± SLLS349J − JUNE 1999 − REVISED MARCH 2004
D RS-232 Bus-Pin ESD Protection Exceeds
D
D
D
D
D
D
D
D
D
D
DB OR PW PACKAGE
(TOP VIEW)
±15 kV Using Human-Body Model (HBM)
Meets or Exceeds the Requirements of
TIA/EIA-232-F and ITU v.28 Standards
Operates With 3-V to 5.5-V VCC Supply
Operates Up To 250 kbit/s
Five Drivers and Three Receivers
Low Standby Current . . . 1 µA Typical
External Capacitors . . . 4 × 0.1 µF
Accepts 5-V Logic Input With 3.3-V Supply
Always-Active Noninverting Receiver
Output (ROUT1B)
Alternative High-Speed Pin-Compatible
Device (1 Mbit/s)
− SNx5C3238
Applications
− Battery-Powered Systems, PDAs,
Notebooks, Subnotebooks, Laptops,
Palmtop PCs, Hand-Held Equipment,
Modems, and Printers
C2 +
GND
C2−
V−
DOUT1
DOUT2
DOUT3
RIN1
RIN2
DOUT4
RIN3
DOUT5
FORCEON
FORCEOFF
1
28
2
27
3
26
4
25
5
24
6
23
7
22
8
21
9
20
10
19
11
18
12
17
13
16
14
15
C1+
V+
VCC
C1−
DIN1
DIN2
DIN3
ROUT1
ROUT2
DIN4
ROUT3
DIN5
ROUT1B
INVALID
description/ordering information
The MAX3238 consists of five line drivers, three line receivers, and a dual charge-pump circuit with ±15-kV ESD
(HBM) protection pin to pin (serial-port connection pins, including GND). The device meets the requirements
of TIA/EIA-232-F and provides the electrical interface between notebook and subnotebook computer
applications. The charge pump and four small external capacitors allow operation from a single 3-V to 5.5-V
supply. In addition, the device includes an always-active noninverting output (ROUT1B), which allows
applications using the ring indicator to transmit data while the device is powered down. These devices operate
at data signaling rates up to 250 kbit/s and a maximum of 30-V/µs driver output slew rate.
ORDERING INFORMATION
ORDERABLE
PART NUMBER
PACKAGE†
TA
SSOP (DB)
−0°C to 70°C
TSSOP (PW)
SSOP (DB)
−40°C to 85°C
TSSOP (PW)
Tube of 50
MAX3238CDB
Reel of 2000
MAX3238CDBR
Tube of 50
MAX3238CPW
Reel of 2000
MAX3238CPWR
Tube of 50
MAX3238IDB
Reel of 2000
MAX3238IDBR
Tube of 50
MAX3238IPW
Reel of 2000
MAX3238IPWR
TOP-SIDE
MARKING
MAX3238C
MA3238C
MAX3238I
MB3238I
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2004, Texas Instruments Incorporated
!"#$%&'(!$" !) *+%%,"( ') $# -+./!*'(!$" 0'(,
%$0+*() *$"#$%& ($ )-,*!#!*'(!$") -,% (1, (,%&) $# ,2') ")(%+&,"()
)('"0'%0 3'%%'"(4 %$0+*(!$" -%$*,))!"5 0$,) "$( ",*,))'%!/4 !"*/+0,
(,)(!"5 $# '// -'%'&,(,%)
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description/ordering information (continued)
Flexible control options for power management are featured when the serial port and driver inputs are inactive.
The auto-powerdown plus feature functions when FORCEON is low and FORCEOFF is high. During this mode
of operation, if the device does not sense valid signal transitions on all receiver and driver inputs for
approximately 30 s, the built-in charge pump and drivers are powered down, reducing the supply current to
1 µA. By disconnecting the serial port or placing the peripheral drivers off, auto-powerdown plus occurs if there
is no activity in the logic levels for the driver inputs. Auto-powerdown plus can be disabled when FORCEON
and FORCEOFF are high. With auto-powerdown plus enabled, the device activates automatically when a valid
signal is applied to any receiver or driver input. INVALID is high (valid data) if any receiver input voltage is greater
than 2.7 V or less than −2.7 V, or has been between −0.3 V and 0.3 V for less than 30 µs. INVALID is low (invalid
data) if all receiver input voltages are between −0.3 V and 0.3 V for more than 30 µs. Refer to Figure 5 for receiver
input levels.
