ON MBR3045STG Switchmodeâ ¢ power rectifier Datasheet

MBR3045ST,
MBRB3045CT-1
SWITCHMODE™
Power Rectifier
Features and Benefits
• Dual Diode Construction — Terminals 1 and 3 May Be Connected
•
•
•
•
for Parallel Operation at Full Rating
45 V Blocking Voltage
Low Forward Voltage Drop
175°C Operating Junction Temperature
Pb−Free Packages are Available
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SCHOTTKY BARRIER
RECTIFIER
30 AMPERES
45 VOLTS
Applications
• Power Supply − Output Rectification
• Power Management
• Instrumentation
Mechanical Characteristics
3
• Case: Epoxy, Molded
• Weight (Approximately): 1.9 Grams (TO−220AB)
•
•
•
2, 4
1
1.5 Grams (TO−262)
Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
Lead Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
Epoxy Meets UL 94 V−0 @ 0.125 in
MARKING
DIAGRAMS
4
TO−220AB
CASE 221A
STYLE 6
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
45
V
Average Rectified Current
(TC = 130°C)
IF(AV)
30
15
A
Peak Repetitive Forward Current, per Diode
(Square Wave, VR = 45 V, 20 kHz)
IFRM
30
A
Non−Repetitive Peak Surge Current (Surge
Applied at Rated Load Conditions,
Halfwave, Single Phase, 60 Hz)
IFSM
150
A
Peak Repetitive Reverse Current, per Diode
(2.0 ms, 1.0 kHz)
IRRM
2.0
A
Storage Temperature Range
Tstg
−65 to
+175
°C
Operating Junction Temperature (Note 1)
TJ
−65 to
+175
°C
TJ(pk)
175
°C
Per Device
Per Diode
Peak Surge Junction Temperature
(Forward Current Applied)
Voltage Rate of Change (Rated VR)
dv/dt
1
2
AYWW
B3045G
AKA
3
4
10,000
V/ms
I2PAK (TO−262)
CASE 418D
PLASTIC
12
3
A
Y
WW
AKA
G
AYWW
B3045CTG
AKA
= Assembly Location
= Year
= Work Week
= Polarity Designator
= Pb−Free Device
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 3 of this data sheet.
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. The heat generated must be less than the thermal conductivity from
Junction−to−Ambient: dPD/dTJ < 1/RqJA.
© Semiconductor Components Industries, LLC, 2008
May, 2008 − Rev. 7
1
Publication Order Number:
MBR3045ST/D
MBR3045ST, MBRB3045CT−1
THERMAL CHARACTERISTICS (Per Diode)
Characteristic
Thermal Resistance, Junction to Case
Symbol
Value
Unit
RθJC
1.5
°C/W
ELECTRICAL CHARACTERISTICS (Per Diode)
Instantaneous Forward Voltage (Note 2)
(iF = 15 Amp, TC = 25°C)
(iF = 15 Amp, TC = 125°C)
(iF = 30 Amp, TC = 25°C)
(iF = 30 Amp, TC = 125°C)
vF
0.62
0.57
0.76
0.72
Volts
Instantaneous Reverse Current (Note 2)
(VR = 45 Volts, TC = 25°C)
(VR = 45 Volts, TC = 125°C)
IR
0.2
40
mA
2 Pulse Test: Pulse Width = 300 μs, Duty Cycle ≤ 2.0%
200
100
150°C
100
TJ = 125°C
10
1.0
25°C
0.1
0
0.2
0.4
0.6
0.8
1.0
40
20
10
4.0
2.0
1.0
0.4
0.2
0.1
0.04
0.02
0.01
0.004
0.002
TJ = 150°C
IR , REVERSE CURRENT (mA)
i F, INSTANTANEOUS FORWARD CURRENT (AMPS)
1000
1.2
1.4
1.6
1.8
125°C
100°C
75°C
25°C
0
10
20
30
40
vF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
VR, REVERSE VOLTAGE (VOLTS)
