body ESD Test Model 6 and IEC 61000-4-2 is higher peak current in IEC 610004-2. Because series resistance is lower in the IEC 61000-4-2 ESD test model (Figure 5), the ESDwithstand voltage measured to this standard is generally lower than that measured using the Human Body Model. Figure 2 shows the current waveform for the ±8kV, IEC 61000-4-2 Level 4, ESD Contact Discharge test. The Air-Gap Discharge test involves approaching the device with a charged probe. The Contact Discharge method connects the probe to the device before the probe is energized. HIGHVOLTAGE DC SOURCE Cs 150pF RD 330Ω DISCHARGE RESISTANCE STORAGE CAPACITOR Figure 5. IEC 61000-4-2 ESD Test Model _______________________________________________________________________________________ DEVICE UNDER TEST Dual, Quad, and Hex High-Speed Differential ESD-Protection ICs 3) Ensure short low-inductance ESD transient return paths to GND and VCC. 4) Minimize conductive power and ground loops. 5) Do not place critical signals near the edge of the PC board. 6) Bypass VCC to GND with a low-ESR ceramic capacitor as close to VCC as possible. 7) Bypass the supply of the protected device to GND with a low-ESR ceramic capacitor as close to the supply pin as possible. UCSP Applications Information For the latest application details on UCSP construction, dimensions, tape carrier information, printed circuit board techniques, bump-pad layout, and recommended reflow temperature profile, as well as the latest information on reliability testing results, go to the Maxim website at www.maxim-ic.com/ucsp for the Application Note, UCSP—A Wafer-Level Chip-Scale Package. Chip Information DIODE COUNT: MAX3205E: 7 MAX3207E: 3 MAX3208E: 5 PROCESS: BiCMOS Typical Operating Circuit L2 VCC L1 I/0 I/0 LINE I/0_ PROTECTED LINE VCC VCC NEGATIVE ESDCURRENT PULSE PATH TO GROUND 0.1µF 0.1µF D1 VC I/O_ D2 PROTECTED CIRCUIT PROTECTED CIRCUIT MAX3205E MAX3207E MAX3208E L3 GND Figure 6. Layout Considerations _______________________________________________________________________________________ 7 MAX3205E/MAX3207E/MAX3208E Layout Recommendations Proper circuit-board layout is critical to suppress ESDinduced line transients (See Figure 6). The MAX3205E/ MAX3207E/MAX3208E clamp to 100V; however, with improper layout, the voltage spike at the device can be much higher. A lead inductance of 10nH with a 45A current spike results in an additional 450V spike on the protected line. It is essential that the layout of the PC board follows these guidelines: 1) Minimize trace length between the connector or input terminal, I/O_, and the protected signal line. 2) Use separate planes for power and ground to reduce parasitic inductance and to reduce the impedance to the power rails for shunted ESD current. Dual, Quad, and Hex High-Speed Differential ESD-Protection ICs MAX3205E/MAX3207E/MAX3208E Pin Configurations MAX3205E C2 C3 N.C. I/O2 15 14 13 I/O4 I/O1 1 N.C. 1 12 I/O3 GND 2 11 N.C. N.C. 3 10 VCC I/O6 4 9 N.C. MAX3205E VCC I/O5 UCSP (BUMPS ON BOTTOM) I/O1 1 10 N.C. N.C. 2 9 I/O4 GND 3 8 I/O2 4 N.C. 5 MAX3208E 7 GND 2 MAX3207E N.C. 3 8 SOT23 N.C. I/O1 N.C. N.C. THIN QFN 16 15 14 13 N.C. 1 12 I/O2 VCC GND 2 11 N.C. 7 N.C. N.C. 3 10 VCC 6 I/O3 I/O4 4 9 N.C. MAX3208E 5 N.C. µMAX 6 N.C. 5 I/O3 6 7 8 N.C. C1 B3 16 I/O5 N.C. A3 I/O4 I/O2 B1 A2 I/O3 I/O1 A1 N.C. GND I/O1 I/O6 N.C. TOP VIEW THIN QFN 8 _______________________________________________________________________________________ 6 N.C. 5 VCC 4 I/O2 Dual, Quad, and Hex High-Speed Differential ESD-Protection ICs 9LUCSP, 3x3.EPS PACKAGE OUTLINE, 3x3 UCSP 21-0093 I 1 1 _______________________________________________________________________________________ 9 MAX3205E/MAX3207E/MAX3208E Package Information (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information, go to www.maxim-ic.com/packages.) Package