Vishay MCU0805ME3BPW00 Precision thin film chip resistor superior moisture resistivity Datasheet

MCT 0603 AT, MCU 0805 AT, MCA 1206 AT - Precision
Vishay Beyschlag
Precision Thin Film Chip Resistor
Superior Moisture Resistivity
FEATURES
• Superior moisture resistivity, |ΔR/R| < 0.5 %
(85 °C; 85 % RH; 1000 h)
• Rated dissipation P70 up to 0.4 W for size 1206
• AEC-Q200 qualified
• Approved according to EN 140401-801
• Lead (Pb)-free solder contacts
• Compliant to RoHS directive 2002/95/EC
APPLICATIONS
• Automotive
• Telecommunication
• Medical equipment
Automotive-Grade MC AT Precision Thin Film Chip
Resistors are the perfect choice for most fields of modern
precision electronics where reliability and stability is of major
concern. Typical applications include automotive,
telecommunication, industrial, medical equipment, precision
test and measuring equipment.
• Industrial equipment
METRIC SIZE
INCH:
METRIC:
0603
0805
1206
RR 1608M
RR 2012M
RR 3216M
TECHNICAL SPECIFICATIONS
DESCRIPTION
MCT 0603 AT
MCU 0805 AT
MCA 1206 AT
RR 1608M
RR 2012M
RR 3216M
47 Ω to 100 kΩ
47 Ω to 100 kΩ
47 Ω to 100 kΩ
Metric size
Resistance range
Resistance tolerance
± 0.1 %
Temperature coefficient
± 25 ppm/K; ± 15 ppm/K
Rated dissipation P70 (1)
Operating voltage, Umax. AC/DC
0.125 W
0.200 W
0.400 W
75 V
150 V
200 V
Permissible film temperature (1)
155 °C
Insulation voltage
1 min; Uins
100 V
200 V
300 V
Continuous
75 V
75 V
75 V
Note
(1) Please refer to APPLICATION INFORMATION below
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For technical questions, contact: [email protected]
Document Number: 28785
Revision: 09-Apr-09
MCT 0603 AT, MCU 0805 AT, MCA 1206 AT - Precision
Precision Thin Film Chip Resistor
Superior Moisture Resistivity
Vishay Beyschlag
APPLICATION INFORMATION
The power dissipation on the resistor generates a temperature rise against the local ambient, depending on the heat flow support
of the printed-circuit board (thermal resistance). The rated dissipation applies only if the permitted film temperature is not
exceeded. Furthermore, a high level of ambient temperature or of power dissipation may raise the temperature of the solder joint,
hence special solder alloys or board materials may be required to maintain the reliability of the assembly.
These resistors do not feature a limited lifetime when operated within the permissible limits. However, resistance value drift
increasing over operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a
functional lifetime. The designer may estimate the performance of the particular resistor application or set certain load and
temperature limits in order to maintain a desired stability.
MAXIMUM RESISTANCE CHANGE AT RATED DISSIPATION
Operation mode
Standard
Power
Rated dissipation
P70
P70
MCT 0603 AT
0.100 W
0.125 W
MCU 0805 AT
0.125 W
0.200 W
MCA 1206 AT
0.250 W
0.400 W
125 °C
155 °C
MCT 0603 AT
47 Ω to 100 kΩ
47 Ω to 100 kΩ
MCU 0805 AT
47 Ω to 100 kΩ
47 Ω to 100 kΩ
MCA 1206 AT
47 Ω to 100 kΩ
47 Ω to 100 kΩ
1000 h
≤ 0.1 %
≤ 0.2 %
8000 h
≤ 0.2 %
≤ 0.4 %
225 000 h
≤ 0.6 %
-
Film temperature
Max. resistance change at rated dissipation for
resistance range:
|ΔR/R| max., after:
Document Number: 28785
Revision: 09-Apr-09
For technical questions, contact: [email protected]
