Vishay MFU0805FF06300E100 Thin film chip fus Datasheet

MFU Series
Vishay Beyschlag
Thin Film Chip Fuses
FEATURES
• Advanced thin film technology
• Very quick acting fuse characteristics
• Outstanding stability of fusing characteristics
• Standard SMD sizes
• Green product, supports lead (Pb)-free soldering
• Halogen-free according to IEC 61249-2-21 definition
• Compliant to RoHS directive 2002/95/EC
APPLICATIONS
• Information technology
• Industrial electronics
• Automotive electronics
• Telecommunication
MFU Thin Film Chip Fuses are the perfect choice for the
most fields of modern electronics. The highly controlled
manufacturing thin film process guarantees an outstanding
stability of fusing characteristics. Typical applications include
information technology, telecommunication, medical
equipment, industrial, audio/video, and automotive
electronics.
• Medical equipment
• Audio/video electronics
SIZE
INCH
METRIC
0402
0603
0805
1206
1005M
1608M
2012M
3216M
TECHNICAL SPECIFICATIONS
DESCRIPTION
MFU 0402
MFU 0603
MFU 0805
MFU 1206
1005M
1608M
2012M
3216M
Rated Current range IR
0.5 A to 3.15 A
0.5 A to 5.0 A
0.5 A to 5.0 A
0.5 A to 6.3 A
Rated voltage, Umax. DC
32 V
32 V
32 V
63 V
50 A at 32 V
50 A at 32 V
50 A at 32 V
50 A at 63 V
Voltage drop at 1 x IR
90 mV to 368 mV
85 mV to 361 mV
98 mV to 374 mV
116 mV to 433 mV
Cold resistance at 0.1 x IR
22 mΩ to 560 mΩ
13 mΩ to 550 mΩ
15 mΩ to 570 mΩ
14 mΩ to 660 mΩ
55/125/56
55/125/56
55/125/56
55/125/56
0.7 x IR
0.7 x IR
0.7 x IR
0.7 x IR
E253806
E253806
E253806
E253806
n/a
Refer to table:
MFU 0603 RATING
≤ 0.2 x 10- 9/h
≤ 0.2 x 10- 9/h
Metric size
Breaking Capacity,
Imax. at Umax. DC
Climatic category (LCT/UCT/days)
Permissible continuous
current rating at ϑamb = 23 °C
UL recognition file
Approval
IEC 60127-4
FITobserved
Document Number: 28747
Revision: 06-May-10
Refer to table:
MFU 1206 RATING
≤ 0.2 x 10- 9/h
For technical questions, contact: [email protected]
≤ 0.2 x 10- 9/h
www.vishay.com
1
MFU Series
Thin Film Chip Fuses
Vishay Beyschlag
PART NUMBER AND PRODUCT DESCRIPTION
(1)
PART NUMBER: MFU0603FF01000PW00
M
F
MODEL/SIZE
MFU0402
MFU0603
MFU0805
MFU1206
U
0
6
0
3
F
FUSE CHARACTERISTIC
FF = Very quick acting
F
0
1
0
0
RATED CURRENT VALUE
Rated current value in mA
Examples:
0.5 A = 00500
1.0 A = 01000
6.3 A = 06300
0
P
W
PACKAGING (2)
E1
E5
E0
P1
P5
PW
0
0
SPECIAL
Up to 2 digits
00 = Standard
PRODUCT DESCRIPTION: MFU 0603 -FF PW 1A0
MFU
0603
-FF
PW
1A0
MODEL
SIZE
FUSE CHARACTERISTIC
PACKAGING (2)
MFU
0402
0603
0805
1206
FF = Very quick acting
E1
E5
E0
P1
P5
PW
RATED CURRENT VALUE
Rated current value in mA
Examples:
0.5 A = 0A5
1.0 A = 1A0
6.3 A = 6A3
