Diodes MiniMELF Suggested pad layout Datasheet

SUGGESTED PAD LAYOUT
Based on IPC-7351A
DFN1006-2 / DFN1006H4-2 / MiniMELF / MELF / SOD-323 / SOD-123 / SOD-523 / SMA / SMB / SMC
C
X
G
Y
Z
Dimensions
Z
G
X
Y
C
DFN1006-2 /
MiniMELF
DFN1006H4-2
1.1
4.7
0.3
2.1
0.7
1.7
0.4
1.3
0.7
3.5
MELF
SOD-123
SOD-323
SOD-523
SMA
SMB
SMC
6.3
3.3
2.7
1.5
4.8
4.9
2.5
0.7
1.2
3.7
3.75
1.05
0.65
1.35
2.40
2.3
1.1
0.8
0.6
1.7
6.5
1.5
1.7
2.5
4.0
6.8
1.8
2.3
2.5
4.3
9.4
4.4
3.3
2.5
6.8
DFN1006-3 / DFN1006H4-3
C
X1
X
G2
G1
Y
Dimensions
Z
G1
G2
X
X1
Y
C
Value (in mm)
1.1
0.3
0.2
0.7
0.25
0.4
0.7
Dimensions
Z
G1
G2
X
X1
X2
Y
C
Value (in mm)
1.38
0.15
0.15
0.95
0.75
0.40
0.75
0.76
Z
DFN1411-3
C
X2
X1
G2 X
Y
G1
Z
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
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Suggested Pad Layout
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DFN1612-6 / DFN1310H4-6
G2
X2
Dimensions
G1
G2
G3
X1
X2
Y1
Y2
a
b
Y2
G1
b
Y1
G3
X1
a
DFN1612-6
0.15
0.175
0.15
0.60
0.25
0.65
0.45
0.10
0.15
DFN1616-6
Y
DFN1616-8
X2
C
Dimensions Value (in mm)
Z
1.3
G
0.175
X1
0.50
X2
0.525
Y
0.30
C
0.50
X2
G
X1
DFN1310H4-6
0.16
0.17
0.15
0.52
0.20
0.52
0.375
0.09
0.06
a
G2
Y2
Y1
G1
X1
Z
Dimensions Value (in mm)
G1
0.15
G2
0.20
X1
0.65
X2
0.25
Y1
1.25
Y2
0.50
C
0.40
a
0.10
C
DFN2018-6
X
C
Y
Y1
G
Dimensions
C
G
X
X1
Y
Y1
Value (in mm)
0.50
0.20
0.25
1.60
0.35
1.20
X1
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
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Suggested Pad Layout
© Diodes Incorporated
DFN2020-3
Dimensions
C
G
X
X1
X2
X3
Y
Y1
Y2
Y3
Y4
R1
R2
R3
X
X3
X2
R2
Y3
Y4
Y2
Y
R1
R3
DFN2020B-3
G
Y1
X1
C
Value (in mm)
1.00
0.15
1.40
0.35
0.45
0.322
1.10
0.60
0.45
0.45
0.698
0.225
0.05
0.20
X
Y
G
X1
Y2
DFN2020B-6
C
C
Y
G
X2
X1
G
Value (in mm)
1.30
0.24
0.35
1.52
1.09
0.47
0.50
C
DFN2020-6
Y
Dimensions
C
G
X
X1
Y
Y1
Y2
Y1
Dimensions Value (in mm)
Z
1.67
G
0.15
X1
0.90
X2
0.45
Y
0.37
C
0.65
G
X2
G1
X1
G
Y
Z
Y1
Dimensions Value (in mm)
Z
1.67
G
0.20
G1
0.40
X1
1.0
X2
0.45
Y
0.37
Y1
0.70
C
0.65
Z
DFN3020B-8
C
X
Y1
G1
G
Y2
Y
X1
Dimensions
C
G
G1
X
X1
Y
Y1
Y2
Value (in mm)
0.650
0.285
0.090
0.400
1.120
0.730
0.500
0.365
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
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Suggested Pad Layout
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DFN3030-4
C
Y3 (2x)
G6
G4
Y2
G1
X3
G3
R
Y
G2
G5
Y1
X2
X1
G7
G8
X (4x)
DFN3030-8
Dimensions
C
G1
G2
G3
G4
G5
G6
G7
G8
R
X
X1
X2
X3
Y
Y1
Y2
Y3
Value (in mm)
1.300
0.100
0.150
0.830
0.115
0.135
0.170
0.500
0.500
0.150
0.500
1.375
1.225
1.175
1.980
1.015
0.715
0.650
Z
X1
X2
Dimensions Value (in mm)
Z
2.59
G
0.11
X1
2.49
X2
0.65
Y
0.39
C
