ON MC14071BDR2 B-suffix series cmos gate Datasheet

MC14001B Series
B-Suffix Series CMOS Gates
MC14001B, MC14011B, MC14023B,
MC14025B, MC14071B, MC14073B,
MC14081B, MC14082B
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The B Series logic gates are constructed with P and N channel
enhancement mode devices in a single monolithic structure
(Complementary MOS). Their primary use is where low power
dissipation and/or high noise immunity is desired.
MARKING
DIAGRAMS
14
PDIP−14
P SUFFIX
CASE 646
Features
• Supply Voltage Range = 3.0 Vdc to 18 Vdc
• All Outputs Buffered
• Capable of Driving Two Low−power TTL Loads or One Low−power
•
•
•
1
14
SOIC−14
D SUFFIX
CASE 751A
Schottky TTL Load Over the Rated Temperature Range.
Double Diode Protection on All Inputs Except: Triple Diode
Protection on MC14011B and MC14081B
Pin−for−Pin Replacements for Corresponding CD4000 Series
B Suffix Devices
Pb−Free Packages are Available
14
1
Unit
−0.5 to +18.0
V
−0.5 to VDD + 0.5
V
Input or Output Current
(DC or Transient) per Pin
± 10
mA
PD
Power Dissipation, per Package
(Note 1)
500
mW
TA
Ambient Temperature Range
−55 to +125
°C
Tstg
Storage Temperature Range
−65 to +150
°C
TL
Lead Temperature
(8−Second Soldering)
260
°C
Vin, Vout
Iin, Iout
DC Supply Voltage Range
Input or Output Voltage Range
(DC or Transient)
14
0xxB
ALYWG
G
TSSOP−14
DT SUFFIX
CASE 948G
Value
VDD
Parameter
140xxBG
AWLYWW
1
MAXIMUM RATINGS (Voltages Referenced to VSS)
Symbol
MC140xxBCP
AWLYYWWG
14
SOEIAJ−14
F SUFFIX
CASE 965
MC140xxB
ALYWG
1
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Temperature Derating:
Plastic “P and D/DW” Packages: – 7.0 mW/_C From 65_C To 125_C
This device contains protection circuitry to guard against damage due to high
static voltages or electric fields. However, precautions must be taken to avoid
applications of any voltage higher than maximum rated voltages to this
high−impedance circuit. For proper operation, Vin and Vout should be constrained
to the range VSS v (Vin or Vout) v VDD.
Unused inputs must always be tied to an appropriate logic voltage level
(e.g., either VSS or VDD). Unused outputs must be left open.
xx
= Specific Device Code
A
= Assembly Location
WL, L
= Wafer Lot
YY, Y
= Year
WW, W = Work Week
G or G
= Pb−Free Package
(Note: Microdot may be in either location)
DEVICE INFORMATION
Device
Description
MC14001B
Quad 2−Input NOR Gate
MC14011B
Quad 2−Input NAND Gate
MC14023B
Triple 3−Input NAND Gate
MC14025B
Triple 3−Input NOR Gate
MC14071B
Quad 2−Input OR Gate
MC14073B
Triple 3−Input AND Gate
MC14081B
Quad 2−Input AND Gate
MC14082B
Dual 4−Input AND Gate
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 8 of this data sheet.
