SUTEX MD1210 High speed dual mosfet driver Datasheet

MD1210
Initial Release
High Speed, Dual MOSFET Driver
Features
6.0ns rise and fall time with 1000pF load
2.0A peak output source/sink current
1.2V to 5V input CMOS compatible
4.5V to 13V total supply voltage
Smart Logic threshold
Low jitter design
Dual matched channels
Outputs can swing below ground
Low inductance package
Thermally-enhanced package
Applications
Medical ultrasound imaging
Piezoelectric transducer drivers
Nondestructive evaluation
PIN diode driver
Clock driver/buffer
High speed level translator
General Description
The Supertex MD1210 is a high speed, dual MOSFET driver. It is
designed to drive high voltage N- and P-channel MOSFET
transistors for medical ultrasound applications and other
application requiring a high output current for a capacitive load.
The high-speed input stage of the MD1210 can operate from 1.2
to 5.0 volt logic interface with an optimum operating input signal
range of 1.8 to 3.3 volts. An adaptive threshold circuit is used to
set the level translator switch threshold to the average of the input
logic 0 and logic 1 levels. The input logic levels may be ground
referenced, even though the driver is putting out bipolar signals.
The level translator uses a proprietary circuit, which provides DC
coupling together with high-speed operation.
The output stage of the MD1210 has separate power connections
enabling the output signal L and H levels to be chosen
independently from the supply voltages used for the majority of
the circuit. As an example, the input logic levels may be 0 and 1.8
volts, the control logic may be powered by +5.0 and –5.0 volts,
and the output L and H levels may be varied anywhere over the
range of –5.0 to +5.0 volts. The output stage is capable of peak
currents of up to ±2.0 amps, depending on the supply voltages
used and load capacitance present.
The OE pin serves a dual purpose. First, its logic H level is used
to compute the threshold voltage level for the channel input level
translators. Secondly, when OE is low, the outputs are disabled,
with the A output high and the B output low. This assists in
properly pre-charging the AC coupling capacitors that may be
used in series in the gate drive circuit of an external PMOS and
NMOS transistor pair.
Typical Application Circuit
NR013105
1
PR120104
MD1210
Ordering Information
Package Option
12-lead 4x4x0.9 QFN
MD1210K6
Device
MD1210
Product Marking Information
1210
Device Number
YWLL
Year, Week Code, Lot Number
1st line
2nd line
Example: 5A88 means Lot #88 of first or second week in 2005
Absolute Maximum Ratings*
VDD-VSS, Logic Supply Voltage
VH, Output High Supply Voltage
VL, Output Low Supply Voltage
VSS, Low Side Supply Voltage
Logic Input Levels
Maximum Junction Temperature
Storage Temperature
-0.5V to +13.5V
VL-0.5V to VDD+0.5V
VSS-0.5V to VH+0.5V
-7.0V to +0.5V
VSS-0.5V to VSS+7.0V
+125°C
-65°C to 150°C
Pin1→
1210
YWLL
Top View
*Absolute Maximum Ratings are those values beyond which damage to the device may occur. Functional
operation under these conditions is not implied. Continuous operation of the device at the absolute rating
level may affect device reliability. All voltages are referenced to device ground.
DC Electrical Characteristics
(Over operating conditions unless otherwise specified, VH=VDD1=VDD2=12V, VL=VSS1=VSS2=0V, VOE=3.3V, TJ= 25°C)
Sym
VDD-VSS
Parameter
Logic supply voltage
Min
4.5
VSS
Low side supply voltage
VH
Max
13
Units
V
-5.5
0
V
Output high supply voltage
VSS+2.0
VDD
V
VL
Output low supply voltage
VSS
VDD-2
V
IDD1Q
VDD1 quiescent current
IDD2Q
VDD2 quiescent current
10
µA
IHQ
VH quiescent current
10
µA
IDD1
VDD1 average current
0.88
mA
IDD2
VDD2 average current
6.6
mA
IH
VH average current
23
mA
VIH
Input logic voltage high
VOE-0.3
5.0
V
VIL
Input logic voltage low
0
0.3
V
IIH
Input logic current high
1.0
µA
IIL
Input logic current low
1.0
µA
VIH
OE Input logic voltage high
1.2
5.0
V
VIL
0
0.3
V
20
30
KΩ
CIN
OE Input logic voltage low
Input logic impedance to
GND
Logic input capacitance
5.0
10
pF
θJA
Thermal resistance to air
47
°C/W
θJC
Thermal resistance to case
7.0
°C/W
RIN
Outputs (V =V
H
DD
Typ
0.55
12
Conditions
mA
No input transitions
One channel on at 5.0Mhz, No load
For logic inputs INA and INB.
For logic input OE
All Inputs
1oz. 4-layer 3x4inch PCB with thermal
pad and thermal via array.
