ETC MC206 Thin smd low/medium-frequency crystal unit Datasheet

THIN SMD LOW/MEDIUM-FREQUENCY CRYSTAL UNIT
MC-206
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High-density mounting-type SMD of max. 2.0mm thickness.
Small with small packaging area and light weight.
High heat resistance allows reflow soldering.
Excellent shock resistance and environmental capability.
Most suitable for small communications devices.
Actual size
Specifications (characteristics)
Item
Symbol
Nominal frequency
Remarks
Specifications
f
32.768 kHz
32.000 kHz to 100.000 kHz
Storage temperature
TSTG
-55˚C to +125˚C
Operating temperature
TOPR
-40˚C to +85˚C
Maximum drive level
GL
1.0µW max.
Soldering condition
TSOL
Temperature
range
Twice at under 260˚C within 10 sec.
or under 230˚C within 3 min.
±20ppm, ±50ppm
±50ppm, ±100ppm
Frequency tolerance (standard)
∆f/f
Peak temperature (frequency)
θT
25˚C ±5˚C
a
-0.04ppm/ ˚C2 max.
Temperature coefficient (frequency)
6pF to ∞
Load capacitance
CL
Series resistance
R1
Motional capacitance
C1
1.8fF typ.
3.0fF max.
Shunt capacitance
C0
0.9pF typ.
1.5pF max.
Insulation resistance
IR
Aging
fa
Shock resistance
Ta=25˚C, DL=0.1µW
55 kΩ max.
Please specify
55 kΩ to 10 kΩ
As per below table
500 MΩ min.
±3ppm/Y max.
Ta=25˚C ±3˚C, first year
±5ppm/Y max.
Three drops on a hard board from 75 cm or excitation
±5ppm max.
S.R.
test with 3000G x 0.3ms x 1/2 sine wave x 3 directions
There are some cases that a parts of the cylindrical capsule of quartz unit expose on the surface of the molding material.
Series resistance
Frequency (kHz)
32 ≤ f < 40
40 ≤ f < 60
60 ≤ f < 70
70 ≤ f ≤100
Series resonance
resistance (Ω)
55K Ω max.
30K Ω max.
25K Ω max.
22K Ω max.
External dimensions
(Unit: mm)
7.3 max.
#4
#3
#1
#2
1.2
3.88
1.2
1.3
4.1
E. A. 67
#2
1.3
2.0max.
1.8
2.4
#1
(Unit: mm)
Internal connection
#3
2.5
#4
Recommended soldering pattern
0.4
5.08
Do not connect #2 and #3 to external device.
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