Microchip MCP41010E/P Single/dual digital potentiometer with spi interface Datasheet

M
MCP41XXX/42XXX
Single/Dual Digital Potentiometer with SPI™ Interface
Features
Description
• 256 taps for each potentiometer
• Potentiometer values for 10 kΩ, 50 kΩ and
100 kΩ
• Single and dual versions
• SPI™ serial interface (mode 0,0 and 1,1)
• ±1 LSB max INL & DNL
• Low power CMOS technology
• 1 µA maximum supply current in static operation
• Multiple devices can be daisy-chained together
(MCP42XXX only)
• Shutdown feature open circuits of all resistors for
maximum power savings
• Hardware shutdown pin available on MCP42XXX
only
• Single supply operation (2.7V - 5.5V)
• Industrial temperature range: -40°C to +85°C
• Extended temperature range: -40°C to +125°C
The MCP41XXX and MCP42XXX devices are 256position, digital potentiometers available in 10 kΩ,
50 kΩ and 100 kΩ resistance versions. The
MCP41XXX is a single-channel device and is offered in
an 8-pin PDIP or SOIC package. The MCP42XXX contains two independent channels in a 14-pin PDIP, SOIC
or TSSOP package. The wiper position of the
MCP41XXX/42XXX varies linearly and is controlled via
an industry-standard SPI interface. The devices consume <1 µA during static operation. A software shutdown feature is provided that disconnects the “A”
terminal from the resistor stack and simultaneously connects the wiper to the “B” terminal. In addition, the dual
MCP42XXX has a SHDN pin that performs the same
function in hardware. During shutdown mode, the contents of the wiper register can be changed and the
potentiometer returns from shutdown to the new value.
The wiper is reset to the mid-scale position (80h) upon
power-up. The RS (reset) pin implements a hardware
reset and also returns the wiper to mid-scale. The
MCP42XXX SPI interface includes both the SI and SO
pins, allowing daisy-chaining of multiple devices. Channel-to-channel resistance matching on the MCP42XXX
varies by less than 1%. These devices operate from a
single 2.7 - 5.5V supply and are specified over the
extended and industrial temperature ranges.
Block Diagram
RS
SHDN
VDD
VSS
Wiper
Register
Control
Logic
SI
SCK
Wiper Resistor
Register Array 1*
16-Bit
Shift
Register
PB1
PA1
PW1
S0
*Potentiometer P1 is only available on the dual
MCP42XXX version.
Package Types
PDIP/SOIC
CS
SCK
SI
VSS
2
3
4
8
7
6
5
VDD
PB0
PW0
PA0
PDIP/SOIC/TSSOP
1
14
2
13
3
4
5
6
7
MCP42XXX
CS
SCK
SI
VSS
PB1
PW1
PA1
 2003 Microchip Technology Inc.
1
MCP41XXX
CS
PB0
Resistor
Array 0
PA0
PW0
12
11
10
9
8
VDD
SO
SHDN
RS
PB0
PW0
PA0
DS11195C-page 1
MCP41XXX/42XXX
1.0
ELECTRICAL CHARACTERISTICS
DC CHARACTERISTICS: 10 kΩ VERSION
Electrical Characteristics: Unless otherwise indicated, VDD = +2.7V to 5.5V, TA = -40°C to +85°C (TSSOP devices are only specified at +25°C and
+85°C). Typical specifications represent values for VDD = 5V, VSS = 0V, VB = 0V, TA = +25°C.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Rheostat Mode
Nominal Resistance
Rheostat Differential Non Linearity
Rheostat Integral Non Linearity
TA = +25°C (Note 1)
R
8
10
12
kΩ
R-DNL
-1
±1/4
+1
LSB
Note 2
Note 2
R-INL
-1
±1/4
+1
LSB
Rheostat Tempco
∆RAB/∆T
—
800
—
ppm/°C
Wiper Resistance
RW
—
52
100
Ω
VDD = 5.5V, IW = 1 mA, code 00h
RW
—
73
125
Ω
VDD = 2.7V, IW = 1 mA, code 00h
IW
-1
—
+1
mA
∆R/R
—
0.2
1
%
Resolution
N
8
—
—
Bits
Monotonicity
N
8
—
—
Bits
Differential Non-Linearity
DNL
-1
±1/4
+1
LSB
Note 3
Integral Non-Linearity
INL
-1
±1/4
+1
LSB
Note 3
∆VW/∆T
—
1
—
Wiper Current
Nominal Resistance Match
MCP42010 only, P0 to P1; TA = +25°C
Potentiometer Divider
Voltage Divider Tempco
Full Scale Error
Zero Scale Error
ppm/°C Code 80h
VWFSE
-2
-0.7
0
LSB
Code FFh, VDD = 5V, see Figure 2-25
VWFSE
-2
-0.7
0
LSB
Code FFh, VDD = 3V, see Figure 2-25
VWZSE
0
+0.7
+2
LSB
Code 00h, VDD = 5V, see Figure 2-25
VWZSE
0
+0.7
+2
LSB
Code 00h, VDD = 3V, see Figure 2-25
Resistor Terminals
Voltage Range
VA,B,W
Capacitance (CA or CB)
Capacitance
CW
0
—
VDD
—
15
—
pF
f = 1 MHz, Code = 80h, see Figure 2-30
—
5.6
—
pF
f = 1 MHz, Code = 80h, see Figure 2-30
Note 4
Dynamic Characteristics (All dynamic characteristics use VDD = 5V)
Bandwidth -3dB
Settling Time
Resistor Noise Voltage
Crosstalk
BW
—
1
—
MHz
tS
—
2
—
µS
eNWB
—
9
—
nV/√Hz
CT
—
-95
—
dB
VB = 0V, Measured at Code 80h,
Output Load = 30 PF
VA = VDD,VB = 0V, ±1% Error Band, Transition
from Code 00h to Code 80h, Output Load = 30 pF
VA = Open, Code 80h, f =1 kHz
VA = VDD, VB = 0V (Note 5)
Digital Inputs/Outputs (CS, SCK, SI, SO) See Figure 2-12 for RS and SHDN pin operation
Schmitt Trigger High-Level Input Voltage
VIH
0.7VDD
—
—
V
Schmitt Trigger Low-Level Input Voltage
VIL
—
—
0.3VDD
V
VHYS
—
0.05VDD
—
Hysteresis of Schmitt Trigger Inputs
Low-Level Output Voltage
VOL
—
—
0.40
V
High-Level Output Voltage
VOH
VDD - 0.5
—
—
V
IOH = -400 µA, VDD = 5V
ILI
-1
—
+1
µA
CS = VDD, VIN = VSS or VDD, includes VA SHDN=0
CIN, COUT
—
10
—
pF
VDD = 5.0V, TA = +25°C, fc = 1 MHz
Operating Voltage Range
VDD
2.7
—
5.5
V
Supply Current, Active
IDDA
—
340
500
µA
VDD = 5.5V, CS = VSS, fSCK = 10 MHz,
SO = Open, Code FFh (Note 6)
Supply Current, Static
IDDS
—
0.01
1
µA
CS, SHDN, RS = VDD = 5.5V, SO = Open (Note 6)
Power Supply Sensitivity
PSS
—
0.0015
0.0035
%/%
VDD = 4.5V - 5.5V, VA = 4.5V, Code 80h
PSS
—
0.0015
0.0035
%/%
VDD = 2.7V - 3.3V, VA = 2.7V, Code 80h
Input Leakage Current
Pin Capacitance (All inputs/outputs)
IOL = 2.1 mA, VDD = 5V
Power Requirements
Note
1:
2:
3:
4:
5:
6:
VAB = VDD, no connection on wiper.
Rheostat position non-linearity R-INL is the deviation from an ideal value measured between the maximum resistance and the minimum
resistance wiper positions. R-DNL measures the relative step change from the ideal between successive tap positions. IW = 50 µA for
VDD = 3V and IW = 400 µA for VDD = 5V for 10 kΩ version. See Figure 2-26 for test circuit.
INL and DNL are measured at VW with the device configured in the voltage divider or potentiometer mode. VA = VDD and VB = 0V. DNL
specification limits of ±1 LSB max are specified monotonic operating conditions. See Figure 2-25 for test circuit.
Resistor terminals A,B and W have no restrictions on polarity with respect to each other. Full-scale and zero-scale error were measured
using Figure 2-25.
Measured at VW pin where the voltage on the adjacent VW pin is swinging full-scale.
Supply current is independent of current through the potentiometers.
DS11195C-page 2
 2003 Microchip Technology Inc.
MCP41XXX/42XXX
DC CHARACTERISTICS: 50 kΩ VERSION
Electrical Characteristics: Unless otherwise indicated, VDD = +2.7V to 5.5V, TA = -40°C to +85°C (TSSOP devices are only specified at +25°C and
+85°C). Typical specifications represent values for VDD = 5V, VSS = 0V, VB = 0V, TA = +25°C.
Parameters
Sym
Min
Typ
Max
Units
Conditions
R
35
50
65
kΩ
R-DNL
-1
±1/4
+1
LSB
Note 2
Note 2
Rheostat Mode
Nominal Resistance
Rheostat Differential Non-Linearity
Rheostat Integral Non-Linearity
TA = +25°C (Note 1)
R-INL
-1
±1/4
+1
LSB
Rheostat Tempco
∆RAB/∆T
—
800
—
ppm/°C
Wiper Resistance
RW
—
125
175
Ω
VDD = 5.5V, IW = 1 mA, code 00h
RW
—
175
250
Ω
VDD = 2.7V, IW = 1 mA, code 00h
IW
-1
—
+1
mA
∆R/R
—
0.2
1
%
Wiper Current
Nominal Resistance Match
MCP42050 only, P0 to P1;TA = +25°C
Potentiometer Divider
Resolution
N
8
—
—
Bits
Monotonicity
N
8
—
—
Bits
Differential Non-Linearity
DNL
-1
±1/4
+1
LSB
Note 3
Integral Non-Linearity
INL
-1
±1/4
+1
LSB
Note 3
Voltage Divider Tempco
∆VW/∆T
—
1
—
Full-Scale Error
VWFSE
-1
-0.25
0
LSB
Code FFh, VDD = 5V, see Figure 2-25
VWFSE
-1
-0.35
0
LSB
Code FFh, VDD = 3V, see Figure 2-25
VWZSE
0
+0.25
+1
LSB
Code 00h, VDD = 5V, see Figure 2-25
VWZSE
0
+0.35
+1
LSB
Code 00h, VDD = 3V, see Figure 2-25
Zero-Scale Error
ppm/°C Code 80h
Resistor Terminals
Voltage Range
VA,B,W
Capacitance (CA or CB)
Capacitance
CW
0
—
VDD
—
11
—
pF
f =1 MHz, Code = 80h, see Figure 2-30
—
5.6
—
pF
f =1 MHz, Code = 80h, see Figure 2-30
Note 4
Dynamic Characteristics (All dynamic characteristics use VDD = 5V)
Bandwidth -3dB
Settling Time
Resistor Noise Voltage
Crosstalk
BW
—
280
—
MHz
tS
—
8
—
µS
eNWB
—
20
—
nV/√Hz
CT
—
-95
—
dB
VB = 0V, Measured at Code 80h,
Output Load = 30 PF
VA = VDD,VB = 0V, ±1% Error Band, Transition
from Code 00h to Code 80h, Output Load = 30 pF
VA = Open, Code 80h, f =1 kHz
VA = VDD, VB = 0V (Note 5)
Digital Inputs/Outputs (CS, SCK, SI, SO) See Figure 2-12 for RS and SHDN pin operation.
