SUTEX MD1811 High speed quad mosfet driver Datasheet

MD1811
High Speed Quad MOSFET Driver
Features
General Description
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The Supertex MD1811 is a high speed, quad MOSFET driver
designed to drive high voltage P and N-channel MOSFETs for
medical ultrasound applications and other applications requiring a
high output current for a capacitive load. The high-speed input stage
of the MD1811 can operate from a 1.2 to 5.0 volt logic interface with an
optimum operating input signal range of 1.8 to 3.3 volts. An adaptive
threshold circuit is used to set the level translator switch threshold
to the average of the input logic 0 and logic 1 levels. The input logic
levels may be ground referenced, even though the driver is putting
out bipolar signals. The level translator uses a proprietary circuit,
which provides DC coupling together with high-speed operation.
6ns rise and fall time
2 A peak output source/sink current
1.2V to 5V input CMOS compatible
5V to 12V total supply voltage
Smart Logic threshold
Low jitter design
Quad matched channels
Drives two P- and two N-channel MOSFETs
Outputs can swing below ground
Low inductance quad flat no-lead package
High-performance thermally-enhanced
The output stage of the MD1811 has separate power connections
enabling the output signal L and H levels to be chosen independently
from the supply voltages used for the majority of the circuit. As an
example, the input logic levels may be 0 and 1.8 volts, the control
logic may be powered by +5 and –5 volts, and the output L and H
levels may be varied anywhere over the range of –5 to +5 volts. The
output stage is capable of peak currents of up to ±2 amps, depending
on the supply voltages used and load capacitance present. The OE
pin serves a dual purpose. First, its logic H level is used to compute
the threshold voltage level for the channel input level translators.
Secondly, when OE is low, the outputs are disabled, with the A & C
output high and the B & D output low. This assists in properly precharging the AC coupling capacitors that may be used in series in the
gate drive circuit of an external PMOS and NMOS transistor pair.
Applications
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Medical ultrasound imaging
Piezoelectric transducer drivers
Nondestructive evaluation
PIN diode driver
Clock driver/buffer
High speed level translator
Typical Application Circuit
+100V
+10V
+10V
1 F
0.22 F
ENAB
+PLS1
#1
3.3V CMOS
Logic Inputs
-PLS1
+PLS2
OE
0.47 F
VDD
10nF
To Piezoelectric
Transducer #1
OUTA
INA
10nF
-100V
OUTB
INB
1 F
Supertex
TC6320
OUTC
INC
+100V
1 F
#2
-PLS2
VH
OUTD
IND
GND
VSS
VL
Supertex MD1811
10nF
To Piezoelectric
Transducer #2
10nF
-100V
Supertex
TC6320
1 F
MD1811
Ordering Information
Package Options
DEVICE
16-Lead QFN
4x4mm body, 1.0mm height (max), 0.65mm pitch
MD1811
MD1811K6-G
θJA
45°C/W (1oz. 4-layer 3x4inch PCB)
-G indicates package is RoHS compliant (‘Green’)
Absolute Maximum Ratings
Product Marking
Parameter
Value
VDD-VSS, Logic supply voltage
-0.5V to +13.5V
VH, Output high supply voltage
VL-0.5V to VDD+0.5V
VL, Output low supply voltage
VSS-0.5V to VH+0.5V
VSS, Low side supply voltage
Logic Input levels
1811
YWLL
-7V to +0.5V
16-Lead QFN Package
VSS-0.5V to VSS+7V
Maximum junction temperature
Y = Last Digit of Year Sealed
W = Code for Week Sealed
L = Lot Number
= “Green” Packaging
+125°C
Storage temperature
-65°C to 150°C
Soldering temperature
235°C
Package power dissipation
2.2W
Absolute Maximum Ratings are those values beyond which damage to the
device may occur. Functional operation under these conditions is not implied.
Continuous operation of the device at the absolute rating level may affect device
reliability. All voltages are referenced to device ground.
DC Electrical Characteristics (V
H
Sym.
= VDD = 12V, VL = VSS = GND = 0V, VOE = 3.3V, TJ = 25°C)
Parameter
Min.
Typ.
Max.