Notes
(1)
(2)
Products can be ordered using either the PART NUMBER or the PRODUCT DESCRIPTION
Please refer to table PACKAGING
PACKAGING
REEL
MODEL
MFU0402
MFU0603
MFU0805
MFU1206
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2
DIAMETER
PIECES/REEL
CODE
180 mm/7"
1000
E1
180 mm/7"
5000
E5
180 mm/7"
10 000
E0
180 mm/7"
1000
P1
180 mm/7"
5000
P5
330 mm/13"
20 000
PW
180 mm/7"
1000
P1
180 mm/7"
5000
P5
330 mm/13"
20 000
PW
180 mm/7"
1000
P1
180 mm/7"
5000
P5
330 mm/13"
20 000
PW
For technical questions, contact: [email protected]
Document Number: 28747
Revision: 06-May-10
MFU Series
Thin Film Chip Fuses
Vishay Beyschlag
DIMENSIONS
T1
W
WT
H
T2
L
DIMENSIONS - Chip fuse types, mass and relevant physical dimensions
H
(mm)
L
(mm)
W
(mm)
WT
(mm)
T1
(mm)
T2
(mm)
MASS
(mg)
0.32 ± 0.07
1.0 ± 0.05
0.5 ± 0.05
> 75 % of W
0.2 + 0.1/- 0.15
0.2 ± 0.1
0.65
MFU 0603 0.45 + 0.1/- 0.05
1.55 ± 0.05
0.85 ± 0.1
> 75 % of W
0.3 + 0.15/- 0.2
0.3 + 0.15/- 0.2
1.9
MFU 0805 0.45 + 0.1/- 0.05
2.0 ± 0.1
1.25 ± 0.15
> 75 % of W
0.4 + 0.1/- 0.2
0.4 + 0.1/- 0.2
4.7
3.2 + 0.1/- 0.2
1.6 ± 0.15
> 75 % of W
0.5 ± 0.25
0.5 ± 0.25
9.5
TYPE
MFU 0402
MFU 1206
0.55 ± 0.1
SOLDER PAD DIMENSIONS
X
G
Y
Z
RECOMMENDED SOLDER PAD DIMENSIONS
WAVE SOLDERING
TYPE
REFLOW SOLDERING
G
(mm)
Y
(mm)
X
(mm)
Z
(mm)
G
(mm)
Y
(mm)
X
(mm)
Z
(mm)
MFU 0402
-
-
-
-
0.35
0.55
0.55
1.45
MFU 0603
0.55
1.10
1.10
2.75
0.65
0.70
0.95
2.05
MFU 0805
0.80
1.25
1.50
3.30
0.90
0.90
1.40
2.70
MFU 1206
1.40
1.50
1.90
4.40
1.50
1.15
1.75
3.80
Note
• The given solder pad dimensions reflect the considerations for board design and assembly as outlined e.g. in standards IEC 61188-5-x, or in
publication IPC-7351. They do not guarantee any supposed thermal properties, particularly as these are also strongly influenced by many other
parameters.
Document Number: 28747
Revision: 06-May-10
For technical questions, contact: [email protected]
www.vishay.com
3
MFU Series
Thin Film Chip Fuses
Vishay Beyschlag
MFU 0402 RATING - Very quick acting (FF)
SIZE
VOLT.
COLD
(2)
FUSE
RATED
RATED PRE-ARCING
DROP (2) RESIS (2) BREAKING
I2t
CAPACITY MARK. APPROVAL
(1)
CHAR. CURRENT
VOLTAGE
at
at
at 10 x IR
DC
1 x IR
0.1 x IR
500 mA (5)
32 V
0.0009 A2s
368 mV
560 mΩ 50 A at 32 V
-
UL
MFU0402FF00500E500
(5)
32 V
0.0014
A2s
331 mV
400 mΩ 50 A at 32 V
-
UL
MFU0402FF00630E500
750 mA (5)
32 V
0.0020 A2s
275 mV
280 mΩ 50 A at 32 V
-
UL
MFU0402FF00750E500
800 mA
32 V
0.0023
A2s
231 mV
220 mΩ 50 A at 32 V
-
UL
MFU0402FF00800E500
1.0 A
32 V
0.0028 A2s
184 mV
140 mΩ 50 A at 32 V
-
UL
MFU0402FF01000E500
1.25 A
32 V
0.0039 A2s
159 mV
97 mΩ
50 A at 32 V
-
UL
MFU0402FF01250E500
1.5 A
32 V
0.0059
A2s
146 mV
74 mΩ
