MICREL MIC2013

MIC2003/2013
Current Limiting Circuit Protector
General Description
Features
MIC2003 and MIC2013 are high-side current limiting
devices, designed for power distribution applications in
PCs, PDAs, printers and peripheral devices.
MIC2003 and MIC2013 are thermally protected and will
shutdown should their internal temperature reach unsafe
levels, protecting both the device and the load, under
high current or fault conditions. Both devices are fully
self-contained, with the current limit value being factory
set to one of several convenient levels.
• 70mΩ typical on-resistance
• 2.5V - 5.5V operating range
• Pre-set current limit values of 0.5A, 0.8A and 1.2A
MIC2013 offers a unique new feature: Kickstart™,
which allows momentary high current surges to pass
unrestricted without sacrificing overall system safety.
MIC2003 and MIC2013 are excellent choices for USB
and IEEE 1394 (FireWire) applications or for any system
where current limiting and power control are desired.
The MIC2003 and MIC2013 are offered in space saving
6 pin SOT-23 and 2mm x 2mm MLF packages.
Data sheets and support documentation can be found
on Micrel’s web site at www.micrel.com.
•
•
•
•
Kickstart™
Thermal Protection
Under voltage lock-out
Low quiescent current
Applications
•
•
•
•
•
•
•
•
USB / IEEE 1394 Power Distribution
Desktop and Laptop PCs
Set top boxes
Game consoles
PDAs
Printers
Docking stations
Chargers
_________________________________________________________________________________________________________
Typical Application
Figure 1. Typical Application Circuit
Kickstart is a trademark of Micrel, Inc
MLF and MicroLeadFrame are trademarks of Amkor Technology, Inc.
Micrel Inc. • 2180 Fortune Drive • San Jose, CA 95131 • USA • tel +1 (408) 944-0800 • fax + 1 (408) 474-1000 • http://www.micrel.com
October 2005
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MIC2003/MIC20013
MIC2000 Family Members
Part Number
Pin Function
Enable
CSLEW
FAULT/
DLM*
--
--
--
--
--
Load
Discharge
--
--
▲
--
--
--
▲
--
▲
▲
▲
--
--
▲
--
▲
--
▲
--
--
▲
▲
--
--
--
--
▲
--
--
Kickstart
2003
2013
2004
2014
2005
2015
2006
2016
--
▲
2007
2017
▲
▲
2008
2018
▲
▲
2009
2019
▲
▲
* Dynamic Load Management
I Limit
I Adj.
Normal Limiting
Fixed
Adj.
Adj = Adjustable current limit
Fixed = Factory programmed current limit
Ordering Information
Part Number
Marking(1)
Current Limit
MIC2003-0.5YM5
FD05
0.5A
MIC2003-0.8YM5
FD08
0.8A
MIC2003-1.2YM5
FD12
1.2A
MIC2003-0.5YML
D05
0.5A
MIC2003-0.8YML
D08
0.8A
MIC2003-1.2YML
D12
1.2A
MIC2013-0.5YM5
FL05
0.5A
MIC2013-0.8YM5
FL08
0.8A
MIC2013-1.2YM5
FL12
1.2A
MIC2013-0.5YML
L05
0.5A
MIC2013-0.8YML
L09
0.8A
MIC2013-1.2YML
L12
1.2A
Kickstart
Pb-Free
Package
SOT-23-5
No
Yes
2mmX2mm MLF
SOT-23-5
Yes
2mmX2mm MLF
Note:
1. Under-bar symbol ( _ ) may not be to scale
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MIC2003/MIC20013
Pin Configuration
GND
6 VIN
VOUT 1
PAD ON
BACKSIDE
IS GROUND
NIC 2
NIC 3
NIC
3
2
VIN
1
5 GND
4
NIC
4 NIC
5
VOUT
SOT 23-5 (M5)
Top View
6-Lead 2mmX2mm MLF (ML)
Top View
Pin Description
Pin
Number
SOT-23
Pin
Number
MLF
Pin
Name
1
6
VIN
Input
2
5
GND
--
Ground.
3
4
NIC
--
No internal connection. An electrical signal to this pin will have no effect on
device operation.