Schmitt Trigger High-Level Input Voltage
VIH
0.7VDD
—
—
V
Schmitt Trigger Low-Level Input Voltage
VIL
—
—
0.3VDD
V
VHYS
—
0.05VDD
—
Hysteresis of Schmitt Trigger Inputs
Low-Level Output Voltage
VOL
—
—
0.40
V
High-Level Output Voltage
VOH
VDD - 0.5
—
—
V
IOH = -400 µA, VDD = 5V
ILI
-1
—
+1
µA
CS = VDD, VIN = VSS or VDD, includes VA SHDN=0
CIN, COUT
—
10
—
pF
VDD = 5.0V, TA = +25°C, fc = 1 MHz
Operating Voltage Range
VDD
2.7
—
5.5
V
Supply Current, Active
IDDA
—
340
500
µA
VDD = 5.5V, CS = VSS, fSCK = 10 MHz,
SO = Open, Code FFh (Note 6)
Supply Current, Static
IDDS
—
0.01
1
µA
CS, SHDN, RS = VDD = 5.5V, SO = Open (Note 6)
Power Supply Sensitivity
PSS
—
0.0015
0.0035
%/%
VDD = 4.5V - 5.5V, VA = 4.5V, Code 80h
PSS
—
0.0015
0.0035
%/%
VDD = 2.7V - 3.3V, VA = 2.7V, Code 80h
Input Leakage Current
Pin Capacitance (All inputs/outputs)
IOL = 2.1 mA, VDD = 5V
Power Requirements
Note
1:
2:
3:
4:
5:
6:
VAB = VDD, no connection on wiper.
Rheostat position non-linearity R-INL is the deviation from an ideal value measured between the maximum resistance and the minimum
resistance wiper positions. R-DNL measures the relative step change from the ideal between successive tap positions. IW = VDD/R for
+3V or +5V for 50 kΩ version. See Figure 2-26 for test circuit.
INL and DNL are measured at VW with the device configured in the voltage divider or potentiometer mode. VA = VDD and VB = 0V. DNL
specification limits of ±1 LSB max are specified monotonic operating conditions. See Figure 2-25 for test circuit.
Resistor terminals A,B and W have no restrictions on polarity with respect to each other. Full-scale and zero-scale error were measured
using Figure 2-25.
Measured at VW pin where the voltage on the adjacent VW pin is swinging full scale.
Supply current is independent of current through the potentiometers.
 2003 Microchip Technology Inc.
DS11195C-page 3
MCP41XXX/42XXX
DC CHARACTERISTICS: 100 kΩ VERSION
Electrical Characteristics: Unless otherwise indicated, VDD = +2.7V to 5.5V, TA = -40°C to +85°C (TSSOP devices are only specified at +25°C and
+85°C). Typical specifications represent values for VDD = 5V, VSS = 0V, VB = 0V, TA = +25°C.
Parameters
Sym
Min
Typ
Max
R
R-DNL
Units
Conditions
70
100
130
kΩ
-1
±1/4
+1
LSB
Note 2
Note 2
Rheostat Mode
Nominal Resistance
Rheostat Differential Non-Linearity
Rheostat Integral Non-Linearity
TA = +25°C (Note 1)
R-INL
-1
±1/4
+1
LSB
Rheostat Tempco
∆RAB/∆T
—
800
—
ppm/°C
Wiper Resistance
RW
—
125
175
Ω
VDD = 5.5V, IW = 1 mA, code 00h
RW
—
175
250
Ω
VDD = 2.7V, IW = 1 mA, code 00h
IW
-1
—
+1
mA
∆R/R
—
0.2
1
%
Resolution
N
8
—
—
Bits
Monotonicity
N
8
—
—
Bits
Differential Non-Linearity
DNL
-1
±1/4
+1
LSB
Note 3
Integral Non-Linearity
INL
-1
±1/4
+1
LSB
Note 3
Voltage Divider Tempco
∆VW/∆T
—
1
—
Full-Scale Error
VWFSE
-1
-0.25
0
LSB
Code FFh, VDD = 5V, see Figure 2-25
VWFSE
-1
-0.35
0
LSB
Code FFh, VDD = 3V, see Figure 2-25
VWZSE
0
+0.25
+1
LSB
Code 00h, VDD = 5V, see Figure 2-25
VWZSE
0
+0.35
+1
LSB
Code 00h, VDD = 3V, see Figure 2-25
Wiper Current
Nominal Resistance Match
MCP42010 only, P0 to P1;TA = +25°C
Potentiometer Divider
Zero-Scale Error
ppm/°C Code 80h
Resistor Terminals
Voltage Range
VA,B,W
Capacitance (CA or CB)
Capacitance
CW
0
—
VDD
—
11
—
pF
f =1 MHz, Code = 80h, see Figure 2-30
—
5.6
—
pF
f =1 MHz, Code = 80h, see Figure 2-30
Note 4
Dynamic Characteristics (All dynamic characteristics use VDD = 5V.)
Bandwidth -3dB
Settling Time
Resistor Noise Voltage
Crosstalk
BW
—
145
—
MHz
tS
—
18
—
µS
eNWB
—
29
—
nV/√Hz
CT
—
-95
—
dB
VB = 0V, Measured at Code 80h,
Output Load = 30 PF
VA = VDD,VB = 0V, ±1% Error Band, Transition
from Code 00h to Code 80h, Output Load = 30 pF
VA = Open, Code 80h, f =1 kHz
VA = VDD, VB = 0V (Note 5)
Digital Inputs/Outputs (CS, SCK, SI, SO) See Figure 2-12 for RS and SHDN pin operation.
Schmitt Trigger High-Level Input Voltage
VIH
0.7VDD
—
—
V
Schmitt Trigger Low-Level Input Voltage
VIL
—
—
0.3VDD
V
VHYS
—
0.05VDD
—
Hysteresis of Schmitt Trigger Inputs
Low-Level Output Voltage
VOL
—
—
0.40
V
High-Level Output Voltage
VOH
VDD - 0.5
—
—
V
IOH = -400 µA, VDD = 5V
ILI
-1
—
+1
µA
CS = VDD, VIN = VSS or VDD, includes VA SHDN=0
CIN, COUT
—
10
—
pF
VDD = 5.0V, TA = +25°C, fc = 1 MHz
Operating Voltage Range
VDD
2.7
—
5.5
V
Supply Current, Active
IDDA
—
340
500
µA
VDD = 5.5V, CS = VSS, fSCK = 10 MHz,
SO = Open, Code FFh (Note 6)
Supply Current, Static
IDDS
—
0.01
1
µA
CS, SHDN, RS = VDD = 5.5V, SO = Open (Note 6)
Power Supply Sensitivity
PSS
—
0.0015
0.0035
%/%
VDD = 4.5V - 5.5V, VA = 4.5V, Code 80h
PSS
—
0.0015
0.0035
%/%
VDD = 2.7V - 3.3V, VA = 2.7V, Code 80h
Input Leakage Current
Pin Capacitance (All inputs/outputs)
IOL = 2.1 mA, VDD = 5V
Power Requirements
Note
1:
2:
3:
4:
5:
6:
VAB = VDD, no connection on wiper.
Rheostat position non-linearity R-INL is the deviation from an ideal value measured between the maximum resistance and the minimum
resistance wiper positions. R-DNL measures the relative step change from the ideal between successive tap positions. IW = 50 µA for
VDD = 3V and IW = 400 µA for VDD = 5V for 10 kΩ version. See Figure 2-26 for test circuit.
INL and DNL are measured at VW with the device configured in the voltage divider or potentiometer mode. VA = VDD and VB = 0V. DNL
specification limits of ±1 LSB max are specified monotonic operating conditions. See Figure 2-25 for test circuit.
Resistor terminals A,B and W have no restrictions on polarity with respect to each other. Full-scale and zero-scale error were measured
using Figure 2-25.
Measured at VW pin where the voltage on the adjacent VW pin is swinging full-scale.
Supply current is independent of current through the potentiometers.
DS11195C-page 4
 2003 Microchip Technology Inc.
MCP41XXX/42XXX
Absolute Maximum Ratings †
VDD...................................................................................7.0V
† Notice: Stresses above those listed under “maximum ratings” may cause permanent damage to the device. This is a
stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may
affect device reliability.
All inputs and outputs w.r.t. VSS ............... -0.6V to VDD +1.0V
Storage temperature .....................................-60°C to +150°C
Ambient temp. with power applied ................-60°C to +125°C
ESD protection on all pins ..................................................≥ 2 kV
AC TIMING CHARACTERISTICS
Electrical Characteristics: Unless otherwise indicated, VDD = +2.7V to 5.5V, TA = -40°C to +85°C.
Parameter
Sym
Min.
Typ.
Max.
