ON MJF3055 Complementary silicon power transistor Datasheet

MJF3055 (NPN),
MJF2955 (PNP)
Complementary
Silicon Power Transistors
Specifically designed for general purpose amplifier and switching
applications.
Features
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COMPLEMENTARY SILICON
POWER TRANSISTORS
10 AMPERES
90 VOLTS, 30 WATTS
Isolated Overmold Package (1500 Volts RMS Min)
Electrically Similar to the Popular MJE3055T and MJE2955T
Collector−Emitter Sustaining Voltage − VCEO(sus) 90 Volts
10 Amperes Rated Collector Current
No Isolating Washers Required
Reduced System Cost
UL Recognized, File #E69369, to 3500 VRMS Isolation
Epoxy Meets UL 94 V−0 at 0.125 in
ESD Ratings: Machine Model, C; u400 V
Human Body Model, 3B; u8000 V
Pb−Free Packages are Available*
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MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Collector−Emitter Sustaining Voltage
VCEO(sus)
90
Vdc
Collector−Emitter Breakdown Voltage
VCES
90
Vdc
Base−Emitter Voltage
VEBO
5.0
Vdc
Collector Current − Continuous
IC
10
Adc
Base Current − Continuous
IB
6.0
RMS Isolation Voltage (Note 3)
(t = 0.3 sec, R.H. ≤ 30%, TA = 25_C)
Per Figure 5
VISOL
TO−220 FULLPACK
CASE 221D
STYLE 2
1
2
MARKING DIAGRAM
Adc
4500
PD
30
0.25
W
W/_C
Total Power Dissipation @ TA = 25_C
Derate above 25_C
PD
2.0
0.016
W
W/_C
TJ, Tstg
–55 to
+150
_C
Fxx55G
AYWW
Fxx55 = Specific Device Code
xx= 29 or 30
G
= Pb−Free Package
A
= Assembly Location
Y
= Year
WW
= Work Week
THERMAL CHARACTERISTICS
Characteristic
Symbol
Max
Unit
Thermal Resistance, Junction−to−Case (Note 2)
RqJC
4.0
_C/W
Thermal Resistance, Junction−to−Ambient
RqJA
62.5
_C/W
Lead Temperature for Soldering Purposes
TL
260
_C
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. Pulse Test: Pulse Width = 5.0 ms, Duty Cycle v 10%.
2. Measurement made with thermocouple contacting the bottom insulated
surface (in a location beneath the die), the devices mounted on a heatsink with
thermal grease and a mounting torque of ≥ 6 in. lbs.
3. Proper strike and creepage distance must be provided.
*For additional information on our Pb−Free strategy and soldering details,
please download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2008
July, 2008 − Rev. 7
3
VRMS
Total Power Dissipation @ TC = 25_C (Note 2)
Derate above 25_C
Operating and Storage Temperature Range
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1
ORDERING INFORMATION
Device
Package
Shipping
MJF2955
TO−220 FULLPACK
50 Units/Rail
MJF2955G
TO−220 FULLPACK
(Pb−Free)
50 Units/Rail
MJF3055
TO−220 FULLPACK
50 Units/Rail
MJF3055G
TO−220 FULLPACK
(Pb−Free)
50 Units/Rail
Publication Order Number:
MJF3055/D
MJF3055 (NPN), MJF2955 (PNP)
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ELECTRICAL CHARACTERISTICS (TC = 25_C unless otherwise noted)
Characteristic
Symbol
Min
Max
Unit
VCEO(sus)
90
−
Vdc
Collector Cutoff Current
(VCE = 90 Vdc, VBE = 0)
ICES
−
1.0
mAdc
Collector Cutoff Current
(VCE = 90 Vdc, IE = 0)
ICBO
−
1.0
mAdc
Emitter−Base Leakage
(VEB = 5.0 Vdc, IC = 0)
IEBO
−
1.0
mAdc
hFE
20
5.0
100
−
−
−
−
1.0
2.5
OFF CHARACTERISTICS (Note 4)
Collector−Emitter Sustaining Voltage
(IC = 200 mAdc, IB = 0)
ON CHARACTERISTICS (Note 4)
DC Current Gain
DC Current Gain
(ICE = 4.0 Adc, VCE = 4.0 Vdc)
(ICE = 10 Adc, VCE = 4.0 Vdc)
Collector−Emitter Saturation Voltage
(IC = 4.0 Adc, IB = 0.4 Adc)
(IC = 10 Adc, IB = 3.3 Adc)
VCE(sat)
Vdc
Base−Emitter On Voltage
(IC = 4.0 Adc, VBE = 4.0 Vdc)
VBE(on)
−
1.5
Vdc
fT
2.0
−
MHz
DYNAMIC CHARACTERISTICS
Current−Gain−Bandwidth Product
(VCE = 10 Vdc, IC = 0.5 Adc, ftest = 500 kHz)