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MCT 0603 AT, MCU 0805 AT, MCA 1206 AT - Precision
Precision Thin Film Chip Resistor
Superior Moisture Resistivity
Vishay Beyschlag
PART NUMBER AND PRODUCT DESCRIPTION (1)
PART NUMBER: MCT0603MD4641BPW00
M
C
T
0
6
0
3
M
D
4
6
4
1
B
P
W
0
0
MODEL/SIZE
VERSION
TCR
VALUE
TOLERANCE
PACKAGING
SPECIAL
MCT0603
MCU0805
MCA1206
M = AT
(Automotive)
E = ± 15 ppm/K
D = ± 25 ppm/K
3 digit value
1 digit
multiplier
B = ± 0.1 %
P1
P5
PW
Up to 2 digits
00 = Standard
MULTIPLIER
0 = *100
1 = *101
2 = *102
3 = *103
PRODUCT DESCRIPTION: MCT 0603 - 25 0.1 % AT PW 4K64
MCT
0603
- 25
0.1 %
AT
PW
4K64
MODEL
SIZE
TCR
TOLERANCE
VALUE
VERSION
PACKAGING
RESISTANCE
VALUE
MCT
MCU
MCA
0603
0805
1206
± 15 ppm/K
± 25 ppm/K
± 0.1 %
AT = Automotive
P1
P5
PW
47K = 47 kΩ
Note
(1) Products can be ordered using either the PART NUMBER or PRODUCT DESCRIPTION
TEMPERATURE COEFFICIENT AND RESISTANCE RANGE
RESISTANCE VALUE (2)
DESCRIPTION
TCR
TOLERANCE
MCT 0603 AT
MCU 0805 AT
MCA 1206 AT
± 0.1 %
47 Ω to 100 kΩ
47 Ω to 100 kΩ
47 Ω to 100 kΩ
± 25 ppm/K
± 15 ppm/K
Note
(2) Resistance values to be selected from E96 and E192
PACKAGING
REEL
MODEL
MCT 0603 AT
MCU 0805 AT
PIECES/
PAPER TAPE ON REEL
CODE
1000
P1
5000
P5
20 000
PW
1000
P1
5000
P5
20 000
PW
1000
P1
5000
P5
MCA 1206 AT
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For technical questions, contact: [email protected]
Document Number: 28785
Revision: 09-Apr-09
MCT 0603 AT, MCU 0805 AT, MCA 1206 AT - Precision
Precision Thin Film Chip Resistor
Superior Moisture Resistivity
Vishay Beyschlag
DIMENSIONS
T1
W
WT
H
T2
L
DIMENSIONS AND MASS
H
(mm)
L
(mm)
W
(mm)
WT
(mm)
T1
(mm)
T2
(mm)
MASS
(mg)
MCT 0603 AT
0.45 + 0.1/- 0.05
1.55 ± 0.05
0.85 ± 0.1
> 75 % of W
0.3 + 0.15/- 0.2
0.3 + 0.15/- 0.2
1.9
MCU 0805 AT
0.52 ± 0.1
2.0 ± 0.1
1.25 ± 0.15
> 75 % of W
0.4 + 0.1/- 0.2
0.4 + 0.1/- 0.2
4.6
MCA 1206 AT
0.55 ± 0.1
3.2 + 0.1/- 0.2
1.6 ± 0.15
> 75 % of W
0.5 ± 0.25
0.5 ± 0.25
9.2
TYPE
SOLDER PAD DIMENSIONS
X
G
Y
Z
RECOMMENDED SOLDER PAD DIMENSIONS
WAVE SOLDERING
TYPE
REFLOW SOLDERING
G
(mm)
Y
(mm)
X
(mm)
Z
(mm)
G
(mm)
Y
(mm)
X
(mm)
Z
(mm)
MCT 0603 AT
0.5
1.2
1.1
2.9
0.5
0.95
0.95
2.4
MCU 0805 AT
0.65
1.4
1.5
3.45
0.65
1.1
1.4
2.85
MCA 1206 AT
1.5
1.6
1.9
4.7
1.5
1.25
1.75
4.0
Note
• The rated dissipation applies only if the permitted film temperature is not exceeded. Furthermore, a high level of ambient temperature or of
power dissipation may raise the temperature of the solder joint, hence special solder alloys or boardmaterials may be required to maintain the
reliability of the assembly. Specified power rating above 125 °C requires dedicated heat-sink pads, which depend on boardmaterials.
The given solder pad dimensions reflect the considerations for board design and assembly as outlined e.g. in standards IEC 61188-5-x, or in
publication IPC-7351. They do not guarantee any supposed thermal properties, particularly as these are also strongly influenced by many other
parameters.
Still, the given solder pad dimensions will be found adequate for most general applications, e.g. those referring to “standard operation mode”.
Please note however that applications for “power operation mode” require special considerations for the design of solder pads and adjacent
conductor areas.