Units
Clock Frequency
FCLK
—
—
10
MHz
Clock High Time
tHI
40
—
—
ns
Clock Low Time
Conditions
VDD = 5V (Note 1)
tLO
40
—
—
ns
tCSSR
40
—
—
ns
Data Input Setup Time
tSU
40
—
—
ns
Data Input Hold Time
tHD
10
—
—
ns
SCK Fall to SO Valid Propagation Delay
tDO
—
80
ns
SCK Rise to CS Rise Hold Time
tCHS
—
—
ns
SCK Rise to CS Fall Delay
tCS0
10
—
—
ns
CS Rise to CLK Rise Hold
tCS1
100
—
—
ns
CS High Time
tCSH
40
—
—
ns
Reset Pulse Width
tRS
150
—
—
ns
Note 2
tRSCS
150
—
—
ns
Note 2
CS rising to RS or SHDN falling delay time
tSE
40
—
—
ns
Note 3
CS low time
tCSL
100
—
—
ns
Note 3
tSH
150
—
—
ns
Note 3
CS Fall to First Rising CLK Edge
RS Rising to CS Falling Delay Time
Shutdown Pulse Width
Note
1:
2:
3:
30
CL = 30 pF (Note 2)
When using the device in the daisy-chain configuration, maximum clock frequency is determined by a combination of propagation delay
time (tDO) and data input setup time (tSU). Max. clock frequency is therefore ~ 5.8 MHz based on SCK rise and fall times of 5 ns, tHI =
40 ns, tDO = 80 ns and tSU = 40 ns.
Applies only to the MCP42XXX devices.
Applies only when using hardware pins to exit software shutdown mode, MCP42XXX only.
 2003 Microchip Technology Inc.
DS11195C-page 5
MCP41XXX/42XXX
tCSH
CS
1/FCLK
tCSSR
tHI
tCSO
SCK
tCHS
tLO
tCS1
tSU
tHD
SI
msb in
tDO
(First 16 bits out are always zeros)
SO
tS
±1% Error Band
VOUT
FIGURE 1-1:
±1%
Detailed Serial interface Timing.
Wiper position is changed to
mid-scale (80h) if RS is held
low for 150 ns
Code 80h is latched
on rising edge of RS
CS
tRSCS
tRS
RS
tS
VOUT
FIGURE 1-2:
±1% Error Band
±1%
Reset Timing.
tCSL
CS
tSE
tRS
RS
tSE
tSH
SHDN
FIGURE 1-3:
DS11195C-page 6
Software Shutdown Exit Timing.
 2003 Microchip Technology Inc.
MCP41XXX/42XXX
2.0
TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated, curve represents 10 kΩ, 50 kΩ and 100 kΩ devices, VDD = 5V, VSS = 0V, TA = +25°C,
VB = 0V.
14
VDD = +3V to +5V
Nominal Resistance (kΩ)
Normalized Resistance (Ω)
1
0.8
0.6
0.4
RWB
RWA
0.2
10
8
4
2
0
64
96
128 160
Code (Decimal)
192
224
Potentiometer INL Error (LSB)
TA = -40°C to +85°C
Refer to Figure 2-25
0
32
64
96
5
FIGURE 2-4:
vs. Temperature.
Nominal Resistance 10 kΩ
70
60
RAB
50
40
30
RWB
Code = 80h
20
10
MCP41050, MCP42050 (50 kΩ potentiometers)
0
-40 -25 -10
128 160 192 224 256
5
TA = -40°C to +85°C
VA = 3V
60
50
40
30
20
10
0
-10
0
32
64
96
128
160
192
224
256
FIGURE 2-5:
vs. Temperature.
50
65
80
95 110 125
FIGURE 2-3:
Potentiometer Mode
Tempco vs. Code.
Nominal Resistance 50 kΩ
120
RAB
100
80
RWB
Code = 80h
60
40
20
MCP41100, MCP42100 (100 kΩ potentiometers)
0
-40 -25 -10
5
20
35
50
65
80
95 110 125
Temperature (°C)
Code (Decimal)
 2003 Microchip Technology Inc.
35
140
Nominal Resistance (kΩ)
Potentiometer Mode TempCo
(ppm / °C)
Potentiometer INL Error vs.
70
20
Temperature (°C)
Code (Decimal)
FIGURE 2-2:
Code.
20 35 50 65 80 95 110 125
Temperature (°C)
FIGURE 2-1:
Normalized Wiper to End
Terminal Resistance vs. Code.
0.5
0.4
0.3
0.2
0.1
0
-0.1
-0.2
-0.3
-0.4
-0.5
MCP41010, MCP42010 (10 kΩ potentiometers)
-40 -25 -10
256
Nominal Resistance (kΩ)
32
RWB
Code = 80h
6
0
0
RAB
12
FIGURE 2-6:
vs. Temperature.
Nominal Resistance 100 kΩ
DS11195C-page 7
MCP41XXX/42XXX
Refer to Figure 2-27
TA = +85°C
TA = +25°C
TA = -40°C
0
32
64
FIGURE 2-7:
Code.
96 128 160
Code (Decimal)
224
TA = -40°C to +85°C,
VA = no connect,
RWB measured
2500
2000
1500
1000
500
0
0
32
64
96
280
VDD = 5V
230
130
80
VDD = 3V
30
5
FIGURE 2-10:
Temperature.
1000
Active Supply Current vs.
A - VDD = 5.5V, Code = AAh
B - VDD = 3.3V, Code = AAh
C - VDD = 5.5V, Code = FFh
D - VDD = 3.3V, Code = FFh
900
800
700
500
400
A
C
300
200
100
D
1k
10k
100
10
1
-40 -25 -10 5
20 35 50 65 80 95 11 12
0 5
Temperature (°C)
FIGURE 2-9:
Temperature.
DS11195C-page 8
Static Current vs.
FIGURE 2-11:
Clock Frequency.
RS & SHDN Sink Current (mA)
Static Current (nA)
1000
B
600
0
128 160 192 224 256
Rheostat Mode Tempco vs.
20 35 50 65 80 95 110 125
Temperature (°C)
Code (Decimal)
FIGURE 2-8:
Code.
FCLK = 3 MHz
Code = FFh
180
-40 -25 -10
256
Rheostat INL Error vs.
3000
Rheostat Mode TempCo
(ppm / °C)
192
Active Supply Current (µA)
0.5
0.4
0.3
0.2
0.1
0
-0.1
-0.2
-0.3
-0.4
-0.5
Active Supply Current (mA)
Rheostat INL Error (LSB)
Note: Unless otherwise indicated, curve represents 10 kΩ, 50 kΩ and 100 kΩ devices, VDD = 5V, VSS = 0V, TA = +25°C,
VB = 0V.
100k
1M
Clock Frequency (Hz)
10M
Active Supply Current vs.
1
VDD = 5.5V
0
-1
-2
-3
-4
-5
-6
-7
0
2
4
6
RS & SHDN Pin Voltage (V)
FIGURE 2-12:
Reset & Shutdown Pins
Current vs. Voltage.
 2003 Microchip Technology Inc.
MCP41XXX/42XXX
Note: Unless otherwise indicated, curve represents 10 kΩ, 50 kΩ and 100 kΩ devices, VDD = 5V, VSS = 0V, TA = +25°C,
VB = 0V.
Number of Occurrences
180
160
140
CL = 27 pF
MCP41010,MCP42010
Code = 00h,
Sample Size = 400
VOUT
120
FFh
100
80
00h
60
40
20
CS
0
47 48 49 50 51 52 53 54 55 56 57 58 59
Wiper Resistance (Ω)
FIGURE 2-13:
10 kΩ Device Wiper
Resistance Histogram.
Number of Occurrences
140
FIGURE 2-16:
Full-Scale Settling Time.
CL = 27 pF
MCP41050, MCP41100,
MCP42050, MCP42100
Code = 00h,
Sample Size = 796
120
100
Code = 80h
VOUT
80
60
40
20
CS
0
115 117 119 121 123 125 127 129 131 133
Wiper Resistance (Ω)
FIGURE 2-14:
50 kΩ, 100 kΩ Device Wiper
Resistance Histogram.
FIGURE 2-17:
Time.
Digital Feed through vs.
6
CL = 17 pF
Code = FFh
0
Code = 80h
-6
Code = 40h
VOUT
Code = 7Fh
Code = 80h
Gain (dB)
-12
Code = 20h
-18
Code = 10h
-24
Code = 08h
-30
Code = 04h
-36
Code = 02h
-42
CS
-48
-54
-60
FIGURE 2-15:
One Position Settling Time.
 2003 Microchip Technology Inc.
Code = 01h
CL = 30pF, Refer to Figure 2-29
MCP41010, MCP42010 (10kΩ potentiometers)
100
1k
10k
100k
Frequency (Hz)
1M
10M
FIGURE 2-18:
Gain vs. Frequency for
10 kΩ Potentiometer.
DS11195C-page 9
MCP41XXX/42XXX
Note: Unless otherwise indicated, curve represents 10 kΩ, 50 kΩ and 100 kΩ devices, VDD = 5V, VSS = 0V, TA = +25°C,
VB = 0V.
6
35
Code = 80h
-6
Code = 40h
-12
Code = 10h
-24
Code = 08h
-30
Code = 04h
-36
Code = 02h
-42
100
1k
10k
100k
Frequency (Hz)
6
1M
100 kΩ Potentiometer
Wiper Resistance (Ω)
Code = 20h
-18
Code = 10h
-24
Code = 08h
-30
Code = 04h
-36
Code = 02h
-42
Code = 01h
-48
CL = 30pF, Refer to Figure 2-29
MCP41100, MCP42100 (100kΩ potentiometers)
-54
100
1k
100k
Frequency (Hz)
10k
Frequency (Hz)
100k
VDD = 2.7V
500
400
300
200
VDD = 5V
100
0
1
2
3
FIGURE 2-23:
Voltage.
279 kHz
10 kΩ
-18
-24
50 kΩ
CL = 30 pF, Code = 80h
Refer to Figure 2-29
1k
FIGURE 2-21:
DS11195C-page 10
10k
100k
Frequency (Hz)
Code = 00h
Refer to Figure 2-27
-3 dB Bandwidths.
350
300
VDD = 2.7V
250
200
150
VDD = 5V
100
50
0
100 kΩ
1M
Wiper Resistance (Ω)
1.06 MHz
145 kHz
5
10 kΩ Wiper Resistance vs.
400
-6
4
Terminal B Voltage (V)
450
-30
10M
MCP41010, MCP42010
Iw = 1 mA, Code = 00h,
Refer to Figure 2-27
600
1M
0
-12
1M
0
FIGURE 2-20:
Gain vs. Frequency for
100kΩ Potentiometer.
-36
10k
700
Code = 40h
-12
1k
FIGURE 2-22:
Power Supply Rejection
Ratio vs. Frequency.
Code = 80h
-6
Gain (dB)
0
10M
Code = FFh
0
Gain (dB)
50 kΩ Potentiometer
15
5
FIGURE 2-19:
Gain vs. Frequency for
50kΩ Potentiometer.