4
3
NIC
--
No internal connection. An electrical signal to this pin will have no effect on
device operation.
2
NIC
--
No internal connection. An electrical signal to this pin will have no effect on
device operation.
1
VOUT
Output
Switch output. The load being driven by MIC2003/2013 is connected to this
pin.
5
October 2005
Type
Description
Supply input. This pin provides power to both the output switch and the
MIC2003/2013’s internal control circuitry.
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MIC2003/MIC20013
Absolute Maximum Ratings(1)
Operating Ratings(2)
VIN, VOUT ............................................................ –0.3 to 6V
All other pins .................................................. –0.3 to 5.5V
Power Dissipation.................................. Internally Limited
Continuous Output Current..................................... 2.25A
Maximum Junction Temperature ........................... 150°C
Storage Temperature .............................. –65°C to 150°C
Supply Voltage............................................. 2.5V to 5.5V
Continuous Output Current Range .................... 0 to 2.1A
Ambient Temperature Range .................... –40°C to 85°C
Package Thermal Resistance (θJA)
SOT-23-5 .............................................
MLF 2x2 mm(5) .........................................
230°C/W
90°C/W
Electrical Characteristics
VIN = 5V, TAMBIENT = 25°C unless specified otherwise. Bold indicates –40°C to +85°C limits.
Symbol
Parameter
VIN
Switch Input Voltage
IIN
Internal Supply Current
IIN
Internal Supply Current
Conditions
Min
Typ
Max
Units
5.5
V
1
5
µA
80
300
µA
2.5
Switch = OFF,
ENABLE = 0V
Switch = ON, IOUT = 0
ENABLE = 1.5V
ILEAK
Output Leakage Current
VIN = 5V, VOUT = 0 V, ENABLE
=0
12
100
µA
RDS(ON)
Power Switch Resistance
VIN = 5V, IOUT = 100 mA
70
100
mΩ
125
mΩ
ILIMIT
Current Limit: –0.5
VOUT = 0.8VIN to VOUT = 1V
0.5
0.7
0.9
A
ILIMIT
Current Limit: –0.8
VOUT = 0.8VIN to VOUT = 1V
0.8
1.1
1.5
A
ILIMIT
Current Limit: –1.2
VOUT = 0.8VIN, to VOUT = 1V
1.2
1.6
2.1
A
ILIMIT_2nd
Secondary current limit
(Kickstart)
MIC2013, VIN = 2.7V
2.2
4
6
A
OTTHRESHOLD
Over-temperature Threshold
TJ increasing
145
TJ decreasing
135
October 2005
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MIC2003/MIC20013
AC Characteristics
Symbol
Parameter
Condition
Min
Typ
Max
Units
tLIMIT
Delay before current limiting
Secondary current limit
77
128
192
ms
tRESET
Delay before resetting
Kickstart current limit delay,
tLIMIT
Out of current limit following a
current limit.
77
128
192
ms
Symbol
Parameter
Condition
Min
Typ
Max
Units
VESD_HB
Electro Static Discharge
Voltage: Human Body Model
VOUT and GND
±4
±2
kV
± 200
V
(MIC2013)
(MIC2013)
ESD
VESD_MCHN
Electro Static Discharge
Voltage; Machine Model
All other pins
All pins
kV
Machine Model
Notes:
1. Exceeding the absolute maximum rating may damage the device.
2. The device is not guaranteed to function outside its operating rating.
3. Devices are ESD sensitive. Handling precautions recommended. Human body model, 1.5k in series with 100pF.
4. Specification for packaged product only.
5. Requires proper thermal mounting to achieve this performance.
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Timing Diagrams
ENABLE
50%
50%
tON_DLY
tOFF_DLY
90%
VOUT
10%
Switching Delay Times
tFALL
tRISE
90%
90%
10%
10%
Rise and Fall Times
tRISE
90%
VOUT
10%
Output Rise Time
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Typical Characteristics
Supply Current
Output Enabled
1.00
0.90
25°C
85°C
60
40
20
3
4
VIN (V)
5
3
4
5
VIN (V)
6
0.40
0.30
0.20
0.10
0
-50 -30 -10 10 30 50 70
TEMPERATURE (°C)
7
1.65
1.60
ILIMIT (A)
247.0
246.5
246.0
1.45
1.2
IN
VIN = 3V
V = 5V
IN
1.40
0.5A
0.6
1.2A
0.2
1.25
-50 -30 -10 10 30 50 70
TEMPERATURE (°C)
90
0.8
0.4
1.30
245.0
-50 -30 -10 10 30 50 70
TEMPERATURE (°C)
0.8A
1.0
1.35
245.5
Temperature
1.4
V = 2.5V
1.50
0
-50 -30 -10 10 30 50 70
TEMPERATURE (°C)
90
ILIMIT vs. Temperature
ILIMIT vs. Temperature
RON vs.
