ON MC33263NW-33R2 Ultra low noise 150 ma low dropout voltage regulator with on/off control Datasheet

MC33263
Ultra Low Noise
150 mA Low Dropout
Voltage Regulator with
ON/OFF Control
Housed in a SOT23–L package, the MC33263 delivers up to
150 mA where it exhibits a typical 180 mV dropout. With an
incredible noise level of 25 mVRMS (over 100 Hz to 100 kHz, with a
10 nF bypass capacitor), the MC33263 represents the ideal choice for
sensitive circuits, especially in portable applications where noise
performance and space are premium. The MC33263 also excels in
response time and reacts in less than 25 ms when receiving an OFF to
ON signal (with no bypass capacitor).
Thanks to a novel concept, the MC33263 accepts output capacitors
without any restrictions regarding their Equivalent Series Resistance
(ESR) thus offering an obvious versatility for immediate implementation.
With a typical DC ripple rejection better than –90 dB (–70 dB @
1 kHz), it naturally shields the downstream electronics against choppy
power lines.
Additionally, thermal shutdown and short–circuit protection
provide the final product with a high degree of ruggedness.
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MARKING
DIAGRAMS
6
SOT–23L
NW SUFFIX
CASE 318J
6
1
xAYLW
1
x
= Voltage Option Code
A
= Assembly Location
WL, L = Wafer Lot
YY, Y = Year
WW, W = Work Week
Features:
PIN CONNECTIONS
• Very Low Quiescent Current 170 µA (ON, no load), 100 nA (OFF,
no load)
• Very Low Dropout Voltage, typical value is 137 mV at an output
current of 100 mA
typically 25 µVrms over 100 Hz to 100 kHz
Internal Thermal Shutdown
Extremely Tight Line Regulation typically –90 dB
Ripple Rejection –70 dB @ 1 kHz
Line Transient Response: 1 mV for DVin = 3 V
Extremely Tight Load Regulation, typically 20 mV at DIout = 150 mA
Multiple Output Voltages Available
Logic Level ON/OFF Control (TTL–CMOS Compatible)
ESR can vary from 0 to 3W
Functionally and Pin Compatible with TK112xxA/B Series
Applications:
• All Portable Systems, Battery Powered Systems, Cellular
Telephones, Radio Control Systems, Toys and Low Voltage Systems
MC33263 Block Diagram
6
Input
Shutdown
1
ON/OFF
3
Bypass
2
Band Gap
Reference
* Current Limit
* Antisaturation
* Protection
Thermal
Shutdown
4
Output
5
GND
 Semiconductor Components Industries, LLC, 2000
April, 2000 – Rev. 2
6 VIN
GND 2
• Very Low Noise with external bypass capacitor (10 nF),
•
•
•
•
•
•
•
•
•
ON/OFF 1
1
5 GND
BYPASS 3
4 VOUT
(Top View)
ORDERING INFORMATION
Device
Version
Shipping
MC33263NW–28R2
2.8 V
2500 Tape & Reel
MC33263NW–30R2
3.0 V
2500 Tape & Reel
MC33263NW–32R2
3.2 V
2500 Tape & Reel
MC33263NW–33R2
3.3 V
2500 Tape & Reel
MC33263NW–38R2
3.8 V
2500 Tape & Reel
MC33263NW–40R2
4.0 V
2500 Tape & Reel
MC33263NW–47R2
4.75 V
2500 Tape & Reel
MC33263NW–50R2
5.0 V
2500 Tape & Reel
All Devices Available in SOT–23L 6 Lead Package
GND
Publication Order Number:
MC33263/D
MC33263
DEVICE MARKING
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XALYW
Marking
Version
1st Digit
A
2.8 V
B
3.0 V
C
3.2 V
D
3.3 V
E
3.8 V
F
4.0 V
G
4.75 V
H
5.0 V
2nd Digit
A
Location Code
3rd Digit
L
Wafer Lot Traceability
4th/5th Digits
YW
Date Code
6
5
Pin 1 Ink
Mark Identifier
or
Solid Pin 1 Dot
or Dimple
4
XALYW
1
2
3
SOT–23L
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MAXIMUM RATINGS
Rating
Symbol
Pin #
Value
Unit
Vin
6
12
V
Internally
Limited
210
W
Power Supply Voltage
Power Dissipation and Thermal Resistance
Maximum Power Dissipation
NW Suffix, Plastic Package
Thermal Resistance, Junction–to–Air
