Freescale MCZ33811EGR2 Solenoid monitor integrated circuit (ic) Datasheet

Freescale Semiconductor
Advance Information
Document Number: MC33811
Rev. 3, 8/2008
Solenoid Monitor Integrated
Circuit (IC)
33811
The 33811 is a 5 channel Solenoid Monitor IC that is used to verify
proper electrical and mechanical solenoid operation. The IC contains
five solenoid driver voltage monitoring stages and a serial peripheral
interface (SPI) for fault communication and setup. The IC has the
ability to determine the correct movement of solenoid armatures by
analyzing the variation in the voltage profile, across the solenoid
driver MOSFET, which represents the actual solenoid current profile.
These features, along with cost effective packaging, make the
33811 ideal for powertrain solenoid monitoring applications.
SOLENOID MONITOR
Features
•
•
•
•
•
•
•
Typical operating voltage range, 10.5 < VPWR < 15.5 volts
Interfaces to 3.3 and 5 volt microprocessors via SPI protocol
Reset pin to initialize all 5 fault outputs
Internal voltage regulator
Internal oscillator
Unique solenoid current profile detection circuitry
Pb-free packaging designated by suffix code EG
EG SUFFIX (PB_FREE)
98ASB42567B
16-PIN SOICW
ORDERING INFORMATION
Device
Temperature
Range (TA)
Package
MCZ33811EG/R2
-40°C to 125°C
16 SOICW
33811
VBAT
VDD
VPWR
VDD
SOLM1
VSPI
SOLM2
SOLM3
MCU
MOSI
SCLK
CS
MISO
P00
SI
SCLK
CS
SO
RESET
SOLM4
SOLM5
D_GND
A_GND
VBAT
SOLENOID DRIVER
PORTS
P01
IN1
OUT1
P02
IN2
OUT2
P03
IN3
OUT3
P04
IN4
P05
IN5
OUT4
VBAT
VBAT
VBAT
VBAT
OUT5
Figure 1. 33811 Simplified Application Diagram
* This document contains certain information on a new product.
Specifications and information herein are subject to change without notice.
© Freescale Semiconductor, Inc., 2007. All rights reserved.
SOLENOIDS
INTERNAL BLOCK DIAGRAM
INTERNAL BLOCK DIAGRAM
VPWR, VDD, 5.0 V
Oscillator
and Clock Generator
VPWR
VDD
D_GND
VSPI
Waveform Detection
Circuitry
SOLM1
Waveform Detection
Circuitry
SOLM2
Waveform Detection
Circuitry
SOLM3
Waveform Detection
Circuitry
SOLM4
Waveform Detection
Circuitry
SOLM5
RESET
SPI Interface
SI
15µA
15µA
VDD
CS
SCLK
SO
A_GND
Figure 2. 33811 Simplified Internal Block Diagram
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Analog Integrated Circuit Device Data
Freescale Semiconductor
PIN CONNECTIONS
PIN CONNECTIONS
VDD
1
16
A_GND
D_GND
2
15
N/C
SO
3
14
SOLM1
SI
4
13
SOLM2
5
12
SOLM3
6
11
7
10
SOLM5
8
9
VPWR
CS
SCLK
RESET
VSPI
SOLM4
Figure 3. 33811 Pin Connections
Table 1. 33811 Pin Definitions
A functional description of each pin can be found in the Functional Pin Description section beginning on page 11.
Pin Number
Pin Name
Pin Function
Formal Name
Definition
1
VDD
Power
Digital Voltage Supply
The VDD pin is the digital logic supply voltage used internally in the IC.
2
D_GND
Ground
Digital Ground
Digital ground for the internal control circuits of the IC. This ground should
be used for decoupling of the VDD supply.
3
SO
Output
Serial Output Data
The SO output pin is used to transmit serial data from the device to the
MCU. The SO pin remains tri-state until selected by the active low CS.
The serial output data is available to be latched by the MCU on the rising
edge of SCLK. The SO data transitions on falling edge of the SCLK.
4
SI
Input
Serial Input Data
The SI input pin is used to receive serial data from the MCU. The serial
input data is latched on the rising edge of SCLK, and the input data
transitions on the falling edge of SCLK.
