TDK MLF2012DR68KT Inductors for standard circuits multilayer/std magnetic shielded mlf sery Datasheet

Inductors for Standard Circuits
Multilayer/STD • magnetic shielded
MLF series
Type:
MLF1005L
MLF1608
MLF2012
1005[0402 inch]*
1608[0603 inch]
2012[0805 inch]
* Dimensions Code JIS[EIA]
Issue date:
November 2011
• All specifications are subject to change without notice.
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
(1/9)
Inductors for Standard Circuits
Multilayer/STD • Magnetic Shielded
Conformity to RoHS Directive
MLF Series MLF1005L
Various digital devices are required to be further downsized yet
remain highly functional, and to excel in low power consumption,
and parts mounted on the devices are also required to have lower
resistance.
The MLF1005L type is a new line of inductors that have been
developed to meet such requirements: their resistance has been
lowered by up to 35% in comparison with that of the existing
MLF1005 type.
In addition, the new inductors use similar magnetic shielding,
which enables their high-density mounting.
PRODUCT IDENTIFICATION
MLF 1005 L R10 K T
(1)
(2) (3) (4) (5) (6)
(1) Series name
(2) Dimensions L×W
1005
1.0×0.5×0.5
(3) Type name
L
FEATURES
• The resistance of the MLF1005L type has been lowered by up to
35% in comparison with that of the existing MLF1005 type.
• Magnetically shielded configuration allowing for high-density
mounting.
• Does not contain lead and is compatible with lead-free
soldering.
• It is a product conforming to RoHS directive.
(7)
Low-resistance type
(4) Inductance
R10
1R0
0.1µH
1.0µH
(5) Tolerance
K
±10%
(6) Packaging style
APPLICATIONS
Signal processing modules such as cellular phones and tuners
T
Taping [reel]
(7) TDK internal code
SPECIFICATIONS
Operating temperature range
Storage temperature range
–40 to +85°C
–40 to +85°C(After mount)
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
10s max.
250 to 260˚C
Natural
cooling
230˚C
180˚C
150˚C
Preheating
60 to 120s
Soldering
30 to 60s
Time(s)
PACKAGING STYLE AND QUANTITIES
Packaging style
Taping
Quantity
10000 pieces/reel
HANDLING AND PRECAUTIONS
• Before soldering, be sure to preheat components.
The preheating temperature should be set so that the temperature difference between the solder temperature and product
temperature does not exceed 150°C.
• After mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
• The inductance value may change due to magnetic saturation if
the current exceeds the rated maximum.
• Do not expose the inductors to stray magnetic fields.
• Avoid static electricity discharge during handling.
• When hand soldering, apply the soldering iron to the printed circuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
• Please contact our Sales office when your application is considered the following:
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
• All specifications are subject to change without notice.
001-05 / 20111129 / e511_mlf_02
(2/9)
SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD PATTERN
0.5
0.5±0.05
1.0±0.05
0.5
0.4
0.5
0.1min.
0.5±0.05
0.1min.
Weight : 1.2mg
Dimensions in mm
ELECTRICAL CHARACTERISTICS
Inductance
(µH)
Inductance
tolerance
0.1
0.12
0.15
0.18
0.22
0.27
0.33
0.39
0.47
0.56
0.68
0.82
1.0
1.2
1.5
1.8
2.2
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
Test
frequency
L, Q (MHz)
25
25
25
25
25
25
25
10
10
10
10
10
10
10
10
10
10
Test
current
L, Q (mA)
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
Q min.
10
10
10
10
10
10
10
25
25
25
25
25
25
25
25
25
25
TYPICAL ELECTRICAL CHARACTERISTICS
INDUCTANCE vs. FREQUENCY CHARACTERISTICS
DC resistance
(Ω )max.
Rated current
(mA)max.
Part No.
0.51
0.59
0.63
0.76
0.79
0.91
1.05
0.41
0.42
0.47
0.55
0.59
0.64
0.79
0.95
1.05
1.15
150
140
130
120
110
100
90
50
50
45
40
35
35
35
30
20
15
MLF1005LR10KT
MLF1005LR12KT
MLF1005LR15KT
MLF1005LR18KT
MLF1005LR22KT
MLF1005LR27KT
MLF1005LR33KT
MLF1005LR39KT
MLF1005LR47KT
MLF1005LR56KT
MLF1005LR68KT
MLF1005LR82KT
MLF1005L1R0KT
MLF1005L1R2KT
MLF1005L1R5KT
MLF1005L1R8KT
MLF1005L2R2KT
IMPEDANCE vs. FREQUENCY CHARACTERISTICS
10
10000
1000
1
Impedance (Ω)
2.2µH
Inductance (µH)
Self-resonant
frequency
(MHz)min.
