MIC5202 Dual 100 mA Low-Dropout Regulator Features General Description • • • • • • • • • • • • The MIC5202 is a dual linear voltage regulator with low dropout voltage (typically 17 mV at light loads and 210 mV at 100 mA), and low ground current (1 mA at 100 mA per output). Ideal for battery-operated applications, the MIC5202 offers 1% output voltage accuracy and dual enable pins. The enable pins may be driven individually or tied directly to VIN. When the part is disabled, power consumption drops to nearly zero. The MIC5202 ground current increases slightly in dropout, which minimizes power consumption and increases battery life. Some key features include reversed battery protection, current-limit, and overtemperature protection. High Output Voltage Accuracy Variety of Output Voltages Up to 100 mA of Continuous Output Current Low Ground Current Low Dropout Voltage Excellent Line and Load Regulations Extremely Low Temperature Coefficient Current and Thermal Limit Protections Reverse-Battery Protection Zero-Off Mode Current Logic-Controlled Electronic Shutdown 8-Pin SOIC Package The MIC5202 is available in fixed output voltages in the small 8-pin SOIC package. Applications • • • • • • • Cell Phones Laptop, Notebook, and Palmtop Computers Battery-Powered Equipment PCMCIA VCC and VPP Regulation/Switching Barcode Scanners SMPS Post-Regulator/DC-to-DC Modules High-Efficiency Linear Power Supplies Typical Application Schematic MIC5202 8-PIN SOIC U1 MIC5202 VOUT1 VOUT2 2016 Microchip Technology Inc. VOUT1 VIN1 GND1 EN1 VOUT2 VIN2 GND2 EN2 EN1 EN2 DS20005614A-page 1 MIC5202 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings † Input Supply Voltage (VIN1, VIN2) ................................................................................................................ –20V to +60V Enable Input Voltage (EN1, EN2)................................................................................................................ –20V to +60V ESD Rating (Note 1)................................................................................................................................... ESD Sensitive Operating Ratings ‡ Input Supply Voltage (VIN1, VIN2) ............................................................................................................... +2.5V to +26V Enable Input Voltage (EN1, EN2)....................................................................................................................... 0V to VIN † Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended periods may affect device reliability. ‡ Notice: The device is not guaranteed to function outside its operating ratings. Note 1: Devices are ESD sensitive. Handling precautions recommended. Human body model, 1.5 kΩ in series with 100 pF. DS20005614A-page 2 2016 Microchip Technology Inc. MIC5202 TABLE 1-1: ELECTRICAL CHARACTERISTICS Electrical Characteristics: VIN = VOUT + 1V, COUT = 10 µF; IOUT = 1 mA; TJ = 25°C, bold values indicate –40°C ≤ TJ ≤ +125°C; unless noted. Specifications are for one LDO. (Note 1). Parameters Min. Typ. Max. –1 — 1 –2 — 2 ∆VOUT/∆T — 40 150 Line Regulation ∆VOUT/ VOUT — 0.004 0.10 — — 0.40 Load Regulation (Note 3) ∆VOUT/ VOUT — 0.04 0.16 — — 0.30 — 17 — IOUT = 100 µA — 130 — IOUT = 20 mA — 150 — — 180 — IOUT = 50 mA — 225 350 IOUT = 100 mA — 0.01 — — 170 — VEN ≥ 2.0V, IOUT = 100 µA — 270 — IOUT = 20 mA — 330 — — 500 — IOUT = 50 mA — 1200 1500 IOUT = 100 mA Output Voltage Accuracy Output Voltage Temperature Coefficient (Note 2) Dropout Voltage (Note 4) Ground Pin Current Shutdown Ground Pin Current (Note 5) Sym. VOUT VIN – VOUT ISHUTDOWN IGND Units Conditions % — ppm/°C — % VIN = VOUT + 1V to 26V % IOUT = 0.1 mA to 100 mA mV µA µA IOUT = 30 mA VEN ≤ 0.7V (shutdown) IOUT = 30 mA Ground Pin Current in Dropout IGNDDO — 270 330 µA VIN = 0.5V less than VOUT, IOUT = 100 µA Power Supply Rejection Ratio PSRR — 75 — dB — Short Circuit Current Limit Thermal Regulation (Note 6) Output Noise Note 1: 2: 3: 4: 5: 6: ILIMIT — 280 — mA VOUT = 0V ∆VOUT/ ∆PD — 0.05 — %/W — en — 100 — µV — Specification for packaged product only. Output voltage temperature coefficient is defined as the worst case voltage change divided by the temperature range. Load regulation is measured at a constant junction temperature using low duty cycle pulse testing. Parts are tested for load regulation in the load range from 0.1 mA to 100 mA. Changes in output voltage caused by heating effects are covered by the thermal regulation specification. Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at 1V differential. Ground pin current is the regulator quiescent current plus pass transistor base current. The total current drawn from the supply is the sum of the load current plus the ground pin current. Thermal regulation is defined as the change in output voltage at a time “t” after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a 100 mA load pulse at VIN = 26V for t = 10 ms. 2016 Microchip Technology Inc. DS20005614A-page 3 MIC5202 TABLE 1-1: ELECTRICAL CHARACTERISTICS (CONTINUED) Electrical Characteristics: VIN = VOUT + 1V, COUT = 10 µF; IOUT = 1 mA; TJ = 25°C, bold values indicate –40°C ≤ TJ ≤ +125°C; unless noted. Specifications are for one LDO. (Note 1). Parameters Sym. Min. Typ. Max. — — 0.7 2.0 — — IENL — 0.01 — IENH — 8 50 Units Conditions Enable Input Enable Input Voltage Enable Input Current Note 1: 2: 3: 4: 5: 6: VEN V µA Logic-Low = Off Logic-High = On VEN ≤ 0.7V VEN ≥ 2.0V Specification for packaged product only. Output voltage temperature coefficient is defined as the worst case voltage change divided by the temperature range. Load regulation is measured at a constant junction temperature using low duty cycle pulse testing. Parts are tested for load regulation in the load range from 0.1 mA to 100 mA. Changes in output voltage caused by heating effects are covered by the thermal regulation specification. Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at 1V differential. Ground pin current is the regulator quiescent current plus pass transistor base current. The total current drawn from the supply is the sum of the load current plus the ground pin current. Thermal regulation is defined as the change in output voltage at a time “t” after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a 100 mA load pulse at VIN = 26V for t = 10 ms. DS20005614A-page 4 2016 Microchip Technology Inc. MIC5202 TEMPERATURE SPECIFICATIONS Parameters Sym. Min. Typ. Max. Units Conditions Junction Operating Temperature Range TJ –40 — +125 °C Storage Temperature TS –65 — +150 °C — Lead Temperature — — — +260 °C Soldering, 10s JA — 63 — °C/W Temperature Ranges Note 1 Package Thermal Resistances Thermal Resistance, SOIC 8-Ld Note 1: — The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability. 2016 Microchip Technology Inc. DS20005614A-page 5 MIC5202 2.0 TYPICAL PERFORMANCE CURVES Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. 10 GROUND CURRENT (mA) DROPOUT VOLTAGE (mV) 250 200 150 100 50 0 0.01 0.1 1 10 100 1 0.1 0.01 1000 OUTPUT CURRENT (mA) FIGURE 2-1: Current. Dropout Voltage vs. Output FIGURE 2-4: Current. 10 100 Ground Current vs. Output 0.3 IOUT = 100mA 0.2 0.1 IOUT = 1mA -60 0 -30 30 60 120 90 1.4 1.2 0.8 0.6 0.4 IOUT = 1mA 0.2 0.0 150 IOUT = 100mA 1.0 0 TEMPERATURE (ºC) FIGURE 2-2: Temperature. Dropout Voltage vs. 4 8 6 10 FIGURE 2-5: Voltage. Ground Current vs. Input 3.5 OUTPUT VOLTAGE (V) 3.0 IOUT = 100mA 2.5 2.0 1.5 1.0 IOUT = 100μA, 1mA 0 2 4 6 3.0 2.5 CIN = 2.2μF COUT = 4.7μF 2.0 1.5 1.0 0.5 0.5 0.0 2 INPUT VOLTAGE (V) 3.5 OUTPUT VOLTAGE (V) 1 1.6 GROUND CURRENT (mA) DROPOUT VOLTAGE (V) 0.4 0 0.1 OUTPUT CURRENT (mA) 8 10 0.0 0 FIGURE 2-3: DS20005614A-page 6 Dropout Characteristics. 