5
CS
Input
Chip Select
The Chip Select input pin is an active low signal sent by the MCU to
indicate that the device is being addressed. This input requires CMOS
logic levels and has an internal active pull-up current source.
6
SCLK
Input
Serial Clock Input
The SCLK input pin is used to clock in and out the serial data on the SI
and SO pins while being addressed by the CS. The SCLK signal consists
of a 50% duty cycle with CMOS logic levels. Input data is latched by the
device on the rising edge of SCLK while output data is changed on the
falling edge. SCLK is ignored by the device while CS is high.
7
RESET
Input
Reset Input
The RESET pin, when pulled high, clears any fault bits and causes the
Serial Output pin to be tri-stated. The RESET pin operates at the CMOS
levels dictated by the VDD line and the state of the VSPI pin.
8
VSPI
Input
VSPI
The VSPI pin determines the voltage levels for the SPI interface. It must
be connected to the same voltage supply (+5 volts or +3.3 Volts) as the
MCU’s SPI interface.
9
VPWR
Power
10
SOLM5
Input
Solenoid Monitor 5
The Solenoid Monitor Input is connected to the solenoid coil at the output
driver. It monitors the current waveform through the solenoid coil as it
appears as a voltage across the output driver MOSFET.
11
SOLM4
Input
Solenoid Monitor 4
The Solenoid Monitor Input is connected to the solenoid coil at the output
driver. It monitors the current waveform through the solenoid coil as it
appears as a voltage across the output driver MOSFET.
Analog Voltage Supply The analog voltage supply provides the power for all the input amplifiers
and other analog circuitry in the IC.
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Freescale Semiconductor
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PIN CONNECTIONS
Table 1. 33811 Pin Definitions (continued)
A functional description of each pin can be found in the Functional Pin Description section beginning on page 11.
Pin Number
Pin Name
Pin Function
Formal Name
Definition
12
SOLM3
Input
Solenoid Monitor 3
The Solenoid Monitor Input is connected to the solenoid coil at the output
driver. It monitors the current waveform through the solenoid coil as it
appears as a voltage across the output driver MOSFET.
13
SOLM2
Input
Solenoid Monitor 2
The Solenoid Monitor Input is connected to the solenoid coil at the output
driver. It monitors the current waveform through the solenoid coil as it
appears as a voltage across the output driver MOSFET.
14
SOLM1
Input
Solenoid Monitor 1
The Solenoid Monitor Input is connected to the solenoid coil at the output
driver. It monitors the current waveform through the solenoid coil as it
appears as a voltage across the output driver MOSFET.
15
N/C
No Connect
No Connect
16
A_GND
Ground
Analog Ground
This pin is not to be used and must be left open in any design.
The Analog Ground is the return for the VDD and VPWR supply.
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Freescale Semiconductor
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings
Symbol
Value
VPWR
-1.5 to 25
Unit
ELECTRICAL RATINGS
Supply Voltage (continuous)
VPWR
VDD
VDC
VDD
-0.3 to 7.0
VSPI
-0.3 to 7.0
VPWRMAX
-1.5 to 50
VDC
–
-0.3 to VSPI
VDC
VINJMXMAX
64
VDC
–
3.2
MHz
VESD1
VESD2
±2000
±200
Peak Package Reflow Temperature During Reflow(4), (5)
TPPRT
Note 5
°C
Storage Temperature
TSTG
-55 to 150
°C
Operating Ambient Temperature
TA
-40 to 125
°C
Operating Junction Temperature
TJ
-40 to 150
°C
VSPI
Supply Voltage (transient) on VPWR
CS, SI, SO, SCLK, RESET
Solenoid Monitor Inputs Maximum Voltage (5ms. maximum duration)
Frequency of SPI Operation (VDD = 5.0V)(1)
V
ESD Voltage(2)
Human Body Model(3)
Machine Model
THERMAL RATINGS
Notes
1.
2.
This parameter is guaranteed by design but is not production tested.
ESD testing is performed in accordance with the Human Body Model (HBM) (Per AEC-Q100-002, CZAP = 100pF, RZAP = 1500Ω) and
the Machine Model (MM) (Per AEC-Q100-002, CZAP = 200pF, RZAP = 0Ω). ESD data available upon request.
3.
4.
All pins when tested individually.
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes
and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.
5.