50 A at 32 V
-
UL
MFU0402FF01500E500
1.6 A
32 V
0.0065 A2s
136 mV
65 mΩ
50 A at 32 V
-
UL
MFU0402FF01600E500
1.75 A
32 V
0.0077 A2s
124 mV
54 mΩ
50 A at 32 V
-
UL
MFU0402FF01750E500
2.0 A
32 V
0.0101
A2s
115 mV
44 mΩ
50 A at 32 V
-
UL
MFU0402FF02000E500
2.5 A
32 V
0.0157 A2s
107 mV
33 mΩ
50 A at 32 V
-
UL
MFU0402FF02500E500
3.0 A
32 V
0.0227
A2s
95 mV
24 mΩ
50 A at 32 V
-
UL
MFU0402FF03000E500
3.15 A
32 V
0.0250 A2s
90 mV
22 mΩ
50 A at 32 V
-
UL
MFU0402FF03150E500
630 mA
0402
FF
PART NUMBER (3)(4)
Notes
(1) Other values of rated current are available on request
(2) Typical values
(3) For packages with 1000 pieces, please use for packaging E1 instead of E5
(4) For packages with 10 000 pieces, please use for packaging E0 instead of E5
(5) Available on request
MFU 0603 RATING - Very quick acting (FF)
FUSE
RATED
RATED
SIZE CHAR. CURRENT (6) VOLTAGE
0603
FF
PRE-ARCING (7) VOLT.(7) COLD(7) BREAKING
DROP
RESIS
CAPACITY MARK. APPROVAL
I2t
at
at
DC
at 10 x IR
1 x IR
0.1 x IR
PART NUMBER (8)(9)
500 mA
32 V
0.0009 A2s
361 mV
550 mΩ 50 A at 32 V
F
UL/IEC
MFU0603FF00500P500
630 mA
32 V
0.0014 A2s
331 mV
400 mΩ 50 A at 32 V
CT
UL
MFU0603FF00630P500
750 mA
32 V
0.0020 A2s
258 mV
262 mΩ 50 A at 32 V
G
UL
MFU0603FF00750P500
800 mA
32 V
0.0023
A2s
249 mV
237 mΩ 50 A at 32 V
CV
UL
MFU0603FF00800P500
1.0 A
32 V
0.0028 A2s
223 mV
170 mΩ 50 A at 32 V
H
UL/IEC
MFU0603FF01000P500
1.25 A
32 V
0.0039 A2s
180 mV
110 mΩ 50 A at 32 V
J
UL
MFU0603FF01250P500
1.5 A
32 V
0.0059
A2s
155 mV
79 mΩ
50 A at 32 V
K
UL
MFU0603FF01500P500
1.6 A
32 V
0.0065 A2s
159 mV
76 mΩ
50 A at 32 V
EF
UL/IEC
MFU0603FF01600P500
1.75 A
32 V
0.0077
A2s
138 mV
60 mΩ
50 A at 32 V
L
UL
MFU0603FF01750P500
2.0 A
32 V
0.0101 A2s
150 mV
57 mΩ
50 A at 32 V
N
UL/IEC
MFU0603FF02000P500
2.5 A
32 V
0.0157 A2s
121 mV
37 mΩ
50 A at 32 V
O
UL
MFU0603FF02500P500
A2s
3.0 A
32 V
0.0227
126 mV
32 mΩ
50 A at 32 V
P
UL
MFU0603FF03000P500
3.15 A
32 V
0.0250 A2s
120 mV
29 mΩ
50 A at 32 V
EL
UL/IEC
MFU0603FF03150P500
3.5 A
32 V
0.0308 A2s
106 mV
23 mΩ
50 A at 32 V
R
UL
MFU0603FF03500P500
4.0 A
32 V
0.0403
A2s
100 mV
19 mΩ
50 A at 32 V
S
UL
MFU0603FF04000P500
5.0 A
32 V
0.2275 A2s
85 mV
13 mΩ
50 A at 32 V
T
UL
MFU0603FF05000P500
Notes
Other values of rated current are available on request
Typical values
For packages with 1000 pieces, please use for packaging P1 instead of P5
For packages with 20 000 pieces, please use for packaging PW instead of P5
(6)
(7)
(8)
(9)
www.vishay.com
4
For technical questions, contact: [email protected]
Document Number: 28747
Revision: 06-May-10
MFU Series
Thin Film Chip Fuses
Vishay Beyschlag
MFU 0805 RATING - Very quick acting (FF)
SIZE
VOLT.