© Semiconductor Components Industries, LLC, 2006
October, 2006 − Rev. 6
1
Publication Order Number:
MC14001B/D
MC14001B Series
LOGIC DIAGRAMS
NAND
OR
AND
MC14001B
Quad 2−Input NOR Gate
MC14011B
Quad 2−Input NAND Gate
MC14071B
Quad 2−Input OR Gate
MC14081B
Quad 2−Input AND Gate
2 INPUT
NOR
1
2
3
1
2
3
1
2
3
1
2
3
5
6
4
5
6
4
5
6
4
5
6
4
8
9
10
8
9
10
8
9
10
8
9
10
12
13
11
12
13
11
12
13
11
12
13
11
3 INPUT
MC14025B
Triple 3−Input NOR Gate
1
2
8
3
4
5
11
12
13
9
6
10
MC14023B
Triple 3−Input NAND Gate
1
2
8
3
4
5
11
12
13
MC14073B
Triple 3−Input AND Gate
1
2
8
3
4
5
11
12
13
9
6
10
9
6
10
MC14082B
Dual 4−Input AND Gate
2
3
4
5
9
10
11
12
1
13
NC = 6, 8
VDD = PIN 14
VSS = PIN 7
FOR ALL DEVICES
PIN ASSIGNMENTS
MC14001B
Quad 2−Input NOR Gate
MC14023B
Triple 3−Input NAND Gate
MC14011B
Quad 2−Input NAND Gate
MC14025B
Triple 3−Input NOR Gate
IN 1A
1
14
VDD
IN 1A
1
14
VDD
IN 1A
1
14
VDD
IN 1A
1
14
VDD
IN 2A
2
13
IN 2D
IN 2A
2
13
IN 2D
IN 2A
2
13
IN 3C
IN 2A
2
13
IN 3C
OUTA
3
12
IN 1D
OUTA
3
12
IN 1D
IN 1B
3
12
IN 2C
IN 1B
3
12
IN 2C
OUTB
4
11
OUTD
OUTB
4
11
OUTD
IN 2B
4
11
IN 1C
IN 2B
4
11
IN 1C
IN 1B
5
10
OUTC
IN 1B
5
10
OUTC
IN 3B
5
10
OUTC
IN 3B
5
10
OUTC
IN 2B
6
9
IN 2C
IN 2B
6
9
IN 2C
OUTB
6
9
OUTA
OUTB
6
9
OUTA
VSS
7
8
IN 1C
VSS
7
8
IN 1C
VSS
7
8
IN 3A
VSS
7
8
IN 3A
MC14071B
Quad 2−Input OR Gate
MC14073B
Triple 3−Input AND Gate
MC14081B
Quad 2−Input AND Gate
MC14082B
Dual 4−Input AND Gate
IN 1A
1
14
VDD
IN 1A
1
14
VDD
IN 1A
1
14
VDD
OUTA
1
14
VDD
IN 2A
2
13
IN 2D
IN 2A
2
13
IN 3C
IN 2A
2
13
IN 2D
IN 1A
2
13
OUTB
OUTA
3
12
IN 1D
IN 1B
3
12
IN 2C
OUTA
3
12
IN 1D
IN 2A
3
12
IN 4B
OUTB
4
11
OUTD
IN 2B
4
11
IN 1C
OUTB
4
11
OUTD
IN 3A
4
11
IN 3B
IN 1B
5
10
OUTC
IN 3B
5
10
OUTC
IN 1B
5
10
OUTC
IN 4A
5
10
IN 2B
IN 2B
6
9
IN 2C
OUTB
6
9
OUTA
IN 2B
6
9
IN 2C
NC
6
9
IN 1B
VSS
7
8
IN 1C
VSS
7
8
IN 3A
VSS
7
8
IN 1C
VSS
7
8
NC
NC = NO CONNECTION
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2
MC14001B Series
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ELECTRICAL CHARACTERISTICS (Voltages Referenced to VSS)
Characteristic
Output Voltage
Vin = VDD or 0
Symbol
− 55_C
25_C
125_C
VDD
Vdc
Min
Max
Min
Typ (2)
Max
Min
Max
Unit
“0” Level
VOL
5.0
10
15
−
−
−
0.05
0.05
0.05
−
−
−
0
0
0
0.05
0.05
0.05
−
−
−
0.05
0.05
0.05
Vdc
“1” Level
VOH
5.0
10
15
4.95
9.95
14.95
−
−
−
4.95
9.95
14.95
5.0
10
15
−
−
−
4.95
9.95
14.95
−
−
−
Vdc
Input Voltage
“0” Level
(VO = 4.5 or 0.5 Vdc)
(VO = 9.0 or 1.0 Vdc)
(VO = 13.5 or 1.5 Vdc)
VIL
5.0
10
15
−
−
−
1.5
3.0
4.0
−
−
−
2.25
4.50
6.75
1.5
3.0
4.0
−
−
−
1.5
3.0
4.0
“1” Level
VIH
5.0
10
15
3.5
7.0
11
−
−
−
3.5
7.0
11
2.75
5.50
8.25
−
−
−
3.5
7.0
11
−
−
−
5.0
5.0
10
15
– 3.0
– 0.64
– 1.6
– 4.2
−
−
−
−
– 2.4
– 0.51
– 1.3
– 3.4
– 4.2
– 0.88
– 2.25