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Freescale Semiconductor
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ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 3. Static Electrical Characteristics
Characteristics noted under conditions 7.0V ≤ VPWR ≤ 17V, - 40°C ≤ TA ≤ 125°C, GND = 0V, unless otherwise noted. Typical
values noted reflect the approximate parameter means at TA = 25°C under nominal conditions, unless otherwise noted.
Characteristic
Symbol
Min
Typ
Max
Unit
VPWR (FO)
10.5
–
15.5
V
VDD (FO)
4.75
5.0
5.25
V
VSPI(FO)
3.0
5.0
5.25
V
IPWR (ON)
–
1.0
5.0
mA
1.0
5.0
mA
0.5
1.0
mV
1.5
mV
POWER INPUT (VPWR, IPWR, IVDD, VDD, IDD)
Analog Supply Voltage Range
Fully Operational
Digital Logic Supply Voltage Range
Fully Operational
SPI Voltage Supply Voltage Range
Fully Operational
3.3
Supply Current from VPWR
All Outputs Disabled (Normal & Default Mode) VPWR = 17V
Supply Current from VDD
All Outputs Disabled (Normal & Default Mode) VDD = 5.5V
IDD (ON)
Positive Threshold Voltage Point A (10.5V < = VPWR < = 15.5V)
V+TH_A
Positive Threshold Voltage Point A with Offset
0
V+TH_A_OFFSET
(10.5V < = VPWR < = 15.5V)
Positive Threshold Voltage Point B(10.5V < = VPWR < = 15.5V)
Negative Threshold Voltage (10.5V < = VPWR < = 15.5V)
Negative Threshold Voltage with Offset
V+TH_B
1.5
3.0
4.5
mV
V-TH
0
-0.5
-1.0
mV
-1.5
mV
V
V-TH_OFFSET
(10.5V < = VPWR < = 15.5V)
Logic Supply Voltage
VDD
Logic Supply Current
IDD
Static Condition
3.0
–
5.5
250
400
700
μA
SPI DIGITAL INTERFACE (VIH, VIL, VHYS, CIN, LOGICSS)
Input Logic High-voltage Thresholds (8)
VIH
0.7 x VSPI
–
VSPI + 0.3
V
Input Logic Low-voltage Thresholds (8)
VIL
GND - 0.3
–
0.2 x VSPI
V
VHYS
100
–
300
mV
CIN
–
–
20
pF
Input Logic Voltage Hysteresis (8)
Input Logic Capacitance (9)
Notes
6.
7.
8.
9.
Output fault detection thresholds with outputs programmed OFF. Output fault detect thresholds are the same for output open and shorts.
This parameter is guaranteed by design, however is not production tested.
Parameter applies to SI, RESET, CS and is guaranteed by design.
Undervoltage thresholds minimum and maximum include hysteresis.
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Analog Integrated Circuit Device Data
Freescale Semiconductor
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 3. Static Electrical Characteristics
Characteristics noted under conditions 7.0V ≤ VPWR ≤ 17V, - 40°C ≤ TA ≤ 125°C, GND = 0V, unless otherwise noted. Typical
values noted reflect the approximate parameter means at TA = 25°C under nominal conditions, unless otherwise noted.
Characteristic
Normal Mode Input Logic Pull-down Current 0.8V to 5.0V
Symbol
Min
Typ
Max
5.0
10
25
CS, RESET Pull-up Current
-5.0
-10
-25
-10
–
10
-10
–
10
–
–
10
VSPI - 0.4
–
–
–
–
0.4
ISOLM_PU
-2.5
-5
-12.5
μA
ISOLM_LKG
-10
–
10
μA
VSOHIGH
ISOHIGH = -1.0mA
SO Low-State Output Voltage
V
VSOLOW
ISOLOW = 1.0 mA
Solenoid Monitor Input Pull-up Current
μA
ICS(LKG)
CS = 5.0V, VSPI = 0.0V
SO High-State Output Voltage
μA
ICS
CS = VSPI
CS Leakage Current to VSPI
μA
I SCK, I TRISO
0.0 V to 5.0 V
CS Input Current
μA
IDEFAULTPU
(CS, RESET = 0)
SCLK, Tri-state SO Output
μA
ISPIPD
(SI)
Unit
V
(VSOLM = 0V)
Solenoid Monitor Input Leakage Current
(VSOLM = 64V)
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Freescale Semiconductor
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ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
Table 4. Dynamic Electrical Characteristics
Characteristics noted under conditions 10.5V ≤ VPWR ≤ 15.5V, - 40°C ≤ TA ≤ 125°C, GND = 0V, unless otherwise noted. Typical
values noted reflect the approximate parameter means at TA = 25°C under nominal conditions, unless otherwise noted.