-60
20
10
CL = 30pF, Refer to Figure 2-29
MCP41050, MCP42050 (50kΩ potentiometers)
-54
-60
25
Code = 01h
-48
VDD = 4.5V to 5.5V,
Code = 80h,
CL = 27 pF,
VA = 4V
Refer to Figure 2-28
10 kΩ Potentiometer
30
Code = 20h
-18
PSRR (dB)
Gain (dB)
40
Code = FFh
0
10M
0
1
2
3
4
5
Terminal B Voltage (V)
FIGURE 2-24:
50 kΩ & 100 kΩ Wiper
Resistance vs. Voltage.
 2003 Microchip Technology Inc.
MCP41XXX/42XXX
2.1
Parametric Test Circuits
A
V+
B
DUT
VA
V+ = VDD
1LSB = V+/256
VDD A
V+
W
B
DUT
+
VMEAS*
-
W
+ V
MEAS*
-
*Assume infinite input impedance
V+ = VDD ± 10%
FIGURE 2-25:
Potentiometer Divider NonLinearity Error Test Circuit (DNL, INL).
PSRR (dB) = 20LOG (
PSS (%/%) = ∆VDD
∆VMEAS
No Connection
*Assume infinite input impedance
A
FIGURE 2-28:
Power Supply Sensitivity
Test Circuit (PSS, PSRR).
IW
W
B
+
- VMEAS*
DUT
A
VIN
*Assume infinite input impedance
Rsw = 0.1V
Isw
Code = 00h
A
W
B
ISW
+
-
+5V
W
~
VOUT
+
-
DUT
B
OFFSET
GND
FIGURE 2-26:
Resistor Position NonLinearity Error Test Circuit (Rheostat operation
DNL, INL).
DUT
∆VDD
)
∆VMEAS
2.5V DC
FIGURE 2-29:
Circuit.
Gain vs. Frequency Test
A
0.1V
DUT
B
+5V
VSS = 0 to VDD
VIN
FIGURE 2-27:
Circuit.
Wiper Resistance Test
~
+
2.5V DC
Offset
FIGURE 2-30:
 2003 Microchip Technology Inc.
VOUT
MCP601
Capacitance Test Circuit.
DS11195C-page 11
MCP41XXX/42XXX
3.0
PIN DESCRIPTIONS
3.1
PA0, PA1
3.9
Shutdown (SHDN)
(MCP42XXX devices only)
Potentiometer Wiper Connection.
The Shutdown pin has a Schmitt Trigger input. Pulling
this pin low will put the device in a power-saving mode
where A terminal is opened and the B and W terminals
are connected for all potentiometers. This pin should
not be toggled low when the CS pin is low. In order to
minimize power consumption, this pin has an active
pull-up circuit. The performance of this circuit is shown
in Figure 2-12. This pin will draw negligible current at
logic level ‘0’ and logic level ‘1’. Do not leave this pin
floating.
3.4
TABLE 3-1:
Potentiometer Terminal A Connection.
3.2
PB0, PB1
Potentiometer Terminal B Connection.
3.3
PW0, PW1
Chip Select (CS)
This is the SPI port chip select pin and is used to execute a new command after it has been loaded into the
shift register. This pin has a Schmitt Trigger input.
3.5
Serial Clock (SCK)
This is the SPI port clock pin and is used to clock-in
new register data. Data is clocked into the SI pin on the
rising edge of the clock and out the SO pin on the falling
edge of the clock. This pin is gated to the CS pin (i.e.,
the device will not draw any more current if the SCK pin
is toggling when the CS pin is high). This pin has a
Schmitt Trigger input.
3.6
Serial Data Input (SI)
This is the SPI port serial data input pin. The command
and data bytes are clocked into the shift register using
this pin. This pin is gated to the CS pin (i.e., the device
will not draw any more current if the SI pin is toggling
when the CS pin is high). This pin has a Schmitt Trigger
input.
3.7
Serial Data Output (SO)
(MCP42XXX devices only)
This is the SPI port serial data output pin used for
daisy-chaining more than one device. Data is clocked
out of the SO pin on the falling edge of clock. This is a
push-pull output and does not go to a high-impedance
state when CS is high. It will drive a logic-low when CS
is high.
3.8
Reset (RS)
(MCP42XXX devices only)
The Reset pin will set all potentiometers to mid-scale
(Code 80h) if this pin is brought low for at least 150 ns.
This pin should not be toggled low when the CS pin is
low. It is possible to toggle this pin when the SHDN pin
is low. In order to minimize power consumption, this pin
has an active pull-up circuit. The performance of this
circuit is shown in Figure 2-12. This pin will draw negligible current at logic level ‘0’ and logic level ‘1’. Do not
leave this pin floating.
DS11195C-page 12
MCP41XXX Pins
Pin # Name
Function
1
CS
Chip Select
2
SCK
Serial Clock
3
SI
Serial Data Input
4
VSS
Ground
5
PA0
Terminal A Connection For Pot 0
6
PW0
Wiper Connection For Pot 0
7
PB0
Terminal B Connection For Pot 0
8
VDD
Power
TABLE 3-2:
MCP42XXX Pins
Pin # Name
Function
1
CS
Chip Select
2
SCK
Serial Clock
3
SI
Serial Data Input
4
VSS
Ground
5
PB1
Terminal B Connection For Pot 1
6
PW1
Wiper Connection For Pot 1
7
PA1
Terminal A Connection For Pot 1
8
PA0
Terminal A Connection For Pot 0
9
PW0
Wiper Connection For Pot 0
10
PB0
Terminal B Connection For Pot 0
11
RS
Reset Input
12
SHDN Shutdown Input
13
SO
Data Out for Daisy-Chaining
14
VDD
Power
 2003 Microchip Technology Inc.
MCP41XXX/42XXX
4.0
APPLICATIONS INFORMATION
The MCP41XXX/42XXX devices are 256 position
single and dual digital potentiometers that can be used
in place of standard mechanical pots. Resistance values of 10 kΩ, 50 kΩ and 100 kΩ are available. As
shown in Figure 4-1, each potentiometer is made up of
a variable resistor and an 8-bit (256 position) data register that determines the wiper position. There is a
nominal wiper resistance of 52Ω for the 10 kΩ version,
125Ω for the 50 kΩ and 100 kΩ versions. For the dual
devices, the channel-to-channel matching variation is
less than 1%. The resistance between the wiper and
either of the resistor endpoints varies linearly according
to the value stored in the data register. Code 00h
effectively connects the wiper to the B terminal. At
power-up, all data registers will automatically be loaded
with the mid-scale value (80h). The serial interface provides the means for loading data into the shift register,
which is then transferred to the data registers. The
serial interface also provides the means to place individual potentiometers in the shutdown mode for maximum power savings. The SHDN pin can also be used
to put all potentiometers in shutdown mode and the RS
pin is provided to set all potentiometers to mid-scale
(80h).
PW0
PA0
PW1
PB0 PA1
PB1
RDAC2
RDAC1
Data Register 0
Data Register 1
D7
D7
D0
D0
RS
Decode
Logic
CS
D7
D0
16-bit Shift Register
SCK
SI
SO
SHDN
FIGURE 4-1:
Block diagram showing the MCP42XXX dual digital potentiometer. Data register 0 and
data register 1 are 8-bit registers allowing 256 positions for each wiper. Standard SPI pins are used with
the addition of the Shutdown (SHDN) and Reset (RS) pins. As shown, reset affects the data register and
wipers, bringing them to mid-scale. Shutdown disconnects the A terminal and connects the wiper to B,
without changing the state of the data registers.
VDD
VDD
µC
Data Lines
MCP4XXXX
0.1 uF
0.1 uF
B
W
A
To Application
Circuit
 2003 Microchip Technology Inc.
When laying out the circuit for your digital potentiometer, bypass capacitors should be used. These capacitors should be placed as close as possible to the device
pin. A bypass capacitor value of 0.1 µF is recommended. Digital and analog traces should be separated
as much as possible on the board, with no traces running underneath the device or the bypass capacitor.
Extra precautions should be taken to keep traces with
high-frequency signals (such as clock lines) as far as
possible from analog traces. Use of an analog ground
plane is recommended in order to keep the ground
potential the same for all devices on the board.
DS11195C-page 13
MCP41XXX/42XXX
4.1
Modes of Operation
Digital potentiometer applications can be divided into
two categories: rheostat mode and potentiometer, or
voltage divider, mode.
4.1.1
RHEOSTAT MODE
In the rheostat mode, the potentiometer is used as a
two-terminal resistive element. The unused terminal
should be tied to the wiper, as shown in Figure 4-2.
Note that reversing the polarity of the A and B terminals
will not affect operation.
4.1.2
POTENTIOMETER MODE
In the potentiometer mode, all three terminals of the
device are tied to different nodes in the circuit. This
allows the potentiometer to output a voltage proportional to the input voltage. This mode is sometimes
called voltage divider mode. The potentiometer is used
to provide a variable voltage by adjusting the wiper
position between the two endpoints as shown in
Figure 4-3. Note that reversing the polarity of the A and
B terminals will not affect operation.
V1
A
A
W
W
B
B
MCP4XXXX
V2
MCP4XXXX
Resistor
FIGURE 4-2:
Two-terminal or rheostat
configuration for the digital potentiometer. Acting
as a resistive element in the circuit, resistance is
controlled by changing the wiper setting.
Using the device in this mode allows control of the total
resistance between the two nodes. The total measured
resistance would be the least at code 00h, where the
wiper is tied to the B terminal. The resistance at this
code is equal to the wiper resistance, typically 52Ω for
the 10 kΩ MCP4X010 devices, 125Ω for the 50 kΩ
(MCP4X050), and 100 kΩ (MCP4X100) devices. For
the 10 kΩ device, the LSB size would be 39.0625Ω
(assuming 10 kΩ total resistance). The resistance
would then increase with this LSB size until the total
measured resistance at code FFh would be 9985.94Ω.
The wiper will never directly connect to the A terminal
of the resistor stack.
FIGURE 4-3:
divider mode.
Three terminal or voltage
In this configuration, the ratio of the internal resistance
defines the temperature coefficient of the device. The
resistor matching of the RWB resistor to the RAB resistor
performs with a typical temperature coefficient of
1 ppm/°C (measured at code 80h). At lower codes, the
wiper resistance temperature coefficient will dominate.