Function Tables
EACH DRIVER
INPUTS
OUTPUT
DOUT
DRIVER STATUS
X
Z
Powered off
Normal operation with
auto-powerdown plus disabled
DIN
FORCEON
FORCEOFF
TIME ELAPSED SINCE LAST
RIN OR DIN TRANSITION
X
X
L
L
H
H
X
H
H
H
H
X
L
L
L
H
<30 s
H
H
L
H
<30 s
L
L
L
H
>30 s
Z
H
L
H
>30 s
Z
Normal operation with
auto-powerdown plus enabled
Powered off by
auto-powerdown plus feature
H = high level, L = low level, X = irrelevant, Z = high impedance
EACH RECEIVER
INPUTS
RIN1
RIN2−RIN3
FORCEOFF
OUTPUTS
TIME ELAPSED SINCE LAST RIN
OR DIN TRANSITION
ROUT1B
ROUT
L
X
L
X
L
Z
H
X
L
X
H
Z
L
L
H
<30 s
L
H
L
H
H
<30 s
L
L
H
L
H
<30 s
H
H
H
H
H
<30 s
H
L
Open
Open
H
>30 s
L
H
RECEIVER STATUS
Powered off while
ROUT1B is active
Normal operation with
auto-powerdown plus
disabled/enabled
H = high level, L = low level, X = irrelevant, Z = high impedance (off), Open = input disconnected or connected driver off
2
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± SLLS349J − JUNE 1999 − REVISED MARCH 2004
logic diagram (positive logic)
DIN1
DIN2
DIN3
DIN4
DIN5
FORCEOFF
FORCEON
ROUT1B
ROUT1
ROUT2
ROUT3
24
5
23
6
22
7
19
10
17
12
DOUT1
DOUT2
DOUT3
DOUT4
DOUT5
14
13
Auto-powerdown
Plus
15
INVALID
16
21
8
20
9
18
11
RIN1
RIN2
RIN3
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3
± SLLS349J − JUNE 1999 − REVISED MARCH 2004
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 6 V
Positive output supply voltage range, V+ (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 7 V
Negative output supply voltage range, V− (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.3 V to −7 V
Supply voltage difference, V+ − V− (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 V
Input voltage range, VI: Driver (FORCEOFF, FORCEON) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 6 V
Receiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −25 V to 25 V
Output voltage range, VO: Driver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −13.2 V to 13.2 V
Receiver (INVALID) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to VCC + 0.3 V
Package thermal impedance, θJA (see Notes 2 and 3): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . 62°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . 62°C/W
Operating virtual junction temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltages are with respect to network GND.
2. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable
ambient temperature is PD = (TJ(max) − TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
3. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 4 and Figure 6)
VCC = 3.3 V
VCC = 5 V
Supply voltage
VIH
Driver and control high-level input voltage
DIN, FORCEOFF, FORCEON
VIL
VI
Driver and control low-level input voltage
DIN, FORCEOFF, FORCEON
Driver and control input voltage
DIN, FORCEOFF, FORCEON
VI
Receiver input voltage
VCC = 3.3 V
VCC = 5 V
MAX3238C
TA
Operating free-air temperature
MAX3238I
MIN
NOM
MAX
3
3.3
3.6
4.5
5
5.5
UNIT
V
2
V
2.4
0.8
V
0
5.5
V
−25
25
V
0
70
−40
85
°C
NOTE 4: Testing supply conditions are C1−C4 = 0.1 µF at VCC = 3.3 V ± 0.15 V; C1−C4 = 0.22 µF at VCC = 3.3 V ± 0.3 V; and C1 = 0.047 µF
and C2−C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4 and Figure 6)
PARAMETER
II
ICC
Input leakage current
Supply current
(TA = 25
25°C)
C)
TEST CONDITIONS
FORCEOFF, FORCEON
MIN
TYP‡
MAX
±0.01
±1
µA
0.5
2
mA
Auto-powerdown plus
disabled
No load,
FORCEOFF and FORCEON at VCC
Powered off
No load, FORCEOFF at GND
1
10
Auto-powerdown plus
enabled
No load, FORCEOFF at VCC,
FORCEON at GND,
All RIN are open or grounded
1
10
UNIT
µA
‡ All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
NOTE 4: Testing supply conditions are C1−C4 = 0.1 µF at VCC = 3.3 V ± 0.15 V; C1−C4 = 0.22 µF at VCC = 3.3 V ± 0.3 V; and C1 = 0.047 µF
and C2−C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
4
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DRIVER SECTION
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4 and Figure 6)
PARAMETER
TEST CONDITIONS
MIN
TYP†
VOH
VOL
High-level output voltage
All DOUT at RL = 3 kΩ to GND
5
5.4
Low-level output voltage
All DOUT at RL = 3 kΩ to GND
−5
−5.4
IIH
IIL
High-level input current
VI = VCC
VI at GND
Low-level input current
IOS
Short-circuit output current‡
VCC = 3.6 V,
VCC = 5.5 V,
ro
Output resistance
VCC, V+, and V− = 0 V,
±0.01
VO = 0 V
VO = 0 V
VO = ±2 V
VO = ±12 V,
300
MAX
UNIT
V
V
±1
µA
±0.01
±1
µA
±35
±60
±40
±100
mA
Ω
10M
±25
VCC = 3 V to 3.6 V
µA
VO = ±10 V,
VCC = 4.5 V to 5.5 V
±25
† All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
‡ Short-circuit durations should be controlled to prevent exceeding the device absolute power-dissipation ratings, and not more than one output
should be shorted at a time.