450
400
350
320
290
260
230
210
190
170
150
130
120
110
100
90
80
1.0µH
0.33µH
0.1
0.1µH
2.2µH
1.0µH
0.1µH
100
0.33µH
10
0.01
1
10
100
1000
Frequency (MHz)
1
1
10
100
1000
Frequency (MHz)
Q vs. FREQUENCY CHARACTERISTICS
70
2.2µH
60
50
1.0µH
0.1µH
Q
40
0.33µH
30
20
10
0
1
10
100
1000
Frequency (MHz)
• All specifications are subject to change without notice.
001-05 / 20111129 / e511_mlf_02
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PACKAGING STYLES
REEL DIMENSIONS
ø60min.
1.0
2.0±0.5
8.4 +2.0
–0.0
ø13±0.2
14.4max.
ø21±0.8
ø180±2.0
Dimensions in mm
Cavity
3.5±0.05
1.5 +0.1
–0.0
0.8max.
0.65±0.1
4.0±0.1
2.0±0.05
160min.
Taping
2.0±0.05
1.15±0.1
8.0±0.3
Sprocket hole
1.75±0.1
TAPE DIMENSIONS
200min.
Drawing direction
300min.
Dimensions in mm
• All specifications are subject to change without notice.
001-05 / 20111129 / e511_mlf_02
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Inductors for Standard Circuits
Multilayer/STD • Magnetic Shielded
Conformity to RoHS Directive
MLF Series MLF1608
FEATURES
• High-reliability monolithic structure.
• Ferrite core and magnetic shielding enables the design of compact circuits with high density mounting.
• Excellent solderability and high heat resistance permits either
flow or reflow soldering.
• The products contain no lead and also support lead-free
soldering.
• It is a product conforming to RoHS directive.
PRODUCT IDENTIFICATION
MLF 1608 A 1R0 K T
(1)
(2) (3) (4) (5) (6)
(7)
(1) Series name
(2) Dimensions L×W
1608
1.6×0.8mm
(3) Type name
APPLICATIONS
Digital cellular phone, tuner, personal computers, audio, or various
electronic appliances
SPECIFICATIONS
Operating temperature range
Storage temperature range
–40 to +85°C
–40 to +85°C(After mount)
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
(4) Inductance
47N
R15
1R0
47nH[0.047µH]
0.15µH
1µH
(5) Tolerance
K
M
±10%
±20%
(6) Packaging style
T
Taping [reel]
10s max.
250 to 260˚C
Natural
cooling
230˚C
(7) TDK internal code
PACKAGING STYLE AND QUANTITIES
Packaging style
Taping
180˚C
Quantity
4000 pieces/reel
150˚C
Preheating
60 to 120s
Soldering
30 to 60s
Time(s)
HANDLING AND PRECAUTIONS
• Before soldering, be sure to preheat components.
The preheating temperature should be set so that the temperature difference between the solder temperature and product
temperature does not exceed 150°C.
• After mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
• The inductance value may change due to magnetic saturation if
the current exceeds the rated maximum.
• Do not expose the inductors to stray magnetic fields.
• Avoid static electricity discharge during handling.
• When hand soldering, apply the soldering iron to the printed circuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
• Please contact our Sales office when your application is considered the following:
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
• All specifications are subject to change without notice.
001-05 / 20111129 / e511_mlf_02
(5/9)
SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD PATTERN
0.8
0.8±0.15
1.6±0.15
0.6
0.8±0.15
0.3±0.2
Weight: 4mg
0.8
0.6
Dimensions in mm
ELECTRICAL CHARACTERISTICS
Inductance
(µH)
Inductance
tolerance
0.047
0.068
0.082
0.1
0.12
0.15
0.18
0.22
0.27
0.33
0.39
0.47
0.56
0.68
0.82
1
1.2
1.5
1.8
2.2
2.7
3.3
3.9
4.7
5.6
6.8
8.2
10
12
15
18
22
27
33
±20%
±20%
±20%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
Q
min.
10
10
10
15
15
15
15
15
15
15
15
15
15
15
15
35
35
35
35
35
35
35
35
35
35
35
35
30
30
20
20
20
20
20
typ.
20
20
20
25
25
25
25
25
25
25
25
30
30
30
30
50
50
55
55
55
55
60
60
60
60
60
60
55
55
40
40
40
40
40
Test
frequency
L, Q (MHz)
50
50
50
25
25
25
25
25
25
25
25
25
25
25
25
10
10
10
10
10
10
10
10
10
4
4
4
2
2
1
1
1
1
1
Test
current
L, Q (mA)
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
Self-resonant
frequency (MHz)
min.
typ.
600
900
550
700
500
650
450
600
400
550
350
500
320
450
290
400
260
350
230
320
210
290
190
260
170
230
150
210
130
190
120
170
110
150
100
140
90
130
80
120
70
110
65
100
60
90
55
80
45
70
40
60
35
55
30
50
25
45
22
42
20
40
18
38
15
35
10
30
DC resistance
(Ω )
max.
typ.