– 8.8
−
−
−
−
– 1.7
– 0.36
– 0.9
– 2.4
−
−
−
−
IOL
5.0
10
15
0.64
1.6
4.2
−
−
−
0.51
1.3
3.4
0.88
2.25
8.8
−
−
−
0.36
0.9
2.4
−
−
−
mAdc
Input Current
Iin
15
−
± 0.1
−
± 0.00001
± 0.1
−
± 1.0
mAdc
Input Capacitance
(Vin = 0)
Cin
−
−
−
−
5.0
7.5
−
−
pF
Quiescent Current
(Per Package)
IDD
5.0
10
15
−
−
−
0.25
0.5
1.0
−
−
−
0.0005
0.0010
0.0015
0.25
0.5
1.0
−
−
−
7.5
15
30
mAdc
IT
5.0
10
15
Vin = 0 or VDD
(VO = 0.5 or 4.5 Vdc)
(VO = 1.0 or 9.0 Vdc)
(VO = 1.5 or 13.5 Vdc)
Output Drive Current
(VOH = 2.5 Vdc)
(VOH = 4.6 Vdc)
(VOH = 9.5 Vdc)
(VOH = 13.5 Vdc)
Source
(VOL = 0.4 Vdc)
(VOL = 0.5 Vdc)
(VOL = 1.5 Vdc)
Total Supply Current (3) (4)
(Dynamic plus Quiescent,
Per Gate, CL = 50 pF)
Sink
IOH
Vdc
Vdc
mAdc
IT = (0.3 mA/kHz) f + IDD/N
IT = (0.6 mA/kHz) f + IDD/N
IT = (0.9 mA/kHz) f + IDD/N
mAdc
2. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
3. The formulas given are for the typical characteristics only at 25_C.
4. To calculate total supply current at loads other than 50 pF:
IT(CL) = IT(50 pF) + (CL − 50) Vfk
where: IT is in mA (per package), CL in pF, V = (VDD − VSS) in volts, f in kHz is input frequency, and k = 0.001 x the number of exercised gates
per package.
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3
MC14001B Series
B−SERIES GATE SWITCHING TIMES
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SWITCHING CHARACTERISTICS (5) (CL = 50 pF, TA = 25_C)
Characteristic
Symbol
Output Rise Time, All B−Series Gates
tTLH = (1.35 ns/pF) CL + 33 ns
tTLH = (0.60 ns/pF) CL + 20 ns
tTLH = (0.40 ns/PF) CL + 20 ns
tTLH
Output Fall Time, All B−Series Gates
tTHL = (1.35 ns/pF) CL + 33 ns
tTHL = (0.60 ns/pF) CL + 20 ns
tTHL = (0.40 ns/pF) CL + 20 ns
tTHL
Propagation Delay Time
MC14001B, MC14011B only
tPLH, tPHL = (0.90 ns/pF) CL + 80 ns
tPLH, tPHL = (0.36 ns/pF) CL + 32 ns
tPLH, tPHL = (0.26 ns/pF) CL + 27 ns
All Other 2, 3, and 4 Input Gates
tPLH, tPHL = (0.90 ns/pF) CL + 115 ns
tPLH, tPHL = (0.36 ns/pF) CL + 47 ns
tPLH, tPHL = (0.26 ns/pF) CL + 37 ns
8−Input Gates (MC14068B, MC14078B)
tPLH, tPHL = (0.90 ns/pF) CL + 155 ns
tPLH, tPHL = (0.36 ns/pF) CL + 62 ns
tPLH, tPHL = (0.26 ns/pF) CL + 47 ns
VDD
Vdc
Min
Typ (6)
Max
5.0
10
15
−
−
−
100
50
40
200
100
80
5.0
10
15
−
−
−
100
50
40
200
100
80
Unit
ns
ns
tPLH, tPHL
ns
5.0
10
15
−
−
−
125
50
40
250
100
80
5.0
10
15
−
−
−
160
65
50
300
130
100
5.0
10
15
−
−
−
200
80
60
350
150
110
5. The formulas given are for the typical characteristics only at 25_C.
6. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
14
PULSE
GENERATOR
20 ns
VDD
20 ns
INPUT
INPUT
OUTPUT
7
0V
tPHL
CL
*
VDD
90%
50%
10%
OUTPUT
INVERTING
VSS
tPLH
90%
50%
10%
tTHL
tPLH
OUTPUT
NON-INVERTING
*All unused inputs of AND, NAND gates must be connected to VDD.
