CREE MCEEZW-H1-0000-0000J030F Product family data sheet Datasheet

Cree XLamp MC-E LED
®
®
MC-E White
MC-E Dynamic White
MC-E Color
Product Description
FEATURES
The XLamp MC-E LED is a family
•
Available in white (2600 K –
Table of Contents
Characteristics
of lighting-class, multi-chip LEDs
10,000 K CCT), EasyWhite®,
Complete Package................... 2
that provides high lumen output
Dynamic White, or color
Per LED Die (White)................. 2
in
(RGBW)
to
a
small
discrete
package.
LEDs,
Compared
XLamp
MC-E
•
LEDs reduce the distance between
ANSI-compatible neutral &
Per LED Die (Color).................. 2
Flux Characteristics
warm white chromaticity bins
White..................................... 3
EasyWhite.............................. 4
LED die, creating a small optical
•
Individually addressable LEDs
source for excellent optical control
•
MC-E Dynamic White LEDs
Relative Spectral Power
and efficient color mixing. XLamp
have two cool-white (6500 K)
Distribution
MC-E LEDs can reduce LED system
and two warm-white (2700 K)
White..................................... 5
complexity by reducing the number
LED die
Color...................................... 5
XLamp
LEDs
MC-E EasyWhite LEDs
Relative Flux Output vs
available in 2 and 4-step bins,
Junction Temperature.................. 6
up to 85 CRI
Electrical Characteristics.............. 7
Maximum drive current:
Relative Intensity vs. Current....... 7
700 mA per LED die
Typical Spatial Radiation Pattern... 8
Reflow solderable – JEDEC
Reflow Soldering Characteristics... 9
J-STD-020
Notes.......................................10
Electrically neutral thermal
Mechanical Dimensions..............12
path
Tape and Reel...........................13
•
RoHS-compliant
Packaging.................................14
•
UL-recognized component
•
of components required.
Cree
bring
high
performance and quality of light to a
•
wide range of lighting applications,
including color-changing lighting,
portable
and
personal
•
lighting,
outdoor lighting, indoor directional
•
lighting, and entertainment lighting.
www.cree.com/Xlamp
CLD-DS16 Rev 11A
Product family data sheet
(E349212)
Copyright © 2008-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without
notice. Cree®, the Cree logo, XLamp® and EasyWhite® are are registered trademarks of Cree, Inc.
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
xlamp MC-e leds
Characteristics - Complete Package
The following table lists the product characteristics for the XLamp MC-E LED package.
Characteristics
Unit
Thermal Resistance, junction to solder point - white
°C/W
Thermal Resistance, junction to solder point - color
Minimum
Typical
Maximum
3
°C/W
4
Viewing Angle (FWHM) - white
degrees
110
Viewing Angle (FWHM) - color
degrees
115
ESD withstand voltage (HBM per Mil-Std-883D)
V
8000
LED Junction Temperature
°C
150
Characteristics - Per LED Die (White, EasyWhite, Dynamic White)
The following table lists the product characteristics of each individual LED die within the XLamp MC-E White LED package.
Characteristics
Unit
Temperature Coefficient of Voltage
Minimum
Typical
mV/°C
DC Forward Current
Maximum
-4
mA
700
Reverse Voltage
V
5
Forward Voltage (@ 350 mA)
V
3.1
Forward Voltage (@ 700 mA)
V
3.4
3.9
Characteristics - Per LED Die (Color)
The following table lists the product characteristics for each LED die within the XLamp MC-E Color LED package.
Characteristics
Temperature Coefficient of Voltage
DC Forward Current
Reverse Voltage
Unit
Red
Green
Blue
White
Typical
-2
-4
-4
-4
mA
Maximum
700
700
700
700
V
Maximum
5
5
5
5
Typical
2.1
3.4
3.2
3.1
Maximum
2.5
3.9
3.9
3.9
Typical
2.3
3.7
3.5
3.5
mV/°C
Forward Voltage (@ 350 mA)
V
Forward Voltage (@ 700 mA)
V
Copyright © 2008-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®v, the Cree logo, XLamp® and EasyWhite® are
registered trademarks of Cree, Inc.