Figure 2-3 shows the effect of the wiper. Above the
lower codes, this figure shows that 70% of the states
will typically have a temperature coefficient of less than
5 ppm/°C. 30% of the states will typically have a
ppm/°C of less than 1.
In the 00h state, the total resistance is the wiper resistance. To avoid damage to the internal wiper circuitry in
this configuration, care should be taken to ensure the
current flow never exceeds 1 mA.
For dual devices, the variation of channel-to-channel
matching of the total resistance from A to B is less than
1%. The device-to-device matching, however, can vary
up to 30%. In the rheostat mode, the resistance has a
positive temperature coefficient. The change in wiperto-end terminal resistance over temperature is shown
in Figure 2-8. The most variation over temperature will
occur in the first 6% of codes (code 00h to 0Fh) due to
the wiper resistance coefficient affecting the total resistance. The remaining codes are dominated by the total
resistance tempco RAB, typically 800 ppm/°C.
DS11195C-page 14
 2003 Microchip Technology Inc.
MCP41XXX/42XXX
4.2
Typical Applications
4.2.1
PROGRAMMABLE SINGLE-ENDED
AMPLIFIERS
Potentiometers are often used to adjust system reference levels or gain. Programmable gain circuits using
digital potentiometers can be realized in a number of
different ways. An example of a single-supply, inverting
gain amplifier is shown in Figure 4-4. Due to the high
input impedance of the amplifier, the wiper resistance
is not included in the transfer function. For a single-supply, non-inverting gain configuration, the circuit in
Figure 4-5 can be used.
.
MCP41010
B
A
VDD
W
-IN
-
MCP606
+IN +
VREF
V OUT
VOUT
VSS
10
R
R
= – V IN  ------B-  + V REF  1 + ------B- 

R 
R 
A
A
Where:
Absolute Gain (V/V)
VIN
R AB ( 256 – D n )
R A = -------------------------------------256
In order for these circuits to work properly, care must be
taken in a few areas. For linear operation, the analog
input and output signals must be in the range of VSS to
VDD for the potentiometer and input and output rails of
the op-amp. The circuit in Figure 4-4 requires a virtual
ground or reference input to the non-inverting input of
the amplifier. Refer to Application Note 682, “Using
Single-Supply Operational Amplifiers in Embedded
Systems” (DS00682), for more details. At power-up or
reset (RS), the resistance is set to mid-scale, with RA
and RB matching. Based on the transfer function for the
circuit, the gain is -1 V/V. As the code is increased and
the wiper moves towards the A terminal, the gain
increases. Conversely, when the wiper is moved
towards the B terminal, the gain decreases. Figure 4-6
shows this relationship. Notice the pseudo-logarithmic
gain around decimal code 128. As the wiper
approaches either terminal, the step size in the gain
calculation increases dramatically. Due to the
mismatched ratio of RA and RB at the extreme high and
low codes, small increments in wiper position can
dramatically affect the gain. As shown in Figure 4-3,
recommended gains lie between 0.1 and 10 V/V.
R AB D n
R B = ----------------256
R AB = Total Resistance of pot
D n = Wiper setting forD n = 0 to 255
1
0.1
0
FIGURE 4-4:
Single-supply,
programmable, inverting gain amplifier using a
digital potentiometer.
VDD
VIN
+IN
MCP606
-IN RA
W
VOUT
VSS
RB
MCP41010
Where:
R AB ( 256 – D n )
R A = -------------------------------------256
R
V OUT = V IN  1 + ------B-

R 
A
R AB D n
R B = ----------------256
128
192
256
Decimal code (0-255)
FIGURE 4-6:
Gain vs. Code for inverting
and differential amplifier circuits.
4.2.2
+
64
PROGRAMMABLE DIFFERENTIAL
AMPLIFIER
An example of a differential input amplifier using digital
potentiometers is shown in Figure 4-7. For the transfer
function to hold, both pots must be programmed to the
same code. The resistor-matching from channel-tochannel within a dual device can be used as an advantage in this circuit. This circuit will also show stable
operation over temperature due to the low potentiometer temperature coefficient. Figure 4-6 also shows the
relationship between gain and code for this circuit. As
the wiper approaches either terminal, the step size in
the gain calculation increases dramatically. This circuit
is recommended for gains between 0.1 and 10 V/V.
R AB = Total Resistance of pot
D n = Wiper setting forD n = 0 to 255
FIGURE 4-5:
Single-supply,
programmable, non-inverting gain amplifier.
 2003 Microchip Technology Inc.
DS11195C-page 15
MCP41XXX/42XXX
4.3
1/2
MCP42010
A
B
VB
(SIG -)
-IN
VA
A
1/2
MCP42010
(SIG +)
Where:
RA
VDD
+
VOUT
MCP601
+IN
-
VSS
B
VREF
RB
R AB D n
= ----------------256
R AB = Total Resistance of pot
D n = Wiper setting forDn = 0 to 255
NOTE: Potentiometer values must be equal
FIGURE 4-7:
Single Supply
programmable differential amplifier using digital
potentiometers.
PROGRAMMABLE OFFSET TRIM
For applications requiring only a programmable voltage
reference, the circuit in Figure 4-8 can be used. This
circuit shows the device used in the potentiometer
mode along with two resistors and a buffered output.
This creates a circuit with a linear relationship between
voltage-out and programmed code. Resistors R1 and
R2 can be used to increase or decrease the output voltage step size. The potentiometer in this mode is stable
over temperature. The operation of this circuit over
temperature is shown in Figure 2-3. The worst performance over temperature will occur at the lower codes
due to the dominating wiper resistance. R1 and R2 can
also be used to affect the boundary voltages, thereby
eliminating the use of these lower codes.
VDD
VDD
MCP41010
R1
-IN
B
R2
-
MCP606
OUT
+IN +
VSS
0.1 uF
A
VSS
FIGURE 4-8:
By changing the values of
R1 and R2, the voltage output resolution of this
programmable voltage reference circuit is
affected.
DS11195C-page 16
When programming the digital potentiometer settings,
the following equations can be used to calculate the
resistances. Programming code 00h effectively brings
the wiper to the B terminal, leaving only the wiper resistance. Programming higher codes will bring the wiper
closer to the A terminal of the potentiometer. The equations in Figure 4-9 can be used to calculate the terminal
resistances. Figure 4-10 shows an example calculation
using a 10 kΩ potentiometer.
R
V OUT = ( V A – V B ) ------BRA
R AB ( 256 – D n )
= -------------------------------------256
4.2.3
Calculating Resistances
PA
PW
PB
( R AB ) ( 256 – D n )
- + RW
R WA ( D n ) = ------------------------------------------256
( R AB ) ( D n )
- + RW
R WB ( D n ) = --------------------------256
Where:
PA is the A terminal
PB is the B terminal
PW is the wiper terminal
RWA is resistance between Terminal A and wiper
RWB is resistance between Terminal B and Wiper
RAB is overall resistance for pot (10 kΩ, 50 kΩ or 100 kΩ)
RW is wiper resistance
Dn is 8-bit value in data register for pot number n
FIGURE 4-9:
Potentiometer resistances
are a function of code. It should be noted that,
when using these equations for most feedback
amplifier circuits (see Figure 4-4 and Figure 4-5),
the wiper resistance can be omitted due to the
high impedance input of the amplifier.
PA
10 kΩ
PW
Example:
R = 10 kΩ
Code = C0h = 192d
PB
( R AB ) ( 256 – D n )
R WA ( D n ) = ------------------------------------------- + RW
256
( 10k Ω ) ( 256 – 192 )
R WA ( C0h ) = --------------------------------------------------- + 52 Ω
256
R WA ( C0h ) = 2552 Ω
( R AB ) ( D n )
- + RW
R WB ( D n ) = --------------------------256
( 10k Ω ) ( 192 )
R WB ( C0h ) = ----------------------------------- + 52 Ω
256
R WB ( C0h ) = 7552 Ω
Note: All values shown are typical and
actual results will vary.
FIGURE 4-10:
calculations.
Example Resistance
 2003 Microchip Technology Inc.
MCP41XXX/42XXX
5.0
SERIAL INTERFACE
Communications from the controller to the
MCP41XXX/42XXX digital potentiometers is accomplished using the SPI serial interface. This interface
allows three commands:
1.
2.
3.
Write a new value to the potentiometer data
register(s).
Cause a channel to enter low power shutdown
mode.
NOP (No Operation) command.
Executing any command is accomplished by setting
CS low and then clocking-in a command byte followed
by a data byte into the 16-bit shift register. The command is executed when CS is raised. Data is clockedin on the rising edge of clock and out the SO pin on the
falling edge of the clock (see Figure 5-1). The device
will track the number of clocks (rising edges) while CS
is low and will abort all commands if the number of
clocks is not a multiple of 16.
5.1
Command Byte
The first byte sent is always the command byte, followed by the data byte. The command byte contains
two command select bits and two potentiometer select
bits. Unused bits are ‘don’t care’ bits. The command
select bits are summarized in Figure 5-2. The command select bits C1 and C0 (bits 4:5) of the command
byte determine which command will be executed. If the
command bits are both 0’s or 1’s, then a NOP command will be executed once all 16 bits have been
loaded. This command is useful when using the daisychain configuration. When the command bits are 0,1, a
write command will be executed with the 8 bits sent in
the data byte. The data will be written to the potentiometer(s) determined by the potentiometer select bits. If
the command bits are 1,0, then a shutdown command
will be executed on the potentiometers determined by
the potentiometer select bits.
For the MCP42XXX devices, the potentiometer select
bits P1 and P0 (bits 0:1) determine which potentiometers are to be acted upon by the command. A corresponding ‘1’ in the position signifies that the command
for that potentiometer will get executed, while a ‘0’ signifies that the command will not effect that
potentiometer (see Figure 5-2).
5.2
Writing Data Into Data Registers
When new data is written into one or more of the potentiometer data registers, the write command is followed
by the data byte for the new value. The command
select bits C1, C0 are set to 0,1. The potentiometer
selection bits P1 and P0 allow new values to be written
to potentiometer 0, potentiometer 1 (or both) with a single command. A ‘1’ for either P1 or P0 will cause the
data to be written to the respective data register and a
‘0’ for P1 or P0 will cause no change. See Figure 5-2
for the command format summary.