Thermal Resistance, Junction–to–Case
PD
RqJA
RqJC
Operating Ambient Temperature
Maximum Junction Temperature
TA
TJmax
Tstg
Storage Temperature Range
°C/W
°C/W
–40 to +85
150
°C
°C
–60 to +150
°C
ELECTRICAL CHARACTERISTICS (For typical values TA = 25°C, for min/max values TA = –40°C to +85°C, Max TJ = 150°C)
Symbol
Characteristics
Pin #
Min
Typ
Max
Unit
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CONTROL ELECTRICAL CHARACTERISTICS
Input Voltage Range
VON/OFF
1
ON/OFF Input Current (All versions)
VON/OFF = 2.4 V
ION/OFF
1
ON/OFF Input Voltages (All versions)
Logic “0”, i.e. OFF State
Logic “1”, i.e. ON State
VON/OFF
0
–
Vin
–
2.5
–
–
2.2
–
–
0.3
–
–
0.1
2.0
–
170
200
–
900
1400
175
210
–
V
mA
1
V
CURRENTS PARAMETERS
Current Consumption in OFF State (All versions)
OFF Mode Current: Vin = Vout + 1.0 V, Iout = 0 mA
IQOFF
Current Consumption in ON State (All versions)
ON Mode Sat Current: Vin = Vout + 1.0 V, Iout = 0 mA
IQON
Current Consumption in Saturation ON State (All versions)
ON Mode Sat Current: Vin = Vout – 0.5 V, Iout = 0 mA
IQSAT
Current Limit Vin = Vout + 1.0 V, (All versions)
Output Short–circuited (Note 1.)
IMAX
mA
mA
mA
mA
1. Iout (Output Current) is the measured current when the output voltage drops below 0.3 V with respect to Vout at Iout = 30 mA.
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2
MC33263
ELECTRICAL CHARACTERISTICS (For typical values TA = 25°C, for min/max values TA = –40°C to +85°C, Max TJ = 150°C)
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Symbol
Pin #
Vin = Vout + 1.0 V, TA = 25°C, 1.0 mA < Iout < 150 mA
2.8 Suffix
3.0 Suffix
3.2 Suffix
3.3 Suffix
3.8 Suffix
4.0 Suffix
4.75 Suffix
5.0 Suffix
Vout
4
Vin = Vout + 1.0 V, –40°C < TA < 80°C,
1.0 mA < Iout < 150 mA
2.8 Suffix
3.0 Suffix
3.2 Suffix
3.3 Suffix
3.8 Suffix
4.0 Suffix
4.75 Suffix
5.0 Suffix
Vout
Characteristics
Min
Typ
Max
2.74
2.94
3.13
3.23
3.72
3.92
4.66
4.90
2.8
3.0
3.2
3.3
3.8
4.0
4.75
5.0
2.86
3.06
3.27
3.37
3.88
4.08
4.85
5.1
Unit
V
4
V
2.7
2.9
3.09
3.18
3.67
3.86
4.58
4.83
2.8
3.0
3.2
3.3
3.8
4.0
4.75
5.0
2.9
3.1
3.31
3.42
3.93
4.14
4.92
5.17
–
2.0
10
–
–
–
8.0
15
20
25
35
45
–
–
–
30
137
180
90
230
260
60
70
–
–
1.0
–
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LINE AND LOAD REGULATION, DROPOUT VOLTAGES
Line Regulation (All versions)
Vout + 1.0 V < Vin < 12 V, Iout = 60 mA
Regline
Load Regulation (All versions)
Regload
Vin = Vout + 1.0 V
Iout = 1.0 to 60 mA
Iout = 1.0 to 100 mA
Iout = 1.0 to 150 mA
Dropout Voltage (All versions)
Vin – Vout
4/6
mV
1
mV
4, 6
Iout = 10 mA
Iout = 100 mA
Iout = 150 mA
mV
DYNAMIC PARAMETERS
Ripple Rejection (All versions)
Vin = Vout + 1.0 V, Vpp = 1.0 V, f = 1.0 kHz, Iout = 60 mA
4, 6
Line Transient Response
Vin = Vout + 1.0 V to Vout + 4.0 V, Iout = 60 mA,
d(Vin)/dt = 15 mV/ms
4, 6
Output Noise Voltage (All versions)
Cout = 1.0 µF, Iout = 60 mA, f = 100 Hz to 100 kHz
Cbypass = 10 nF
Cbypass = 1.0 nF
Cbypass = 0 nF
VRMS
Output Noise Density
VN
tr
mV
µVrms
4, 6
–
–
–
25
40
65
–
–
–
–
230
–
–
–
40
1.1
–
–
µs
ms
–
150
–
°C
nV/ √Hz
4
Cout = 1.0 µF, Iout = 60 mA, f = 1.0 kHz
Output Rise Time (All versions)
Cout = 1.0 µF, Iout = 30 mA, VON/OFF = 0 to 2.4 V
1% of ON/OFF Signal to 99% of Nominal Output Voltage
Without Bypass Capacitor
With Cbypass = 10 nF
dB
4
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THERMAL SHUTDOWN
Thermal Shutdown (All versions)
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3
MC33263
DEFINITIONS
This feature is provided to prevent catastrophic failures from
accidental overheating.