COLD
(2)
FUSE
RATED
RATED PRE-ARCING
DROP (2) RESIS (2) BREAKING
I2t
CAPACITY MARK. APPROVAL
(1)
CHAR. CURRENT
VOLTAGE
at
at
at 10 x IR
DC
1 x IR
0.1 x IR
32 V
0.0009 A2s
374 mV
570 mΩ 50 A at 32 V
F
630 mA
32 V
0.0014
A2s
347 mV
420 mΩ 50 A at 32 V
750 mA
32 V
0.0021 A2s
280 mV
285 mΩ 50 A at 32 V
800 mA
32 V
0.0023
A2s
262 mV
250 mΩ 50 A at 32 V
1.0 A
32 V
0.0028 A2s
243 mV
185 mΩ 50 A at 32 V
1.25 A
32 V
0.0040 A2s
205 mV
125 mΩ 50 A at 32 V
1.5 A
32 V
0.0059
A2s
171 mV
87 mΩ
1.6 A
32 V
0.0065 A2s
164 mV
78 mΩ
1.75 A
32 V
0.0077 A2s
161 mV
2.0 A
32 V
0.0101
A2s
2.5 A
32 V
0.0157 A2s
500 mA
0805
FF
PART NUMBER (3)(4)
UL
MFU0805FF00500P500
CT
UL
MFU0805FF00630P500
G
UL
MFU0805FF00750P500
CV
UL
MFU0805FF00800P500
H
UL
MFU0805FF01000P500
J
UL
MFU0805FF01250P500
50 A at 32 V
K
UL
MFU0805FF01500P500
50 A at 32 V
EF
UL
MFU0805FF01600P500
70 mΩ
50 A at 32 V
L
UL
MFU0805FF01750P500
176 mV
67 mΩ
50 A at 32 V
N
UL
MFU0805FF02000P500
131 mV
40 mΩ
50 A at 32 V
O
UL
MFU0805FF02500P500
A2s
3.0 A
32 V
0.0227
134 mV
34 mΩ
50 A at 32 V
P
UL
MFU0805FF03000P500
3.15 A
32 V
0.0250 A2s
128 mV
31 mΩ
50 A at 32 V
EL
UL
MFU0805FF03150P500
3.5 A
32 V
0.0308 A2s
119 mV
26 mΩ
50 A at 32 V
R
UL
MFU0805FF03500P500
4.0 A
32 V
0.0403
A2s
105 mV
20 mΩ
50 A at 32 V
S
UL
MFU0805FF04000P500
5.0 A
32 V
0.2275 A2s
98 mV
15 mΩ
50 A at 32 V
T
UL
MFU0805FF05000P500
MFU 1206 RATING - Very quick acting (FF)
SIZE
1206
VOLT.
COLD
(2)
FUSE
RATED
RATED PRE-ARCING
DROP (2) RESIS (2) BREAKING
I2t
CAPACITY MARK. APPROVAL
(1)
CHAR. CURRENT
VOLTAGE
at
at
DC
at 10 x IR
1 x IR
0.1 x IR
FF
500 mA
630 mA
750 mA
800 mA
1.0 A
1.25 A
1.5 A
1.6 A
1.75 A
2.0 A
2.5 A
3.0 A
3.15 A
3.5 A
4.0 A
5.0 A
6.3 A
63 V
63 V
63 V
63 V
63 V
63 V
63 V
63 V
63 V
63 V
63 V
63 V
63 V
63 V
63 V
63 V
63 V
0.0009 A2s
0.0014 A2s
0.0022 A2s
0.0023 A2s
0.0028 A2s
0.0041 A2s
0.0059 A2s
0.0066 A2s
0.0077 A2s
0.0102 A2s
0.0159 A2s
0.0229 A2s
0.0251 A2s
0.0310 A2s
0.0404 A2s
0.2275 A2s
0.5160 A2s
433 mV
372 mV
325 mV
273 mV
262 mV
230 mV
207 mV
168 mV
174 mV
181 mV
161 mV
173 mV
153 mV
161 mV
147 mV
131 mV
116 mV
660 mΩ
450 mΩ
330 mΩ
260 mΩ
200 mΩ
140 mΩ
105 mΩ
80 mΩ
76 mΩ
69 mΩ
49 mΩ
44 mΩ
37 mΩ
35 mΩ
28 mΩ
20 mΩ
14 mΩ
50 A at 63 V
50 A at 63 V
50 A at 63 V
50 A at 63 V
50 A at 63 V
50 A at 63 V
50 A at 63 V
50 A at 63 V
50 A at 63 V
50 A at 63 V
50 A at 63 V
50 A at 63 V
50 A at 63 V
50 A at 63 V
50 A at 63 V
50 A at 63 V
50 A at 63 V
F
CT
G
CV
H
J
K
EF
L
N
O
P
EL
R
S
T
ET
UL/IEC
UL
UL
UL
UL/IEC