0.65
G
Y
C
DFN3030E-8
X (x8)
C
Y
(x8)
Y1
Y2
Dimensions
C
C1
X
Y
Y1
Y2
Value (in mm)
0.65
2.35
0.30
0.65
1.60
2.75
C1
DFN3030-10
Y
DFN3030-12
C
Y
X1
G
X
G
Dimensions Value (in mm)
Z
2.60
G
0.15
X
1.80
X1
0.60
Y
0.30
C
0.50
C
X1
G
X
Z
G
Dimensions Value (in mm)
Z
2.60
G
0.15
X
1.80
X1
0.60
Y
0.28
C
0.45
Z
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
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Suggested Pad Layout
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DFN5020-6
Y
X
C
X1
G
Dimensions Value (in mm)
C
0.50
G
0.35
X
0.35
X1
0.90
X2
1.80
Y
0.70
Y2
1.60
Y3
3.20
Y2
Y3
X2
MSOP-8L
DF-S / MiniDIP
X
Z
X
Dimensions DF-S MiniDIP
Z
10.26
6.91
X
1.2
0.60
Y
1.52
0.76
C
5.2
2.67
Dimensions Value (in mm)
X
0.45
Y
1.4
C1
4.4
C2
0.65
C1
C2
Y
Y
C
MSOP-8L-EP
X
X1
Y1
C2
Y
C1
MSOP-10L
Dimensions Value (in mm)
C1
4.2
C2
0.65
X
0.32
X1
1.95
Y
0.8
Y1
1.65
X
C1
Dimensions
X
Y
C1
C2
Value (in mm)
0.30
1.4
4.4
0.50
C2
Y
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
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Suggested Pad Layout
© Diodes Incorporated
®
®
PowerDI 5
®
PowerDI 123 / PowerDI 323
X
X1
Y
G
X2
Y2
X1
(2x)
Y1
G
Y1
(2x)
C
Dimensions
C
G
X
X1
Y
Y1
Value (in mm)
1.840
0.852
3.360
1.390
4.860
1.400
Dimensions
G
X1
X2
Y1
Y2
PowerDI3333-8
®
PowerDI 123
1.0
2.2
0.9
1.4
1.4
®
PowerDI 323
0.5
2.0
0.8
0.8
1.1
PowerDI5060-8
X
X
G
Y2
8
Y2
5
G1
X1
Y1
Y1
Y
Y
1
G1
4
C
Y3 (4x)
Y3
X2
Dimensions
C
G
G1
Y
Y1
Y2
Y3
X
X2
X2 (8x)
C
Dimensions
C
G
G1
X
X1
X2
Y
Y1
Y2
Y3
Value (in mm)
0.650
0.230
0.420
3.700
2.250
1.850
0.700
2.370
0.420
G
Value (in mm)
1.270
0.660
0.820
4.420
4.100
0.610
6.610
3.810
1.020
1.270
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 38
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Suggested Pad Layout
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SM-8
SO-8
X
Y (8x)
Dimensions
C
C1
X
Y
Y1
C1
Y1
X (8x)
Value (in mm)
1.52
4.6
0.95
2.80
6.80
C1
C2
Dimensions Value (in mm)
X
0.60
Y
1.55
C1
5.4
C2
1.27
Y
C
SOD-323F
X1
Y (2x)
Dimensions Value (in mm)
X
0.710
X1
2.700
Y
0.403
X (2x)
SOP-14L
X
Dimensions Value (in mm)
X
0.60
Y
1.50
C1
5.4
C2
1.27
C1
C2
Y
SOP-16L
X
C1
C2
Dimensions
X
Y
C1
C2
Value (in mm)
0.60
1.50
5.4
1.27
Y
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
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Suggested Pad Layout
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SOT-143
X2
SOT-223
X1
X
Y1
Y
Z
C1
C
G
Y2
Dimensions
Z
G
X
X1
X2
Y
C
C2
X2
X1
X2
Value (in mm)
2.70
1.30
2.50
1.0
0.60
0.70
2.0
Dimensions
X1
X2
Y1
Y2
C1
C2
Value (in mm)
3.3
1.2
1.6
1.6
6.4
2.3
SOT-523 / SOT-323 / SOT23 / SC-59
Y
Z
C
X
Dimensions
Z
X
Y
C
E
SOT-523
1.8
0.4
0.51
1.3
0.7
E