Maximum Package Power Dissipation – The maximum
package power dissipation is the power dissipation level at
which the junction temperature reaches its maximum value
i.e. 125°C. The junction temperature is rising while the
difference between the input power (VCC X ICC) and the
output power (Vout X Iout) is increasing.
Depending on ambient temperature, it is possible to
calculate the maximum power dissipation, maximum load
current or maximum input voltage (see Application Hints:
Protection).
The maximum power dissipation supported by the device
is a lot increased when using appropriate application design.
Mounting pad configuration on the PCB, the board material
and also the ambient temperature are affected the rate of
temperature rise. It means that when the IC has good thermal
conductivity through PCB, the junction temperature will be
“low” even if the power dissipation is great.
The thermal resistance of the whole circuit can be
evaluated by deliberately activating the thermal shutdown
of the circuit (by increasing the output current or raising the
input voltage for example).
Then you can calculate the power dissipation by
subtracting the output power from the input power. All
variables are then well known: power dissipation, thermal
shutdown temperature (150°C for MC33263) and ambient
temperature.
Load Regulation – The change in output voltage for a
change in load current at constant chip temperature.
Dropout Voltage – The input/output differential at which
the regulator output no longer maintains regulation against
further reductions in input voltage. Measured when the
output drops 100 mV below its nominal value (which is
measured at 1.0 V differential), dropout voltage is affected
by junction temperature, load current and minimum input
supply requirements.
Output Noise Voltage – The RMS AC voltage at the
output with a constant load and no input ripple, measured
over a specified frequency range.
Maximum Power Dissipation – The maximum total
dissipation for which the regulator will operate within
specifications.
Quiescent Current – Current which is used to operate the
regulator chip and is not delivered to the load.
Line Regulation – The change in input voltage for a
change in the input voltage. The measurement is made under
conditions of low dissipation or by using pulse techniques
such that the average chip temperature is not significantly
affected.
Line Transient Response – Typical over– and
undershoot response when input voltage is excited with a
given slope.
Thermal Protection – Internal thermal shutdown
circuitry is provided to protect the integrated circuit in the
event that the maximum junction temperature is exceeded.
When activated, typically 150°C, the regulator turns off.
APPLICATION HINTS
The bypass capacitor impacts the start–up phase of the
MC33263 as depicted by the data–sheet curves. A typical
1 ms settling time is achieved with a 10 nF bypass capacitor.
However, thanks to its low–noise architecture, the
MC33263 can operate without bypass and thus offers a
typical 20 ms start–up phase. In that case, the typical output
noise stays lower than 65 mVRMS between 100 Hz –
100 kHz.
Protections – The MC33263 hosts several protections,
conferring natural ruggedness and reliability to the products
implementing the component. The output current is
internally limited to a minimum of 175 mA while
temperature shutdown occurs if the die heats up beyond
150°C. These value lets you assess the maximum
differential voltage the device can sustain at a given output
current before its protections come into play.
The maximum dissipation the package can handle is given
by:
Input Decoupling – As with any regulator, it is necessary
to reduce the dynamic impedance of the supply rail that
feeds the component. A 1 mF capacitor either ceramic or
tantalum is recommended and should be connected close to
the MC33263 package. Higher values will correspondingly
improve the overall line transient response.