 2003 Microchip Technology Inc.
5.3
Using The Shutdown Command
The shutdown command allows the user to put the
application circuit into a power-saving mode. In this
mode, the A terminal is open-circuited and the B and W
terminals are shorted together. The command select
bits C1, C0 are set to 1,0. The potentiometer selection
bits P1 and P0 allow each potentiometer to be shutdown independently. If either P1 or P0 are high, the
respective potentiometer will enter shutdown mode. A
‘0’ for P1 or P0 will have no effect. The eight data bits
following the command byte still need to be transmitted
for the shutdown command, but they are ‘don’t care’
bits. See Figure 5-2 for command format summary.
Once a particular potentiometer has entered the shutdown mode, it will remain in this mode until:
• A new value is written to the potentiometer data
register, provided that the SHDN pin is high. The
device will remain in the shutdown mode until the
rising edge of the CS is detected, at which time
the device will come out of shutdown mode and
the new value will be written to the data register(s). If the SHDN pin is low when the new value
is received, the registers will still be set to the new
value, but the device will remain in shutdown
mode. This scenario assumes that a valid command was received. If an invalid command was
received, the command will be ignored and the
device will remain in the shutdown mode.
It is also possible to use the hardware shutdown pin
and reset pin to remove a device from software shutdown. To do this, a low pulse on the chip select line
must first be sent. For multiple devices, sharing a single
SHDN or RESET line allows you to pick an individual
device on that chain to remove from software shutdown
mode. See Figure 1-3 for timing. With a preceding chip
select pulse, either of these situations will also remove
a device from software shutdown:
• A falling edge is seen on the RS pin and held low
for at least 150 ns, provided that the SHDN pin is
high. If the SHDN pin is low, the registers will still
be set to mid-scale, but the device will remain in
shutdown mode. This condition assumes that CS
is high, as bringing the RS pin low while CS is low
is an invalid state and results are indeterminate.
• A rising edge on the SHDN pin is seen after being
low for at least 100 ns, provided that the CS pin is
high. Toggling the SHDN pin low while CS is low
is an invalid state and results are indeterminate.
• The device is powered-down and back up.
Note:
The hardware SHDN pin will always put
the device in shutdown regardless of
whether a potentiometer has already been
put in the shutdown mode using the
software command.
DS11195C-page 17
MCP41XXX/42XXX
Data is always latched
in on the rising edge
of SCK.
Data is always clocked out
of the SO pin after the
falling edge of SCK.
Data Registers are
loaded on rising
edge of CS. Shift
register is loaded
with zeros at this time.
CS†
1
2
3
4
5
6
7
8
9
10 11 12 13 14 15 16
SCK
COMMAND Byte
Don’t
Care
Bits
X
SI
X
Command
Bits
Don’t
Care
Bits
C1 C0 X
Data Byte
Channel
Select
Bits
New Register Data
X P1* P0 D7 D6 D5 D4 D3 D2 D1 D0
First 16 bits shifted out will always be zeros
SO‡
X
SO pin will always
drive low when CS
goes high.
† There must always be multiples of 16 clocks while CS is low or commands will abort.
‡ The serial data out pin (SO) is only available on the MCP42XXX device.
* P1 is a ‘don’t care’ bit for the MCP41XXX.
FIGURE 5-1:
Timing Diagram for Writing Instructions or Data to a Digital Potentiometer.
COMMAND BYTE
X
X C1 C0 X
Command
Selection
Bits
C1 C0
Command
X P1* P0
Potentiometer
Selection
Bits
Command Summary
P1* P0
Potentiometer Selections
0
0
None
No Command will be executed.
0
0
0
1
Write Data
Write the data contained in Data Byte to the
potentiometer(s) determined by the potentiometer selection bits.
Dummy Code: Neither Potentiometer
affected.
0
1
Command executed on
Potentiometer 0.
1
0
Command executed on
Potentiometer 1.
1
1
Command executed on both
Potentiometers.
1
0
Shutdown
Potentiometer(s) determined by potentiometer selection bits will enter Shutdown Mode.
Data bits for this command are ‘don’t cares’.
1
1
None
No Command will be executed.
FIGURE 5-2:
DS11195C-page 18
Command Byte Format.
 2003 Microchip Technology Inc.
MCP41XXX/42XXX
5.4
Daisy-Chain Configuration
Multiple MCP42XXX devices can be connected in a
daisy-chain configuration, as shown in Figure 5-4, by
connecting the SO pin from one device to the SI pin on
the next device. The data on the SO pin is the output of
the 16-bit shift register. The daisy-chain configuration
allows the system designer to communicate with several devices without using a separate CS line for each
device. The example shows a daisy-chain configuration with three devices, although any number of
devices (with or without the same resistor values) can
be configured this way. While it is not possible to use a
MCP41XXX at the beginning or middle of a daisy-chain
(because it does not provide the serial data out (SO)
pin), it is possible to use the device at the end of a
chain. As shown in the timing diagram in Figure 5-3,
data will be clocked-out of the SO pin on the falling
edge of the clock. The SO pin has a CMOS push-pull
output and will drive low when CS goes high. SO will
not go to a high-impedance state when CS is held high.
When using the daisy-chain configuration, the maximum clock speed possible is reduced to ~5.8 MHz,
because of the propagation delay of the data coming
out of the SO pin.
When using the daisy-chain configuration, keep in mind
that the shift register of each device is automatically
loaded with zeros whenever a command is executed
(CS = high). Because of this, the first 16 bits that come
out of the SO pin once the CS line goes low will always
be zeros. This means that when the first command is
being loaded into a device, it will always shift a NOP
command into the next device on the chain because
the command bits (and all the other bits) will be zeros.
This feature makes it necessary only to send command
and data bytes to the device farthest down the chain
that needs a new command. For example, if there were
three devices on the chain and it was desired to send a
command to the device in the middle, only 32 bytes of
data need to be transmitted. The last device on the
chain will have a NOP loaded from the previous device
so no registers will be affected when the CS pin is
raised to execute the command. The user must
always ensure that multiples of 16 clocks are
always provided (while CS is low), as all commands
will abort if the number of clocks provided is not a
multiple of 16.
Data Registers for all
devices are loaded
on Rising Edge of CS
CS
1 2 3 4 5 6 7 8 9 10111213141516
1 2 3 4 5 6 7 8 9 10 111213141516
1 2 3 4 5 6 7 8 9 10 111213141516
SCK
Command Byte
for Device 3
SI
Data Byte
for Device 3
X XC C X X P P D DD DDDD D
SO
First 16 bits shifted out
will always be zeros
Command Byte
for Device 2
Data Byte
for Device 2
Command Byte
for Device 1
Data Byte
for Device 1
X XC C X X P P D DD DDDD D
X XC C X X P P D DD DDDD D
Command and Data for Device 3
start shifting out after the first 16 clocks
Command and Data for Device 2
start shifting out after the first 32 clocks
X XC C X X P P D DD DD DD D
X XC C X X P P D DD DDDD D
† There must always be multiples of 16 clocks while CS is low or commands will abort.
‡ The serial data out pin (SO) is only available on the MCP42XXX device.
FIGURE 5-3:
Timing Diagram for Daisy-Chain Configuration.
 2003 Microchip Technology Inc.
DS11195C-page 19
MCP41XXX/42XXX
CS
SCK
SO
Microcontroller
CS
SCK
SO
SI
Device 1
EXAMPLE:
CS
SCK
SI
SO
Device 2
If you want to load the following
command/data into each part
in the chain.
Device 2
XX01XX10 11110000
c
SI
Device 3
XX10XX00 10101010
After 16 clocks, Device 2 and
Device 3 will both have all
zeros clocked in from the
previous part’s shift register.
Device 1
XX10XX00 10101010
Device 2
00000000 00000000
d
Clock-In the command and
data for Device 2 (16 more
clocks). The data that was previously loaded gets shifted to
the next device on the chain.
SCK
Device 3*
Device 1
XX10XX11 11001100
Start by setting CS low and
clocking in the command and
data that will end up in Device
3 (16 clocks).
CS
Device 3
00000000 00000000
After 32 clocks, Device 2 has
the data previously loaded
into Device 1 and Device 3
gets 16 more zeros.
Device 1
XX01XX10 11110000
Device 2
XX10XX00 10101010
Device 3
00000000 00000000
e
Clock-In the data for Device 1
(16 more clocks). The data that
was previously loaded into
Device 1 gets shifted into
Device 2 and Device 3 contains
the first byte loaded. Raise the
CS line to execute the commands for all 3 devices at the
same time.
FIGURE 5-4:
DS11195C-page 20
After 48 clocks, all 3 devices
have the proper command/
data loaded into their shift
registers.
Device 1
XX10XX11 11001100
Device 2
XX01XX10 11110000
Device 3
XX10XX00 10101010
* Last device on a daisy-chain may be a single channel MCP41XXX device.
Daisy-Chain Configuration.
 2003 Microchip Technology Inc.
MCP41XXX/42XXX
5.5
Reset (RS) Pin Operation
The Reset pin (RS) will automatically set all potentiometer data latches to mid-scale (Code 80h) when pulled
low (provided that the pin is held low at least 150 ns
and CS is high). The reset will execute regardless of
the position of the SCK, SHDN and SI pins. It is possible to toggle RS low and back high while SHDN is low.
In this case, the potentiometer registers will reset to
mid-scale, but the potentiometer will remain in
shutdown mode until the SHDN pin is raised.
TABLE 5-1:
TRUTH TABLE FOR LOGIC
INPUTS
SCK
CS
RS
SHDN
Action
X
Ø
H
H
Communication is initiated with
device. Device comes out of
standby mode.
L
L
H
H
No action. Device is waiting for
data to be clocked into shift
register or CS to go high to
execute command.
¦
L
H
X
Shift one bit into shift register.
The shift register can be loaded
while the SHDN pin is low.
Ø
L
H
X
Shift one bit out of shift register
on the SO pin. The SO pin is
active while the SHDN pin is
low.
When held low, the shutdown pin causes the application circuit to go into a power-saving mode by open-circuiting the A terminal and shorting the B and W
terminals for all potentiometers. Data register contents
are not affected by entering shutdown mode (i.e., when
the SHDN pin is raised, the data register contents are
the same as before the shutdown mode was entered).
X
¦
H
H
Based on command bits, either
load data from shift register into
data latches or execute shutdown command. Neither command executed unless
multiples of 16 clocks have
been entered while CS is low.
SO pin goes to a logic low.
While in shutdown mode, it is still possible to clock in
new values for the data registers, as well as toggling
the RS pin to cause all data registers to go to mid-scale.