4. Pulse Test: Pulse Width = 5.0 ms, Duty Cycle v 10%.
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2
MJF3055 (NPN), MJF2955 (PNP)
500
10
100 ms
hFE, DC CURRENT GAIN
IC, COLLECTOR CURRENT (AMPS)
20
5 ms
5
3
2
TJ = 150°C
1
1 ms
dc
CURRENT LIMIT
SECONDARY BREAKDOWN LIMIT
THERMAL LIMIT @ TC = 25°C
(SINGLE PULSE)
0.5
0.3
0.2
1
300
200
TJ = 150°C
100
25°C
VCE = 2 V
50
-55°C
30
20
10
2
3
5
10
20 30
50
VCE, COLLECTOR-EMITTER VOLTAGE (VOLTS)
5
0.01
100
0.02
Figure 1. Maximum Forward Bias Safe
Operating Area
10
PNP
MJF3055
2
1.4
TJ = 25°C
1.2
V, VOLTAGE (VOLTS)
1.6
1.2
VBE(sat) @ IC/IB = 10
VBE @ VCE = 3 V
TJ = 25°C
1
0.8
VBE(sat) @ IC/IB = 10
0.6
VBE @ VCE = 2 V
0.4
0.4
0.2
VCE(sat) @ IC/IB = 10
0
0.1
0.2 0.3
0.5
1
2
3
5
0
0.1
10
VCE(sat) @ IC/IB = 10
0.2 0.3
IC, COLLECTOR CURRENT (AMP)
0.5
1
TC TA
40 4.0
30 3.0
TC
20 2.0
TA
10 1.0
0
0
0
20
2
3
IC, COLLECTOR CURRENT (AMP)
Figure 3. “On” Voltages
PD, POWER DISSIPATION (WATTS)
V, VOLTAGE (VOLTS)
5
Figure 2. DC Current Gain
PNP
MJF2955
0.8
0.05 0.1 0.2
2
0.5
1
IC, COLLECTOR CURRENT (AMP)
40
60
100
120
80
T, TEMPERATURE (°C)
Figure 4. Power Derating
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3
140
160
5
10
MJF3055 (NPN), MJF2955 (PNP)
TEST CONDITIONS FOR ISOLATION TESTS*
FULLY ISOLATED PACKAGE
LEADS
HEATSINK
0.110, MIN
Figure 5. Mounting Position
*Measurement made between leads and heatsink with all leads shorted together.
MOUNTING INFORMATION
4-40 SCREW
CLIP
PLAIN WASHER
HEATSINK
COMPRESSION WASHER
HEATSINK
NUT
Figure 6. Typical Mounting Techniques*
Laboratory tests on a limited number of samples indicate, when using the screw and compression washer mounting technique, a screw
torque of 6 to 8 in . lbs is sufficient to provide maximum power dissipation capability. The compression washer helps to maintain a constant
pressure on the package over time and during large temperature excursions.
Destructive laboratory tests show that using a hex head 4−40 screw, without washers, and applying a torque in excess of 20 in . lbs will
cause the plastic to crack around the mounting hole, resulting in a loss of isolation capability.
Additional tests on slotted 4−40 screws indicate that the screw slot fails between 15 to 20 in . lbs without adversely affecting the
package. However, in order to positively ensure the package integrity of the fully isolated device, ON Semiconductor does not
recommend exceeding 10 in . lbs of mounting torque under any mounting conditions.
** For more information about mounting power semiconductors see Application Note AN1040.
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MJF3055 (NPN), MJF2955 (PNP)
PACKAGE DIMENSIONS
TO−220 FULLPAK
CASE 221D−03
ISSUE J
−T−
−B−
F
SEATING
PLANE
C
S
Q
U
A
1 2 3
H
−Y−
K
G
N
L
D
J
R
3 PL
0.25 (0.010)
M
B
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH
3. 221D-01 THRU 221D-02 OBSOLETE, NEW
STANDARD 221D-03.
DIM
A
B
C
D
F
G
H
J
K
L
N
Q
R
S
U
INCHES
MIN
MAX
0.617
0.635
0.392
0.419
0.177
0.193
0.024
0.039
0.116
0.129
0.100 BSC
0.118
0.135
0.018
0.025
0.503
0.541
0.048
0.058
0.200 BSC
0.122
0.138
0.099
0.117
0.092
0.113
0.239
0.271
MILLIMETERS
MIN
MAX
15.67
16.12
9.96
10.63
4.50
4.90
0.60
1.00
2.95
3.28
2.54 BSC
3.00
3.43
0.45
0.63
12.78
13.73
1.23
1.47
5.08 BSC
3.10
3.50
2.51
2.96
2.34
2.87
6.06
6.88
STYLE 2:
PIN 1. BASE
2. COLLECTOR
3. EMITTER
Y
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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