Document Number: 28785
Revision: 09-Apr-09
For technical questions, contact: [email protected]
www.vishay.com
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MCT 0603 AT, MCU 0805 AT, MCA 1206 AT - Precision
Precision Thin Film Chip Resistor
Superior Moisture Resistivity
Vishay Beyschlag
DESCRIPTION
APPROVALS
Production is strictly controlled and follows an extensive
set of instructions established for reproducibility. A
homogeneous film of special metal alloy is deposited on a
high grade (Al2O3) ceramic substrate and conditioned to
achieve the desired temperature coefficient. Specially
designed inner contacts are deposited on both sides. A
special laser is used to achieve the target value by smoothly
cutting a meander groove in the resistive layer without
damaging the ceramics. The resistor elements are covered
by a unique protective coating designed for electrical,
mechanical and climatic protection. The terminations receive
a final pure tin on nickel plating.
The resistors are approved within the IECQ-CECC Quality
Assessment System for Electronic Components to the detail
specification EN 140401-801 which refers to EN 60115-1,
EN 140400 and the variety of environmental test procedures
of the IEC 60068 (3) series. The detail specification refers to
the climatic categories 55/125/56, which relates to the
“standard operation mode” of this datasheet.
The result of the determined production is verified by an
extensive testing procedure and optical inspection
performed on 100 % of the individual chip resistors. Only
accepted products are laid directly into the paper tape in
accordance with IEC 60286-3 (3).
Conformity is attested by the use of the CECC Logo (
the Mark of Conformity on the package label.
) as
Vishay BEYSCHLAG has achieved “Approval of
Manufacturer” in accordance with IEC QC 001002-3,
clause 2. The release certificate for “Technology Approval
Schedule” in accordance with CECC 240001 based on
IEC QC 001002-3, clause 6 is granted for the
Vishay BEYSCHLAG manufacturing process.
The resistors are qualified according to AEC-Q200.
ASSEMBLY
RELATED PRODUCTS
The resistors are suitable for processing on automatic SMD
assembly systems. They are suitable for automatic soldering
using wave, reflow or vapour phase as shown in
IEC 61760-1 (3). The encapsulation is resistant to all cleaning
solvents commonly used in the electronics industry,
including alcohols, esters and aqueous solutions. The
suitability of conformal coatings, if applied, shall be qualified
by appropriate means to ensure the long-term stability of the
whole system.
For more information about products with higher operation
temperature please refer to the professional datasheet
document no. 28760.
Chip resistor arrays may be used in sensing applications or
precision amplifiers where close matching between multiple
resistors
is
necessary.
Please
refer
to
the
ACAS AT - Precision datasheet document no. 28770.
The resistors are RoHS compliant; the pure tin plating
provides
compatibility
with
lead
(Pb)-free
and
lead-containing soldering processes. Solderability is
specified for 2 years after production or requalification. The
permitted storage time is 20 years. The immunity of the
plating against tin whisker growth has been proven under
extensive testing.
All products comply with the GADSL (1) and the
CEFIC-EECA-EICTA (2) list of legal restrictions on
hazardous substances. This includes full compliance with
the following directives:
• 2000/53/EC End of Vehicle life Directive (ELV) and
Annex II (ELV II)
• 2002/95/EC Restriction of the
Substances directive (RoHS)
use
of
Hazardous
• 2002/96/EC Waste Electrical and Electronic Equipment
Directive (WEEE)
Notes
(1) Global Automotive Declarable Substance List, see www.gadsl.org
(2) CEFIC (European Chemical Industry Council), EECA (European Electronic Component Manufacturers Association), EICTA (European trade
organisation representing the information and communications technology and consumer electronics), see www.eicta.org → issues →
environment policy → chemicals → chemicals for electronics
(3) The quoted IEC standards are also released as EN standards with the same number and identical contents
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For technical questions, contact: [email protected]
Document Number: 28785
Revision: 09-Apr-09
MCT 0603 AT, MCU 0805 AT, MCA 1206 AT - Precision
Precision Thin Film Chip Resistor
Superior Moisture Resistivity
Vishay Beyschlag
Rated Power in %
FUNCTIONAL PERFORMANCE
Standard Mode
Power Mode
100
80
60
40
20
0
- 55
0
50
70
100
125
180
155
Ambient Temperature in °C
For permissible resistance change please refer to table MAXIMUM RESISTANCE CHANGE AT RATED POWER, above
Current Noise A1
Derating
3
MCT 0603 AT
MCU 0805 AT
MCA 1206 AT
1
µV/V
0.1
0.01
10 Ω
100 Ω
1 kΩ
10 kΩ
100 kΩ
1 MΩ
Resistance Value R
Current noise A1 in accordance with IEC 60195
Current Noise
TESTS AND REQUIREMENTS
All tests are carried out in accordance with the following
specifications:
EN 60115-1, generic specification
EN 140400, sectional specification
EN 140401-801, detail specification
The components are approved in accordance with the
IECQ-CECC-system, where applicable. The following table
contains only the most important tests. For the full test
schedule refer to the documents listed above. The testing
also covers most of the requirements specified by
EIA/IS-703 and JIS-C-5202.