2
xlamp MC-e leds
Flux Characteristics - White, Dynamic White, Color (TJ = 25 °C)
The following tables provide several base order codes for XLamp MC-E. It is important to note that the base order codes
listed here are a subset of the total available order codes for the product family. For more order codes, as well as a
complete description of the order-code nomenclature, please consult the XLamp MC-E Binning and Labeling document.
Part
White
Dynamic White
Color
Color
CCT / Dominant Wavelength
Range
Min.
Max.
Cool White
5000 K
10,000 K
Neutral White
3700 K
5000 K
Warm White
2600 K
3700 K
Base order codes
Min. Luminous Flux
@ 350 mA*
Order Code
Group
Flux (lm)
K
370
MCE4WT-A2-0000-000K01
M
430
MCE4WT-A2-0000-000M01
J
320
MCE4WT-A2-0000-000JE4
K
370
MCE4WT-A2-0000-000KE4
G
240
MCE4WT-A2-0000-000GE7
H
280
MCE4WT-A2-0000-000HE7
J
320
MCE4WT-A2-0000-000JE7
2 cool-white die
6500 K
K
100
2 warm-white die
2700 K
G
70
2 cool-white die
6000 K
K
100
2 warm-white die
2700 K
G
70
Red
620 nm
630 nm
Green
520 nm
535 nm
Blue
450 nm
465 nm
8.2
Cool White
5700 K
7000 K
100
Red
620 nm
630 nm
30.6
Green
520 nm
535 nm
Blue
450 nm
465 nm
Neutral White
3700 K
4300 K
MCEDWT-A1-0000-0000A1001
MCEDWT-A1-0000-0000A1002
30.6
A5
A4
67.2
67.2
8.2
MCE4CT-A2-0000-00A5AAAA1
MCE4CT-A2-0000-00A4AAAB1
80
Notes:
•
Cree maintains a tolerance of ±7% on flux and power measurements, ±0.005 on chromaticity (CCx, CCy)
measurements, ±2 on CRI measurements and ± 1 nm on dominant wavelength measurements.
•
Typical CRI for cool white and neutral white (3700 K - 10,000 K CCT) is 75.
•
Typical CRI for warm white (2600 K - 3700 K CCT) is 80.
•
Flux and chromaticity are measured with each LED die connected to independent drive circuits at 350 mA. The flux
and chromaticity of XLamp MC-E White are measured with all LEDs lit simultaneously. The flux and color of each LED
in XLamp MC-E Dynamic White and MC-E Color are measured individually.
Copyright © 2008-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®v, the Cree logo, XLamp® and EasyWhite® are
registered trademarks of Cree, Inc.
3
xlamp MC-e leds
Flux Characteristics - EasyWhite MC-E LEDs (TJ = 25 °C)
The following table provides order codes for XLamp MC-E EasyWhite LEDs. For a complete description of the order-code
nomenclature, please consult the XLamp MC-E Binning and Labeling document.
Color
CCT
Range
4000 K
Standard
CRI
EasyWhite
3500 K
3000 K
2700 K
4000 K
80-CRI
Minimum
EasyWhite
3500 K
3000 K
2700 K
85-CRI
Minimum
EasyWhite
3000 K
2700 K
Base Order Codes
Min. Luminous Flux
@ 350 mA, 25 ° C
Group
Flux (lm)
K
370
J
320
J
320
H
280
J
320
H
280
J
320
H
280
K
370
J
320
J
320
H
280
J
320
H
280
J
320
H
280
H
280
G
240
H
280
G
240
2-Step Order Code
Chromaticity
Region
40H
35H
30H
27H
40H
35H
30H
27H
30H
27H
4-Step Order Code
Chromaticity
Region
MCEEZW-A1-0000-0000K040H
MCEEZW-A1-0000-0000J040H
MCEEZW-A1-0000-0000J035H
MCEEZW-A1-0000-0000H035H
MCEEZW-A1-0000-0000J030H
MCEEZW-A1-0000-0000H030H
MCEEZW-A1-0000-0000J027H
MCEEZW-A1-0000-0000H027H
MCEEZW-H1-0000-0000K040H
MCEEZW-H1-0000-0000J040H
MCEEZW-H1-0000-0000J035H
MCEEZW-H1-0000-0000H035H
MCEEZW-H1-0000-0000J030H
MCEEZW-H1-0000-0000H030H
MCEEZW-H1-0000-0000J027H
MCEEZW-H1-0000-0000H027H
MCEEZW-P1-0000-0000H030H
MCEEZW-P1-0000-0000G030H
MCEEZW-P1-0000-0000H027H
MCEEZW-P1-0000-0000G027H