NOTE 4: Testing supply conditions are C1−C4 = 0.1 µF at VCC = 3.3 V ± 0.15 V; C1−C4 = 0.22 µF at VCC = 3.3 V ± 0.3 V; and C1 = 0.047 µF
and C2−C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
Ioff
Output leakage current
FORCEOFF = GND
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4 and Figure 6)
PARAMETER
TEST CONDITIONS
Maximum data rate
CL = 1000 pF,
One DOUT switching,
RL = 3 kΩ,
See Figure 1
tsk(p)
Pulse skew§
CL = 150 pF to 2500 pF
RL = 3 kΩ to 7 kΩ,
See Figure 2
SR(tr)
Slew rate, transition region
(see Figure 1)
VCC = 3.3 V,
RL = 3 kΩ to 7 kΩ
MIN
TYP†
150
250
kbit/s
100
ns
MAX
CL = 150 pF to 1000 pF
6
30
CL = 150 pF to 2500 pF
4
30
UNIT
V/µs
† All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
§ Pulse skew is defined as |tPLH − tPHL| of each channel of the same device.
NOTE 4: Testing supply conditions are C1−C4 = 0.1 µF at VCC = 3.3 V ± 0.15 V; C1−C4 = 0.22 µF at VCC = 3.3 V ± 0.3 V; and C1 = 0.047 µF
and C2−C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
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5
± SLLS349J − JUNE 1999 − REVISED MARCH 2004
RECEIVER SECTION
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4 and Figure 6)
PARAMETER
VOH
VOL
TEST CONDITIONS
High-level output voltage
IOH = −1 mA
IOL = 1.6 mA
Low-level output voltage
VIT+
Positive-going input threshold voltage
VCC = 3.3 V
VCC = 5 V
VIT−
Negative-going input threshold voltage
VCC = 3.3 V
VCC = 5 V
Vhys
Ioff
Input hysteresis (VIT+ − VIT−)
MIN
TYP†
VCC−0.6 V
VCC−0.1 V
MAX
V
0.4
1.5
2.4
1.8
2.4
0.6
1.2
0.8
1.5
±0.05
FORCEOFF = 0 V
V
V
V
0.3
Output leakage current (except ROUT1B)
UNIT
V
±10
µA
ri
Input resistance
VI = ±3 V to ±25 V
3
5
7
kΩ
† All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
NOTE 4: Testing supply conditions are C1−C4 = 0.1 µF at VCC = 3.3 V ± 0.15 V; C1−C4 = 0.22 µF at VCC = 3.3 V ± 0.3 V; and C1 = 0.047 µF
and C2−C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4)
PARAMETER
TEST CONDITIONS
tPLH
tPHL
Propagation delay time, low- to high-level output
ten
tdis
Output enable time
Propagation delay time, high- to low-level output
Output disable time
Pulse skew‡
CL = 150 pF, See Figure 3
CL = 150 pF, RL = 3 kΩ,
kΩ See Figure 4
MIN
TYP†
MAX
UNIT
150
ns
150
ns
200
ns
200
ns
tsk(p)
See Figure 3
50
ns
† All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
‡ Pulse skew is defined as |tPLH − tPHL| of each channel of the same device.