(MIC20xx - 0.8)
(MIC20xx - 0.5)
Supply Voltage
0.75
0.73
1.20
ILIMIT (A)
1.00
0.80
0.60
0.40
5V
Note:
0.20
3V
Please note that the 3
2.5V plots overlay each
0.00
-50 -30 -10 10 30 50 70
TEMPERATURE (°C)
90
100
0.65
0.63
0.61
90
80
0.71
0.69
0.67
RON (mOhm)
1.40
90
ILIMIT vs.
vs. Temperature
(MIC20xx-1.2)
1.55
ILIMIT (A)
0.80
0.70
0.60
0.50
LIMIT
247.5
THRESHOLD (mV)
85°C
25°C
I
UVSD Threshold
vs. Temperature
248.0
-40°C
0.10
0
2
6
1.00
0.90
ILIMIT (A)
0
2
0.80
0.70
0.60
0.50
0.40
0.30
0.20
Switch Leakage Current - OFF
(µA)
-40°C
80
SUPPLY CURRENT (µA)
SUPPLY CURRENT (µA)
100
Supply Current
Output Disabled
5V
0.59
3V
0.57
2.5V
0.55
-50 -30 -10 10 30 50 70
TEMPERATURE (°C)
60
40
20
90
0
2
2.5
3
3.5 4 4.5
VIN (V)
5
5.5
RON vs.
120
RON (mOhm)
100
Temperature
3.3V
2.5V
80
60
5V
40
20
0
-50 -30 -10 10 30 50 70
TEMPERATURE (°C)
October 2005
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Functional Characteristics
Kickstart Response
Normal Load with Temporary High Load
Current Limit Response Thermal Shutdown
VIN = 5.0V
RLOAD
CLOAD = 47µF
VOUT
(1V/div)
VOUT
(1V/div)
IOUT
(250mA/div)
IOUT
(0.5A/div)
0
50
100
150
200
250 300
Time (ms)
350
400
450
500
0
550
VOUT
(1V/div)
VOUT
(1V/div)
IOUT
(0.5A/div)
IOUT
(0.5A/div)
50
100
150
200
250 300 350
Time (ms)
400
100
150
200
250 300 350
Time (ms)
400
450
500
550
Kickstart Response
Normal Load with Temporary Short Circuit
Kickstart Response
No Load to Short Circuit
0
50
450
500
550
0
50
100
150
Inrush Current Response
MIC20xx-0.5
200
250 300 350
Time (ms)
400
450
500
550
Turn-On/Turn-Off
VIN = 5.0V
RLOAD
CLOAD = 100nF
0µF
10µF
22µF47µF 100µF
VOUT
(1V/div)
VOUT
(1V/div)
220µF
470µF
IOUT
(200mA/div)
IOUT
(200mA/div)
0
October 2005
4
8
12
16
20
24
Time (ms)
28
32
36
0
40
8
2
4
6
8
Time (ms)
10
12
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UVLO Decreasing
UVLO Increasing
VOUT
(1V/div)
VOUT
(1V/div)
VIN
(1/div)
VIN
(1/div)
0
4
8
12
16
20
24 28
Time (µs)
32
36
40
44
0
48
4
8
12
16
20
24 28
Time (µs)
32
36
40
44
48
UVSD
VOUT
(1V/div)
VIN
(1/div)
0
October 2005
20
40
60
80
100 120
Time (µs)
140
160
180
200
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Functional Diagram
Under
Voltage
Detector
VIN
Curre nt
Mirror FE T
Control Logic
and Delay T imer
Power
FET
Gate Control
VOUT
Thermal
Sensor
Slew Rate
Control
VREF
Curre nt L imit
control Loop
GND
Factory
a dju ste d
Figure 2 MIC2003/2013 Block Diagram
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MIC2003/MIC20013
duration of the Kickstart period. After this time the
MIC2013 reverts to its normal current limit. An example
of Kickstart operation is shown below.