All unused inputs of OR, NOR gates must be connected to VSS.
tTLH
Figure 1. Switching Time Test Circuit and Waveforms
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4
VOH
tTLH
tPHL
90%
50%
10%
tTHL
VOL
VOH
VOL
MC14001B Series
CIRCUIT SCHEMATIC
NOR, OR GATES
MC14001B, MC14071B
One of Four Gates Shown
MC14025B
One of Three Gates Shown
VDD
VDD
14
VDD
1, 3, 11
1, 6, 8, 13
*
2, 4, 12
2, 5, 9, 12
14
VDD
3, 4, 10, 11
*
VSS
VSS
7
9, 6, 10
VSS
VDD
*Inverter omitted in MC14001B
8, 5, 13
7
VSS
VSS
*Inverter omitted in MC14025B
CIRCUIT SCHEMATIC
NAND, AND GATES
MC14023B, MC14073B
One of Three Gates Shown
MC14011B, MC14081B
One of Four Gates Shown
VDD
14
VDD
*
3, 4, 10, 11
2, 4, 12
1, 3, 11
14
2, 5, 9, 12
VDD
1, 6, 8, 13
VSS
7 VSS
*Inverter omitted in MC14011B
*
VDD
9, 6, 10
8, 5, 13
7
VSS
VSS
*Inverter omitted in MC14023B
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5
MC14001B Series
TYPICAL B−SERIES GATE CHARACTERISTICS
N−CHANNEL DRAIN CURRENT (SINK)
P−CHANNEL DRAIN CURRENT (SOURCE)
- 10
5.0
ID , DRAIN CURRENT (mA)
ID , DRAIN CURRENT (mA)
- 9.0
4.0
TA = - 55°C
3.0
- 40°C
+ 85°C + 25°C
2.0
+ 125°C
1.0
- 8.0
TA = - 55°C
- 7.0
- 40°C
- 6.0
- 5.0
+ 25°C
+ 85°C
- 4.0
+ 125°C
- 3.0
- 2.0
- 1.0
0
0
1.0
2.0
3.0
4.0
VDS, DRAIN-TO-SOURCE VOLTAGE (Vdc)
0
5.0
0
Figure 2. VGS = 5.0 Vdc
- 50
- 45
TA = - 55°C
16
14
- 40°C
12
+ 25°C
+ 85°C
10
ID , DRAIN CURRENT (mA)
ID , DRAIN CURRENT (mA)
18
+ 125°C
8.0
6.0
- 40
- 35
- 30
+ 85°C
- 15
2.0
- 5.0
1.0
2.0 3.0 4.0 5.0
6.0 7.0 8.0
VDS, DRAIN-TO-SOURCE VOLTAGE (Vdc)
9.0
0
10
- 40°C
+ 25°C
- 20
- 10
0
TA = - 55°C
- 25
4.0
+ 125°C
0
Figure 4. VGS = 10 Vdc
- 100
45
- 90
40
- 80
35
TA = - 55°C
30
- 40°C
25
+ 25°C
ID , DRAIN CURRENT (mA)
ID , DRAIN CURRENT (mA)
- 1.0 - 2.0 - 3.0 - 4.0 - 5.0 - 6.0 - 7.0 - 8.0 - 9.0 - 10
VDS, DRAIN-TO-SOURCE VOLTAGE (Vdc)
Figure 5. VGS = − 10 Vdc
50
+ 85°C
20
+ 125°C
15
10
5.0
0
- 5.0
Figure 3. VGS = − 5.0 Vdc
20
0
- 1.0
- 2.0
- 3.0
- 4.0
VDS, DRAIN-TO-SOURCE VOLTAGE (Vdc)
- 70
- 60
TA = - 55°C
- 50
- 40°C
+ 25°C
- 40
+ 85°C
- 30
+ 125°C
- 20
- 10
0
2.0
4.0
6.0 8.0 10
12
14
16
VDS, DRAIN-TO-SOURCE VOLTAGE (Vdc)
18
0
20
0
Figure 6. VGS = 15 Vdc
- 2.0 - 4.0 - 6.0 - 8.0 - 10 - 12 - 14 - 16
VDS, DRAIN-TO-SOURCE VOLTAGE (Vdc)
Figure 7. VGS = − 15 Vdc
These typical curves are not guarantees, but are design aids.