SOT-323
2.8
0.7
0.9
1.9
1.0
SOT23
2.9
0.8
0.9
2.0
1.35
SC-59
3.4
0.8
1.0
2.4
1.35
SOT-23F
C
Dimensions Value (in mm)
C
0.95
X
0.60
Y
0.80
Y1
1.80
Y1
Y (3x)
X (3x)
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
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Suggested Pad Layout
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SC-74R / SOT-26 / SOT-363 / SOT-563
C2
Z
SOT-25 / SOT-353
C2
C2
C1
G
Z
C1
G
Y
Y
X
Dimensions
Z
G
X
Y
C1
C2
C2
X
SC-74R / SOT-26
3.20
1.60
0.55
0.80
2.40
0.95
SOT-363
2.5
1.3
0.42
0.6
1.9
0.65
SOT-563
2.2
1.2
0.375
0.5
1.7
0.5
Dimensions
Z
G
X
Y
C1
C2
SOT-25
3.20
1.60
0.55
0.80
2.40
0.95
SOT-353
2.5
1.3
0.42
0.6
1.9
0.65
SOT-666
C
Y (6x)
Dimensions Value (in mm)
C
0.50
G
0.80
X
0.35
Y
0.50
G
X
(6x)
SOT-953
C
C
Dimensions Value (in mm)
C
0.350
X
0.200
Y
0.200
Y1
1.100
Y1
Y (5X)
X (5X)
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
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Suggested Pad Layout
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SOT-963
C
C
Dimensions Value (in mm)
C
0.350
X
0.200
Y
0.200
Y1
1.100
Y1
Y (6X)
X (6X)
SOT89-3L
SOT89-5L
X1
X1
Dimensions Value (in mm)
X
0.900
X1
1.733
X2
0.416
Y
1.300
Y1
4.600
Y2
1.475
Y3
0.950
Y4
1.125
C
1.500
X2 (2x)
Y1
Y3
Y4
Y2
Y
C
Y4
Y1
X2
Y2
X3
Y3
Dimensions Value (in mm)
X1
1.7
X2
0.55
X3
0.4
Y1
4.6
Y2
1.2
Y3
0.5
Y4
1.1
C
3.0
C
X (3x)
2
TO252-3L (DPAK) / TO263-3L (D PAK)
X2
Dimensions
Y2
C
Z
X1
X2
Y1
Y2
C
E1
Z
Y1
X1
TO252-3L /
DPAK
11.6
1.5
7.0
2.5
7.0
6.9
2.3
TO263-3L /
2
D PAK
16.9
1.1
10.8
3.5
11.4
9.5
2.5
E1
TO252-4L
X1
Y1
Y2
Y3
c1
Y
X (4x)
Dimensions
c
c1
X
X1
Y
Y1
Y2
Y3
Value (in mm)
1.27
2.54
1.00
5.73
2.00
6.17
1.64
2.66
c
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
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Suggested Pad Layout
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TO252-5L
TO263-5L
X
X
Y1
Y1
Y
Y
C1
Y2
Y2
X1
X1
C2
Dimensions
X
X1
Y
Y1
Y2
C1
C2
C
Value (in mm)
5.6
0.6
11.0
5.6
2.0
7.2
1.27
Dimensions
X
X1
Y
Y1
Y2
C
Value (in mm)
10.9
1.05
15.7
9.1
2.5
1.7
TSOT23-5
C
C
Dimensions Value (in mm)
C
0.950
X
0.700
Y
1.000
Y1
3.199
Y1
Y (5x)
X (5x)
TSOT23-6
C
C
Dimensions Value (in mm)
C
0.950
X
0.700
Y
1.000
Y1
3.199
Y1
Y (6x)
X (6x)
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
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Suggested Pad Layout
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TSSOP-14L
X
Dimensions Value (in mm)
X
0.45
Y
1.45
C1
5.9
C2
0.65
C1
C2
Y
WL-CSD1010H6-4
ØD
C
Dimensions
C
D
Value (in mm)
0.50
0.25
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 38
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Suggested Pad Layout
© Diodes Incorporated