Functional Description
Input and Output
VIN is both the power supply connection for the internal
circuitry driving the switch and the input (Source
connection) of the power MOSFET switch. VOUT is the
Drain connection of the power MOSFET and supplies
power to the load. In a typical circuit, current flows from
VIN to VOUT toward the load. Since the switch is bidirectional when enabled, if VOUT is greater than VIN,
current will flow from VOUT to VIN.
When the switch is disabled, current will not flow to the
load, except for a small unavoidable leakage current of
a few microamps. However, should VOUT exceed VIN by
more than a diode drop (~0.6V), while the switch is
disabled, current will flow from output to input via the
power MOSFET’s body diode. This effect can be used
to advantage when large bypass capacitors are placed
on MIC2003/2013’s’s output. When power to the switch
is removed, the output capacitor will be automatically
discharged.
If discharging CLOAD is required by your application,
consider using MIC2003/2013 or MIC2007/2017 in place
of MIC2003/2013. These MIC2000 family members are
equipped with a discharge FET to insure complete
discharge of CLOAD.
OUT
OUT
Figure 3. Kickstart Operation
Picture Key:
A) MIC2013 is enabled into an excessive load (slew
rate limiting not visible at this time scale) The initial
current surge is limited by either the overall circuit
resistance and power supply compliance, or the
secondary current limit, whichever is less.
B) RON of the power FET increases due to internal
heating (effect exaggerated for emphasis).
C) Kickstart period.
D) Current limiting initiated. FAULT/ goes LOW.
E) VOUT is non-zero (load is heavy, but not a dead short
where VOUT = 0. Limiting response will be the same
for dead shorts).
F) Thermal shutdown followed by thermal cycling.
G) Excessive load released, normal load remains.
MIC2013 drops out of current limiting.
H) FAULT/ delay period followed by FAULT/ going
HIGH.
Current Sensing and Limiting
MIC2003/2013 protects the system power supply and
load from damage by continuously monitoring current
through the on-chip power MOSFET. Load current is
monitored by means of a current mirror in parallel with
the power MOSFET switch. Current limiting is invoked
when the load exceeds an internally set over-current
threshold. When current limiting is activated the output
current is constrained to the limit value, and remains at
this level until either the load/fault is removed, the load’s
current requirement drops below the limiting value, or
the MIC2003/2013 goes into thermal shutdown.
Kickstart (MIC2013 only)
The MIC2013 is designed to allow momentary current
surges (Kickstart) before the onset of current limiting,
which permits dynamic loads, such as small disk drives
or portable printers to draw the energy needed to
overcome inertial loads without sacrificing system
safety. In this respect, the MIC2013 differs markedly
from MIC2003 and its peers, which immediately limit
load current, potentially starving the motor and causing
the appliance to stall or stutter.
During this delay period, typically 128 ms, a secondary
current limit is in effect. If the load demands a current in
excess the secondary limit, MIC2013 acts immediately
to restrict output current to the secondary limit for the
October 2005
Slew Rate Control
Large capacitive loads can create significant current
surges when charged through a high-side switch such
as the MIC2003/2013. For this reason, MIC2003/2013
provides built-in slew rate control to limit the initial inrush
currents upon enabling the power MOSFET switch.
Slew rate control is active upon powering up, and upon
re-enabling the load. At shutdown, the discharge slew
rate is controlled by the external load and output
capacitor.
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MIC2003/2013 will continue cycling between ON and
OFF states until the offending load has been removed.
Depending on PCB layout, package type, ambient
temperature, etc., hundreds of milliseconds may elapse
from the incidence of a fault to the output MOSFET
being shut off. This delay is due to thermal time
constants within the system itself. In no event will the
device be damaged due to thermal overload because
die temperature is monitored continuously by on-chip
circuitry.