Figure 1. Typical Forward Voltage
Figure 2. Typical Reverse Current
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2
50
28
dc
24
SQUARE WAVE
20
16
12
RATED VOLTAGE APPLIED
RqJC = 1.5°C/W
8.0
4.0
0
110
PF(AV) , AVERAGE POWER DISSIPATION (WATTS)
I F(AV) , AVERAGE FORWARD CURRENT (AMPS)
32
120
130
140
32
RATED VR APPLIED
28
dc
RqJA = 16°C/W
(With TO-220 Heat Sink)
RqJA = 60°C/W
(No Heat Sink)
24
20
SQUARE WAVE
16
12
dc
8.0
4.0
SQUARE WAVE
0
150
0
40
20
60
80
100
120
140
TC, CASE TEMPERATURE (°C)
TA, AMBIENT TEMPERATURE (°C)
Figure 3. Current Derating, Case
Figure 4. Current Derating, Ambient
160
10000
32
SQUARE WAVE
I
(RESISTIVELOAD) PK + p
I
AV
28
TJ = 25°C
f = 1 MHz
C, CAPACITANCE (pF)
IF(AV) , AVERAGE FORWARD CURRENT (AMPS)
MBR3045ST, MBRB3045CT−1
24
I
(CAPACITATIVELOAD) PK + 5.0
I
20
dc
AV
16
10
12
20
1000
100
8.0
TJ = 125°C
4.0
0
10
0
4.0
8.0
12
16
20
24
28
32
36
40
0
10
20
30
IF, AVERAGE FORWARD CURRENT (AMPS)
VR, REVERSE VOLTAGE (V)
Figure 5. Forward Power Dissipation
Figure 6. Capacitance
ORDERING INFORMATION
Device
MBR3045ST
MBR3045STG
MBRB3045CT−1
MBRB3045CT−1G
Package
Shipping
TO−220
50 Units/Rail
TO−220
(Pb−Free)
50 Units/Rail
TO−262
50 Units/Rail
TO−262
(Pb−Free)
50 Units/Rail
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3
40
50
MBR3045ST, MBRB3045CT−1
PACKAGE DIMENSIONS
TO−220
CASE 221A−09
ISSUE AF
−T−
B
F
T
SEATING
PLANE
C
S
4
DIM
A
B
C
D
F
G
H
J
K
L
N
Q
R
S
T
U
V
Z
A
Q
U
1 2 3
H
K
Z
L
R
V
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION Z DEFINES A ZONE WHERE ALL
BODY AND LEAD IRREGULARITIES ARE
ALLOWED.
J
G
D
N
INCHES
MIN
MAX
0.570
0.620
0.380
0.405
0.160
0.190
0.025
0.035
0.142
0.161
0.095
0.105
0.110
0.155
0.014
0.025
0.500
0.562
0.045
0.060
0.190
0.210
0.100
0.120
0.080
0.110
0.045
0.055
0.235
0.255
0.000
0.050
0.045
----0.080
STYLE 6:
PIN 1.
2.
3.
4.
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4
ANODE
CATHODE
ANODE
CATHODE
MILLIMETERS
MIN
MAX
14.48
15.75
9.66
10.28
4.07
4.82
0.64
0.88
3.61
4.09
2.42
2.66
2.80
3.93
0.36
0.64
12.70
14.27
1.15
1.52
4.83
5.33
2.54
3.04
2.04
2.79
1.15
1.39
5.97
6.47
0.00
1.27
1.15
----2.04
MBR3045ST, MBRB3045CT−1
PACKAGE DIMENSIONS
I2PAK (TO−262)
CASE 418D−01
ISSUE D
C
E
V
−B−
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
4
A
W
1
2
DIM
A
B
C
D
E
F
G
H
J
K
S
V
W
3
F
−T−
SEATING
PLANE
K
S
INCHES
MIN
MAX
0.335
0.380
0.380
0.406
0.160
0.185
0.026
0.035
0.045
0.055
0.122 REF
0.100 BSC
0.094
0.110
0.013
0.025
0.500
0.562
0.390 REF
0.045
0.070
0.522
0.551
MILLIMETERS
MIN
MAX
8.51
9.65
9.65
10.31
4.06
4.70
0.66
0.89
1.14
1.40
3.10 REF
2.54 BSC
2.39
2.79
0.33
0.64
12.70
14.27
9.90 REF
1.14
1.78
13.25
14.00
J
G
D 3 PL
0.13 (0.005) M T B
H
M
SWITCHMODE is a trademark of Semiconductor Components Industries, LLC.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
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MBR3045ST/D
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