UL
UL
UL/IEC
UL
UL/IEC
UL
UL
UL/IEC
UL
UL
UL
UL
PART NUMBER (3)(4)
MFU1206FF00500P500
MFU1206FF00630P500
MFU1206FF00750P500
MFU1206FF00800P500
MFU1206FF01000P500
MFU1206FF01250P500
MFU1206FF01500P500
MFU1206FF01600P500
MFU1206FF01750P500
MFU1206FF02000P500
MFU1206FF02500P500
MFU1206FF03000P500
MFU1206FF03150P500
MFU1206FF03500P500
MFU1206FF04000P500
MFU1206FF05000P500
MFU1206FF06300P500
Notes
(1) Other values of rated current are available on request
(2) Typical values
(3) For packages with 1000 pieces, please use for packaging P1 instead of P5
(4) For packages with 20 000 pieces, please use for packaging PW instead of P5
Document Number: 28747
Revision: 06-May-10
For technical questions, contact: [email protected]
www.vishay.com
5
MFU Series
Thin Film Chip Fuses
Vishay Beyschlag
DESCRIPTION
ASSEMBLY
Production is strictly controlled and follows an extensive
set of instructions established for reproducibility. A
homogeneous film of metal alloy is deposited on a high
grade ceramic body. The fuse elements are covered by a
protective coating designed for electrical, mechanical and
climatic protection. The terminations receive a final pure tin
on nickel plating.
The fuses are suitable for processing on automatic SMD
assembly systems. They are suitable for automatic
soldering using wave, reflow or vapour phase. The
encapsulation is resistant to all cleaning solvents commonly
used in the electronics industry, including alcohols, esters
and aqueous solutions. The fuses are RoHS compliant, the
pure tin plating provides compatibility with lead (Pb)-free
and lead-containing soldering processes. The immunity of
the plating against tin whisker growth has been proven
under extensive testing. Solderability is specified for 2 years
after production or re-qualification. The permitted storage
time is 20 years.
The result of the determined production is verified by an
extensive testing procedure performed on 100 % of the
individual fuses. Only accepted products are laid directly
into the paper tape in accordance with IEC 60286-3.
APPROVALS
The fuses are tested in accordance with IEC 60127-4 and
UL 248-14 which refers to UL 248-1, IEC 60127-1 and
IEC 60068 series. Approval of conformity is indicated by the
UMF logo on the package label. Recognition by Underwriter
Laboratories Inc. is indicated by the UL logo on the package
label.
e3
All products comply with the CEFIC-EECA-EICTA list of legal
restrictions on hazardous substances.