0.1 0.2 0.3 OUTPUT CURRENT (A) INPUT VOLTAGE (V) FIGURE 2-6: Current. Output Voltage vs. Output 2016 Microchip Technology Inc. MIC5202 3.6 IOUT = 100μA OUTPUT VOLTAGE (V) GROUND CURRENT (mA) 0.30 CIN = 2.2μF COUT = 4.7μF 0.25 0.20 0.15 -60 -30 0 30 60 90 120 3.5 COUT = 4.7μF 3.4 3.3 3.2 3 DEVICES: HI/AVG/LO 3.1 CURVES APPLICABLE AT 100μA AND 100mA 3.0 -60 150 CIN = 2.2μF -30 TEMPERATURE (ºC) FIGURE 2-7: Temperature. Ground Current vs. OUTPUT CURRENT (mA) GROUND CURRENT (mA) 90 60 120 150 300 IOUT = 100mA 1.4 CIN = 2.2μF COUT = 4.7μF 1.3 1.2 1.1 280 260 240 220 VOUT = 3.3V 200 180 VOUT = 0V (SHORT CIRCUIT) 160 140 120 1.0 -50 50 0 100 100 -60 150 -30 FIGURE 2-8: Temperature. FIGURE 2-11: Temperature. Ground Current vs. 30 60 90 120 150 Output Current vs. 3.30 MINIMUM INPUT VOLTAGE (V) 100 50 0 COUT = 4.7μF 100 0 0 5 10 15 20 25 30 35 3.29 3.28 Thermal Regulation (3.3V 2016 Microchip Technology Inc. CIN = 2.2μF 3.27 COUT = 4.7μF 3.26 IOUT = 1mA 3.25 3.24 3.23 3.22 3.21 3.20 -60 -30 0 30 60 90 120 150 TEMPERATURE (ºC) TIME (ms) FIGURE 2-9: Version). 0 TEMPERATURE (ºC) TEMPERATURE (ºC) ¨OUTPUT (mV) 30 FIGURE 2-10: Output Voltage vs. Temperature (3.3V Version). 1.5 OUTPUT CURRENT (mA) 0 TEMPERATURE (ºC) FIGURE 2-12: Temperature. Minimum Input Voltage vs. DS20005614A-page 7 300 120 250 100 INPUT CURRENT (mA) SHORT CIRCUIT CURRENT (mA) MIC5202 200 150 100 CIN = 2.2μF 50 VOUT = 3.3V 0 COUT = 4.7μF 1 2 3 5 4 6 80 60 40 20 0 7 ROUT = 33 0 1 2 Short Circuit Current vs. ¨OUTPUT (mV) 20 10 0 -10 COUT = 4.7μF -20 200 100 0 0 2 4 8 6 ¨OUTPUT (mV) COUT = 47μF 200 100 10 20 -5 6 4 0.2 DS20005614A-page 8 0.4 0.6 0.8 30 Load Transient. Line Transient. 15 10 COUT = 10μF 5 IOUT = 1mA 0 6 4 40 0 TIME (ms) FIGURE 2-15: 10 IOUT = 1mA 0 INPUT VLOTAGE (V) ¨OUTPUT (mV) OUTPUT CURRENT (mA) 0 0 9 0 FIGURE 2-17: 10 0 8 TIME (ms) 20 -20 7 COUT = 1μF 5 10 Load Transient. -10 6 10 TIME (ms) FIGURE 2-14: 5 4 FIGURE 2-16: Input Current vs. Input Voltage (3.3V Version). INPUT VLOTAGE (V) OUTPUT CURRENT (mA) ¨OUTPUT (mV) FIGURE 2-13: Input Voltage. 3 INPUT VOLTAGE (V) INPUT VOLTAGE (V) 0.1 0.2 0.3 0.4 0.5 0.6 TIME (ms) FIGURE 2-18: Line Transient. 2016 Microchip Technology Inc. MIC5202 1000 0.001 0 1 2 3 4 5 6 IOUT = 100mA 0.01 7 FREQUENCY (Hz) INPUT VOLTAGE (V) FIGURE 2-19: Input Current vs. Input Voltage (3.3V Version). FIGURE 2-22: 4 ENABLE CURRENT (μA) OUTPUT (V) ENABLE (V) Output Impedance. 35 5 3 2 COUT = 4.7μF 1 IOUT = 1mA 0 2 0 0 50 150 100 200 250 COUT = 4.7μF 25 20 15 VEN = 5V 10 5 VEN = 2V 0 -5 -60 300 CIN = 2.2μF 30 -30 FIGURE 2-20: Version). Enable Transient (3.3V FIGURE 2-23: vs. Temperature. 4 3 2 ENABLE VOLTAGE (V) OUTPUT (V) 30 60 90 120 150 Enable Current Threshold 1.6 5 ENABLE (V) 0 TEMPERATURE (ºC) TIME (μs) COUT = 4.7μF 1 IOUT = 100mA 0 2 0 0 50 100 150 200 250 300 TIME (μs) FIGURE 2-21: Version). 1×106 0 0.1 100×103 10 IOUT = 1mA 1 10×103 ROUT = 66 20 10 1×103 30 IOUT = 100μA 100×100 40 100 10×100 50 1×100 OUTPUT IMPEDANCE () INPUT CURRENT (mA) 60 Enable Transient (3.3V 2016 Microchip Technology Inc. 1.4 CIN = 2.2μF COUT = 4.7μF 1.2 1.0 ON 0.8 OFF 0.6 0.4 -60 -30 0 30 60 90 120 150 TEMPERATURE (ºC) FIGURE 2-24: vs. Temperature. Enable Voltage Threshold DS20005614A-page 9 MIC5202 80 IOUT = 100μA 60 40 FIGURE 2-25: FREQUENCY (Hz) 1×106 100×103 10×103 1×103 0 100×100 20 10×100 RIPPLE VOLTAGE (dB) 100 Ripple vs. Frequency. 80 IOUT = 1mA 60 40 FIGURE 2-26: FREQUENCY (Hz) 1×106 100×103 10×103 1×103 0 100×100 20 10×100 RIPPLE VOLTAGE (dB) 100 Ripple vs. Frequency. 