The tests are carried out in accordance with IEC 60068 and
under standard atmospheric conditions in accordance with
IEC 60068-1, 5.3. Climatic category LCT/UCT/56 (rated
temperature range: Lower category temperature, upper
Document Number: 28785
Revision: 09-Apr-09
category temperature; damp heat, long term, 56 days) is
valid (LCT = - 55 °C/UCT = 125 °C).
Unless otherwise specified the following values apply:
Temperature: 15 °C to 35 °C
Relative humidity: 45 % to 75 %
Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar).
The components are mounted for testing on boards in
accordance with EN 140400, 2.3.3 unless otherwise
specified.
The requirements stated in the Test Procedures and
Requirements table are based on the required tests and
permitted limits of EN 140401-801. However, some
additional tests and a number of improvements against those
minimum requirements have been included.
For technical questions, contact: [email protected]
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MCT 0603 AT, MCU 0805 AT, MCA 1206 AT - Precision
Precision Thin Film Chip Resistor
Superior Moisture Resistivity
Vishay Beyschlag
TEST PROCEDURES AND REQUIREMENTS
EN
60115-1
CLAUSE
IEC
60068-2
TEST
METHOD
TEST
PROCEDURE
REQUIREMENTS
PERMISSIBLE CHANGE (ΔR)
STABILITY CLASS 0.25 OR BETTER (1)
Stability for product types:
MCT 0603 AT
47 Ω to 100 kΩ
MCU 0805 AT
47 Ω to 100 kΩ
MCA 1206 AT
47 Ω to 100 kΩ
± 0.1 % R
4.5
-
Resistance
4.8.4.2
-
Temperature
coefficient
At (20/- 55/20) °C and
(20/155/20) °C
Endurance at 70 °C:
Standard operation mode
U = P 70 x R or U = Umax.;
whichever is the less severe;
1.5 h on; 0.5 h off;
70 °C; 1000 h
70 °C; 8000 h
± (0.1 % R + 0.02 Ω)
± (0.2 % R + 0.02 Ω)
Endurance at 70 °C:
Power operation mode
U = P 70 x R or U = Umax.;
whichever is the less severe;
1.5 h on; 0.5 h off;
70 °C; 1000 h
70 °C; 8000 h
± (0.2 % R + 0.02 Ω)
± (0.4 % R + 0.05 Ω)
-
Endurance at
upper category
temperature
125 °C; 1000 h
155 °C; 1000 h
± (0.15 % R + 0.02 Ω)
± (0.3 % R + 0.02 Ω)
78 (Cab)
Damp heat,
steady state
(40 ± 2) °C; 56 days;
(93 ± 3) % RH
± (0.1 % R + 0.02 Ω)
67 (Cy)
Damp heat,
steady state,
accelerated
(85 ± 2) °C
(85 ± 5) % RH
U = 0.1 x P 70 x R
≤ 100 V;
1000 h
± (0.5 % R + 0.05 Ω)
4.25.1
4.25.3
4.24
4.39
-
4.23
4.23.2
± 25 ppm/K; ± 15 ppm/K
Climatic sequence:
2 (Ba)
dry heat
125 °C; 16 h
4.23.3
30 (Db)
damp heat, cyclic
55 °C; 24 h; > 90 % RH;
1 cycle
4.23.4
1 (Aa)
cold
- 55 °C; 2 h
4.23.5
13 (M)
low air pressure
8.5 kPa; 2 h; (25 ± 10) °C
damp heat, cyclic
55 °C; 5 days > 90 % RH;
5 cycles
± (0.25 % R + 0.02 Ω)
4.23.6
30 (Db)
4.23.7
-
DC load
U = P 70 x R ≤ Umax.; 1 min
-
1 (Aa)
Storage at low
temperature
- 55 °C; 2 h
± (0.05 % R + 0.01 Ω)
4.19
14 (Na)
Rapid change of
temperature
30 min at - 55 °C and
30 min at 125 °C;
1000 cycles
± (0.25 % R + 0.02 Ω)
4.13
-
Short time overload;
standard operation mode
U = 2.5 x P 70 x R
≤ 2 × Umax.; 5 s
± (0.05 % R + 0.01 Ω)
4.27
-
Single pulse high
voltage overload;
standard operation mode
Severity no. 4:
U = 10 x P 70 x R
≤ 2 x Umax.;
10 pulses
± (0.25 % R + 0.05 Ω)
Note
(1) According to the detail specification EN 140401-801 the stability class applies to the category temperatures 85 °C and 125 °C and their
respective test conditions.