1=VDD2=12V, VL=VSS1=VSS2=0V, VOE=3.3V, TJ=25°C)
Sym
RSINK
Parameter
Output sink resistance
Min
Typ
RSOURCE
Output source resistance
ISINK
Peak output sink current
2.0
A
ISOURCE
Peak output source current
2.0
A
2
Max
12.5
Units
Ω
12.5
Ω
Conditions
ISINK =50mA
ISOURCE =50mA
NR013105
MD1210
AC Electrical Characteristics (V =V
H
Sym
tirf
Parameter
tr
tf
tPHL
tPOE
l tr - tf l
l tPLH-tPHL l
∆tdm
1=VDD2=12V, VL=VSS1=VSS2=0V, VOE=3.3V, TJ=25°C)
Min
Inputs or OE rise & fall time
Propagation delay when
output is from low to high
Propagation delay when
output is from high to low
Propagation delay OE to
outputs
Output rise time
tPLH
DD
Typ
Max
Units
10
ns
7.0
ns
7.0
ns
9.0
ns
6.0
ns
Output fall time
6.0
ns
Rise and fall time matching
Propagation low to high and
high to low matching
Propagation delay Match
1.0
TBD
1.0
Conditions
Logic input edge speed requirement
No load, see timing diagram
Input signal rise/fall time 2ns
CLOAD=1000pF, see timing diagram
Input signal rise/fall time 2ns
ns
ns
±2.0
TBD
ns
Device to device delay match
Logic Truth Table
OE
H
H
H
H
L
Logic Inputs
INA
L
L
H
H
X
Output
INB
L
H
L
H
X
OUTA
VH
VH
VL
VL
VH
OUTB
VH
VL
VH
VL
VL
Timing Diagram
Propagation Delay
3.3V
50%
IN
50%
0V
tPLH
tPHL
90%
90%
OUT
0V
10%
10%
tr
tf
Simplified Block Diagram
Logic Input Threshold
3
NR013105
MD1210
Detailed Block Diagram
VDD1
OE
Level
Shifter
INA
Level
Shifter
VDD2
VH
OUTA
VSS2
VL
VH
VDD2
INB
OUTB
Level
Shifter
SUB
GND
VSS1
VSS2
VL
Application Information
The supplied voltages of VH and VL determine the output
logic levels. These two pins can draw fast transient
currents of up to 2.0A, so they should be provided with an
appropriate bypass capacitor located next to the chip
pins. A ceramic capacitor of up to 1.0µF may be
appropriate, with a series ferrite bead to prevent
resonance in the power supply lead coming to the
capacitor. Pay particular attention to minimizing trace
lengths and using sufficient trace width to reduce
inductance. Surface mount components are highly
recommended. Since the output impedance of this driver
is very low, in some cases it may be desirable to add a
small series resistor in series with the output signal to
obtain better waveform integrity at the load terminals.
This will of course reduce the output voltage slew rate at
the terminals of a capacitive load.
For proper operation of the MD1210, low inductance
bypass capacitors should be used on the various supply
pins. The GND input pin should be connected to the
digital ground. The INA, INB, and OE pins should be
connected to their logic source with a swing of GND to
logic level high which is 1.2 to 5.0 volts. Good trace
practices should be followed corresponding to the desired
operating speed. The internal circuitry of the MD1210 is
capable of operating up to 100MHz, with the primary
speed limitation being the loading effects of the load
capacitance.
Because of this speed and the high
transient currents that result with capacitive loads, the
bypass capacitors should be as close to the chip pins as
possible. Unless the load specifically requires bipolar
drive, the VSS1, VSS2, and VL pins should have low
inductance feed-through connections directly to a ground
plane. If these voltages are not zero, then they need
bypass capacitors in a manner similar to the positive
power supplies. The power connections VDD1 and VDD2
should have a ceramic bypass capacitor to the ground
plane with short leads and decoupling components to
prevent resonance in the power leads. A common
capacitor and voltage source may be used for these two
pins, which should always have the same DC voltage
applied. For applications sensitive to jitter and noise,
separate decoupling networks may be used for VDD1 and
VDD2.
Pay particular attention to the parasitic coupling from the
driver output to the input signal terminals. This feedback
may cause oscillations or spurious waveform shapes on
the edges of signal transitions. Since the input operates
with signals down to 1.2V even small coupled voltages
may cause problems. Use of a solid ground plane and
good power and signal layout practices will prevent this
problem. Be careful that the circulating ground return
current from a capacitive load cannot react with common
inductance to cause noise voltages in the input logic
circuitry.
4
NR013105
MD1210
Pin Description
VDD1
High side analog circuit and level shifter supply voltage. Should be at the same potential as VDD2.
VDD2
High side gate drive supply voltage
VSS1
Low side analog circuit and level shifter supply voltage. Should be at the same potential as VSS2.
VSS2
Low side gate drive supply voltage
VH
Supply voltage for P-channel output stage
VL
Supply voltage for N-channel output stage
GND
Logic input ground reference
OE
Output-enable logic input. When OE is high, (VOE+VGND)/2 sets the threshold transition between logic level high
and low for INA and INB. When OE is low, OUTA is at VH and OUTB is at VL regardless of INA and INB.
INA
Logic input. Controls OUTA when OE is high. Input logic high will cause the output to swing to VL. Input logic
low will cause the output to swing to VH.
INB
Logic input. Controls OUTB when OE is high. Input logic high will cause the output to swing to VL. Input logic
low will cause the output to swing to VH.
OUTA
Output driver. Swings from VH to VL. Intended to drive the gate of an external P-channel MOSFET via a series
capacitor. When OE is low, the output is disabled. OUTA will swing to VH turning off the external P-channel
MOSFET.
OUTB
Output driver. Swings from VH to VL. Intended to drive the gate of an external N-channel MOSFET via a series
capacitor. When OE is low, the output is disabled. OUTB will swing to VL turning off the external N-channel
MOSFET.
Pin Configuration
Pin #
Function
1
INA
2
VL
3
INB
4
GND
5
VSS1
6
VSS2
7
OUTB
8
VH
9
OUTA
10
VDD2
11
VDD1
12
OE
Note
2.15
12
1
9
QFN-12
4x4x0.9
2.15
3
7
0.55
4
0.30
Thermal Pad, and substrate are
connected to Pin#5,VSS1
Doc.#: DSFP-MD1210
10
6
0.80
(Top View, mm)
NR013105
5
NR013105
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