40F
35F
30F
27F
40F
35F
30F
27F
30F
27F
MCEEZW-A1-0000-0000K040F
MCEEZW-A1-0000-0000J040F
MCEEZW-A1-0000-0000J035F
MCEEZW-A1-0000-0000H035F
MCEEZW-A1-0000-0000J030F
MCEEZW-A1-0000-0000H030F
MCEEZW-A1-0000-0000J027F
MCEEZW-A1-0000-0000H027F
MCEEZW-H1-0000-0000K040F
MCEEZW-H1-0000-0000J040F
MCEEZW-H1-0000-0000J035F
MCEEZW-H1-0000-0000H035F
MCEEZW-H1-0000-0000J030F
MCEEZW-H1-0000-0000H030F
MCEEZW-H1-0000-0000J027F
MCEEZW-H1-0000-0000H027F
MCEEZW-P1-0000-0000H030F
MCEEZW-P1-0000-0000G030F
MCEEZW-P1-0000-0000H027F
MCEEZW-P1-0000-0000G027F
Notes:
•
For Standard CRI parts, the typical CRI is 80 for 4000 and 3500 K CCT parts and typical CRI is 82 for 3000 and
2700 K CCT.
•
Cree maintains a tolerance of ±7% on flux and power measurements, ±0.005 on chromaticity (CCx, CCy)
measurements and ±2 on CRI measurements.
•
Flux and chromaticity are measured with each LED die connected to independent drive circuits at 350 mA and with
all LEDs lit simultaneously.
Copyright © 2008-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®v, the Cree logo, XLamp® and EasyWhite® are
registered trademarks of Cree, Inc.
4
xlamp MC-e leds
Relative
Spectral
Power Distribution
(If -=White
350 mA per LED) Relative
Spectral
Power Distribution
(IF = 350 mA per LED)
The following graph represents typical spectral output of the XLamp MC-E White LED with all four LEDs on sim
The following graph represents typical spectral output of the XLamp MC-E White LED with all four LEDs on simultaneously.
Relative Radiant Power (%)
100
80
60
5000K - 10000K CCT
3700K - 5000K CCT
40
2600K - 3700K CCT
20
0
400
450
500
550
600
650
700
750
Wavelength (nm)
Relative Spectral Power Distribution (If = 350 mA per LED) - C
Relative
Spectral
Power Distribution
(IF = 350
mA
per LED)
Color
The following
graph represents
typical spectral output
of the
XLamp
MC-E -Color
LED with all four LEDs on simul
The following graph represents typical spectral output of the XLamp MC-E Color LED with all four LEDs on simultaneously.
Relative Radiant Power (%)
100
80
RGBW (6000K)
60
RGBW (4000K)
40
20
0
400
450
500
550
600
650
700
750
Wavelength (nm)
Copyright © 2008-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®v, the Cree logo, XLamp® and EasyWhite® are
registered trademarks of Cree, Inc.
5
xlamp MC-e leds
Relative
Spectral
Power Distribution
(IF = of
350
per MC-E
LED)Color
- Color
(continued)
The following
graph represents
typical spectral output
themA
XLamp
LED with
each LED on independe
The following graph represents typical spectral output of the XLamp MC-E Color LED with each LED on independently.
Relative Radiant Power (%)
100
80
Red
60
Green
Blue
40
White (6000K)
White (4000K)
20
0
400
450
500
550
600
650
700
750
Wavelength (nm)
Relative Flux Output vs Junction Temperature (I = 350 mA)
Relative
Flux Output vs. Junction Temperature (If = 350 m
F
The
graphrepresents
represents
typical
performance
of each
LED
the XLamp
MC-E LED
Thefollowing
following graph
typical
performance
of each
LED die
in die
the in
XLamp
MC-E LED.
100%
Relative Luminous Flux
90%
80%
70%
White
60%
Red
50%
Green
40%
Blue
30%
20%
10%
0%
25
50
75
100
125
150
Junction Temperature (ºC)
Copyright © 2008-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®v, the Cree logo, XLamp® and EasyWhite® are
registered trademarks of Cree, Inc.