80 IOUT = 100mA 60 40 FIGURE 2-27: DS20005614A-page 10 FREQUENCY (Hz) 1×106 100×103 10×103 1×103 0 100×100 20 10×100 RIPPLE VOLTAGE (dB) 100 Ripple vs. Frequency. 2016 Microchip Technology Inc. MIC5202 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 3-1. Package Type MIC5202 8-Pin SOIC (M) (Top View) TABLE 3-1: VOUT1 1 8 VIN1 GND1 2 7 EN1 VOUT2 3 6 VIN2 GND2 4 5 EN2 PIN FUNCTION TABLE Pin Number Pin Name 1 VOUT1 Output of regulator 1. 2 GND1 Ground pin of LDO1. 3 VOUT2 Output of regulator 2. 4 GND2 Ground pin of LDO2. 5 EN2 Enable input for LDO2. Active-high Input. Logic-high = On, logic-low = Off. Do not leave floating. 6 VIN2 Voltage input for LDO2. 7 EN1 Enable input for LDO1. Active-high Input. Logic-high = On, logic-low = Off. Do not leave floating. 8 VIN1 Voltage input for LDO1. 2016 Microchip Technology Inc. Description DS20005614A-page 11 MIC5202 4.0 APPLICATION INFORMATION The MIC5202 is a dual linear voltage regulator with low dropout voltage and low ground current features. Ideal for battery-operated applications, the MIC5202 offers 1% output voltage accuracy, two independent enable pins, reversed battery protection, short circuit current limit and overtemperature protection. When the MIC5202 is disabled, the ground pin current drops to sub-micro amp and prolongs the battery life. 4.1 Input Supply Voltage VIN1 and VIN2 provide power to each internal circuit and may be tied together. 4.2 regulator and sends it to a “zero” off-mode-current state. In this state, current consumed by the regulator goes nearly to zero. Forcing the enable pin high enables the output voltage. The active-high enable pin typically consumes 8 µA of current and cannot be left floating; a floating enable pin may cause an indeterminate state on the output. 4.7 Thermal Shutdown When the internal die temperature of MIC5202 reaches the limit, the internal driver is disabled until the die temperature falls. Ground Both ground pins (pin 2 and 4) must be tied to the same ground potential when using a single power supply. 4.3 Input Capacitor A 1 µF tantalum or aluminum electrolytic capacitor should be placed close to each VIN pin if there is more than 10 inches of copper between the input and the capacitor, or if a battery is used as the supply. 4.4 Output Capacitor The MIC5202 requires an output capacitor of 1 µF or greater to maintain stability. Increasing the output capacitor leads to an improved transient response; however, the size and cost also increase. Most tantalum and aluminum electrolytic capacitors are adequate; film capacitors will work as well, but at a higher cost. Many aluminum electrolytics have electrolytes that freeze at –30°C, so tantalum capacitors are recommended for operations below –25°C. An equivalent series resistance (ESR) of 5Ω or less with a resonance frequency above 500 kHz is recommended. The output capacitor value may be increased without limit. At lower output loads, a smaller output capacitor value is required for output stability. The capacitor can be reduced to 0.47 µF for current below 10 mA or 0.33 µF for current below 1 mA. 4.5 No-Load Stability Unlike many other voltage regulators, the MIC5202 remains stable and in regulation with no load. This is especially important in CMOS RAM keep-alive applications. 4.6 Enable Input The MIC5202 features dual active-high enable pins that allow each regulator to be enabled and disabled independently. Forcing the enable pin low disables the DS20005614A-page 12 2016 Microchip Technology Inc. MIC5202 5.0 THERMAL CONSIDERATIONS 5.1 Layout The MIC5202 (8-pin SOIC package) has the thermal characteristics shown in Table 5-1, when mounted on a single-layer copper-clad printed circuit board. TABLE 5-1: THERMAL CHARACTERISTIC CONSIDERATIONS PC Board Dielectric θJA FR4 160°C/W Ceramic 120°C/W Multi-layer boards with a dedicated ground plane, wide traces, and large supply bus lines provide better thermal conductivity. The “worst case” value of 160°C/W assumes no ground plane, minimum trace widths, and a FR4 material board. 