This includes full compliance with the following directives:
• 2000/53/EC End of Vehicle life Directive (ELV) and
Annex II (ELV II)
• 2002/95/EC Restriction of the
Substances Directive (RoHS)
use
of
Hazardous
• 2002/96/EC Waste Electrical and Electronic Equipment
Directive (WEEE)
Lead (Pb)-free Identification
on the Package Label
FUNCTIONAL PERFORMANCE
120
MFU Series
110
100
Current Rating Factor [%]
90
80
70
60
50
40
30
20
10
0
- 60
- 45
- 30
- 15
0
15
30
45
60
75
90
Ambient Temperature ϑamb [°C]
105
120
135
150
Current Rating Factor (1) vs. Ambient Temperature ϑamb
Note
(1) Current rating factor is in addition to the given permissible continuous current rating of 0.7
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6
For technical questions, contact: [email protected]
Document Number: 28747
Revision: 06-May-10
MFU Series
Thin Film Chip Fuses
Vishay Beyschlag
FUNCTIONAL PERFORMANCE
104
MFU 0402-FF
3.15 A
3.00 A
2.50 A
2.00 A
1.75 A
1.60 A
1.50 A
1.25 A
1.00 A
0.80 A
0.75 A
0.63 A
0.50 A
103
Pre-arc Time tpre-arc [s]
102
101
100
10-1
10-2
10-3
10-4
0.1
1
10
100
Current I [A]
Typical tpre-arc vs. I characteristic of MFU 0402 (1)
104
MFU 0402-FF
103
Joule Integral l2t [A2S]
102
101
3.15 A
3.00 A
2.50 A
2.00 A
1.75 A
1.60 A
1.50 A
1.25 A
1.00 A
0.80 A
0.75 A
0.63 A
0.50 A
100
10-1
10-2
10-3
10-4
10-5
10-4
10-3
10-2
10-1
Pre-arc Time tpre-arc [s]
100
101
102
Typical I2t vs. tpre-arc characteristic of MFU 0402 (1)
Note
(1) Fuses mounted on a test board according to IEC 60127-4
Document Number: 28747
Revision: 06-May-10
For technical questions, contact: [email protected]
www.vishay.com
7
MFU Series
Thin Film Chip Fuses
Vishay Beyschlag
FUNCTIONAL PERFORMANCE
104
MFU 0603-FF
103
Pre-arc Time tpre-arc [s]
102
5.00 A
4.00 A
3.50 A
3.15 A
3.00 A
2.50 A
2.00 A
1.75 A
1.60 A
1.50 A
1.25 A
1.00 A
0.80 A
0.75 A
0.63 A
0.50 A
101
100
10-1
10-2
10-3
10-4
0.1
1
10
100
Current I [A]
Typical tpre-arc vs. I characteristic of MFU 0603 (1)
104
MFU 0603-FF
103
Joule Integral l2t [A2S]
102
101
5.00 A
4.00 A
3.50 A
3.15 A
3.00 A
2.50 A
2.00 A
1.75 A
1.60 A
1.50 A
1.25 A
1.00 A
0.80 A
0.75 A
0.63 A
0.50 A
100
10-1
10-2
10-3
10-4
10-5
10-4
10-3
10-2
10-1
Pre-arc Time tpre-arc [s]
100
101
102
Typical I2t vs. tpre-arc characteristic of MFU 0603 (1)
Note
(1) Fuses mounted on a test board according to IEC 60127-4
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For technical questions, contact: [email protected]
Document Number: 28747
Revision: 06-May-10
MFU Series
Thin Film Chip Fuses
Vishay Beyschlag
FUNCTIONAL PERFORMANCE
104
MFU 0805-FF
103
Pre-arc Time tpre-arc [s]
102
5.00 A
4.00 A
3.50 A
3.15 A
3.00 A
2.50 A
2.00 A
1.75 A
1.60 A
1.50 A
1.25 A
1.00 A
0.80 A
0.75 A
0.63 A
0.50 A
101
100
10-1
10-2
10-3
10-4
0.1
1
10
100
Current I [A]
Typical tpre-arc vs. I characteristic of MFU 0805 (1)
104
MFU 0805-FF
103
Joule Integral l2t [A2S]
102
101
5.00 A
4.00 A
3.50 A
3.15 A
3.00 A
2.50 A
2.00 A
1.75 A
1.60 A
1.50 A
1.25 A
1.00 A
0.80 A
0.75 A
0.63 A
0.50 A
100
10-1
10-2
10-3
10-4
10-5
10-4
10-3
10-2
10-1
Pre-arc Time tpre-arc [s]
100
101
102
Typical I2t vs. tpre-arc characteristic of MFU 0805 (1)
Note
(1) Fuses mounted on a test board according to IEC 60127-4
Document Number: 28747
Revision: 06-May-10
For technical questions, contact: [email protected]
www.vishay.com
9
MFU Series
Thin Film Chip Fuses
Vishay Beyschlag
FUNCTIONAL PERFORMANCE
104
MFU 1206-FF
103
Pre-arc Time tpre-arc [s]
102
6.30 A
5.00 A
4.00 A
3.50 A
3.15 A
3.00 A
2.50 A
2.00 A
1.75 A
1.60 A
1.50 A
1.25 A
1.00 A
0.80 A
0.75 A
0.63 A
0.50 A
101
100
10-1
10-2