6
xlamp MC-e leds
Electrical Characteristics (Tj = 25ºC)
Electrical
(TJ performance
= 25 ˚C) of each LED die in the XLamp MC-E LED
The following Characteristics
graph represents typical
The following graph represents typical performance of each LED die in the XLamp MC-E LED.
700
Forward Current (mA)
600
500
400
White, Blue
300
Red
Green
200
100
0
1.5
2.0
2.5
3.0
3.5
4.0
Forward Voltage (V)
Relative
Intensity vs. Current (Tj = 25ºC)
Relative Intensity vs. Current (T = 25 ˚C)
J
The following graph represents typical performance of each LED die in the XLamp MC-E LED.
Relative Luminous Flux (%)
200
180
160
140
120
White, Blue
100
Red
80
Green
60
40
20
0
0
100
200
300
400
500
600
700
Forward Current (mA)
Copyright © 2008-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®v, the Cree logo, XLamp® and EasyWhite® are
registered trademarks of Cree, Inc.
7
xlamp MC-e leds
Typical Spatial Radiation Pattern
Typical Spatial Radiation Pattern
The following
graph represents
typical
spectral
of the
LED
with all four LEDs on simultan
The following
graph represents
typical output
of the
XLampoutput
MC-E LED
withXLamp
all four MC-E
LEDs on
simultaneously.
Relative Luminous Intensity (%)
120
100
80
White
60
Color
40
20
0
-90
-60
-30
0
30
60
90
Angle (º)
Copyright © 2008-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®v, the Cree logo, XLamp® and EasyWhite® are
registered trademarks of Cree, Inc.
8
xlamp MC-e leds
Reflow Soldering Characteristics
In testing, Cree has found XLamp MC-E LEDs to be compatible with JEDEC J-STD-020C, using the parameters listed
below. As a general guideline, Cree recommends that users follow the recommended soldering profile provided by the
manufacturer of solder paste used.
Note that this general guideline may not apply to all PCB designs and configurations of reflow soldering equipment.
tP
TP
Critical Zone
TL to TP
Temperature
Ramp-up
TL
tS
Tsmax
Tsmin
Ramp-down
ts
Preheat
25
t 25˚C to Peak
Profile Feature
Average Ramp-Up Rate (Tsmax to Tp)
Time
Lead-Based Solder
Lead-Free Solder
3 °C/second max.
3 °C/second max.
Preheat: Temperature Min (Tsmin)
100 °C
150 °C
Preheat: Temperature Max (Tsmax)
150 °C
200 °C
60-120 seconds
60-180 seconds
183 °C
217°C
60-150 seconds
60-150 seconds
215 °C
260 °C
10-30 seconds
20-40 seconds
6 °C/second max.
6 °C/second max.
6 minutes max.
8 minutes max.
Preheat: Time (tsmin to tsmax)
Time Maintained Above: Temperature (TL)
Time Maintained Above: Time (tL)
Peak/Classification Temperature (Tp)
Time Within 5 °C of Actual Peak Temperature (tp)
Ramp-Down Rate
Time 25 °C to Peak Temperature
Note: All temperatures refer to topside of the package, measured on the package body surface.
Copyright © 2008-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®v, the Cree logo, XLamp® and EasyWhite® are
registered trademarks of Cree, Inc.
9
xlamp MC-e leds
Notes
Lumen Maintenance Projections
Cree now uses standardized IES LM-80-08 and TM-21-11 methods for collecting long-term data and extrapolating LED
lumen maintenance. For information on the specific LM-80 data sets available for this LED, refer to the public LM-80
results document at www.cree.com/xlamp_app_notes/LM80_results.
Moisture Sensitivity
XLamp MC-E LEDs are shipped in sealed, moisture-barrier
Maximum Percent Relative Humidity
bags (MBB) designed for long shelf life. If XLamp MC-E LEDs
Temperature
30%
40%
50%
60%
70%
80%
are exposed to moist environments after opening the MBB
30 ºC
9
5
4
3
1
1
1
packaging but before soldering, damage to the LED may
25 ºC
12
7
5
4
2
1
1
occur during the soldering operation. The derating table
20 ºC
17
9
7
6
2
2
1
90%
at right defines the maximum exposure time (in days) for
an XLamp MC-E LED in the listed humidity and temperature conditions. LEDs with exposure time longer than the time
specified below must be baked according to the baking conditions listed here.