NOTE 4: Testing supply conditions are C1−C4 = 0.1 µF at VCC = 3.3 V ± 0.15 V; C1−C4 = 0.22 µF at VCC = 3.3 V ± 0.3 V; and C1 = 0.047 µF
and C2−C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
6
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AUTO-POWERDOWN PLUS SECTION
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Figure 5)
PARAMETER
TEST CONDITIONS
MIN
VT+(valid)
Receiver input threshold
for INVALID high-level output voltage
FORCEON = GND,
FORCEOFF = VCC
VT−(valid)
Receiver input threshold
for INVALID high-level output voltage
FORCEON = GND,
FORCEOFF = VCC
−2.7
VT(invalid)
Receiver input threshold
for INVALID low-level output voltage
FORCEON = GND,
FORCEOFF = VCC
−0.3
VOH
INVALID high-level output voltage
IOH = −1 mA, FORCEON = GND,
FORCEOFF = VCC
VOL
INVALID low-level output voltage
IOL = 1.6 mA, FORCEON = GND,
FORCEOFF = VCC
TYP†
MAX
UNIT
2.7
V
V
0.3
V
VCC−0.6
V
0.4
V
† All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Figure 5)
PARAMETER
MIN
TYP†
MAX
UNIT
tvalid
Propagation delay time, low- to high-level output
0.1
µs
tinvalid
Propagation delay time, high- to low-level output
50
µs
ten
tdis
Supply enable time
µs
25
Receiver or driver edge to auto-powerdown plus
15
30
60
s
† All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
PARAMETER MEASUREMENT INFORMATION
3V
Generator
(see Note B)
Input
RS-232
Output
50 Ω
RL
tTHL
CL
(see Note A)
3V
FORCEOFF
TEST CIRCUIT
0V
Output
6V
SR(tr) +
t THL or t TLH
tTLH
3V
3V
−3 V
−3 V
VOH
VOL
VOLTAGE WAVEFORMS
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
Figure 1. Driver Slew Rate
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± SLLS349J − JUNE 1999 − REVISED MARCH 2004
PARAMETER MEASUREMENT INFORMATION
3V
Generator
(see Note B)
RS-232
Output
50 Ω
Input
0V
CL
(see Note A)
RL
1.5 V
1.5 V
tPHL
tPLH
VOH
3V
FORCEOFF
50%
50%
Output
VOL
TEST CIRCUIT
VOLTAGE WAVEFORMS
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
Figure 2. Driver Pulse Skew
3 V or 0 V
FORCEON
3V
Input
1.5 V
1.5 V
−3 V
Output
Generator
(see Note B)
50 Ω
tPHL
CL
(see Note A)
3V
FORCEOFF
tPLH
VOH
50%
Output
50%
VOL
TEST CIRCUIT
VOLTAGE WAVEFORMS
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
Figure 3. Receiver Propagation Delay Times
3V
3 V or 0 V
FORCEON
VCC
S1
Input
1.5 V
0V
tPHZ
(S1 at GND)
RL
3 V or 0 V
1.5 V
GND
VOH
Output
50%
Output
CL
(see Note A)
FORCEOFF
Generator
(see Note B)
0.3 V
tPLZ
(S1 at VCC)
50 Ω
tPZL
(S1 at VCC)
0.3 V
Output
50%
VOL
TEST CIRCUIT
NOTES: A.
B.
C.
D.
VOLTAGE WAVEFORMS
CL includes probe and jig capacitance.
The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
tPLZ and tPHZ are the same as tdis.
tPZL and tPZH are the same as ten.
Figure 4. Receiver Enable and Disable Times
8
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± SLLS349J − JUNE 1999 − REVISED MARCH 2004
PARAMETER MEASUREMENT INFORMATION
ÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎ
Valid RS-232 Level, INVALID High
ROUT
Generator
(see Note B)
2.7 V
50 Ω
Indeterminate
0.3 V
0V
If Signal Remains Within This Region
For More Than 30 µs, INVALID Is Low†
−0.3 V
Indeterminate
Autopowerdown
Plus
INVALID
−2.7 V
CL = 30 pF
(see Note A)
Valid RS-232 Level, INVALID High
† Auto-powerdown plus disables drivers and reduces
supply current to 1 µA.
FORCEOFF
FORCEON
DIN
DOUT
TEST CIRCUIT
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following
characteristics: PRR = 5 kbit/s, ZO = 50 Ω,
50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
Receiver
Input
3V
2.7 V
0V
0V
−2.7 V
−3 V
tinvalid
tvalid
INVALID
Output
Driver
Input
50%
VCC
50%
0V
3 V to 5 V
50%
50%
0V
≈5.5 V
Driver
Output
≈ −5.5 V
tdis
ten
tdis
V+
Supply
Voltages
ten
V+
V+ −0.3 V
V− +0.3 V
V−
V−
Voltage Waveforms and Timing Diagrams
Figure 5. INVALID Propagation-Delay Times and Supply-Enabling Time
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± SLLS349J − JUNE 1999 − REVISED MARCH 2004
APPLICATION INFORMATION
CBYPASS = 0.1 µF
+
−
1
2
+
C2
27
+
GND
−
4
+
V+
28
−
3
−
C1+
C2+
C2−
VCC
V−
C1−
C4
DOUT1
DOUT2
DOUT3
RIN1
C3†
+
−
26
C1
25
5
24
6
23
7
22
8
21
9
20
DIN1
DIN2
DIN3
ROUT1
RS-232 Port
RIN2
ROUT2
Logic I/Os
5 kΩ
DOUT4
RIN3
10
19
11
18
DIN4
ROUT3
5 kΩ
DOUT5
12
17
16
DIN5
ROUT1B
5 kΩ
FORCEON
FORCEOFF
13
14
Autopowerdown
Plus
15
INVALID
VCC vs CAPACITOR VALUES
† C3 can be connected to VCC or GND.