Units
Logic supply voltage
4.5
-
13
V
--
VSS
Low side supply voltage
-5.5
-
0
V
--
VH
Output high supply voltage
VSS+2
-
VDD
V
--
VL
Output low supply voltage
VSS
-
VDD-2
V
--
0.8
VDD-VSS
IDDQ
VDD quiescent current
-
IHQ
VH quiescent current
-
IDD
VDD average current
-
IH
VH average current
VIH
mA
10
µA
8.0
-
mA
-
26
-
mA
Input logic voltage high
VOE-0.3
-
5.0
V
VIL
Input logic voltage low
0
-
0.3
V
IIH
Input logic current high
-
-
1.0
µA
IIL
Input logic current low
-
-
1.0
µA
VIH
OE Input logic voltage high
1.2
-
5
V
VIL
OE Input logic voltage low
0
-
0.3
V
RIN
Input logic impedance to GND
12
20
30
KΩ
CIN
Logic input capacitance
-
5.0
10
pF
2
Conditions
No input transitions, OE = 1
One channel on at 5.0Mhz,
No load
For logic inputs
INA, INB, INC, and IND
For logic input OE
--
MD1811
Outputs (V
H
= VDD = 12V, VL = VSS = GND = 0V, VOE = 3.3V, TJ = 25°C)
Sym.
Parameter
Min.
Typ.
Max.
Units
Conditions
RSINK
Output sink resistance
-
-
12.5
Ω
ISINK = 50mA
RSOURCE
Output source resistance
-
-
12.5
Ω
ISOURCE = 50mA
ISINK
Peak output sink current
-
2.0
-
A
--
Peak output source current
-
2.0
-
A
--
ISOURCE
AC Electrical Characteristics (V
H
Sym
Min
Typ
Max
Units
Input or OE rise & fall time
-
-
10
ns
tPLH
Propagation delay when output
is from low to high
-
7.0
-
ns
tPHL
Propagation delay when output
is from high to low
-
7.0
-
ns
tPOE
Propagation delay OE to output
-
9.0
-
ns
tr
Output rise time
-
6.0
-
ns
tf
Output fall time
-
6.0
-
ns
l tr - tf l
Rise and fall time matching
-
1.0
-
ns
l tPLHtPHL l
Propagation low to high and
high to low matching
-
1.0
-
ns
∆tdm
Propagation delay matching
-
±2.0
-
ns
tirf
Parameter
= VDD = 12V, VL = VSS = GND = 0V, VOE = 3.3V, TJ = 25°C)
Conditions
Logic input edge speed requirement
CLOAD = 1000pF, see timing diagram
Input signal rise/fall time 2ns
for each channel
Device to device delay match
Logic Truth Table
Logic Inputs
Output
OE
INA
INB
OUTA
OUTB
H
L
L
VH
VH
H
L
H
VH
VL
H
H
L
VL
VH
H
H
H
VL
VL
L
X
X
VH
VL
OE
INC
IND
OUTC
OUTD
H
L
L
VH
VH
H
L
H
VH
VL
H
H
L
VL
VH
H
H
H
VL
VL
L
X
X
VH
VL
3
MD1811
VTH vs VOE
Timing Diagram and VTH / VOE Curve
VTH
VOE/2
1.8V
IN
2.0
50%
5 0%
1.5
0V
t PLH
tPHL
12V
90 %
1.0
0.6V
9 0%
OUT
0.5
0V
10%
10%
0
tr
tf
0
1.0
2.0
3.0
4.0
5.0
VOE
Application Information
For proper operation of the MD1811, low inductance bypass
capacitors should be used on the various supply pins. The
GND pin should be connected to the logic ground. The INA,
INB INC, IND, and OE pins should be connected to a logic
source with a swing of GND to VLL, where VLL is 1.2 to 5.0 volts.
Good trace practices should be followed corresponding to the
desired operating speed. The internal circuitry of the MD1811
is capable of operating up to 100MHz, with the primary speed
limitation being the loading effects of the load capacitance.
Because of this speed and the high transient currents that
result with capacitive loads, the bypass capacitors should
be as close to the chip pins as possible. Unless the load
specifically requires bipolar drive, the VSS, and VL pins should
have low inductance feed-through connections directly to a
ground plane. If these voltages are not zero, then they need
bypass capacitors in a manner similar to the positive power
supplies. The power connection VDD should have a ceramic
bypass capacitor to the ground plane with short leads and
decoupling components to prevent resonance in the power
leads.
of up to 1.0µF may be appropriate, with a series ferrite bead
to prevent resonance in the power supply lead coming to
the capacitor. Pay particular attention to minimizing trace
lengths, current loop area and using sufficient trace width to
reduce inductance. Surface mount components are highly
recommended. Since the output impedance of this driver is
very low, in some cases it may be desirable to add a small
series resistance in series with the output signal to obtain
better waveform transitions at the load terminals. This will of
course reduce the output voltage slew rate at the terminals
of a capacitive load.