Thermal Shutdown
Thermal
shutdown
is
employed
to
protect
MIC2003/2013 from damage should the die temperature
exceed safe operating levels. Thermal shutdown shuts
off the output MOSFET and asserts the FAULT/ output if
the die temperature reaches 145°C.
MIC2003/2013 will automatically resume operation
when the die temperature cools down to 135°C. If
resumed operation results in reheating of the die,
another shutdown cycle will occur and the
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Application Information
ILIMIT vs. IOUT measured
MIC2003/2013’s’s current limiting circuitry is designed to
act as a constant current source to the load. As the load
tries to pull more than the allotted current, VOUT drops
and the input to output voltage differential increases.
When VIN -VOUT exceeds 1V, IOUT drops below ILIMIT to
reduce the drain of fault current on the system’s power
supply and to limit internal heating of MIC2003/2013.
When measuring IOUT it is important to bear this voltage
dependence in mind, otherwise the measurement data
may appear to indicate a problem when none really
exists. This voltage dependence is illustrated in Figures
4 and 5.
In Figure 4 output current is measured as VOUT is pulled
below VIN, with the test terminating when VOUT is 1V
below VIN. Observe that once ILIMIT is reached IOUT
remains constant throughout the remainder of the test.
In Figure 5 this test is repeated but with VIN - VOUT
exceeding 1V.
When VIN - VOUT > 1V, MIC2003/2013’s current limiting
circuitry responds by decreasing IOUT, as can be seen in
Figure 5. In this demonstration, VOUT is being controlled
and IOUT is the measured quantity. In real life
applications VOUT is determined in accordance with
Ohm’s law by the load and the limiting current.
Figure 5. IOUT in Current Limiting for VOUT >1V
NORMALIZED OUTPUT CURRENT (A)
This folding back of ILIMIT can be generalized by plotting
ILIMIT as a function of VOUT, as shown below. The slope
of VOUT between IOUT = 0 and IOUT = ILIMIT (where ILIMIT =
1) is determined by RON of MIC2003/2013 and ILIMIT.
1.2
Normalized Output Current
vs. Output Voltage (5V)
1.0
0.8
0.6
0.4
0.2
0
0
1
2
3
4
5
OUTPUT VOLTAGE (V)
6
Figure 6.
Figure 4. IOUT in Current Limiting for VOUT ≤1V
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NORMALIZED OUTPUT CURRENT (A)
Micrel
1.2
Normalized Output Current
vs. Output Voltage (2.5V)
1.0
0.8
0.6
VOUT
0.4
0.2
0
0
0.5 1.0 1.5 2.0 2.5
OUTPUT VOLTAGE (V)
Kickstart
3.0
Current Limiting
IOUT
Figure 7.
Load Removed
0
Kickstart (MIC2013)
Kickstart allows brief current surges to pass to the load
before the onset of normal current limiting, which
permits dynamic loads to draw bursts of energy without
sacrificing system safety.
Functionally, Kickstart is a forced override of the normal
current limiting function provided by MIC2013. The
Kickstart period is governed by an internal timer which
allows current to pass unimpeded to the load for 128ms
and then normal (primary) current limiting goes into
action.
During Kickstart a secondary current limiting circuit is
monitoring output current to prevent damage to the
MIC2013, as a hard short combined with a robust power
supply can result in currents of many tens of amperes.
This secondary current limit is nominally set at 4 Amps
and reacts immediately and independently of the
Kickstart period. Once the Kickstart timer has finished its
count the primary current limiting circuit takes over and
holds IOUT to its programmed limit for as long as the
excessive load persists.
Once MIC2013 drops out of current limiting the Kickstart
timer initiates a lock-out period of 128ms such that no
further bursts of current above the primary current limit,
will be allowed until the lock-out period has expired.
Kickstart may be over-ridden by the thermal protection
circuit and if sufficient internal heating occurs, Kickstart
will be terminated and IOUT Æ 0. Upon cooling, if the
load is still present IOUT Æ ILIMIT, not IKICKSTART.
