ON MC74HC1G00 Single 2-input nand gate Datasheet

MC74HC1G00
Single 2−Input NAND Gate
The MC74HC1G00 is a high speed CMOS 2−input NAND gate
fabricated with silicon gate CMOS technology.
The internal circuit is composed of multiple stages, including a
buffer output which provides high noise immunity and stable output.
•
•
•
•
•
•
•
High Speed: tPD = 7 ns (Typ) at VCC = 5 V
Low Power Dissipation: ICC = 1 A (Max) at TA = 25°C
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High Noise Immunity
Balanced Propagation Delays (tPLH = tPHL)
MARKING
DIAGRAMS
Symmetrical Output Impedance (IOH = IOL = 2 mA)
Chip Complexity: FETs = 40
Pb−Free Packages are Available
5
H1d
1
SC70−5/SC−88A/SOT−353
DF SUFFIX
CASE 419A
IN B
1
IN A
2
5
Pin 1
VCC
5
H1M
1
3
GND
4
SOT23−5/TSOP−5/SC59−5
DT SUFFIX
CASE 483
OUT Y
Figure 1. Pinout (Top View)
IN A
&
Pin 1
d = Date Code
M = Month Code
PIN ASSIGNMENT
OUT Y
IN B
Figure 2. Logic Symbol
1
IN B
2
IN A
3
GND
4
OUT Y
5
VCC
FUNCTION TABLE
Output
Inputs
A
B
Y
L
L
H
H
L
H
L
H
H
H
H
L
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
 Semiconductor Components Industries, LLC, 2005
January, 2005 − Rev. 9
1
Publication Order Number:
MC74HC1G00/D
MC74HC1G00
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
VCC
DC Supply Voltage
0.5 to 7.0
V
VIN
DC Input Voltage
0.5 to VCC 0.5
V
VOUT
DC Output Voltage
0.5 to VCC 0.5
V
IIK
DC Input Diode Current
20
mA
IOK
DC Output Diode Current
20
mA
IOUT
DC Output Sink Current
12.5
mA
ICC
DC Supply Current per Supply Pin
25
mA
TSTG
Storage Temperature Range
65 to 150
C
TL
Lead Temperature, 1 mm from Case for 10 Seconds
260
C
TJ
Junction Temperature Under Bias
JA
Thermal Resistance
PD
Power Dissipation in Still Air at 85C
MSL
Moisture Sensitivity
FR
Flammability Rating
VESD
ESD Withstand Voltage
ILATCHUP
Latchup Performance
150
C
SC70−5/SC−88A (Note 1)
TSOP−5
350
230
C/W
SC70−5/SC−88A
TSOP−5
150
200
mW
Level 1
Oxygen Index: 28 to 34
UL 94 V−0 @ 0.125 in
Human Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
2000
200
N/A
V
Above VCC and Below GND at 125C (Note 5)
500
mA
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace with no air flow.
2. Tested to EIA/JESD22−A114−A.
3. Tested to EIA/JESD22−A115−A.
4. Tested to JESD22−C101−A.
5. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Min
Max
Unit
VCC
DC Supply Voltage
Parameter
2.0
6.0
V
VIN
DC Input Voltage
0.0
VCC
V
VOUT
DC Output Voltage
0.0
VCC
V
TA
Operating Temperature Range
55
125
C
tr , tf
Input Rise and Fall Time
0
0
0
0
1000
600
500
400
ns
VCC = 2.0 V
VCC = 3.0 V
VCC = 4.5 V
VCC = 6.0 V
117.8
90
419,300
47.9
100
178,700
20.4
110
79,600
9.4
120
37,000
4.2
130
17,800
2.0
140
8,900
1.0
TJ = 80C
1,032,200
TJ = 90C
80
TJ = 100C
Time, Years
TJ = 110C
Time, Hours
FAILURE RATE OF PLASTIC = CERAMIC
UNTIL INTERMETALLICS OCCUR
TJ = 120C
Junction
Temperature °C
NORMALIZED FAILURE RATE
DEVICE JUNCTION TEMPERATURE VERSUS
TIME TO 0.1% BOND FAILURES
TJ = 130C
Symbol
1
1
10
100
1000
TIME, YEARS
Figure 3. Failure Rate vs. Time Junction Temperature
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2
MC74HC1G00
DC ELECTRICAL CHARACTERISTICS
VCC
Symbol
Parameter
Test Conditions
(V)
Min
1.5
2.1
3.15
4.20
VIH
Minimum High−Level
Input Voltage
2.0
3.0
4.5
6.0
VIL
Maximum Low−Level
Input Voltage
2.0
3.0
4.5
6.0
VOH
Minimum High−Level
Output Voltage
VIN = VIH or VIL
VIN = VIH or VIL
IOH = −20 A
VIN = VIH or VIL
IOH = −2 mA
IOH = −2.6 mA
VOL
Maximum Low−Level
Output Voltage
VIN = VIH or VIL
VIN = VIH or VIL
IOL = 20 A
TA 85C
TA = 25C
Typ
Max
Min
55C TA 125C
Max
Min
1.5
2.1
3.15
4.20
0.5
0.9
1.35
1.80
Max
1.5
2.1
3.15
4.20
0.5
0.9
1.35
1.80
V
0.5
0.9
1.35
1.80
2.0
3.0
4.5
6.0
1.9
2.9
4.4
5.9
2.0
3.0
4.5
6.0
1.9
2.9
4.4
5.9
1.9
2.9
4.4
5.9
4.5
6.0
4.18
5.68
4.31
5.80
4.13
5.63
4.08
5.58
Unit
V
V
2.0
3.0
4.5
6.0
0.0
0.0
0.0
0.0
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
VIN = VIH or VIL
IOL = 2 mA
IOL = 2.6 mA
4.5
6.0
0.17
0.18
0.26
0.26
0.33
0.33
0.40
0.40
V
IIN
Maximum Input
Leakage Current
VIN = 6.0 V or GND
6.0
0.1
1.0
1.0
A
ICC
Maximum Quiescent
Supply Current
VIN = VCC or GND
6.0
1.0
10
40
A
AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 6.0 ns)
TA 85C
TA = 25C
55C TA 125C
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Symbol
Parameter
tPLH,
tPHL
Maximum
Propagation Delay
Delay,
Input A or B to Y
tTLH,
tTHL
Output Transition
Time
CIN
Maximum Input
Capacitance
Test Conditions
Min
Typ
Max
Min
Max
Min
Max
Unit
ns
VCC = 5.0 V
CL = 15 pF
3.5
15
20
25
VCC = 2.0 V
VCC = 3.0 V
VCC = 4.5 V
VCC = 6.0 V
CL = 50 pF
19
10.5
7.5
6.5
100
27
20
17
125
35
25
21
155
90
35
26
VCC = 5.0 V
CL = 15 pF
3
10
15
20
VCC = 2.0 V
VCC = 3.0 V
VCC = 4.5 V
VCC = 6.0 V
CL = 50 pF
25
16
11
9
125
35
25
21
155
45
31
26
200
60
38
32
5
10
10
10
ns
pF
Typical @ 25C, VCC = 5.0 V
CPD
Power Dissipation Capacitance (Note 6)
10
pF
6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no−load dynamic
power consumption; PD = CPD VCC2 fin + ICC VCC.