The new values will take affect when the SHDN pin is
raised.
X
H
H
H
Static Operation.
X
H
Ø
H
All data registers set and
latched to code 80h.
X
H
Ø
L
All data registers set and
latched to code 80h. Device is
in hardware shutdown mode
and will remain in this mode.
X
H
H
Ø
All potentiometers put into
hardware shutdown mode;
terminal A is open and W is
shorted to B.
X
H
H
¦
All potentiometers exit hardware shutdown mode. Potentiometers will also exit software
shutdown mode if this rising
edge occurs after a low pulse
on CS. Contents of data
latches are restored.
Note:
5.6
Bringing the RS pin low while the CS pin is
low constitutes an invalid operating state
and will result in indeterminate results
when RS and/or CS are brought high.
Shutdown (SHDN) Pin Operation
If the device is powered-up with the SHDN pin held low,
it will power-up in the shutdown mode with the data registers set to mid-scale.
Note:
5.7
Bringing the SHDN pin low while the CS
pin is low constitutes an invalid operating
state and will result in indeterminate
results when SHDN and/or CS are brought
high.
Power-up Considerations
When the device is powered on, the data registers will
be set to mid-scale (80h). A power-on reset circuit is
utilized to ensure that the device powers up in this
known state.
 2003 Microchip Technology Inc.
DS11195C-page 21
MCP41XXX/42XXX
5.8
Using the MCP41XXX/42XXX in
SPI Mode 1,1
It is possible to operate the devices in SPI modes 0,0
and 1,1. The only difference between these two modes
is that, when using mode 1,1, the clock idles in the high
state, while in mode 0,0, the clock idles in the low state.
In both modes, data is clocked into the devices on the
rising edge of SCK and data is clocked out the SO pin
once the falling edge of SCK. Operations using mode
0,0 are shown in Figure 5-1. The example in
Figure 5-5 shows mode 1,1.
Data is always clocked out the SO
pin after the falling edge of SCK.
Data is always latched in
on the rising edge of SCK.
CS†
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
D1
D0
Data Registers are
loaded on rising
edge of CS. Shift
register is loaded
with zeros at this time.
SCK
COMMAND BYTE
Don’t
Care
Bits
SI
SO‡
X
X
Command
Bits
C1
C0
Don’t
Care
Bits
X
X
DATA BYTE
Channel
Select
Bits
P1* P0
New Register Data
D7
D6
D5
D4
D3
D2
First 16 bits Shifted out will always be zeros
X
SO pin will always
drive low when CS
goes high.
† There must always be multiples of 16 clocks while CS is low or commands will abort.
‡
The serial data out pin (SO) is only available on the MCP42XXX device.
FIGURE 5-5:
DS11195C-page 22
Timing Diagram for SPI Mode 1,1 Operation.
 2003 Microchip Technology Inc.
MCP41XXX/42XXX
6.0
PACKAGING INFORMATION
6.1
Package Marking Information
8-Lead PDIP (300 mil)
Example:
XXXXXXXX
XXXXXNNN
YYWW
MCP41010
I/P256
0313
8-Lead SOIC (150 mil)
Example:
XXXXXXXX
XXXXYYWW
NNN
MCP41050
I/SN0313
256
14-Lead PDIP (300 mil)
Example:
XXXXXXXXXXXXXX
XXXXXXXXXXXXXX
YYWWNNN
14-Lead SOIC (150 mil)
MCP42010
I/P
0313256
Example:
42050ISL
XXXXXXXXXXX
0313256
XXXXXXXXXXX
XXXXXXXXXXX
YYWWNNN
14-Lead TSSOP (4.4mm) *
Example:
XXXXXXXX
YYWW
0313
NNN
256
Legend: XX...X
YY
WW
NNN
Note:
*
42100I
Customer specific information*
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line thus limiting the number of available characters
for customer specific information.
Standard marking consists of Microchip part number, year code, week code, facility code, mask rev#,
and assembly code.
 2003 Microchip Technology Inc.
DS11195C-page 23
MCP41XXX/42XXX
8-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
E1
D
2
n
1
α
E
A2
A
L
c
A1
β
B1
p
eB
B
Units
Dimension Limits
n
p
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
A
A2
A1
E
E1
D
L
c
§
B1
B
eB
α
β
MIN
.140
.115
.015
.300
.240
.360
.125
.008
.045
.014
.310
5
5
INCHES*
NOM
MAX
8
.100
.155
.130
.170
.145
.313
.250
.373
.130
.012
.058
.018
.370
10
10
.325
.260
.385
.135
.015
.070
.022
.430
15
15
MILLIMETERS
NOM
8
2.54
3.56
3.94
2.92
3.30
0.38
7.62
7.94
6.10
6.35
9.14
9.46
3.18
3.30
0.20
0.29
1.14
1.46
0.36
0.46
7.87
9.40
5
10
5
10
MIN
MAX
4.32
3.68
8.26
6.60
9.78
3.43
0.38
1.78
0.56
10.92
15
15
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-018
DS11195C-page 24
 2003 Microchip Technology Inc.
MCP41XXX/42XXX
8-Lead Plastic Small Outline (SN) – Narrow, 150 mil (SOIC)
E
E1
p
D
2
B
n
1
h
α
45°
c
A2
A
φ
β
L
Units
Dimension Limits
n
p
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Chamfer Distance
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
A
A2
A1
E
E1
D
h
L
φ
c
B
α
β
MIN
.053
.052
.004
.228
.146
.189
.010
.019
0
.008
.013
0
0
A1
INCHES*
NOM
8
.050
.061
.056
.007
.237
.154
.193
.015
.025
4
.009
.017
12
12
MAX
.069
.061
.010
.244
.157
.197
.020
.030
8
.010
.020
15
15
MILLIMETERS
NOM
8
1.27
1.35
1.55
1.32
1.42
0.10
0.18
5.79
6.02
3.71
3.91
4.80
4.90
0.25
0.38
0.48
0.62
0
4
0.20
0.23
0.33
0.42
0
12
0
12
MIN
MAX
1.75
1.55
0.25
6.20
3.99
5.00
0.51
0.76
8
0.25
0.51
15
15
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-057
 2003 Microchip Technology Inc.
DS11195C-page 25
MCP41XXX/42XXX
14-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
E1
D
2
n
1
α
E
A2
A
L
c
A1
B1
β
eB
p
B
Units
Dimension Limits
n
p
MIN
INCHES*
NOM
14
.100
.155
.130
MAX
MILLIMETERS
NOM
14
2.54
3.56
3.94
2.92
3.30
0.38
7.62
7.94
6.10
6.35
18.80
19.05
3.18
3.30
0.20
0.29
1.14
1.46
0.36
0.46
7.87
9.40
5
10
5
10
MIN
Number of Pins
Pitch
Top to Seating Plane
A
.140
.170
Molded Package Thickness
A2
.115
.145
Base to Seating Plane
A1
.015
Shoulder to Shoulder Width
E
.300
.313
.325
Molded Package Width
E1
.240
.250
.260
Overall Length
D
.740
.750
.760
Tip to Seating Plane
L
.125
.130
.135
c
Lead Thickness
.008
.012
.015
Upper Lead Width
B1
.045
.058
.070
Lower Lead Width
B
.014
.018
.022
Overall Row Spacing
§
eB
.310
.370
.430
α
Mold Draft Angle Top
5
10
15
β
Mold Draft Angle Bottom
5
10
15
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-005
DS11195C-page 26
MAX
4.32
3.68
8.26
6.60
19.30
3.43
0.38
1.78
0.56
10.92
15
15
 2003 Microchip Technology Inc.
MCP41XXX/42XXX
14-Lead Plastic Small Outline (SL) – Narrow, 150 mil (SOIC)
E
E1
p
D
2
B
n
1
α
h
45°
c
A2
A
φ
A1
L
β
Units
Dimension Limits
n
p
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Chamfer Distance
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
A
A2
A1
E
E1
D
h
L
φ
c
B
α
β
MIN
.053
.052
.004
.228
.150
.337
.010
.016
0
.008
.014
0
0
INCHES*
NOM
14
.050
.061
.056
.007
.236
.154
.342
.015
.033
4
.009
.017
12
12
MAX
.069
.061
.010
.244
.157
.347
.020
.050
8
.010
.020
15
15
MILLIMETERS
NOM
14
1.27
1.35
1.55
1.32
1.42
0.10
0.18
5.79
5.99
3.81
3.90
8.56
8.69
0.25
0.38
0.41
0.84
0
4
0.20
0.23
0.36
0.42
0
12
0
12
MIN
MAX
1.75
1.55
0.25
6.20
3.99
8.81
0.51
1.27
8
0.25
0.51
15
15
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-065
 2003 Microchip Technology Inc.
DS11195C-page 27
MCP41XXX/42XXX
14-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP)
E
E1
p
D
2
1
n
B
α
A
c
φ
β
A1
L
Units
Dimension Limits
n
p
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Molded Package Length
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
A
A2
A1
E
E1
D
L
φ
c
B
α
β
MIN
.033
.002
.246
.169
.193
.020
0
.004
.007
0
0
INCHES
NOM
14
.026
.035
.004
.251
.173
.197
.024
4
.006
.010
5
5
A2
MAX
.043
.037
.006
.256
.177
.201
.028
8
.008
.012
10
10
MILLIMETERS*
NOM
MAX
14
0.65
1.10
0.85
0.90
0.95
0.05
0.10
0.15
6.25
6.38
6.50
4.30
4.40
4.50
4.90
5.00
5.10
0.50
0.60
0.70
0
4
8
0.09
0.15
0.20
0.19
0.25
0.30
0
5
10
0
5
10
MIN
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.005” (0.127mm) per side.