Cree recommends keeping XLamp LEDs in their sealed moisture-barrier packaging until immediately prior to use. Cree
also recommends returning any unused LEDs to the resealable moisture-barrier bag and closing the bag immediately
after use.
Baking Conditions
It is not necessary to bake all XLamp MC-E LEDs. Only the LEDs that meet all of the following criteria must be baked:
•
LEDs that have been removed from the original MBB packaging.
•
LEDs that have been exposed to a humid environment longer than listed in the Moisture Sensitivity section above.
•
LEDs that have not been soldered.
LEDs should be baked at 80 ºC for 24 hours. LEDs may be baked on the original reels. Remove LEDs from MBB packaging
before baking. Do not bake parts at temperatures higher than 80 ºC. This baking operation resets the exposure time as
defined in the Moisture Sensitivity section above.
Storage Conditions
XLamp MC-E LEDs that have been removed from original MBB packaging but not soldered yet should be stored in a
room or cabinet that will maintain an atmosphere of 25 ± 5 ºC and no greater than 10% RH. For LEDs stored in these
conditions, storage time does not add to exposure time as defined in the above Moisture Sensitivity section.
RoHS Compliance
The levels of RoHS restricted materials in this product are below the maximum concentration values (also referred to
as the threshold limits) permitted for such substances, or are used in an exempted application, in accordance with EU
Directive 2011/65/EC (RoHS2), as implemented January 2, 2013. RoHS Declarations for this product can be obtained
from your Cree representative or from the Product Ecology section of www.cree.com.
Copyright © 2008-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®v, the Cree logo, XLamp® and EasyWhite® are
registered trademarks of Cree, Inc.
10
xlamp MC-e leds
UL Recognized Component
Level 1 enclosure consideration. The LED package or a portion thereof has not been investigated as a fire enclosure or
a fire and electrical enclosure per ANSI/UL 8750.
Vision Advisory Claim
WARNING. Do not look at exposed LED lamps in operation. Eye injury can result. For more information about LEDs and
eye safety, please refer to the Cree LED Eye Safety Application Note (www.cree.com/xlamp_app_notes/led_eye_safety).
Copyright © 2008-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®v, the Cree logo, XLamp® and EasyWhite® are
registered trademarks of Cree, Inc.
11
A
Initial Release
10/16/07
RC
B
Change height due to new lens
10/23/2007
RC
C
Change recommended solder pad footprint
11/26/2007
RC
D
Height change due to new lens (was 3.86)
12/26/2007
RC
E
- Change package height FROM 1.5 TO 1.45
- Add LED reference designators
- Delete Series Configuration schematic
- Add tabs to recommended PCB footprint
5/12/2008
5
4
xlamp MC-e leds
.80
TYP.
3
6
NOTICE
RC
CREE
CONFIDENTIAL. THIS PLOT AND THE INFORMATION
CONTAINED WITHIN ARE THE PROPRIETARY AND
CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT
MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY
UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT
OF CREE INC.
D
4
4.48±.20
D
Mechanical Dimensions
1.45
All measurements are ±.1mm unless otherwise
indicated.
.05±.05
D3
6
D4
5
4
6
6
REV
Bottom View
C
Top View
5
4
3
.05±.05
.05±.05
B
1
D
.80
+.2
9.0
TYP.
1
2.0
+.13
.75 -.03
1
B
2
3
3
.25
4
5/12/2
Color
D1: D2
Red
D3
D2: D1
Green
D4
D3: Blue
D4: White
7.50
4
3
2
R3.18
- Change package height FROM 1.5 TO 1.45
- Add LED reference designators
- Delete Series Configuration schematic
- Add tabs to recommended PCB footprint
.80
TYP.
+.13
.75 -.03
A
2.60
COMMENTS
Initial Release
REVISIONS
.80
Change height due to new lens
TYP.
