MOTOROLA MC74HCT138 1-of-8 decoder/demultiplexer with lsttl compatible input Datasheet

SEMICONDUCTOR TECHNICAL DATA
! $# &!
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High–Performance Silicon–Gate CMOS
N SUFFIX
PLASTIC PACKAGE
CASE 648–08
16
The MC74HCT138A is identical in pinout to the LS138. The HCT138A
may be used as a level converter for interfacing TTL or NMOS outputs to
High Speed CMOS inputs.
The HCT138A decodes a three–bit Address to one–of–eight active–lot
outputs. This device features three Chip Select inputs, two active–low and
one active–high to facilitate the demultiplexing, cascading, and chip–selecting functions. The demultiplexing function is accomplished by using the
Address inputs to select the desired device output; one of the Chip Selects is
used as a data input while the other Chip Selects are held in their active
states.
1
1
1
Output Drive Capability: 10 LSTTL Loads
TTL/NMOS Compatible Input Levels
Outputs Directly Interface to CMOS, NMOS, and TTL
Operating Voltage Range: 4.5 to 5.5 V
Low Input Current: 1.0 µA
In Compliance with the Requirements Defined by JEDEC Standard
No. 7A
• Chip Complexity: 122 FETs or 30.5 Equivalent Gates
ORDERING INFORMATION
MC74HCTXXXAN
MC74HCTXXXAD
MC74HCTXXXADT
ADDRESS
INPUTS
A1
A2
15
2
14
3
13
A0
1
16
VCC
A1
2
15
Y0
A2
3
14
Y1
CS2
4
13
Y2
CS3
5
12
Y3
CS1
6
11
Y4
Y7
7
10
Y5
GND
8
9
Y6
Y0
Y1
Y2
12
Y3
11
Y4
10
Plastic
SOIC
TSSOP
PIN ASSIGNMENT
LOGIC DIAGRAM
1
DT SUFFIX
TSSOP PACKAGE
CASE 948F–01
16
•
•
•
•
•
•
A0
D SUFFIX
SOIC PACKAGE
CASE 751B–05
16
ACTIVE–LOW
OUTPUTS
Y5
9
7
Y6
Y7
FUNCTION TABLE
6
Inputs
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ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
CHIP–
SELECT
INPUTS
CS1
CS2
CS3
4
5
Design Criteria
PIN 16 = VCC
PIN 8 = GND
Value
Units
Internal Gate Count*
30.5
ea.
Internal Gate Propagation Delay
1.5
ns
Internal Gate Power Dissipation
5.0
µW
.0075
pJ
Speed Power Product
X
X
L
X
H
X
H
X
X
X
X
X
X
X
X
X
X
X
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
L
L
L
L
L
L
L
L
L
L
L
L
L
L
H
H
L
H
L
H
L
H
H
H
H
L
H
H
H
H
L
H
H
H
H
L
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
L
L
L
L
L
L
L
L
H
H
H
H
L
L
H
H
L
H
L
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
L
H
H
H
H
L
H
H
H
H
L
H
H
H
H
L
H = high level (steady state)
L = low level (steady state)
X = don’t care
*Equivalent to a two–input NAND gate.
10/95
 Motorola, Inc. 1995
Outputs
CS1CS2 CS3 A2 A1 A0 Y0 Y1 Y2 Y3 Y4 Y5 Y6 Y7
1
REV 6
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MC74HCT138A
MAXIMUM RATINGS*
Symbol
VCC
Parameter
DC Supply Voltage (Referenced to GND)
Value
Unit
– 0.5 to + 7.0
V
Vin
DC Input Voltage (Referenced to GND)
– 0.5 to VCC + 0.5
V
Vout
DC Output Voltage (Referenced to GND)
– 0.5 to VCC + 0.5
V
DC Input Current, per Pin
± 20
mA
Iout
DC Output Current, per Pin
± 25
mA
ICC
DC Supply Current, VCC and GND Pins
± 50
mA
PD
Power Dissipation in Still Air
750
500
450
mW
Tstg
Storage Temperature
– 65 to + 150
_C
Iin
TL
Plastic DIP†
SOIC Package†
TSSOP Package†
This device contains protection
circuitry to guard against damage
due to high static voltages or electric
fields. However, precautions must
be taken to avoid applications of any
voltage higher than maximum rated
voltages to this high–impedance circuit. For proper operation, Vin and
Vout should be constrained to the
range GND (Vin or Vout) VCC.
Unused inputs must always be
tied to an appropriate logic voltage
level (e.g., either GND or VCC).