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For technical questions, contact: [email protected]
Document Number: 28785
Revision: 09-Apr-09
MCT 0603 AT, MCU 0805 AT, MCA 1206 AT - Precision
Precision Thin Film Chip Resistor
Superior Moisture Resistivity
Vishay Beyschlag
TEST PROCEDURES AND REQUIREMENTS
EN
60115-1
CLAUSE
IEC
60068-2
TEST
METHOD
TEST
PROCEDURE
REQUIREMENTS
PERMISSIBLE CHANGE (ΔR)
STABILITY CLASS 0.25 OR BETTER (1)
Stability for product types:
4.37
4.40
4.22
4.17.2
-
-
6 (Fc)
58 (Td)
MCT 0603 AT
47 Ω to 100 kΩ
MCU 0805 AT
47 Ω to 100 kΩ
MCA 1206 AT
47 Ω to 100 kΩ
15 x P 70 x R
≤ 2 x Umax.;
0.1 s on; 2.5 s off;
1000 cycles
± (0.5 % R + 0.05 Ω)
ESD
(Electro Static Discharge)
IEC 61340-3-1;
3 pos. + 3 neg.
(equivalent to MIL-STD-883,
Method 3015)
MCT 0603 AT: 1000 V
MCU 0805 AT: 1500 V
MCA 1206 AT: 2000 V
± (0.5 % R + 0.05 Ω)
Vibration
Endurance by sweeping;
10 Hz to 2000 Hz;
no resonance;
amplitude ≤ 1.5 mm or
≤ 200 m/s2; 6 h
± (0.05 % R + 0.01 Ω)
no visible damage
Solder bath method;
SnPb40; non-activated flux
(215 ± 3) °C; (3 ± 0.3) s
Good tinning (≥ 95 % covered);
no visible damage
Solder bath method;
SnAg3Cu0.5 or SnAg3.5;
non-activated flux;
(235 ± 3) °C; (2 ± 0.2) s
Good tinning (≥ 95 % covered);
no visible damage
Periodic electric
overload;
standard operation mode
Solderability
U=
4.18.2
58 (Td)
Resistance to
soldering heat
Solder bath method;
(260 ± 5) °C; (10 ± 1) s
± (0.05 % R + 0.01 Ω)
no visible damage
4.29
45 (XA)
Component solvent
resistance
Isopropyl alcohol + 50 °C;
method 2
No visible damage
4.32
21 (Ue3)
Shear (adhesion)
RR 2012M and
RR 3216M; 45 N
4.33
21 (Ue1)
Substrate bending
Depth 2 mm, 3 times
± (0.05 % R + 0.01 Ω)
no visible damage; no open circuit in bent position
4.7
-
Voltage proof
URMS = Uins; (60 ± 5) s
No flashover or breakdown
4.35
-
Flammability
Needle flame test; 10 s
No burning after 30 s
RR 1608M; 9 N
Document Number: 28785
Revision: 09-Apr-09
No visible damage
For technical questions, contact: [email protected]
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Legal Disclaimer Notice
Vishay
Disclaimer
All product specifications and data are subject to change without notice.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf
(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein
or in any other disclosure relating to any product.
Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any
information provided herein to the maximum extent permitted by law. The product specifications do not expand or
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed
therein, which apply to these products.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this
document or by any conduct of Vishay.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless
otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such
applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting
from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding
products designed for such applications.
Product names and markings noted herein may be trademarks of their respective owners.
Document Number: 91000
Revision: 18-Jul-08
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