- Change
height FROM 1.5 TO
1.45
Change recommended
solderpackage
pad footprint
11/26/
- Add LED reference designators
E
Series
Configuration
schematic
Height change due -toDelete
new lens
(was
3.86)
12/26/
- Add tabs to recommended PCB footprint
C
E
.05±.05
INK
COMMENTS
A
4.48±.20
A
B
DAT
C
Change recommended solder pad footprint
Initial Release
10/16
D
Height
change
due
to
new
lens
(was
3.86)
Change height due to new lens
10/23/
REV
5.40
1.45
REV
2
+.13
.75 -.03
1.454.48±.20
E
2
1.45
HEATSINK
D
REVISIO
4.48±.20
C
B
C
3
4
N ARE THE PROPRIETARY AND
FORMATION OF CREE, INC. THIS PLOT
PIED,
REPRODUCED
OR DISCLOSED TO ANY
OT AND
THE INFORMATION
.00
.10
ERSON
WITHOUT
THE WRITTEN CONSENT
PROPRIETARY
AND
OF CREE, INC. THIS PLOT
ODUCED OR DISCLOSED TO ANY
HOUT THE WRITTEN CONSENT
A
A
2.60
5
1.50 BSC
NOTICE
AL.
THIS D
PLOT AND THE INFORMATION
PITCH
5
4
7090
C
A
2.60
Side View
.25
+.2 1.16
9.0
.0
B
5.40
A
2.60
R3.18
5.60
+.2
9.0
.0
DRAWN BY
UNLESS OTHERWISE SPECIFIED
R.Chaloupecky
DIMENSIONS ARE IN
MILLIMETERS & BEFORE FINISH. CHECK
Ban Loh
TOLERANCE UNLESS SPECIFIED:
APPROVED
.X ± 0.3
.XX ± .13
± 1°
1.16
MATERIAL
FOR SHEET
B METAL PARTS ONLY
.X ± .25
.XX ± .10
X°
5.60
8
7
DATE
10/16/07
TITLE
SIZE
C
FINAL PROTECTIVE FINISH
SCALE
3.85
DRAWING NO.
20:1
2
1.00 TYP.
2610-00005
2.00
A
1.50 BSC
PITCH
REV.
NEGATIVE (-) 1
A
2.75
7.70 10.02
8
8
1.30
NEGATIVE (-) 2
NEGATIVE (-) 2
7.70 10.02
1
NEGATIVE (-) 3
D1
1.30
Tolerances:
.10
Recommended
PCB Solder Pad
Solder mask windows must be .05 mm bigger
than
1.30PCB Solder Pad.
NEGATIVE (-) 4
C
D1
1
6
2
NEGATIVE (-) 4
D2
D6
2
5
POSITIVE (+) 2
3
D3
D3
D7
POSITIVE (+) 1
D2
D6 6
6
NEGATIVE (-) 4
D5
D5 7
7
NEGATIVE (-) 3
2.84 7.70 10.02
RECOMMENDED
PCB SOLDERNEGATIVE
PAD (-) 3
1.
2.
5
1.50 BSC
PITCH
2.84
7.00
7.70 10.02
NEGATIVE (-) 3
.10
8
D7
3
5
NEGATIVE (-) 4
1
D1
4
D4
D8
4
olerances: .10
NDED
PCBwindows
SOLDER
PAD
older mask
must
be .05 mm bigger
han PCB Solder Pad.
5
D5
D2
2
6
POSITIVE (+) 1
D3
3
D7
5
POSITIVE (+) 2
POSITIVE (+) 2
POSITIVE (+) 3
5
D4
4
4
POSITIVE (+) 4
D8
DRA
UNLESS OTHERWISE SPECIFIED
R.C
DIMENSIONS ARE IN
MILLIMETERS & BEFORE FINISH. CHE
Ba
TOLERANCE UNLESS SPECIFIED:
APPR
.X ± 0.3
.XX ± .13
POSITIVE (+) 3
POSITIVE (+) 4
THIRD ANGLE PROJECTION
POSITIVE (+) 4
Copyright © 2008-2013 Cree, Inc. All rights reserved. The information in this document is subject to
registered trademarks6of Cree, Inc.
5
ECOMMENDED PCB SOLDER PAD
6
SOLDER PAD
DRAWN BY
D8
7
POSITIVE (+) 1
POSITIVE (+) 3
D4
8
.10
NEGATIVE
(-) 2
1. Tolerances:
.10
1
7090MC PARALLEL / INDEPENDENT
2. Solder mask windows must be .05 mm bigger
D6
CONFIGURATION than PCB Solder Pad.