Caution: The maximum rating for output current is 10 mA per pin.
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6
- 18 - 20
MC14001B Series
TYPICAL B−SERIES GATE CHARACTERISTICS (cont’d)
V out , OUTPUT VOLTAGE (Vdc)
V out , OUTPUT VOLTAGE (Vdc)
VOLTAGE TRANSFER CHARACTERISTICS
SINGLE INPUT NAND, AND
MULTIPLE INPUT NOR, OR
5.0
4.0
SINGLE INPUT NOR, OR
MULTIPLE INPUT NAND, AND
3.0
2.0
1.0
0
0
1.0
2.0
SINGLE INPUT NAND, AND
MULTIPLE INPUT NOR, OR
10
8.0
SINGLE INPUT NOR, OR
MULTIPLE INPUT NAND, AND
6.0
4.0
2.0
0
3.0
4.0
5.0
Vin, INPUT VOLTAGE (Vdc)
0
2.0
Figure 8. VDD = 5.0 Vdc
V out , OUTPUT VOLTAGE (Vdc)
6.0
8.0
10
Vin, INPUT VOLTAGE (Vdc)
Figure 9. VDD = 10 Vdc
DC NOISE MARGIN
16
SINGLE INPUT NAND, AND
MULTIPLE INPUT NOR, OR
14
The DC noise margin is defined as the input voltage range
from an ideal “1” or “0” input level which does not produce
output state change(s). The typical and guaranteed limit
values of the input values VIL and VIH for the output(s) to
be at a fixed voltage VO are given in the Electrical
Characteristics table. VIL and VIH are presented graphically
in Figure 11.
Guaranteed minimum noise margins for both the “1” and
“0” levels =
12
SINGLE INPUT NOR, OR
MULTIPLE INPUT NAND, AND
10
8.0
6.0
4.0
2.0
0
4.0
0
2.0
4.0
1.0 V with a 5.0 V supply
2.0 V with a 10.0 V supply
2.5 V with a 15.0 V supply
6.0
8.0
10
Vin, INPUT VOLTAGE (Vdc)
Figure 10. VDD = 15 Vdc
Vout
VDD
Vout
VO
VO
VO
VO
VDD
VDD
0
VDD
Vin
VIL
0
VIH
Vin
VIL
VIH
VSS = 0 VOLTS DC
(a) Inverting Function
(b) Non−Inverting Function
Figure 11. DC Noise Immunity
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7
MC14001B Series
ORDERING INFORMATION
Device
Package
MC14001BCP
PDIP−14
MC14001BCPG
PDIP−14
(Pb−Free)
MC14001BD
SOIC−14
MC14001BDG
SOIC−14
(Pb−Free)
MC14001BDR2
SOIC−14
MC14001BDR2G
SOIC−14
(Pb−Free)
MC14001BDTR2
TSSOP−14*
MC14001BDTR2G
TSSOP−14*
(Pb−Free)
MC14001BFEL
SOEIAJ−14
MC14001BFELG
SOEIAJ−14
(Pb−Free)
MC14011BCP
PDIP−14
MC14011BCPG
PDIP−14
(Pb−Free)
MC14011BD
SOIC−14
MC14011BDG
SOIC−14
(Pb−Free)
MC14011BDR2
SOIC−14
MC14011BDR2G
SOIC−14
(Pb−Free)
MC14011BDTR2
TSSOP−14*
MC14011BDTR2G
TSSOP−14*
(Pb−Free)
MC14011BF
SOEIAJ−14
MC14011BFG
SOEIAJ−14
