ABC MD1608400YL Multilayer chip bead Datasheet

SPECIFICATION FOR APPROVAL
REF :
PAGE: 1
PROD.
ABC'S DWG NO.
M□□□□□□□□□L□-□□□
MULTILAYER CHIP BEAD
NAME
ABC'S ITEM NO.
Ⅰ﹒CONFIGURATION & DIMENSIONS:
A
D
H
D
C
I
G
I
( PCB Pattern )
B
Unit : m/m
Series
A
B
C
D
G
H
I
M□1608
1.6±0.2
0.8±0.2
0.8±0.2
0.30±0.2
0.7
0.7
0.7
M□2029
2.0±0.2
1.2±0.2
0.9±0.2
0.50±0.3
1.0
1.0
1.0
M□3261
3.2±0.2
1.6±0.2
1.1±0.2
0.60±0.4
2.2
1.4
1.1
Ⅱ﹒SCHEMATIC DIAGRAM:
Ⅲ﹒MATERIALS:
a
b
c
Reflow Area
+2.0 ~ 4.0℃
/ sec max.
-(1.0 ~ 5.0)℃ / sec max.
a﹒Body:Ferrite
b﹒Internal conductor:Silver or Ag / Pd
c﹒Terminal electrode:Ag/Ni/Sn
d﹒Remark:Products comply with RoHS' requirements
Ⅳ﹒GENERAL SPECIFICATION:
a﹒Storage temp.:-40 ---- +105℃
b﹒Operating temp.:-55 ---- +125℃
Peak Temp:260℃ max.
Max time above 230℃ :50sec max.
Max time above 200℃ :70sec max.
c﹒Terminal strength:
F
M□1608
M□2029
M□3261
F ( kgf )
0.5
0.6
1.0
Time ( sec )
30±5
d﹒Solderability:
Solder : Sn96.5 / Ag3 / Cu0.5
or equivalent
Solder temp. : 260±5℃
Flux : Rosin
Dip time : 4±1 seconds
AR-001A
Preheat Area
+4.0℃ / sec max.
150 ~ 200 ℃ / 60 ~ 120sec
Forced Cooling Area
P eak Temperature:
260℃
250
50s ec max.
Temperature ( ℃ )
Type
Temperature
Rising Area
230℃
200
150
70sec max.
100
50
0
50
100
150
Time ( seconds )
200
250
SPECIFICATION FOR APPROVAL
REF :
PAGE: 2-1
PROD.
NAME
MULTILAYER CHIP BEAD
M□□□□□□□□□L□-□□□
ABC'S DWG NO.
ABC'S ITEM NO.
Ⅴ﹒ELECTRICAL CHARACTERISITCS:
MD1608400YL□ -□□□
Impedance
(Ω)
at 100MHz
40±25%
RDC
(Ω)
max.
0.30
IDC
(mA)
max.
300
MG1608800YL□ -□□□
80±25%
0.30
300
MG1608121YL□ -□□□
120±25%
0.30
200
MU1608221YL□ -□□□
220±25%
0.30
200
MU1608301YL□ -□□□
300±25%
0.35
150
MZ1608601YL□ -□□□
600±25%
0.45
100
MZ1608102YL□ -□□□
1000±25%
0.60
100
MG1608152YL□ -□□□
1500±25%
0.70
50
MG1608202YL□ -□□□
2000±25%
0.80
50
DWG No.
1). □:Packaging Information… A:Bulk B:Taping Reel
2) ."":Reference code
□□□
AR-001A
MD1608400YL□
MG1608800YL□
MG1608121YL□
MU1608221YL□
MU1608301YL□
MZ1608601YL□
MZ1608102YL□
MG1608152YL□
MG1608202YL□
SPECIFICATION FOR APPROVAL
REF :
PAGE: 2-2
PROD.
NAME
MULTILAYER CHIP BEAD
ABC'S DWG NO.
M□□□□□□□□□L□-□□□
ABC'S ITEM NO.
Ⅴ﹒ELECTRICAL CHARACTERISITCS:
MD2029400YL□ -□□□
Impedance
(Ω)
at 100MHz
40±25%
RDC
(Ω)
max.
0.20
IDC
(mA)
max.
300
MG2029800YL□ -□□□
80±25%
0.20
300
MG2029121YL□ -□□□
120±25%
0.25
300
MU2029221YL□ -□□□
220±25%
0.30
200
MU2029301YL□ -□□□
300±25%
0.30
200
MZ2029601YL□ -□□□
600±25%
0.40
100
MZ2029102YL□ -□□□
1000±25%
0.45
100
MG2029152YL□ -□□□
1500±25%
0.55
100
MG2029202YL□ -□□□
2000±25%
0.60
50
DWG No.
1). □:Packaging Information… A:Bulk B:Taping Reel
2) ."":Reference code
□□□
MD2029400YL□
AR-001A
MG2029800YL□
MG2029121YL□
MU2029221YL□
MU2029301YL□
MZ2029601YL□
MZ2029102YL□
MG2029152YL□
MG2029202YL□
SPECIFICATION FOR APPROVAL
REF :
PAGE: 2-3
PROD.