JEDEC Equivalent: MO-153
Drawing No. C04-087
DS11195C-page 28
 2003 Microchip Technology Inc.
MCP41XXX/42XXX
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
X
/XX
Device
Temperature
Range
Package
Device:
MCP41010: Single Digital Potentiometer (10 kΩ)
MCP41010T: Single Digital Potentiometer (10 kΩ)
(Tape and Reel)
MCP41050: Single Digital Potentiometer (50 kΩ)
(Tape and Reel)
MCP41050T: Single Digital Potentiometer (50 kΩ)
MCP41100: Single Digital Potentiometer (100 kΩ)
(Tape and Reel)
MCP41100T: Single Digital Potentiometer (100 kΩ)
MCP42010: Dual Digital Potentiometer (10 kΩ)
MCP42010T: Dual Digital Potentiometer (10 kΩ)
(Tape and Reel)
MCP42050: Dual Digital Potentiometer (50 kΩ)
MCP42050T: Dual Digital Potentiometer (50 kΩ)
(Tape and Reel)
MCP42100: Dual Digital Potentiometer (100 kΩ)
MCP42100T: Dual Digital Potentiometer (100 kΩ)
(Tape and Reel)
Temperature Range:
Package:
I
E
P
SN
SL
ST
=
=
-40°C to +85°C
-40°C to +125°C
=
=
=
=
Plastic DIP (300 mil Body), 8-lead, 14-lead
Plastic SOIC (150 mil Body), 8-lead
Plastic SOIC (150 mil Body), 14-lead
TSSOP (4.4mm Body), 14-lead
Examples:
a)
b)
c)
h)
i)
MCP41010-I/SN:
I-Temp., 8LD SOIC pkg.
MCP41010-E/P:
E-Temp., 8LD PDIP pkg.
MCP41010T-I/SN: Tape and Reel, I-Temp.,
8LD SOIC pkg.
MCP41050-E/SN: E-Temp., 8LD SOIC pkg.
MCP41050-I/P:
I-Temp., 8LD PDIP pkg.
MCP41050-E/SN: E-Temp., 8LD SOIC pkg.
MCP41100-I/SN:
I-Temp., 8LD SOIC
package.
MCP41100-E/P:
E-Temp., 8LD PDIP pkg.
MCP41100T-I/SN: I-Temp., 8LD SOIC pkg.
a)
b)
c)
MCP42010-E/P:
MCP42010-I/SL:
MCP42010-E/ST:
d)
MCP42010T-I/ST:
e)
f)
MCP42050-E/P:
MCP42050T-I/SL:
g)
h)
MCP42050-E/SL:
MCP42050-I/ST:
i)
MCP42050T-I/SL:
j)
MCP42050T-I/ST:
k)
l)
m)
MCP42100-E/P:
MCP42100-I/SL:
MCP42100-E/ST:
n)
MCP42100T-I/SL:
o)
MCP42100T-I/ST:
d)
e)
f)
g)
E-Temp., 14LD PDIP pkg.
I-Temp., 14LD SOIC pkg.
E-Temp., 14LD TSSOP
pkg.
Tape and Reel, I-Temp.,
14LD TSSOP pkg.
E-Temp., 14LD PDIP pkg.
Tape and Reel, I-Temp.,
14LD SOIC pkg.
E-Temp., 14LD SOIC pkg.
I-Temp., 14LD TSSOP
pkg.
Tape and Reel, I-Temp.,
14LD SOIC pkg.
Tape and Reel, I-Temp.,
14LD TSSOP pkg.
E-Temp., 14LD PDIP pkg.
I-Temp., 14LD SOIC pkg.
E-Temp., 14LD TSSOP
pkg.
Tape and Reel, I-Temp.,
14LD SOIC pkg.
Tape and Reel, I-Temp.,
14LD TSSOP pkg.
Sales and Support
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and
recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1.
2.
3.
Your local Microchip sales office
The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277
The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
 2003 Microchip Technology Inc.
DS11195C-page 29
MCP41XXX/42XXX
NOTES:
DS11195C-page 30
 2003 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is intended through suggestion only
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
No representation or warranty is given and no liability is
assumed by Microchip Technology Incorporated with respect
to the accuracy or use of such information, or infringement of
patents or other intellectual property rights arising from such
use or otherwise. Use of Microchip’s products as critical
components in life support systems is not authorized except
with express written approval by Microchip. No licenses are
conveyed, implicitly or otherwise, under any intellectual
property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
KEELOQ, MPLAB, PIC, PICmicro, PICSTART, PRO MATE and
PowerSmart are registered trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
FilterLab, microID, MXDEV, MXLAB, PICMASTER, SEEVAL
and The Embedded Control Solutions Company are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Accuron, Application Maestro, dsPICDEM, dsPICDEM.net,
ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, InCircuit Serial Programming, ICSP, ICEPIC, microPort,
Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM,
PICC, PICkit, PICDEM, PICDEM.net, PowerCal, PowerInfo,
PowerMate, PowerTool, rfLAB, rfPIC, Select Mode,
SmartSensor, SmartShunt, SmartTel and Total Endurance are
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
Serialized Quick Turn Programming (SQTP) is a service mark
of Microchip Technology Incorporated in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2003, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received QS-9000 quality system
certification for its worldwide headquarters,
design and wafer fabrication facilities in
Chandler and Tempe, Arizona in July 1999
and Mountain View, California in March 2002.
The Company’s quality system processes and
procedures are QS-9000 compliant for its
PICmicro® 8-bit MCUs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals,
non-volatile memory and analog products. In
addition, Microchip’s quality system for the
design and manufacture of development
systems is ISO 9001 certified.
 2003 Microchip Technology Inc.
DS11195C-page 31
M
WORLDWIDE SALES AND SERVICE
AMERICAS
ASIA/PACIFIC
Corporate Office
Australia
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support: 480-792-7627
Web Address: http://www.microchip.com
Suite 22, 41 Rawson Street
Epping 2121, NSW
Australia
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
Atlanta
Unit 915
Bei Hai Wan Tai Bldg.
No. 6 Chaoyangmen Beidajie
Beijing, 100027, No. China
Tel: 86-10-85282100
Fax: 86-10-85282104
3780 Mansell Road, Suite 130
Alpharetta, GA 30022
Tel: 770-640-0034
Fax: 770-640-0307
Boston
2 Lan Drive, Suite 120
Westford, MA 01886
Tel: 978-692-3848
Fax: 978-692-3821
Chicago
333 Pierce Road, Suite 180
Itasca, IL 60143
Tel: 630-285-0071
Fax: 630-285-0075
Dallas
4570 Westgrove Drive, Suite 160
Addison, TX 75001
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Tri-Atria Office Building
32255 Northwestern Highway, Suite 190
Farmington Hills, MI 48334
Tel: 248-538-2250
Fax: 248-538-2260
Kokomo
2767 S. Albright Road
Kokomo, IN 46902
Tel: 765-864-8360
Fax: 765-864-8387
Los Angeles
China - Beijing
China - Chengdu
Rm. 2401-2402, 24th Floor,
Ming Xing Financial Tower
No. 88 TIDU Street
Chengdu 610016, China
Tel: 86-28-86766200
Fax: 86-28-86766599
China - Fuzhou
Unit 28F, World Trade Plaza
No. 71 Wusi Road
Fuzhou 350001, China
Tel: 86-591-7503506
Fax: 86-591-7503521
China - Hong Kong SAR
Unit 901-6, Tower 2, Metroplaza
223 Hing Fong Road
Kwai Fong, N.T., Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431
China - Shanghai
Room 701, Bldg. B
Far East International Plaza
No. 317 Xian Xia Road
Shanghai, 200051
Tel: 86-21-6275-5700
Fax: 86-21-6275-5060
China - Shenzhen
18201 Von Karman, Suite 1090
Irvine, CA 92612
Tel: 949-263-1888
Fax: 949-263-1338
Rm. 1812, 18/F, Building A, United Plaza
No. 5022 Binhe Road, Futian District
Shenzhen 518033, China
Tel: 86-755-82901380
Fax: 86-755-8295-1393
Phoenix
China - Shunde
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7966
Fax: 480-792-4338
Room 401, Hongjian Building
No. 2 Fengxiangnan Road, Ronggui Town
Shunde City, Guangdong 528303, China
Tel: 86-765-8395507 Fax: 86-765-8395571
San Jose
China - Qingdao
2107 North First Street, Suite 590
San Jose, CA 95131
Tel: 408-436-7950
Fax: 408-436-7955
Rm. B505A, Fullhope Plaza,
No. 12 Hong Kong Central Rd.
Qingdao 266071, China
Tel: 86-532-5027355 Fax: 86-532-5027205
Toronto
India
6285 Northam Drive, Suite 108
Mississauga, Ontario L4V 1X5, Canada
Tel: 905-673-0699
Fax: 905-673-6509
Divyasree Chambers
1 Floor, Wing A (A3/A4)
No. 11, O’Shaugnessey Road
Bangalore, 560 025, India
Tel: 91-80-2290061 Fax: 91-80-2290062
Japan
Benex S-1 6F
3-18-20, Shinyokohama
Kohoku-Ku, Yokohama-shi
Kanagawa, 222-0033, Japan
Tel: 81-45-471- 6166 Fax: 81-45-471-6122
DS11195C-page 32
Korea
168-1, Youngbo Bldg. 3 Floor
Samsung-Dong, Kangnam-Ku
Seoul, Korea 135-882
Tel: 82-2-554-7200 Fax: 82-2-558-5932 or
82-2-558-5934
Singapore
200 Middle Road
#07-02 Prime Centre
Singapore, 188980
Tel: 65-6334-8870 Fax: 65-6334-8850
Taiwan
Kaohsiung Branch
30F - 1 No. 8
Min Chuan 2nd Road
Kaohsiung 806, Taiwan
Tel: 886-7-536-4818
Fax: 886-7-536-4803
Taiwan
Taiwan Branch
11F-3, No. 207
Tung Hua North Road
Taipei, 105, Taiwan
Tel: 886-2-2717-7175 Fax: 886-2-2545-0139
EUROPE
Austria
Durisolstrasse 2
A-4600 Wels
Austria
Tel: 43-7242-2244-399
Fax: 43-7242-2244-393
Denmark
Regus Business Centre
Lautrup hoj 1-3
Ballerup DK-2750 Denmark
Tel: 45-4420-9895 Fax: 45-4420-9910
France
Parc d’Activite du Moulin de Massy
43 Rue du Saule Trapu
Batiment A - ler Etage
91300 Massy, France
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Germany
Steinheilstrasse 10
D-85737 Ismaning, Germany
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Italy
Via Quasimodo, 12
20025 Legnano (MI)
Milan, Italy
Tel: 39-0331-742611
Fax: 39-0331-466781
Netherlands
P. A. De Biesbosch 14
NL-5152 SC Drunen, Netherlands
Tel: 31-416-690399
Fax: 31-416-690340
United Kingdom
505 Eskdale Road
Winnersh Triangle
Wokingham
Berkshire, England RG41 5TU
Tel: 44-118-921-5869
Fax: 44-118-921-5820
07/28/03
 2003 Microchip Technology Inc.
Similar pages