(Pb−Free)
MC14011BFEL
SOEIAJ−14
MC14011BFELG
SOEIAJ−14
(Pb−Free)
MC14023BCP
PDIP−14
MC14023BCPG
PDIP−14
(Pb−Free)
MC14023BD
SOIC−14
MC14023BDG
SOIC−14
(Pb−Free)
MC14023BDR2
SOIC−14
MC14023BDR2G
SOIC−14
(Pb−Free)
MC14023BFEL
SOEIAJ−14
MC14023BFELG
SOEIAJ−14
(Pb−Free)
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8
Shipping†
25 Units / Rail
55 Units / Rail
2500 Units / Tape & Reel
2000 Units / Tape & Reel
25 Units / Rail
55 Units / Rail
2500 Units / Tape & Reel
50 Units / Rail
2000 Units / Tape & Reel
25 Units / Rail
55 Units / Rail
2500 Units / Tape & Reel
2000 Units / Tape & Reel
MC14001B Series
ORDERING INFORMATION
Device
Package
MC14025BCP
PDIP−14
MC14025BCPG
PDIP−14
(Pb−Free)
MC14025BD
SOIC−14
MC14025BDG
SOIC−14
(Pb−Free)
MC14025BDR2
SOIC−14
MC14025BDR2G
SOIC−14
(Pb−Free)
MC14025BFEL
SOEIAJ−14
MC14025BFELG
SOEIAJ−14
(Pb−Free)
MC14071BCP
PDIP−14
MC14071BCPG
PDIP−14
(Pb−Free)
MC14071BD
SOIC−14
MC14071BDG
SOIC−14
(Pb−Free)
MC14071BDR2
SOIC−14
MC14071BDR2G
SOIC−14
(Pb−Free)
MC14071BDT
TSSOP−14*
MC14071BDTG
TSSOP−14*
(Pb−Free)
MC14071BDTR2
TSSOP−14*
MC14071BDTR2G
TSSOP−14*
(Pb−Free)
MC14071BFEL
SOEIAJ−14
MC14071BFELG
SOEIAJ−14
(Pb−Free)
MC14073BCP
PDIP−14
MC14073BCPG
PDIP−14
(Pb−Free)
MC14073BD
SOIC−14
MC14073BDG
SOIC−14
(Pb−Free)
MC14073BDR2
SOIC−14
MC14073BDR2G
SOIC−14
(Pb−Free)
MC14073BFEL
SOEIAJ−14
MC14073BFELG
SOEIAJ−14
(Pb−Free)
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9
Shipping†
25 Units / Rail
55 Units / Rail
2500 Units / Tape & Reel
2000 Units / Tape & Reel
25 Units / Rail
55 Units / Rail
2500 Units / Tape & Reel
96 Units per Rail
2500 Units / Tape & Reel
2000 Units / Tape & Reel
25 Units / Rail
55 Units / Rail
2500 Units / Tape & Reel
2000 Units / Tape & Reel
MC14001B Series
ORDERING INFORMATION
Device
Package
MC14081BCP
PDIP−14
MC14081BCPG
PDIP−14
(Pb−Free)
MC14081BD
SOIC−14
MC14081BDG
SOIC−14
(Pb−Free)
MC14081BDR2
SOIC−14
MC14081BDR2G
SOIC−14
(Pb−Free)
MC14081BDTR2
TSSOP−14*
MC14081BDTR2G
TSSOP−14*
(Pb−Free)
MC14081BFEL
SOEIAJ−14
MC14081BFELG
SOEIAJ−14
(Pb−Free)
MC14082BCP
PDIP−14
MC14082BCPG
PDIP−14
(Pb−Free)
MC14082BD
SOIC−14
MC14082BDG
SOIC−14
(Pb−Free)
MC14082BDR2
SOIC−14
MC14082BDR2G
SOIC−14
(Pb−Free)