10-3
10-4
0.1
1
10
100
Current I [A]
Typical tpre-arc vs. I characteristic of MFU 1206 (1)
104
MFU 1206-FF
103
Joule Integral l2t [A2S]
102
101
6.30 A
5.00 A
4.00 A
3.50 A
3.15 A
3.00 A
2.50 A
2.00 A
1.75 A
1.60 A
1.50 A
1.25 A
1.00 A
0.80 A
0.75 A
0.63 A
0.50 A
100
10-1
10-2
10-3
10-4
10-5
10-4
10-3
10-2
10-1
Pre-arc Time tpre-arc [s]
100
101
102
Typical I2t vs. tpre-arc characteristic of MFU 1206 (1)
Note
(1) Fuses mounted on a test board according to IEC 60127-4
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10
For technical questions, contact: [email protected]
Document Number: 28747
Revision: 06-May-10
MFU Series
Thin Film Chip Fuses
Vishay Beyschlag
TEST AND REQUIREMENTS
All tests are carried out in accordance with the following
specifications:
Unless otherwise specified the following values apply:
Temperature: 15 °C to 35 °C
IEC 60127-1, Miniature fuse - Part 1: Definitions for miniature
fuses and general requirements for miniature fuse-links
Relative humidity: 45 % to 75 %
IEC 60127-4, Universal Modular Fuse Links (UMF)
Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar).
UL 248-1, Low voltage fuses - Part 1: General requirements
The components are mounted for testing on printed-circuit
boards in accordance with IEC 60127-4, unless otherwise
specified.
UL 248-14, Low voltage fuses - Part 14: Supplemental fuses
For the full test schedule refer to the documents listed above.
The testing also covers most of the requirements specified
by METI and CCC.
The tests are carried out in accordance with IEC 60068 and
under standard atmospheric conditions in accordance with
IEC 60068-1, 5.3. Climatic category LCT/UCT/56 (rated
temperature range: Lower category temperature, upper
category temperature; damp heat, long term, 56 days) is
valid.
The requirements stated in the Test Procedures and
Requirements table are based on the required tests and
permitted limits of IEC 60127-1 and IEC 60127-4
respectively. However, some additional tests and a number
of improvements against those minimum requirements have
been included.
TEST PROCEDURES AND REQUIREMENTS
IEC
60127-4
CLAUSE
8.3.2
8.6.2
8.7.2
IEC
60068-2
TEST
METHOD
TEST
PROCEDURE
REQUIREMENTS
PERMISSIBLE CHANGE
21 (Ue1)
Substrate
bending
Depth 1 mm;
rate 1 mm/s
1 times
No visible damage
ΔR/R ≤ ± 10 %
Solder bath method; SnPb40;
non-activated flux;
(215 ± 3) °C; (3 ± 0.3) s
Good tinning (≥ 95 % covered);
no visible damage
Solder bath method; SnAg3Cu0.5 or SnAg3.5;
non-activated flux;
(245 ± 3) °C; (2 ± 0.2) s
Good tinning (≥ 95 % covered);
no visible damage
Solder bath method;
(260 ± 5) °C; (10 ± 1) s
No visible damage
ΔR/R ≤ ± 10 %
Reflow method 2
(IR/forced gas convection);
(260 ± 5) °C; (10 ± 1) s
No visible damage
ΔR/R ≤ ± 10 %
58 (Td)
58 (Td)
Solderability
Resistance to
soldering heat
MFU 0402
9.2.1
-
Time/current
characteristics
at nominal
temperature
Cold resistance at 0.1 x IR;
destructive testing under MFU 0402
overcurrent conditions
MFU 0603
(DC-Current)
MFU 0805
MFU 1206
IR ≤ 0.75 A
At 1.25 x IR, tpre-arc > 1 h
at 2.0 x IR, tpre-arc < 60 s
at 10 x IR, tpre-arc < 0.001 s
0.8 A ≤ IR ≤ 3.15 A
IR ≤ 5.0 A
IR ≤ 5.0 A
At 1.25 x IR, tpre-arc > 1 h
at 2.0 x IR, tpre-arc < 5 s
at 10 x IR, tpre-arc < 0.001 s
IR ≤ 6.3 A
9.3.2
-
Breaking
capacity
50 A at rated voltage
acc. to UL 248-14
Optical inspection with naked eye
no visible damage
9.3.3
-
Residual
resistance
50 A at rated voltage
acc. to UL 248-14
Insulation resistance
at 2.0 x UR (DC)
higher than 0.1 MΩ
Document Number: 28747
Revision: 06-May-10
For technical questions, contact: [email protected]