Characteristic
Symbol
Min
Typ
Max
Unit
t RESET
1.0
–
–
μs
t LEAD
100
–
–
ns
0
50
ns
SPI DIGITAL INTERFACE TIMING(10)
Required High State Duration on RESET for Reset to occur(11)
Falling Edge of CS to Rising Edge of SCLK
Required Setup Time
Falling Edge of SCLK to Rising Edge of CS
Required Setup Time
t LAG
SI to Rising Edge of SCLK
Required Setup Time
t SI (SU)
16
–
–
ns
t SI (HOLD)
20
–
–
ns
SI, CS, SCLK Signal Rise Time(12)
t R (SI)
–
5.0
–
ns
SI, CS, SCLK Signal Fall Time(12)
t F (SI)
–
5.0
–
ns
Time from Falling Edge of CS to SO Low-impedance(13)
t SO (EN)
–
65
80
ns
Time from Rising Edge of CS to SO High-impedance(14)
t SO (DIS)
–
–
55
ns
t VALID
–
65
90
ns
1.0
µs
15
pF
Rising Edge of SCLK to SI
Required Hold Time
Time from Falling Edge of SCLK to SO Data Valid(15)
Sequential Transfer Rate
tSTR
Time required between data transfers
Input Capacitance (SI, SCLK)
CINPUT
Load Capacitance (SO)
CLOAD
200
pF
CTRI-STATE
20
pF
Tri-state Output Capacitance (SO)
7
WAVEFORM DETECTION TIMINGS
Start of Activation Filter Time(16)
Detection Window Time
Sample Time
Notes:
10.
11.
12.
13.
14.
15.
16.
tBEGIN
200
400
600
µs
tWINDOW
40
53
66
ms
tSAM
72
µs
These parameters are guaranteed by design. Production test equipment uses 3.2MHz, 5.0V SPI interface.
This parameter is guaranteed by design, however it is not production tested.
Rise and Fall time of incoming SI, CS, and SCLK signals suggested for design consideration to prevent the occurrence of double pulsing.
Time required for valid output status data to be available on SO pin.
Time required for output states data to be terminated at SO pin.
Time required to obtain valid data out from SO following the fall of SCLK with 200pF load.
9 µs guard band included in maximum limit
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ELECTRICAL CHARACTERISTICS
TIMING DIAGRAMS
TIMING DIAGRAMS
Microcontroller
33811
MOSI
SI
Shift Register
MISO
SCLK
Parallel
Ports
SO
SCLK
CS
33811
SI
SO
SCLK
CS
CS
0.2 VDD
tLEAD
tLAG
0.7 VDD
SCLK
0.2 VDD
tSI(SU)
SI
0.7 VDD
0.2 VDD
tSI(HOLD)
MSB IN
tSO(EN)
SO
tVALID
0.7 VDD
0.2 VDD
MSB OUT
tSO(DIS)
LSB OUT
Figure 4. SPI Timing Characteristics
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Freescale Semiconductor
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ELECTRICAL CHARACTERISTICS
MICROCONTROLLER PARAMETRICS
MICROCONTROLLER PARAMETRICS
SPI - MCU INTERFACE DESCRIPTION
The 33811 device directly interfaces to a 3.3V or 5.0V
micro controller unit (MCU) using 16 bit Serial Peripheral
Interface (SPI) protocol. SPI serial clock frequencies up to
3.2MHz may be used when programming and reading output
status information (production tested at 3.2MHz). Figure 5
illustrates the serial peripheral interface (SPI) configuration
between an MCU and one 33811.
Command data is sent to the 33811 device through the SI
input pin. As data is being clocked into the SI pin, status
information is being clocked out of the device by the SO
output pin. The response data received by the MCU during
SPI communication depends on the previous SPI message
sent to the device. Next SO response data is listed at the
bottom of each command table.