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3
MC74HC1G00
VCC
INPUT
A or B 90%
50%
10%
tf
tr
VCC
CL*
GND
tPLH
OUTPUT Y
OUTPUT
INPUT
tPHL
90%
50%
10%
tTLH
*Includes all probe and jig capacitance.
A 1−MHz square input wave is recommended for
propagation delay tests.
tTHL
Figure 4. Switching Waveforms
Figure 5. Test Circuit
DEVICE ORDERING INFORMATION
Device Nomenclature
Logic
Circuit
Indicator
Temp
Range
Identifier
Technology
Device
Function
Package
Suffix
Tape and
Reel
Suffix
MC74HC1G00DFT1
MC
74
HC1G
00
DF
MC74HC1G00DFT1G
MC
74
HC1G
00
MC74HC1G00DFT2
MC
74
HC1G
MC74HC1G00DFT2G
MC
74
MC74HC1G00DTT1
MC
MC74HC1G00DTT1G
MC
Device Order
Number
Package
Type
Tape and
Reel Size†
T1
SC70−5/SC−88A/
SOT−353
178 mm (7 in)
3000 Unit
DF
T1
SC70−5/SC−88A/
SOT−353
(Pb−Free)
178 mm (7 in)
3000 Unit
00
DF
T2
SC70−5/SC−88A/
SOT−353
178 mm (7 in)
3000 Unit
HC1G
00
DF
T2
SC70−5/SC−88A/
SOT−353
(Pb−Free)
178 mm (7 in)
3000 Unit
74
HC1G
00
DT
T1
SOT23−5/TSOP−5/
SC59−5
178 mm (7 in)
3000 Unit
74
HC1G
00
DT
T1
SOT23−5/TSOP−5/
SC59−5
(Pb−Free)
178 mm (7 in)
3000 Unit
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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4
MC74HC1G00
PACKAGE DIMENSIONS
SC70−5/SC−88A/SOT−353
DF SUFFIX
5−LEAD PACKAGE
CASE 419A−02
ISSUE G
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419A−01 OBSOLETE. NEW STANDARD
419A−02.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
A
G
5
4
DIM
A
B
C
D
G
H
J
K
N
S
−B−
S
1
2
3
D 5 PL
0.2 (0.008)
M
B
M
N
INCHES
MIN
MAX
0.071
0.087
0.045
0.053
0.031
0.043
0.004
0.012
0.026 BSC
−−−
0.004
0.004
0.010
0.004
0.012
0.008 REF
0.079
0.087
J
C
K
H
SOLDERING FOOTPRINT*
0.50
0.0197
0.65
0.025
0.65
0.025
0.40
0.0157
1.9
0.0748
SCALE 20:1
mm inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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5
MILLIMETERS
MIN
MAX
1.80
2.20
1.15
1.35
0.80
1.10
0.10
0.30
0.65 BSC
−−−
0.10
0.10
0.25
0.10
0.30
0.20 REF
2.00
2.20
MC74HC1G00
SOT23−5/TSOP−5/SC59−5
DT SUFFIX
5−LEAD PACKAGE
CASE 483−02
ISSUE C
D
S
5
4
1
2
3
B
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. MAXIMUM LEAD THICKNESS INCLUDES
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
4. A AND B DIMENSIONS DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
L
G
DIM
A
B
C
D
G
H
J
K
L
M
S
A
J
C
0.05 (0.002)
H
M
K
MILLIMETERS
MIN
MAX
2.90
3.10
1.30
1.70
0.90
1.10
0.25
0.50
0.85
1.05
0.013
0.100
0.10
0.26
0.20
0.60
1.25
1.55
0_
10 _
2.50
3.00
INCHES
MIN
MAX
0.1142 0.1220
0.0512 0.0669
0.0354 0.0433
0.0098 0.0197
0.0335 0.0413
0.0005 0.0040
0.0040 0.0102
0.0079 0.0236
0.0493 0.0610
0_
10 _
0.0985 0.1181
SOLDERING FOOTPRINT*
0.95
0.037
1.9
0.074
2.4
0.094
1.0
0.039
0.7
0.028
SCALE 10:1
mm inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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For additional information, please contact your
local Sales Representative.
MC74HC1G00/D
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