Output Decoupling – Thanks to a novel concept, the
MC33263 is a stable component and does not require any
Equivalent Series Resistance (ESR) neither a minimum
output current. Capacitors exhibiting ESRs ranging from a
few mW up to 3W can thus safely be used. The minimum
decoupling value is 1 mF and can be augmented to fulfill
stringent load transient requirements. The regulator accepts
ceramic chip capacitors as well as tantalum devices.
Noise Performances – Unlike other LDOs, the MC33263
is a true low–noise regulator. With a 10 nF bypass capacitor,
it typically reaches the incredible level of 25 mVRMS overall
noise between 100 Hz and 100 kHz. To give maximum
insight on noise specifications, ON Semiconductor includes
spectral density graphics as well as noise dependency versus
bypass capacitor.
P max
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4
– T
A
+ TJmax
R
qJA
MC33263
If TJmax is internally limited to 150°C, then the MC33263
can dissipate up to 595 mW @ 25°C.
The power dissipated by the MC33263 can be calculated
from the following formula:
Ptot
+ ǀ Vin @ Ignd(Iout)ǁ ) ǀVin * Vout ǁ @ Iout
or
Vin max
+ PtotI ) V)outI @ Iout
out
gnd
If a 150 mA output current is needed, the ground current
is extracted from the data–sheet curves: 6.5 mA @ 150 mA.
For a MC33263NW28R2 (2.8 V), the maximum input
voltage will then be 6.48 V, a rather comfortable margin.
Typical Application – The following figure portraits the
typical application for the MC33263 where both
input/output decoupling capacitors appear.
Input
Figure 2. Printed Circuit Board
Differential (Vin–Vout)
Output
6
C3
1.0 mF
5
4
C2
1.0 mF
MC33263
Input
1
On/Off
2
C3
+
MC33263
+
3
C2
Output
C1
C1
10 nF
Rpull–up
Figure 1. A Typical MC33263 Application with
Recommended Capacitor Values
ON/OFF
As for any low noise designs, particular care has to be
taken when tackling Printed Circuit Board (PCB) layout.
The following figure gives an example of a layout where
stray inductances/capacitances are minimized.
Figure 3. Copper Side Component Layout
This layout is the basis for an MC33263 performance
evaluation board where the BNC connectors give the user an
easy and quick evaluation mean.
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5
MC33263
MC33263 Wake–up Improvement – In portable
applications, an immediate response to an enable signal is
vital. If noise is not of concern, the MC33263 without a
bypass capacitor settles in nearly 20 ms and typically delivers
65 mVRMS between 100 Hz and 100 kHz.
In ultra low–noise systems, the designer needs a 10 nF
bypass capacitor to decrease the noise down to 25 mVRMS
between 100 Hz and 100 kHz. With the adjunction of the
10 nF capacitor, the wake–up time expands up to 1 ms as
shown on the data–sheet curves. If an immediate response
is wanted, following figure’s circuit gives a solution to
charge the bypass capacitor with the enable signal without
degrading the noise response of the MC33263.
At power–on, C4 is discharged. When the control logic
sends its wake–up signal by going to a high level, the PNP
base is momentarily tight to ground. The PNP switch closes
and immediately charges the bypass capacitor C1 toward its
operating value. After a few ms, the PNP opens and becomes
totally transparent to the regulator.
This circuit improves the response time of the regulator
which drops from 1 ms down to 30 ms. The value of C4 needs
to be tweaked in order to avoid any bypass capacitor
overload during the wake–up transient.
Input
Output
6
5
4
+
+
C3
1.0 mF
C2
1.0 mF
MC33263
1
2
3
On/Off
R2
220 k
C4
470 pF
MMBT2902LT1
Q1
C1
10 nF
Figure 4. A PNP Transistor Drives the
Bypass Pin when Enable Goes High
MC33263 Without
Wake–up Improvement
(Typical Response)
1 ms
MC33263 With
Wake–up Improvement
(Typical Response)
30 ms
Figure 5. MC33263 Wake–up Improvement with Small PNP Transistor
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6
MC33263
area which reaches a typical noise level of 26 mVRMS
(100 Hz to 100 kHz) at Iout = 60 mA.