Pay particular attention that parasitic couplings are minimized
from the output to the input signal terminals. The parasitic
feedback may cause oscillations or spurious waveform
shapes on the edges of signal transitions. Since the input
operates with signals down to 1.2V even small coupled
voltages may cause problems. Use of a solid ground plane
and good power and signal layout practices will prevent this
problem. Be careful that a circulating ground return current
from a capacitive load cannot react with common inductance
to cause noise voltages in the input logic circuitry.
The voltages of VH and VL decide the output signal levels.
These two pins can draw fast transient currents of up to
2A, so they should be provided with an appropriate bypass
capacitor located next to the chip pins. A ceramic capacitor
4
MD1811
Simplified Block Diagram
VH
VDD
MD1811
OE
OUTA
INA
OUTB
INB
OUTC
INC
OUTD
IND
VSS
GND
Detailed Block Diagram
VL
V DD
OE
Level
Shifter
INA
Level
Shifter
VH
OUTA
VSS
VL
VH
VDD
INB
OUTB
Level
Shifter
VSS
VL
VH
VDD
INC
OUTC
Level
Shifter
V SS
VL
VH
VDD
IND
Level
Shifter
OUTD
SUB
VSS
GND
5
VL
MD1811
Pin Description
Pin #
Function
1
INB
5
INC
6
IND
15
INA
2
VL
4
Description
Logic input. Input logic high will cause the output to swing to VH. Input logic low will
cause the output to swing to VL. Keep all logic inputs low until IC powered up.
Supply voltage for N-channel output stage.
3
GND
7
VSS
Low side supply voltage. VSS is also connected to the IC substrate. It is required to
connect to the most negative potential of voltage supplies and powered-up first.
8
OUTD
Output driver. Swings from VH to VL. Intended to drive the gate of an externel Nchannel MOSFET via a series capacitor. When OE is low, the output is disabled.
OUTD will swing to VL turning off the external N-channel MOSFET.
9
OUTC
Output driver. Swings from VH to VL. Intended to drive the gate of an externel P-channel
MOSFET via a series capacitor. When OE is low, the output is disabled. OUTC will
swing to VH turning off the external P-channel MOSFET.
12
OUTB
Output driver. Swings from VH to VL. Intended to drive the gate of an externel Nchannel MOSFET via a series capacitor. When OE is low, the output is disabled.
OUTB will swing to VL turning off the external N-channel MOSFET.
13
OUTA
Output driver. Swings from VH to VL. Intended to drive the gate of an externel P-channel
MOSFET via a series capacitor. When OE is low, the output is disabled. OUTA will
swing to VH turning off the external P-channel MOSFET.
10
Logic input ground reference.
VH
Supply voltage for P-channel output stage.
14
VDD
High side supply voltage.
16
OE
Output enable logic input. When OE is high, (VOE+VGND)/2 sets the threshold transition
between logic level high and low. When OE is low, all outputs are at high impedance.
Keep OE low until IC powered up.
11
Substrate
The IC substrate is internally connected to the thermal pad. Thermal Pad and VSS must
be connected externally.
6
MD1811
16-Lead QFN Package Outline (K6)
4x4mm body, 1.00mm height (max), 0.65mm pitch
Note 1
(Index Area
D/2 x E/2)
D2
D
16
16
1
1
e
Note 1
(Index Area
D/2 x E/2)
E
E2
b
View B
Top View
Bottom View
Note 3
θ
L
A
A3
Seating
Plane
L1
Note 2
A1
View B
Side View
Notes:
1. Details of Pin 1 identifier are optional, but must be located within the indicated area. The Pin 1 identifier may be either a mold, or an embedded metal
or marked feature.
2. Depending on the method of manufacturing, a maximum of 0.15mm pullback (L1) may be present.
3. The inner tip of the lead may be either rounded or square.
Symbol
Dimension
(mm)
A
A1
MIN
0.80
0.00
NOM
0.90
0.02
MAX
1.00
0.05
A3
0.20
REF
b
D
D2
E
E2
0.25
3.85
2.40
3.85
2.40
0.30
4.00
-
4.00
-
0.35
4.15
2.80
4.15
2.80
JEDEC Registration MO-220, Variation VGGC-3, Issue K, June 2006.
Drawings not to scale.
Doc.# DSFP - MD1811
NR40907
7
e
0.65
BSC
L
L1
θ
0.30
-
0O
0.40
-
-
0.50
0.15
14O
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