Unused outputs must be left open.
v
v
_C
Lead Temperature, 1 mm from Case for 10 Seconds
(Plastic DIP, TSSOP or SOIC Package)
260
* Maximum Ratings are those values beyond which damage to the device may occur.
Functional operation should be restricted to the Recommended Operating Conditions.
†Derating — Plastic DIP: – 10 mW/_C from 65_ to 125_C
SOIC Package: – 7 mW/_C from 65_ to 125_C
TSSOP Package: – 6.1 mW/_C from 65_ to 125_C
For high frequency or heavy load considerations, see Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
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v ÎÎÎÎ
v ÎÎÎ
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v
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v
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v
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v
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RECOMMENDED OPERATING CONDITIONS
Symbol
VCC
Vin, Vout
Parameter
Min
DC Supply Voltage (Referenced to GND)
DC Input Voltage, Output Voltage (Referenced to GND)
TA
Operating Temperature, All Package Types
tr, tf
Input Rise and Fall Time (Figure 1)
Max
Unit
4.5
5.5
V
0
VCC
V
– 55
+ 125
_C
0
500
ns
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
Guaranteed Limit
VCC
V
– 55 to
25_C
85_C
125_C
VIH
Minimum High–Level Input
Voltage
Vout = 0.1 V or VCC – 0.1 V
|Iout|
20 µA
4.5
5.5
2.0
2.0
2.0
2.0
2.0
2.0
V
VIL
Maximum Low–Level Input
Voltage
Vout = 0.1 V or VCC – 0.1 V
|Iout|
20 µA
4.5
5.5
0.8
0.8
0.8
0.8
0.8
0.8
V
Minimum High–Level Output
Voltage
Vin = VIH or VIL
|Iout|
20 µA
4.5
5.5
4.4
5.4
4.4
5.4
4.4
5.4
V
Vin = VIH or VIL
|Iout|
4.0 µA
4.5
3.98
3.84
3.7
Vin = VIH or VIL
|Iout|
20 µA
4.5
5.5
0.1
0.1
0.1
0.1
0.1
0.1
Vin = VIH or VIL
|Iout|
4.0 mA
4.5
0.26
0.33
0.4
Maximum Input Leakage Current
Vin = VCC or GND
6.0
± 0.1
± 1.0
± 1.0
µA
ICC
Maximum Quiescent Supply
Current (per Package)
Vin = VCC or GND
Iout = 0 µA
5.5
4.0
40
160
µA
∆ICC
Additional Quiescent Supply
Current
Vin = 2.4 V, Any One Input
Vin = VCC or GND, Other Inputs
lout = 0 µA
Symbol
VOH
VOL
Iin
Parameter
Maximum Low–Level Output
Voltage
Test Conditions
5.5
≥ – 55_C
25_C to 125_C
2.9
2.4
Unit
V
mA
NOTE: Information on typical parametric values can be found in Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
MOTOROLA
2
High–Speed CMOS Logic Data
DL129 — Rev 6
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ÎÎÎ
v ÎÎÎÎ
v
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ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
MC74HCT138A
AC ELECTRICAL CHARACTERISTICS (VCC = 5.0 V ± 10%, CL = 50 pF, Input tr = tf = 6.0 ns)
Guaranteed Limit
– 55 to
25_C
85_C
125_C
tPLH,
tPHL
Maximum Propagation Delay, Input A to Output Y
(Figures 1 and 4)
30
38
45
ns
tPLH,
tPHL
Maximum Propagation Delay, CS1 to Output Y
(Figures 2 and 4)
27
34
41
ns
tPLH,
tPHL
Maximum Output Transition Time, CS2 or CS3 to Output Y
(Figures 3 and 4)
30
38
45
ns
tTLH,
tTHL
Maximum Output Transition Time, Any Output
(Figures 2 and 4)
15
19
22
ns
tr, tf
Maximum Input Rise and Fall Time
500
500
500
ns
Cin
Maximum Input Capacitance
10
10
10
pF
Symbol
Parameter
Unit
NOTE: For propagation delays with loads other than 50 pF, and information on typical parametric values, see Chapter 2 of the Motorola High–
Speed CMOS Data Book (DL129/D).
Typical @ 25°C, VCC = 5.0 V
CPD
Power Dissipation Capacitance (Per Enabled Output)*
pF
51
* Used to determine the no–load dynamic power consumption: PD = CPD VCC 2 f + ICC VCC . For load considerations, see Chapter 2 of the
Motorola High–Speed CMOS Data Book (DL129/D).