www.vishay.com
11
MFU Series
Thin Film Chip Fuses
Vishay Beyschlag
TEST PROCEDURES AND REQUIREMENTS
IEC
60127-4
CLAUSE
IEC
60068-2
TEST
METHOD
9.4
-
9.5
-
9.7
-
-
-
-
-
78 (Cab)
14 (Na)
TEST
Endurance test
acc. to
IEC 60127-1
Maximum
sustained
dissipation acc. to
IEC 60127-1
Fuse-link
temperature
Verification of
temp.-rise and
current- carrying
capacity acc. to
UL 248-14
clause 8.2.3
REQUIREMENTS
PERMISSIBLE CHANGE
PROCEDURE
a) I = 1.0 x IR (DC)
1.0 h on; 0.25 h off;
23 °C; 100 times
MFU 0402
IR ≤ 3.15 A
MFU 0603
IR ≤ 3.15 A
b) I = 1.25 x IR (DC)
1.0 h on
23 °C; 1 time
MFU 0805
IR ≤ 3.15 A
MFU 1206
IR ≤ 3.15 A
Calculation in accordance with results of clause 9.4 b)
The test is performed
during the final 5 min of
clause 9.4 b)
MFU 0402
IR ≤ 3.15 A
MFU 0603
IR ≤ 3.15 A
MFU 0805
IR ≤ 3.15 A
MFU 1206
IR ≤ 3.15 A
MFU 0402
IR ≤ 3.15 A
MFU 0603
IR ≤ 5.0 A
MFU 0805
IR ≤ 5.0 A
MFU 1206
IR ≤ 6.3 A
I = 1.0 x IR (DC)
No visible damage
ΔR/R ≤ ± 10 %
Dissipation ≤ acc. to
IEC 60127-4 table 2
Temperature rise of terminals
≤ 85 K
Temperature rise
of hot spot
≤ 75 K
acc. to
UL 248-14 clause 8.2.4
Damp heat,
steady state
(40 ± 2) °C; 56 days;
(93 ± 3) % RH
ΔR/R ≤ ± 10 %
I-t characteristic
Rapid change
of temperature
30 min at LCT;
30 min at UCT;
LCT = - 55 °C;
UCT = 125 °C;
5 cycles
ΔR/R ≤ ± 10 %
ΔR/R ≤ ± 10 %
-
6 (Fc)
Vibration
Endurance by sweeping;
10 Hz to 2000 Hz;
no resonance;
amplitude ≤ 1.5 mm or
≤ 200 m/s2; 6 h
-
45 (XA)
Component
solvent
resistance
Isopropyl alcohol;
50 °C; method 2
No visible damage
-
45 (XA)
Solvent
resistance
of marking
Isopropyl alcohol;
50 °C; method 1, toothbrush
Marking legible,
no visible damage
-
21 (Ue3)
Shear
(adhesion)
-
-
Flammability
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RR 1608M; 9 N
RR 2012M and RR 3216M; 45 N
IEC 60695-2-2,
needle flame test; 10 s
For technical questions, contact: [email protected]
No visible damage
No burning after 30 s
Document Number: 28747
Revision: 06-May-10
Legal Disclaimer Notice
Vishay
Disclaimer
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,
“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
disclosure relating to any product.
Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or
the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all
liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,
consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular
purpose, non-infringement and merchantability.
Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of typical
requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements
about the suitability of products for a particular application. It is the customer’s responsibility to validate that a particular
product with the properties described in the product specification is suitable for use in a particular application. Parameters
provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All
operating parameters, including typical parameters, must be validated for each customer application by the customer’s
technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase,
including but not limited to the warranty expressed therein.
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining
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Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk and agree
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No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by
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Document Number: 91000
Revision: 11-Mar-11
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1