SPI Integrity Check
Checking the integrity of the SPI communication with the
initial power-up of the VDD and RESET pins is
recommended. After initial system start-up or reset, the MCU
will write one 16-bit pattern to the 33811. The first 8 bits read
by the MCU will be the fault status (SO message 1) of the
outputs. The second 8 bits will be the same bit pattern sent
by the MCU. By the MCU receiving the same bit pattern it
sent, bus integrity is confirmed. The second 16-bit pattern the
MCU sends to the device is the a command word and will be
operated on by the device accordingly on rising edge of CS.
Important A SCLK pulse count strategy has been
implemented to ensure integrity of SPI communications. SPI
messages consisting of 16 SCLK pulses and multiples of
8 clock pulses thereafter will be acknowledged. SPI
messages consisting of other than 16 + multiples of 8 SCLK
pulses will be ignored by the device.
33811
Microcontroller
Shift Register
MOSI
SI
MISO
SO
16-Bit Shift Register
SCLK
Receive
Buffer
Fault Bits
CS
Parallel
Ports
Figure 5. SPI Interface with Microprocessor
Two or more 33811 devices may be used in a module
system. Multiple ICs may be SPI-configured in parallel or
serial. Figures 6 shows the configurations. When using the
serial configuration, 32-clock cycles are required to transfer
data in / out of the ICs.
Microcontroller
33811
MOSI
SI
Shift Register
MISO
SCLK
Parallel
Ports
SO
SCLK
CS
33811
SI
SO
SCLK
CS
Figure 6. SPI Parallel Interface with Microprocessor
33811
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Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DESCRIPTION
FUNCTIONAL PIN DESCRIPTION
FUNCTIONAL DESCRIPTION
FUNCTIONAL PIN DESCRIPTION
ANALOG VOLTAGE SUPPLY (VPWR)
The VPWR pin is battery input to the 33811 IC. The VPWR
pin requires external reverse battery and transient protection.
Maximum input voltage on VPWR is 15.5V for full operation.
All IC analog current is provided from the VPWR pin through
an internal voltage regulator. The VPWR pin requires
adequate decoupling capacitance to the A_GND pin.
DIGITAL VOLTAGE SUPPLY (VDD)
The VDD pin is Logic Supply input to the 33811 IC. Maximum
input voltage on VDD is 5.25V for full operation. All IC digital
logic current except the SPI SO output pin is provided from
the VDD pin. The VDD pin requires adequate decoupling
capacitance to the D_GND pin.
SPI INTERFACE VOLTAGE (VSPI)
The VSPI input pin is used to determine communication logic
voltage levels between the microprocessor and the 33811
device. Current from VSPI is used to drive SO output and
pull-up current for CS and SI. VSPI must be connected to +5
Volts or +3.3 Volts for normal operation.
a logic low state, command words may be sent to the 33811
via the serial input (SI) pin, and status information is received
by the MCU via the serial output (SO) pin. The falling edge of
CS enables the SO output and transfers status information
into the SO buffer.
Rising edge of the CS initiates the following operation:
1. Disables the SO driver (high-impedance)
2. Activates the received command word, allowing the
33811 to activate/deactivate output drivers.
To avoid any spurious data, it is essential the high-to-low
and low-to-high transitions of the CS signal occur only when
SCLK is in a logic low state. Internal to the 33811 device is an
active pull-up to VSPI on CS. In cases where voltage exists on
CS without the application of VSPI, no current will flow from
CS to the VSPI pin.
SERIAL INPUT DATA (SI)
The SI pin is used for serial instruction data input. SI
information is latched into the input register on the rising edge
of SCLK. A logic high state present on SI will program a one
in the command word on the rising edge of the CS signal. To
program a complete word, 16 bits of information must be
entered into the device.
ANALOG GROUND (A_GND)
The Analog Ground (A_GND) pin provides a low current
analog ground for the IC. The VPWR supply is referenced to
the A_GND pin. The A_GND pin should be used for
decoupling the VPWR pin.
DIGITAL GROUND (D_GND)
The Digital Ground (D_GND) pin provides a dedicated
ground for the VDD and VSPI supplies and should be
connected to the A_GND pin.