Information (continued) (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information, go to www.maxim-ic.com/packages.) e 10LUMAX.EPS MAX3205E/MAX3207E/MAX3208E Dual, Quad, and Hex High-Speed Differential ESD-Protection ICs 4X S 10 INCHES 10 H Ø0.50±0.1 0.6±0.1 1 1 0.6±0.1 BOTTOM VIEW TOP VIEW D2 MILLIMETERS MAX DIM MIN 0.043 A 0.006 A1 0.002 A2 0.030 0.037 0.120 D1 0.116 0.118 D2 0.114 E1 0.116 0.120 0.118 E2 0.114 0.199 H 0.187 L 0.0157 0.0275 L1 0.037 REF b 0.007 0.0106 e 0.0197 BSC c 0.0035 0.0078 0.0196 REF S α 0° 6° MAX MIN 1.10 0.05 0.15 0.75 0.95 2.95 3.05 2.89 3.00 2.95 3.05 2.89 3.00 4.75 5.05 0.40 0.70 0.940 REF 0.177 0.270 0.500 BSC 0.090 0.200 0.498 REF 0° 6° E2 GAGE PLANE A2 c A b D1 FRONT VIEW A1 α E1 L L1 SIDE VIEW PROPRIETARY INFORMATION TITLE: PACKAGE OUTLINE, 10L uMAX/uSOP APPROVAL DOCUMENT CONTROL NO. 21-0061 10 ______________________________________________________________________________________ REV. I 1 1 Dual, Quad, and Hex High-Speed Differential ESD-Protection ICs 6LSOT.EPS ______________________________________________________________________________________ 11 MAX3205E/MAX3207E/MAX3208E Package Information (continued) (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information, go to www.maxim-ic.com/packages.) Package Information (continued) (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information, go to www.maxim-ic.com/packages.) 12x16L QFN THIN.EPS MAX3205E/MAX3207E/MAX3208E Dual, Quad, and Hex High-Speed Differential ESD-Protection ICs D2 0.10 M C A B b D D2/2 D/2 E/2 E2/2 CL (NE - 1) X e E E2 L e CL k (ND - 1) X e CL 0.10 C CL 0.08 C A A2 A1 L L e e PACKAGE OUTLINE 12, 16L, THIN QFN, 3x3x0.8mm 21-0136 12 ______________________________________________________________________________________ E 1 2 Dual, Quad, and Hex High-Speed Differential ESD-Protection ICs PKG 12L 3x3 16L 3x3 REF. MIN. NOM. MAX. MIN. NOM. MAX. A 0.70 0.75 0.80 0.70 0.75 0.80 b 0.20 0.25 0.30 0.20 0.25 0.30 D 2.90 3.00 3.10 2.90 3.00 3.10 E e 2.90 3.00 3.10 2.90 3.00 3.10 L 0.45 0.65 0.30 0.50 BSC. 0.55 0.50 BSC. N 12 16 ND 3 4 NE 3 4 A1 A2 k 0 0.02 0.20 REF 0.25 0.05 - 0.50 0.40 0 0.02 0.05 0.25 0.20 REF - - EXPOSED PAD VARIATIONS PKG. CODES E2 D2 MAX. MIN. NOM. MAX. PIN ID JEDEC DOWN BONDS ALLOWED MIN. NOM. T1233-1 0.95 1.10 1.25 0.95 1.10 1.25 0.35 x 45∞ WEED-1 NO T1233-3 0.95 1.10 1.25 0.95 1.10 1.25 0.35 x 45∞ WEED-1 YES T1633-1 0.95 1.10 1.25 0.95 1.10 1.25 0.35 x 45∞ WEED-2 NO T1633-2 0.95 1.10 1.25 0.95 1.10 1.25 0.35 x 45∞ WEED-2 YES T1633F-3 0.65 0.80 0.95 0.65 0.80 0.95 0.225 x 45∞ WEED-2 N/A T1633-4 0.95 1.10 1.25 0.95 1.10 1.25 0.35 x 45∞ NO WEED-2 NOTES: 1. DIMENSIONING & TOLERANCING CONFORM TO ASME Y14.5M-1994. 2. ALL DIMENSIONS ARE IN MILLIMETERS. ANGLES ARE IN DEGREES. 3. N IS THE TOTAL NUMBER OF TERMINALS. 4. THE TERMINAL #1 IDENTIFIER AND TERMINAL NUMBERING CONVENTION SHALL CONFORM TO JESD 95-1 SPP-012. DETAILS OF TERMINAL #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE TERMINAL #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE. 5. DIMENSION b APPLIES TO METALLIZED TERMINAL AND IS MEASURED BETWEEN 0.20 mm AND 0.25 mm FROM TERMINAL TIP. 6. ND AND NE REFER TO THE NUMBER OF TERMINALS ON EACH D AND E SIDE RESPECTIVELY. 7. DEPOPULATION IS POSSIBLE IN A SYMMETRICAL FASHION. 8. COPLANARITY APPLIES TO THE EXPOSED HEAT SINK SLUG AS WELL AS THE TERMINALS. 9. DRAWING CONFORMS TO JEDEC MO220 REVISION C. PACKAGE OUTLINE 12, 16L, THIN QFN, 3x3x0.8mm 21-0136 E 2 2 Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time. Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________ 13 © 2005 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products, Inc. MAX3205E/MAX3207E/MAX3208E Package Information (continued) (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information, go to www.maxim-ic.com/packages.)