100
200
300
Time (ms)
400
500
600
Figure 9. Kickstart
Supply Filtering
A 0.1µF to 1µF bypass capacitor positioned close to the
VIN and GND pins of MIC2003/2013 is both good design
practice and required for proper operation of
MIC2003/2013. This will control supply transients and
ringing. Without a bypass capacitor, large current surges
or an output short may cause sufficient ringing on VIN
(from supply lead inductance) to cause erratic operation
of MIC2003/2013’s control circuitry. Good quality, low
ESR capacitors, such as Panasonic’s TE or ECJ series,
are suggested.
When bypassing with capacitors of 10µF and up, it is
good practice to place a smaller value capacitor in
parallel with the larger to handle the high frequency
components of any line transients. Values in the range
of 0.01µF to 0.1µF are recommended. Again, good
quality, low ESR capacitors should be chosen.
Power Dissipation
Power dissipation depends on several factors such as
the load, PCB layout, ambient temperature, and supply
voltage. Calculation of power dissipation can be
accomplished by the following equation:
PD = R DS(ON) × (IOUT )2
To relate this to junction temperature, the following
equation can be used:
TJ = PD × Rθ (J- A) + TA
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Where: TJ = junction temperature,
When operating at higher current levels or in higher
temperature environments use of Micrel’s MLF
packaging is recommended. MLF packages provide an
exposed power paddle on the back side to which
electrical and thermal contact can be made with the
device. This significantly reduces the package’s thermal
resistance and thus extends the MIC2005/2013’s
operating range.
TA = ambient temperature
Rθ(J-A) is the thermal resistance of the package
In normal operation MIC2003/2013’s Ron is low enough
that no significant I2R heating occurs. Device heating is
most often caused by a short circuit, or very heavy load,
when a significant portion of the input supply voltage
appears across MIC2003/2013’s power MOSFET.
Under these conditions the heat generated will exceed
the package and PCB’s ability to cool the device and
thermal limiting will be invoked.
In Figure 10 die temperature is plotted against IOUT
assuming a constant case temperature of 85°C. The
plots also assume a worst case RON of 140 mΩ at a die
temperature of 135°C. Under these conditions it is clear
that an SOT-23 packaged device will be on the verge of
thermal shutdown, typically 140°C die temperature,
when operating at a load current of 1.25A. For this
reason we recommend using MLF packaged
MIC2003/2013s for any design intending to supply
continuous currents of 1A or more.
2 Vias
0.3 mm diam.
to Ground Plane
1.4 mm
0.8 mm
Figure 11. Pad for thermal mounting to PCB
Die Temperature vs. Iout for Tcase = 85°C
160
Die Temperature - °C
140
120
100
80
60
40
SOT-23
20
MLF
0
0.20 0.40 0.60 0.80 1.00 1.20 1.40 1.60 1.80 2.00
Iout - Amps
Figure 10. Die Temperature vs. IOUT
October 2005
15
M9999-102605
[email protected] or (408) 955-1690
Micrel
MIC2003/MIC20013
Package Information
1.90 (0.075) REF
0.95 (0.037) REF
1.75 (0.069) 3.00 (0.118)
1.50 (0.059) 2.60 (0.102)
DIMENSIONS:
MM (INCH)
1.30 (0.051)
0.90 (0.035)
3.02 (0.119)
2.80 (0.110)
10°
0°
0.50 (0.020)
0.35 (0.014)
0.15 (0.006)
0.00 (0.000)
0.20 (0.008
)
0.09 (0.004
)
0.60 (0.024)
0.10 (0.004)
5-Pin SOT-23 (M5)
6 Pin 2mmX2mm MLF (ML)
MICREL, INC. 2180 FORTUNE DRIVE SAN JOSE, CA 95131 USA
TEL +1 (408) 944-0800 FAX +1 (408) 474-1000 WEB http:/www.micrel.com
The information furnished by Micrel in this data sheet is believed to be accurate and reliable. However, no responsibility is assumed by Micrel for
its use. Micrel reserves the right to change circuitry and specifications at any time without notification to the customer.
Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a
product can reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for
surgical implant into the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant
injury to the user. A Purchaser’s use or sale of Micrel Products for use in life support appliances, devices or systems is a Purchaser’s own risk
and Purchaser agrees to fully indemnify Micrel for any damages resulting from such use or sale.
© 2005 Micrel, Incorporated.
October 2005
16
M9999-102605
[email protected] or (408) 955-1690