SERIAL CLOCK INPUT (SCLK)
The system clock (SCLK) pin clocks the internal shift
register of the 33811. The SI data is latched into the input
shift register on the rising edge of SCLK signal. The SO pin
shifts status bits out on the falling edge of SCLK. The SO data
is available for the MCU to read on the rising edge of SCLK.
With CS in a logic high state, signals on the SCLK and SI pins
will be ignored and the SO pin is tri-state.
SERIAL OUTPUT DATA (SO)
The SO pin is the output from the shift register. The SO pin
remains tri-stated until the CS pin transitions to a logic low
state. All normal operating drivers are reported as zero, all
faulted drivers are reported as one. The negative transition of
CS enables the SO driver.
The SI / SO shifting of the data follows a first-in-first-out
protocol, with both input and output words transferring the
most significant bit (MSB) first.
RESET INPUT (RESET)
The RESET pin is an active high digital input pin used to
clear the fault outputs and registers in the device. During
normal operation the RESET pin should be held low.
SOLENOID MONITOR INPUT (SOLM1, SOLM2,
SOLM3, SOLM4, SOLM5)
These are the five solenoid monitor inputs that are
connected to the Solenoid solenoid driver output pins.
CHIP SELECT (CS)
The system MCU selects the 33811 to receive
communication using the chip select (CS) pin. With the CS in
33811
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Freescale Semiconductor
11
FUNCTIONAL DESCRIPTION
FUNCTIONAL INTERNAL BLOCK DESCRIPTION
FUNCTIONAL INTERNAL BLOCK DESCRIPTION
Figure 7. Functional Internal Block Diagram
POWER SUPPLY AND OSCILLATOR
The 33811 is designed to operate from 10.5V to 15.5V on
the VPWR pin. The VPWR pin supplies power to the internal
regulator which, in turn, supplies the analog circuit blocks.
The VDD Supply is used internally to supply the logic
circuitry. The VSPI supply is used for setting the SPI
communication threshold levels by supplying power to the
SO driver and the SI and CS input buffers. The on-chip
oscillator is used to set the solenoid sample period window
and sample rate.
MCU INTERFACE:
The 33811 device directly interfaces to a 3.3V or 5.0V
micro controller unit (MCU) using 16 bit Serial Peripheral
Interface (SPI) protocol. SPI serial clock frequencies up to
3.2MHz may be used when programming and reading output
status information. The RESET pin is used to place the 33811
into the Reset Mode. Normally the RESET pin is held at logic
0 by the MCU. When the MCU raises the RESET pin to a
logic 1, the 33811 enters the reset Mode. The reset initializes
the 5 fault outputs.
SOLENOID MONITORS: SOLM1 - SOLM5
These are the five solenoid monitor inputs that are
connected to the external solenoid driver output pins. The IC
has the ability to determine the correct movement of solenoid
armatures by analyzing the variation in the voltage profile,
across the solenoid driver MOSFET, which represents the
actual solenoid current profile.
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Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
OPERATIONAL MODES
FUNCTIONAL DEVICE OPERATION
OPERATIONAL MODES
POWER SUPPLY
The 33811 is designed to operate from 10.5V to 15.5V on
the VPWR pin. The VPWR pin supplies power to the internal
regulator which, in turn, supplies the analog circuit blocks.
The VDD Supply is used internally to supply the logic
circuitry. The VSPI supply is used for setting the SPI
communication threshold levels by supplying power to the
SO driver and the SI and CS input buffers. This IC
architecture provides flexible microprocessor interfacing.
When the MCU raises the RESET pin to a logic 1, the 33811
enters the Reset Mode causing two events to occur:
1) The internal Solenoid SPI register bits are cleared to 0.
2) The SO output pin is tri-stated, and pulled high by a pullup resistor, causing all subsequent SPI Responses to contain
all bits set to logic (1).
When the RESET pin is brought low again, the SO pin will
be un-tri-stated and the SPI data will again reflect the data
contained in the SPI register and the Solenoid fault register.
NORMAL MODE
SPI COMMUNICATION
The Normal Mode of operation occurs when the following
conditions are met:
The 33811 integrated circuit communicates to the MCU via
the SPI (Serial Peripheral Interface).
The SPI communication can be between one MCU and
one 33811, or it can be between one MCU and several 33811
ICs.