Shipping†
25 Units / Rail
55 Units / Rail
2500 Units / Tape & Reel
2000 Units / Tape & Reel
2000 Units / Box
55 Units / Rail
2500 Units / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*This package is inherently Pb−Free.
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10
MC14001B Series
PACKAGE DIMENSIONS
PDIP−14
CASE 646−06
ISSUE P
14
8
1
7
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
B
A
F
L
N
C
−T−
SEATING
PLANE
H
G
D 14 PL
J
K
0.13 (0.005)
M
M
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11
DIM
A
B
C
D
F
G
H
J
K
L
M
N
INCHES
MIN
MAX
0.715
0.770
0.240
0.260
0.145
0.185
0.015
0.021
0.040
0.070
0.100 BSC
0.052
0.095
0.008
0.015
0.115
0.135
0.290
0.310
−−−
10 _
0.015
0.039
MILLIMETERS
MIN
MAX
18.16
19.56
6.10
6.60
3.69
4.69
0.38
0.53
1.02
1.78
2.54 BSC
1.32
2.41
0.20
0.38
2.92
3.43
7.37
7.87
−−−
10 _
0.38
1.01
MC14001B Series
PACKAGE DIMENSIONS
SOIC−14
CASE 751A−03
ISSUE H
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.127
(0.005) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
−A−
14
8
−B−
P 7 PL
0.25 (0.010)
M
7
1
G
−T−
D 14 PL
0.25 (0.010)
T B
S
A
DIM
A
B
C
D
F
G
J
K
M
P
R
J
M
K
M
F
R X 45 _
C
SEATING
PLANE
B
M
S
SOLDERING FOOTPRINT*
7X
7.04
14X
1.52
1
14X
0.58
1.27
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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12
MILLIMETERS
MIN
MAX
8.55
8.75
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0_
7_
5.80
6.20
0.25
0.50
INCHES
MIN
MAX
0.337 0.344
0.150 0.157
0.054 0.068
0.014 0.019
0.016 0.049
0.050 BSC
0.008 0.009
0.004 0.009
0_
7_
0.228 0.244
0.010 0.019
MC14001B Series
PACKAGE DIMENSIONS
TSSOP−14
CASE 948G−01
ISSUE B
14X K REF
0.10 (0.004)
0.15 (0.006) T U
M
T U
V
S
S
S
N
2X
14
L/2
M
B
−U−
L
PIN 1
IDENT.
N
F
7
1
0.15 (0.006) T U
0.25 (0.010)
8
S
DETAIL E
K
A
−V−
ÉÉÉ
ÇÇÇ
ÇÇÇ
ÉÉÉ
K1
J J1
SECTION N−N
−W−
C
0.10 (0.004)
−T− SEATING
PLANE
D
H
G
DETAIL E
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
MILLIMETERS
INCHES
DIM MIN
MAX
MIN MAX
A
4.90
5.10 0.193 0.200
B
4.30
4.50 0.169 0.177
C
−−−
1.20
−−− 0.047
D
0.05
0.15 0.002 0.006
F
0.50
0.75 0.020 0.030
G
0.65 BSC
0.026 BSC
H
0.50
0.60 0.020 0.024
J
0.09
0.20 0.004 0.008
J1
0.09
0.16 0.004 0.006
K
0.19
0.30 0.007 0.012
K1 0.19
0.25 0.007 0.010
L
6.40 BSC
0.252 BSC
M
0_
8_
0_
8_
SOLDERING FOOTPRINT*
7.06
1
0.65
PITCH
14X
0.36
14X
1.26
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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13
MC14001B Series
PACKAGE DIMENSIONS
SOEIAJ−14
CASE 965−01
ISSUE A
14
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS AND ARE
MEASURED AT THE PARTING LINE. MOLD FLASH
OR PROTRUSIONS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
LE
8
Q1
E HE
M_
L
7
1
DETAIL P
Z
D
VIEW P
A
e
A1
b
0.13 (0.005)
c
M
0.10 (0.004)
DIM
A
A1
b
c
D
E
e
HE
0.50
LE
M
Q1
Z
MILLIMETERS
MIN
MAX
--2.05
0.05
0.20
0.35
0.50
0.10
0.20
9.90
10.50
5.10
5.45
1.27 BSC
7.40
8.20
0.50
0.85
1.10
1.50
10 _
0_
0.70
0.90
--1.42
INCHES
MIN
MAX
--0.081
0.002
0.008
0.014
0.020
0.004
0.008
0.390
0.413
0.201
0.215
0.050 BSC
0.291
0.323
0.020
0.033
0.043
0.059
10 _
0_
0.028
0.035
--0.056
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
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LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
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For additional information, please contact your local
Sales Representative
MC14001B/D
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