The PNP being wired upon the bypass pin, it shall not
degrade the noise response of the MC33263. Figure 6
confirms the good behavior of the integrated circuit in this
350
Vin = 3.8 V
Vout = 2.8 V
Co = 1.0 mF
Iout = 60 mA
Tamb = 25°C
300
nV/sqrt (Hz)
250
200
Cbyp = 10 nF
150
100
50
Vin = 26 mVrms C = 10 nF
@ 100 Hz – 100 kHz
0
100
1,000
10,000
100,000
1,000,000
Frequency (Hz)
Figure 6. Noise Density of the MC33263 with a
10 nF Bypass Capacitor and a Wake–up
Improvement Network
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7
MC33263
TYPICAL PERFORMANCE CHARACTERISTICS
Ground Current Performances
7.0
2.1
Vin = 3.8 V
Vout = 2.8 V
CO = 1.0 mF
Tamb = 25°C
5.0
2.05
GROUND CURRENT (mA)
GROUND CURRENT (mA)
6.0
4.0
3.0
2.0
Vin = 3.8 V
Vout = 2.8 V
CO = 1.0 mF
Iout = 60 mA
2.0
1.95
1.9
1.85
1.0
0
0
20
60
40
80
120
100
140
160
180
200
1.8
–40
–20
0
20
40
60
80
OUTPUT CURRENT (mA)
AMBIENT TEMPERATURE (°C)
Figure 7. Ground Current versus Output Current
Figure 8. Ground Current versus Ambient
Temperature
Line Transient Response and Output Voltage
QUIESCENT CURRENT ON MODE ( mA)
200
190
Y1
180
170
160
Vin = 3.8 to 7.0 V
Y1 = 1.0 mV/div
Y2 = 1.0 V/div
X = 1.0 ms
Iout = 60 mA
Tamb = 25°C
150
140
130
120
110
100
–40
–20
0
20
40
60
80
dVin = 3.2 V
100
TEMPERATURE (°C)
Figure 9. Quiescent Current versus Temperature
Figure 10. Line Transient Response
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8
Y2
MC33263
TYPICAL PERFORMANCE CHARACTERISTICS
Load Transient Response versus Load Current Slope
Y1
Y2
Vin = 3.8 V
Y1 = 100 mV/div
Y2 = 20 mV/div
X = 200 ms/div
Tamb = 25°C
Vin = 3.8 V
Y1 = 50 mA/div
Y2 = 20 mV/div
X = 20 ms
Tamb = 25°C
Y1
Y2
Y1: OUTPUT CURRENT, Y2: OUTPUT VOLTAGE
Y1: OUTPUT CURRENT, Y2: OUTPUT VOLTAGE
Figure 11. Iout = 3.0 mA to 150 mA
Figure 12. ISlope = 100 mA/ms (Large Scale)
Iout = 3.0 mA to 150 mA
Y1
Y1
Vin = 3.8 V
Y1 = 50 mA/div
Y2 = 20 mV/div
X = 100 ms
Tamb = 25°C
Y2
Vin = 3.8 V
Y1 = 50 mA/div
Y2 = 20 mV/div
X = 200 ms
Tamb = 25°C
Y2
Y1: OUTPUT CURRENT, Y2: OUTPUT VOLTAGE
Y1: OUTPUT CURRENT, Y2: OUTPUT VOLTAGE
Figure 13. ISlope = 6.0 mA/ms (Large Scale)
Iout = 3.0 mA to 150 mA
Figure 14. ISlope = 2.0 mA/ms (Large Scale)
Iout = 3.0 mA to 150 mA
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9
MC33263
TYPICAL PERFORMANCE CHARACTERISTICS
Noise Performances
350
70
250
3.3 nF
60
RMS NOISE (mV)
0 nF
300
nV/Hz
Vin = 3.8 V
Vout = 2.8 V
CO = 1.0 mF
Iout = 60 mA
Tamb = 23°C
200
Cbyp = 10 nF
150
100 Vn = 65 mVrms @ C
bypass = 0
Vn = 30 mVrms @ Cbypass = 3.3 nF
50 Vn = 25 mVrms @ C
bypass = 10 nF
over 100 Hz to 100 kHz
0
100
1000
10,000
50
40
30
Vin = 3.8 V
Vout = 2.8 V
CO = 1.0 mF
Iout = 60 mA
Tamb = 25°C
20
10
0
100,000
1,000,000
0
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
10
FREQUENCY (Hz)
BYPASS CAPACITOR (nF)
Figure 15. Noise Density versus Bypass
Capacitor
Figure 16. RMS Noise versus Bypass Capacitor
(100 Hz – 100 kHz)
Settling Time Performances
1200
Vin = 3.8 V
Vout = 2.8 V
CO = 1.0 mF
Iout = 60 mA
Tamb = 25°C
SETTLING TIME ( m S)
1000
800
600
200 ms/div
500 mV/div
Cbyp = 10 nF
400
Vin = 3.8 V