The MCU can send two different SPI messages to the
33811, one 8 bits in length and one 16 bits in length. The
33811 responds by sending back 8 bit or 16 bit messages.
When the MCU sends an 8 bit message to the 33811, the
33811 responds by sending only the 8 bit fault status. The
fault status contains 5 bits of solenoid status and 3 bits of
logic zeros. When the MCU sends a 16 bit interrogate
message, the 33811 responds by sending the 8 bit fault
status message followed by the last 8 previously sent bits.
The 33811 IC does not decode the SPI messages from the
MCU. It will always respond in the same way, regardless of
the contents of the 8 or 16 bits sent. Hence, no specific SPI
commands are defined, and response is limited to either
solenoid fault status alone, when an 8 bit message is sent, or
the solenoid fault status along with the last 8 bits received
when a 16 bit message is sent. The two SPI scenarios are
outlined in the following diagrams.
1) Device Junction Temperature is below 125°C.
2) VPWR is >10.5V and < 15.5V
3) VDD is > 4.75V and < 5.5V
4) A logic low (0) level is present on the RESET pin.
5) VSPI is 3.3V or 5.0 Volts
The major function of the 33811 integrated circuit is
provide the Engine or Transmission Control MCU with
information about the status of up to five solenoids. When a
solenoid is activated and operates properly, a unique current
profile is produced. This current profile can be observed as a
voltage waveform across the solenoid’s low side driver
MOSFET. The Solenoid Monitor inputs (SOLM1-5) on the
33811 are connected to voltage waveform monitoring circuits
that are capable of discerning a properly opening and closing
solenoid from one that is malfunctioning. When the 33811
determines that an solenoid is malfunctioning, a fault bit is set
in the corresponding Solenoid SPI register. When the MCU
interrogates the 33811 via the SPI, the solenoid fault will be
annunciated by setting the appropriate SPI fault bit to a logic
one (1).
SERIAL OUTPUT (SO) RESPONSE
All fault reporting is accomplished through the SPI
interface. All logic [1]s received by the MCU from the SO pin
indicate individual solenoid faults or the IC being held in the
RESET mode. All logic [0]s received by the MCU from the SO
pin indicate no fault, or normal operating solenoids. All fault
bits are cleared on the positive edge of CS. SO bits 15, 14,
13, 12, and 11 represent the fault status of
solenoids 4,3,2,1,and 5 respectively.
RESET MODE
The RESET pin is used to place the 33811 into the Reset
Mode. Normally the RESET pin is held at logic 0 by the MCU.
SPI COMMUNICATION SUMMARY
1) The SPI communications sequence starts out in step 1
above with the contents of the MCU SPI shift register
containing 8 bits of x x x x x x x x and 8 bits of y y y y y y y
y. The 33811 SPI register contains a previous 8 bit byte of p
p p p p p p p and the contents of the solenoid status register
of 0 0 0 S5 S1 S2 S3 S4 is transferred into the SPI register.
The condition shown is prior to the SPI transfer.
2) The MCU starts the transfer of data from it’s 16 bit SPI
register to the 33811’s SPI register by setting CS to a logic 0
and by issuing 16 SCLK pulses. At the end of the 16 SCLK
pulses, the MCU brings CS back high to a logic 1. When the
transfer is complete the MCU now contains the contents of
the 33811’s SPI register and the 33811 contains the contents
of the MCU’s SPI register.
33811
Analog Integrated Circuit Device Data
Freescale Semiconductor
13
FUNCTIONAL DEVICE OPERATION
OPERATIONAL MODES
3) Step 3 demonstrates an 8 bit SPI transfer. The same
exchange is performed, however, only 8 SCLK pulses are
issued and only 8 bits of data are exchanged.
4) When the transfer is complete, only the eight bits of
solenoid status has been transferred to the MCU. The data in
the 33811’s SPI register lower 8 bits has been overwritten
with the data from the MCU’s SPI register.
5) Step 5 shows the same scenario as step 3 however,
before the transfer, the RESET pin is brought to a logic 1.
This causes all data out of the SO pin to be a logical 1.