MULTILAYER CHIP BEAD
NAME
ABC'S DWG NO.
M□□□□□□□□□L□-□□□
ABC'S ITEM NO.
Ⅴ﹒ELECTRICAL CHARACTERISITCS:
MG3261151YL□ -□□□
Impedance
(Ω)
at 100MHz
150±25%
RDC
(Ω)
max.
0.30
IDC
(mA)
max.
300
MG3261301YL□ -□□□
300±25%
0.30
300
MU3261301YL□ -□□□
300±25%
0.30
300
MU3261601YL□ -□□□
600±25%
0.30
200
MZ3261601YL□ -□□□
600±25%
0.30
200
DWG No.
MZ3261122YL□ -□□□
1200±25% (at 50MHz)
0.50
100
MU3261122YL□ -□□□
1200±25% (at 50MHz)
0.50
100
MZ3261202YL□ -□□□
2000±25% (at 30MHz)
0.60
100
MU3261202YL□ -□□□
2000±25% (at 30MHz)
0.60
100
1). □:Packaging Information… A:Bulk B:Taping Reel
2) ."":Reference code
□□□
AR-001A
MZ3261151YL□
MG3261301YL□
MU3261301YL□
MU3261601YL□
MZ3261601YL□
MZ3261122YL□
MU3261122YL□
MZ3261202YL□
MU3261202YL□
SPECIFICATION FOR APPROVAL
PAGE: 3
REF :
PROD.
ABC'S DWG NO.
MULTILAYER CHIP BEAD
NAME
M□□□□□□□□□L□-□□□
ABC'S ITEM NO.
Ⅵ﹒PACKAGING INFORMATION:
( 1 ) Configuration
T
Cover Tape
N
B
A
2.0±0.5
∮C
∮C
D
G
Embossed Carrier
※ Carrier tape width : D
P:4 m/m
4 m/m
End
Start
Leader
no component
200 m/m min.
Trailer
no comppnent
400 m/m min.
Components
User direction of feed
Unit:m/m
( 2 ) Dimensions
Style
07 - 08
A
178
B
21±0.8
C
13
D
G
N
T
8
10 +0
50 -0
12.5
( 3 ) Q'TY & G.W. Per package
Inner : Reel
Series
AR-001A
Outer : Carton
Q'TY (pcs)
G.W. (gw)
Style
Q'TY(kpcs)
G.W. (Kg)
Size (cm)
M□1608
4,000
90
07 - 08
200
7.0
41 x 39 x 22
M□2029
4,000
120
07 - 08
200
8.5
41 x 39 x 22
M□3261
3,000
150
07 - 08
120
8.5
41 x 39 x 22
SPECIFICATION FOR APPROVAL
PAGE: 4
REF :
PROD.
MULTILAYER CHIP BEAD
NAME
ABC'S DWG NO.
M□□□□□□□□□L□-□□□
ABC'S ITEM NO.
( 4 ) TYPE DIMENSIONS
φ1.55±0.05
2±0.05
4±0.1
(0.157±0.004) (0.079±0.002) (0.061±0.002)
P±0.1
(0.004)
A±0.1
(0.004)
φ1.55±0.05
4±0.1
2±0.05
(0.157±0.004) (0.079±0.002) (0.061±0.002)
0.23±0.1(0.004)
B±0.1(0.004)
F±0.05
(0.002)
W±0.2
(0.008)
1.75±0.1
(0.069±0.004)
Fig 2.
T max.
B±0.1(0.004)
F±0.05
(0.002)
W±0.2
(0.008)
1.75±0.1
(0.069±0.004)
Fig 1.
P±0.1
(0.004)
T±0.1(0.004)
A±0.1
(0.004)
Unit:m/m
AR-001A
Type
A
B
F
P
T
W
Fig
M□1608
1.05
1.85
3.50
4.0
1.10
8.0
1
M□2029
1.50
2.30
3.50
4.0
1.10
8.0
1
M□3261
1.88
3.50
3.50
4.0
1.27
8.0
2
SPECIFICATION FOR APPROVAL
REF :
PAGE: 5
PROD.
NAME
MULTILAYER CHIP BEAD
ABC'S DWG NO.
M□□□□□□□□□L□-□□□
ABC'S ITEM NO.
Ⅶ﹒DWGING NUMBER EXPRESSION:
M
Reference code
Appendix code 2 : Package
Appendix code 1 : Classification
Tolerance code
Electrical code
Dimension code
Type code
Appendix code 1:Product Classification
L:Lead Free Standard products comply with RoHS' requirements
1 ~ 9:Lead Free Special products comply with RoHS' requirements
Appendix code 2:Package Information
Code
A
B
AR-001A
Inner package
T.B.D.
Inner package Q'TY
Remark
T.B.D.
T / R ( Reel package )
4000
pcs
M□1608
T / R ( Reel package )
4000
pcs
M□2029
T / R ( Reel package )
3000
pcs
M□3261
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