NOTES: A. Resistor values shown are nominal.
B. Nonpolarized ceramic capacitors are acceptable. If polarized
tantalum or electrolytic capacitors are used, they should be connected
as shown.
VCC
3.3 V ± 0.15 V
3.3 V ± 0.3 V
5 V ± 0.5 V
3 V to 5.5 V
Figure 6. Typical Operating Circuit and Capacitor Values
10
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
C1
0.1 µF
0.22 µF
0.047 µF
0.22 µF
C2, C3, and C4
0.1 µF
0.22 µF
0.33 µF
1 µF
PACKAGE OPTION ADDENDUM
www.ti.com
10-Jun-2014
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
MAX3238CDB
ACTIVE
SSOP
DB
28
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
MAX3238C
MAX3238CDBE4
ACTIVE
SSOP
DB
28
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
MAX3238C
MAX3238CDBG4
ACTIVE
SSOP
DB
28
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
MAX3238C
MAX3238CDBR
ACTIVE
SSOP
DB
28
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
MAX3238C
MAX3238CDBRE4
ACTIVE
SSOP
DB
28
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
MAX3238C
MAX3238CDBRG4
ACTIVE
SSOP
DB
28
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
MAX3238C
MAX3238CPW
ACTIVE
TSSOP
PW
28
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
MA3238C
MAX3238CPWG4
ACTIVE
TSSOP
PW
28
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
MA3238C
MAX3238CPWR
ACTIVE
TSSOP
PW
28
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
MA3238C
MAX3238CPWRG4
ACTIVE
TSSOP
PW
28
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
MA3238C
MAX3238IDB
ACTIVE
SSOP
DB
28
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
MAX3238I
MAX3238IDBR
ACTIVE
SSOP
DB
28
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
MAX3238I
MAX3238IDBRG4
ACTIVE
SSOP
DB
28
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
MAX3238I
MAX3238IPW
ACTIVE
TSSOP
PW
28
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
MB3238I
MAX3238IPWG4
ACTIVE
TSSOP
PW
28
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
MB3238I
MAX3238IPWR
ACTIVE
TSSOP
PW
28
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
MB3238I
MAX3238IPWRE4
ACTIVE
TSSOP
PW
28
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
MB3238I
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
10-Jun-2014
Status
(1)
MAX3238IPWRG4
Package Type Package Pins Package
Drawing
Qty
ACTIVE
TSSOP
PW
28
2000
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Op Temp (°C)
Device Marking
(4/5)
-40 to 85
MB3238I
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF MAX3238 :
Addendum-Page 2
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
10-Jun-2014
• Automotive: MAX3238-Q1
NOTE: Qualified Version Definitions:
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
30-Apr-2015
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
MAX3238CDBR
SSOP
DB
28
2000
330.0
16.4
8.2
10.5
2.5
12.0
16.0
Q1
MAX3238CPWR
TSSOP
PW
28
2000
330.0
16.4
6.9
10.2
1.8
12.0
16.0
Q1
MAX3238CPWR
TSSOP
PW
28
2000
330.0
16.4
6.9
10.2
1.8
12.0
16.0
Q1
MAX3238IDBR
SSOP
DB
28
2000
330.0
16.4
8.2
10.5
2.5
12.0
16.0
Q1
MAX3238IPWR
TSSOP
PW
28
2000
330.0
16.4
6.9
10.2
1.8
12.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
30-Apr-2015
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
MAX3238CDBR
SSOP
DB
28
2000
367.0
367.0
38.0
MAX3238CPWR
TSSOP
PW
28
2000
367.0
367.0
38.0
MAX3238CPWR
TSSOP
PW
28
2000
367.0
367.0
38.0
MAX3238IDBR
SSOP
DB
28
2000
367.0
367.0
38.0
MAX3238IPWR
TSSOP
PW
28
2000
367.0
367.0
38.0
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
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