6) This step shows the contents of the MCU SPI register
after the transfer. All bits are logical 1 because the RESET
pin was held high for the duration of the transfer
WAVEFORM DETECTION ALGORITHM
Three Stage Current Waveform
An operational solenoid, once activated, produces a
current waveform that consists of three distinct regions. The
three regions are categorized by their relationship to a “dip”
in the current that occurs when the solenoid armature moves
within the coil. The regions are labeled the “Pre-Dip”, “Dip”,
and “Post-Dip” regions. At this point, it should be noted that
the 33811 does not monitor this current directly. It monitors
the voltage across the low-side MOSFET driver. When the
MOSFET is turned on, it can be thought of, to a first
approximation, as a resistor with value RDS. Hence, any
current variation through the solenoid, appears on the
MOSFET drain, as a voltage variation, as is predicted by
Ohm’s law. The 33811 is designed to monitor the voltage
across the MOSFET and determine if the solenoid is
operational or faulty based on the voltage waveform that is
produced.
Activation of the Solenoid
If the solenoid is not activated, the low side MOSFET
driver is turned off, so almost the entire supply voltage
appears across the MOSFET. When the MOSFET is
activated, the voltage across it drops from the supply voltage
to a voltage that depends on the instantaneous current flow
through the solenoid and the RDS of the MOSFET. This
dramatic voltage swing from the supply voltage, to near
ground, triggers a timer in the 33811 IC. The time value of this
timer is labeled TBEGIN and is 400 to 600μs in duration. If the
voltage is still close to ground after TBEGIN, then the solenoid
is deemed to be activated and the waveform detection
algorithm is started.
The PRE-DIP Region
After dropping to near ground, the voltage across the
MOSFET starts to increase as the current through the
solenoid begins to increase. The “Pre-Dip” region consists of
a positive slope region, leading to a voltage maxima or peak,
followed by a negative slope region. The 33811 monitors this
voltage ramp up by sampling the voltage every 72μs and
comparing it to the previous sample. If the new sample
exceeds the previous sample by 0.5mV or more, the
sampling comparator’s output is auto-zeroed to the new
voltage level by adjusting the reference voltage to the input
voltage and the sampling continues. At some point the
voltage will reach a peak and the slope of the voltage curve
will turn from positive to negative. The 33811 will continue
sampling the voltage as it begins to descend but will not autozero the comparator until at least three consecutive samples
of 3mV in magnitude have been detected.
The DIP Region
Once the three descending samples have been detected,
sampling and auto-zeroing will continue to try to determine
the next inflection point. This next inflection point will be the
Dip which is caused by the successful travel of the solenoid’s
armature. If a Dip is not discovered within the total time
window of 56 mS. then the solenoid will be said to be faulty
and the appropriate SPI register fault bit will be set to a logic
1. If the inflection point is discovered then sampling will
continue.
The Post-DIP Region
After the Dip has occurred the waveform detection
algorithm will continue sampling the voltage for the remainder
of the 56mS. time window. If the voltage is still increasing
after three sample times, then the solenoid is deemed to be
operational and the appropriate SPI register fault bit is
cleared to a logic 0. The waveform detection logic is then
reset back to a state where it look for the next solenoid
activation event.
33811
14
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
OPERATIONAL MODES
Figure 8. Valid Solenoid Waveform
33811
Analog Integrated Circuit Device Data
Freescale Semiconductor
15
PACKAGING
PACKAGE DIMENSIONS
PACKAGING
PACKAGE DIMENSIONS
For the most current package revision, visit www.freescale.com and perform a keyword search using the “98A” listed below.
EG SUFFIX
16-PIN
PLASTIC PACKAGE
98ASB42567B
ISSUE F
33811
16
Analog Integrated Circuit Device Data
Freescale Semiconductor
REVISION HISTORY
REVISION HISTORY
REVISION
1.0
2.0
3
DATE
DESCRIPTION OF CHANGES
•
Initial Release
Removed Peak Package Reflow Temperature During Reflow (solder reflow) parameter from
Maximum Ratings on page 5.
Added notes (4) and (5) to Maximum Ratings
7/2007
•
Updates to form and style.
8/2008
•
•
Changed Part Number on page 1 from PCZ to MCZ.
Upgraded from Product Preview to Advance Information status.
4/2007
•
•
33811
Analog Integrated Circuit Device Data
Freescale Semiconductor
17
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MC33811
Rev. 3
8/2008
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