Vout = 2.8 V
Cout = 1.0 mF
Iout = 50 mA
Tamb = 25°C
200
0
0
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
10
BYPASS CAPACITOR (nF)
Figure 17. Output Voltage Settling Time versus
Bypass Capacitor
100 ms/div
500 mV/div
Cbyp = 3.3 nF
Figure 18. Output Voltage Settling Shape
Cbypass = 10 nF
Vin = 3.8 V
Vout = 2.8 V
Cout = 1.0 mF
Iout = 50 mA
Tamb = 25°C
10 ms/div
500 mV/div
Cbyp = 0 nF
Figure 19. Output Voltage Settling Shape
Cbypass = 3.3 nF
Vin = 3.8 V
Vout = 2.8 V
Cout = 1.0 mF
Iout = 50 mA
Tamb = 25°C
Figure 20. Output Voltage Settling Shape without
Bypass Capacitor
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10
MC33263
TYPICAL PERFORMANCE CHARACTERISTICS
Dropout Voltage
250
250
85°C
10 mA
200
25°C
DROPOUT (mV)
DROPOUT (mV)
200
–40°C
150
100
50
60 mA
150
100 mA
100
50
0
10
100
60
150 mA
0
–40
150
–20
0
20
40
60
80
100
IO (mA)
TEMPERATURE (°C)
Figure 21. Dropout Voltage versus Iout
Figure 22. Dropout Voltage versus Temperature
Output Voltage
2.860
2.805
1 mA
2.840
OUTPUT VOLTAGE (V)
OUTPUT VOLTAGE (V)
2.800
2.795
60 mA
2.790
100 mA
2.785
150 mA
2.780
2.820
2.800
25°C
–40°C
2.780
85°C
2.760
2.775
2.770
–40
2.740
–20
0
20
40
60
80
0
100
20
40
60
80
100
120
140
TEMPERATURE (°C)
OUTPUT CURRENT (mA)
Figure 23. Output Voltage versus Temperature
Figure 24. Output Voltage versus Iout
160
Ripple Rejection Performances
0
0
–10
Vin = 3.8 V
Vout = 2.8 V
CO = 1.0 mF
Iout = 60 mA
Tamb = 25°C
–20
–30
–40
(dB)
(dB)
–40
Vin = 3.8 V
Vout = 2.8 V
CO = 1.0 mF
Iout = 60 mA
Tamb = 25°C
–20
–50
–60
–60
–80
–70
–80
–100
–90
–100
–120
100
1000
10,000
100,000
10
100
1000
10,000
100,000
1,000,000
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 25. Ripple Rejection versus Frequency with
10 nF Bypass Capacitor
Figure 26. Ripple Rejection versus Frequency
without Bypass Capacitor
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11
MC33263
PACKAGE DIMENSIONS
SOT–23L
NW SUFFIX
CASE 318J–01
ISSUE B
0.05
E
E1
A
S
B
S
C A
6
5
4
M
A
C
M
0.10
3
C B
b
2
A
M
e1
D
1
ÇÇ
ÇÇ
ÇÇ
0.20
e
PIN 1 IDENTIFIER
IN THIS ZONE
A1
A
B
ÉÉÉ
ÇÇÇ
ÉÉÉ
(b)
q
c1
H
c
b1
L
SECTION A–A
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSION E1 DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.23 PER
SIDE.
4. DIMENSIONS b AND b2 DO NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 TOTAL IN EXCESS
OF THE b AND b2 DIMENSIONS AT MAXIMUM
MATERIAL CONDITION.
5. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
6. DIMENSIONS D AND E1 ARE TO BE DETERMINED
AT DATUM PLANE H.
DIM
A
A1
b
b1
c
c1
D
E
E1
e
e1
L
q
MILLIMETERS
MIN
MAX
1.25
1.40
0.00
0.10
0.35
0.50
0.35
0.45
0.10
0.25
0.10
0.20
3.20
3.60
3.00
3.60
2.00
2.40
0.95
1.90
0.55
0.25
0_
10_
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are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes
without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular
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including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or
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MC33263/D
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