NEGATIVE (-) 1
2.84
6
7090MC PARALLEL
/ INDEPENDENTPCB
RECOMMENDED
CONFIGURATION
7
NEGATIVE (-) 1
2.00
1.50 BSC
PITCH
6
7.00
E
SHEET 1 OF 1
2.84
2.75
2.00
5 2.00
7
7090MC PARALLEL / INDEPENDENT
CONFIGURATION 1.30
2.75
OUTLINE DRAWING,
7090MC PACKAGE
1.00 TYP.
Dynamic White NEGATIVE (-) 1
7.00
D1: Cool
White .10
D2: Warm White
NEGATIVE (-) 2
D3: Cool White
D4: Warm White
A
DATE
± 2°
5.60
4600 Silicon Drive
Durham, N.C 27703
5.60
DATE
5
1.50 BSC
PITCH
8
1.50 BSC
PITCH
.25
5.40
X°
R3.18
.25
5.40
6
Top View
D1 D4
3.85
7
D1 D4
D2 D3
1.00 TYP.
7.50
8
D2 D3
7.50
R3.18
0 TYP.
75
3
HEATSINK
NOTICE
CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION
CONTAINED WITHIN ARE THE PROPRIETARY AND
CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT
MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY
UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT
OF CREE INC.
X°
± 1°
FOR SHEET METAL PARTS ONLY
.X ± .25
.XX ± .10
DATE
UNLESS OTHERWISE SPECIFIED
10/16/07
R.Chaloupecky
DIMENSIONS
ARE IN XLamp® and EasyWhite
X° ®± 2°
change without notice. Cree , the
Cree logo,
are
DATE
MILLIMETERS & BEFORE FINISH. CHECK
DRAWN BY
DATE
Ban Loh
4
UNLESS OTHERWISETOLERANCE
SPECIFIED UNLESS SPECIFIED: 3
10/16/07
R.Chaloupecky
APPROVED
DATE
DIMENSIONS ARE IN
.X ± 0.3
DATE
TITLE
MILLIMETERS & BEFORE FINISH.
.XX ± CHECK
.13
Ban Loh
TOLERANCE UNLESS SPECIFIED:
THIRD ANGLE PROJECTION
MATERIAL
X°
±
1°
APPROVED
DATE
.X ± 0.3
TITLE
.XX ± .13
FOR SHEET METAL PARTS ONLY
MATE
FINAL
®v
12
O
7
xlamp MC-e leds
Tape and Reel
All Cree carrier tapes conform to EIA-481D, Automated Component Handling Systems Standard.
All measurements in mm.
4.0±.1
1.5±.1
12.0±.1
1.75±.10
5.5±.1
Cathode Side
+.3
16.0
.0
Anode Side
(denoted by chamfer)
User Feed Direction
END
START
Loaded Pockets
(200 Lamps)
Trailer
160mm (min) of
empty pockets
sealed with tape
(13 pockets min.)
Leader
400mm (min) of
empty pockets with
at least 100mm
sealed by tape
(34 empty pockets min.)
User Feed Direction
Cover Tape
Pocket Tape
13mm
7"
Copyright © 2008-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®v, the Cree logo, XLamp® and EasyWhite® are
registered trademarks of Cree, Inc.
13
xlamp MC-e leds
Packaging
Unpackaged Reel
Vacuum-Sealed
Vacuum-Sealed
Moisture
Barrier Bag
Moisture Barrier Bag
Label
CREE
Binwith
Code Cree Bin
&
Barcode
LabelLot #
Code,
Qty,
Label with Cree Bin
Code, Qty, Reel ID
Label
with
Cree Bin
Label with
Customer
P/N, Qty,Qty,
Lot #, Lot
PO # #
Code,
Packaged Reel
Patent Label
Dessicant
(inside bag)
Label with Customer Order
Label
with Cree Order Code,
Code, Qty, Reel ID, PO #
Qty, Reel ID, PO #
Humidity Indicator Card
(inside bag)
Label with Cree Bin
Code, Qty, Reel ID
Boxed Reel
Label with Cree Order Code,
Qty, Reel ID, PO #
Label with Cree Bin
Code, Qty, Reel ID
Patent Label
(on bottom of box)
Copyright © 2008-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®v, the Cree logo, XLamp® and EasyWhite® are
registered trademarks of Cree, Inc.
14
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