EXPANDED LOGIC DIAGRAM
15
14
A0
A1
13
1
12
2
11
A2
3
10
CS3
CS2
Y1
Y2
Y3
Y4
Y5
5
4
9
7
CS1
Y0
Y6
Y7
6
High–Speed CMOS Logic Data
DL129 — Rev 6
3
MOTOROLA
MC74HCT138A
SWITCHING WAVEFORMS
VALID
tr
VALID
INPUT CS1
1.3 V
GND
tPLH
OUTPUT Y
tPHL
tPHL
GND
tPLH
90%
1.3 V
10%
OUTPUT Y
1.3 V
3V
2.7 V
1.3 V
0.3 V
3V
INPUT A
tf
tTHL
tTLH
Figure 1.
Figure 2.
tf
tr
3V
2.7 V
1.3 V
0.3 V
INPUT
CS2, CS3
GND
tPHL
tPLH
90%
1.3 V
10%
OUTPUT Y
tTHL
tTLH
Figure 3.
TEST CIRCUIT
TEST POINT
OUTPUT
DEVICE
UNDER
TEST
CL*
* Includes all probe and jig capacitance
Figure 4.
MOTOROLA
4
High–Speed CMOS Logic Data
DL129 — Rev 6
MC74HCT138A
OUTLINE DIMENSIONS
N SUFFIX
PLASTIC PACKAGE
CASE 648–08
ISSUE R
–A
–
16
9
1
8
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
B
F
C
DIM
A
B
C
D
F
G
H
J
K
L
M
S
L
S
–T
–
SEATING
PLANE
K
H
D 16 PL
0.25 (0.010)
M
M
J
G
T A
M
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751B–05
ISSUE J
–A
–
16
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
9
–B
–
1
P 8 PL
0.25 (0.010)
8
M
B
M
G
K
F
R X 45°
C
–T
SEATING
–
PLANE
J
M
D 16 PL
0.25 (0.010)
High–Speed CMOS Logic Data
DL129 — Rev 6
M
T
B
S
A
S
5
INCHES
MILLIMETERS
MIN
MAX
MIN
MAX
0.740 0.770 18.80 19.55
6.35
0.250 0.270
6.85
3.69
0.145 0.175
4.44
0.39
0.015 0.021
0.53
1.02
0.040 0.070
1.77
0.100 BSC
2.54 BSC
0.050 BSC
1.27 BSC
0.21
0.008 0.015
0.38
2.80
0.110 0.130
3.30
7.50
0.295 0.305
7.74
0°
0°
10°
10°
0.020 0.040
0.51
1.01
DIM
A
B
C
D
F
G
J
K
M
P
R
MILLIMETERS
MIN
MAX
9.80 10.00
4.00
3.80
1.75
1.35
0.49
0.35
1.25
0.40
1.27 BSC
0.25
0.19
0.25
0.10
7°
0°
6.20
5.80
0.50
0.25
INCHES
MIN
MAX
0.386 0.393
0.150 0.157
0.054 0.068
0.014 0.019
0.016 0.049
0.050 BSC
0.008 0.009
0.004 0.009
0°
7°
0.229 0.244
0.010 0.019
MOTOROLA
MC74HCT138A
OUTLINE DIMENSIONS
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948F–01
ISSUE O
16X K REF
0.10 (0.004)
0.15 (0.006) T U
M
T U
V
S
ÇÇÇ
ÉÉ
ÇÇÇ
ÉÉ
ÇÇÇ
ÉÉ
ÇÇÇ
ÉÉ
S
S
K
K1
2X
L/2
16
9
J1
B
–U–
L
SECTION N–N
J
PIN 1
IDENT.
8
1
N
0.25 (0.010)
0.15 (0.006) T U
S
A
–V–
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.
PROTRUSIONS OR GATE BURRS. MOLD FLASH OR
GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER
SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED AT
DATUM PLANE –W–.
M
N
F
DETAIL E
–W–
C
0.10 (0.004)
–T– SEATING
PLANE
H
D
DETAIL E
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
MILLIMETERS
MIN
MAX
4.90
5.10
4.30
4.50
–––
1.20
0.05
0.15
0.50
0.75
0.65 BSC
0.18
0.28
0.09
0.20
0.09
0.16
0.19
0.30
0.19
0.25
6.40 BSC
0_
8_
INCHES
MIN
MAX
0.193
0.200
0.169
0.177
–––
0.047
0.002
0.006
0.020
0.030
0.026 BSC
0.007
0.011
0.004
0.008
0.004
0.006
0.007
0.012
0.007
0.010
0.252 BSC
0_
8_
G
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*MC74HCT138A/D*
MC74HCT138A/D
High–Speed CMOS Logic Data
DL129 — Rev 6
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