5.2 Nominal Power Dissipation and Die Temperature At +25°C ambient temperature, the MIC5202 operates reliably at up to 625 mW when mounted in the “worst case” manner described in the previous section. At an ambient temperature of +55°C, the device can safely dissipate 440 mW. These power levels are equivalent to a die temperature of +125°C, which corresponds to the recommended maximum temperature for non-military grade silicon integrated circuits. 2016 Microchip Technology Inc. DS20005614A-page 13 MIC5202 6.0 PACKAGING INFORMATION 6.1 Package Marking Information Legend: XX...X Y YY WW NNN e3 * 8-Pin SOIC* Example XXXX XXYM YYWWC 5202 50YM 1423C Product code or customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC® designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. ●, ▲, ▼ Pin one index is identified by a dot, delta up, or delta down (triangle mark). Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. Package may or may not include the corporate logo. Underbar (_) symbol may not be to scale. DS20005614A-page 14 2016 Microchip Technology Inc. MIC5202 8-Pin SOIC Package Outline and Recommended Land Pattern Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging. 2016 Microchip Technology Inc. DS20005614A-page 15 MIC5202 NOTES: DS20005614A-page 16 2016 Microchip Technology Inc. MIC5202 APPENDIX A: REVISION HISTORY Revision A (August 2016) • Converted Micrel document MIC5202 to Microchip data sheet DS20005614A. • Minor text changes throughout. 2016 Microchip Technology Inc. DS20005614A-page 17 MIC5202 NOTES: DS20005614A-page 18 2016 Microchip Technology Inc. MIC5202 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office. – PART NO. Device X.X X XX – X.X Examples: a) MIC5202-3.0YM: Dual 100 mA Low-Dropout Regulator, 3.0V Voltage, –40°C to +125°C Temp. Range, 8-Pin SOIC, 95/Tube b) MIC5202-3.0YM-TR: Dual 100 mA Low-Dropout Regulator, 3.0 Voltage, –40°C to +125°C Temp. Range, 8-Pin SOIC, 2,500/Reel c) MIC5202-3.3YM: Dual 100 mA Low-Dropout Regulator, 3.3V Voltage, –40°C to +125°C Temp. Range, 8-Pin SOIC, 95/Tube d) MIC5202-3.3YM-TR: Dual 100 mA Low-Dropout Regulator, 3.3V Voltage, –40°C to +125°C Temp. Range, 8-Pin SOIC, 2,500/Reel e) MIC5202-4.8YM: Dual 100 mA Low-Dropout Regulator, 4.85V Voltage, –40°C to +125°C Temp. Range, 8-Pin SOIC, 95/Tube f) Dual 100 mA Low-Dropout Regulator, 4.85V Voltage, –40°C to +125°C Temp. Range, 8-Pin SOIC, 2,500/Reel Output Temperature Package Media Type Voltage Device: MIC5202: Output Voltage: 3.0 3.3 4.8 5.0 = = = = Dual 100 mA Low-Dropout Regulator 3.0V 3.3V 4.85V 5.0V Temperature: Y = –40°C to +125°C Package: M = 8-Pin SOIC Media Type: TR = blank= 2,500/Reel 95/Tube 2016 Microchip Technology Inc. MIC5202-4.8YM-TR: g) MIC5202-5.0YM: Dual 100 mA Low-Dropout Regulator, 5.0V Voltage, –40°C to +125°C Temp. Range, 8-Pin SOIC, 95/Tube h) MIC5202-5.0YM-TR: Dual 100 mA Low-Dropout Regulator, 5.0V Voltage, –40°C to +125°C Temp. Range, 8-Pin SOIC, 2,500/Reel DS20005614A-page 19 MIC5202 NOTES: DS20005614A-page 20 2016 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. 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SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 == 2016 Microchip Technology Inc. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademarks of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2016, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. 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