0.20
0.10
0.30
0.15
0.30
0.15
0.35
0.20
0.40
0.20
0.45
0.25
0.50
0.25
0.55
0.30
0.60
0.35
0.75
0.40
0.85
0.45
0.95
0.50
1.05
0.55
1.25
0.65
1.40
0.75
0.50
0.25
0.65
0.25
0.70
0.30
0.85
0.35
1.00
0.45
1.15
0.50
1.30
0.55
1.45
0.65
1.60
0.75
1.10
0.55
1.30
0.65
1.50
0.80
1.70
1.00
1.80
1.20
1.50
0.80
1.60
0.85
1.70
0.90
1.80
1.20
2.20
1.40
Rated current
(mA)max.
Part No.
200
200
200
200
200
200
150
150
150
100
100
100
100
70
70
50
50
50
50
30
30
30
30
30
15
15
10
10
10
2
2
2
2
2
MLF1608D47N∗MT
MLF1608D68NMT
MLF1608D82NMT
MLF1608DR10KT
MLF1608DR12KT
MLF1608DR15KT
MLF1608DR18KT
MLF1608DR22KT
MLF1608DR27KT
MLF1608DR33KT
MLF1608DR39KT
MLF1608DR47KT
MLF1608DR56KT
MLF1608DR68KT
MLF1608DR82KT
MLF1608A1R0KT
MLF1608A1R2KT
MLF1608A1R5KT
MLF1608A1R8KT
MLF1608A2R2KT
MLF1608A2R7KT
MLF1608A3R3KT
MLF1608A3R9KT
MLF1608A4R7KT
MLF1608E5R6KT
MLF1608E6R8KT
MLF1608E8R2KT
MLF1608E100KT
MLF1608E120KT
MLF1608C150KT
MLF1608C180KT
MLF1608C220KT
MLF1608C270KT
MLF1608C330KT
∗
47N means for 47nH (0.047µH).
• Test equipment
Inductance, Q: Ag4294A-16034G
• All specifications are subject to change without notice.
001-05 / 20111129 / e511_mlf_02
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TYPICAL ELECTRICAL CHARACTERISTICS
INDUCTANCE CHANGE vs. DC SUPERPOSITION
CHARACTERISTICS
IMPEDANCE vs. FREQUENCY CHARACTERISTICS
100
100
22µH
8.2µH
10
Impedance (kΩ)
Inductance (µH)
10
1µH
1
1
22µH
1µH
8.2µH
0.1
0.01
0.1
0.068µH
1
5
0.68µH
10
50 100
DC current (mA)
0.01
500 1000
INDUCTANCE CHANGE vs. TEMPERATURE
CHARACTERISTICS
1
5
10
50 100
Frequency (MHz)
500 1000
Q vs. FREQUENCY CHARACTERISTICS
0
5
60
8.2µH
1µH
0 25
50
85
–5 Temperature (˚C)
–10
40
22µH
0.68µH
20
0
PACKAGING STYLES
REEL DIMENSIONS
0.1
0.5 1
5 10
50 100
Frequency (MHz)
5001000
TAPE DIMENSIONS
Sprocket hole
1.5 +0.1
–0.0
Cavity
1.1max.
1.1±0.2
4.0±0.1
4.0±0.1
2.0±0.05
2.0±0.5
8.4 +2.0
–0.0
ø13±0.2
14.4max.
160min.
Taping
1.9±0.2
ø60min.
8.0±0.3
1.0
3.5±0.05
–25
1µH
8.2µH
0.68µH
22µH
1.75±0.1
10
Q
∆L /L(%)
80
22µH
0.68µH
8.2µH
1µH
200min.
ø21±0.8
ø180±2.0
Dimensions in mm
Drawing direction
300min.
Dimensions in mm
• All specifications are subject to change without notice.
001-05 / 20111129 / e511_mlf_02
(7/9)
Inductors for Standard Circuits
Multilayer/STD • Magnetic Shielded
Conformity to RoHS Directive
MLF Series MLF2012
FEATURES
• High-reliability monolithic structure.
• Ferrite core and magnetic shielding enables the design of compact circuits with high density mounting.
• Excellent solderability and high heat resistance permits either
flow or reflow soldering.
• The products contain no lead and also support lead-free
soldering.
• It is a product conforming to RoHS directive.
PRODUCT IDENTIFICATION
MLF 2012 A 1R0 K T
(1)
(2) (3) (4) (5) (6)
(7)
(1) Series name
(2) Dimensions L×W
2012
2.0×1.25mm
(3) Type name
APPLICATIONS
Digital cellular phone, car audio, TV, personal computers, or various electronic appliances
SPECIFICATIONS
Operating temperature range
Storage temperature range
–40 to +85°C
–40 to +85°C(After mount)
(4) Inductance
47N
R15
1R0
100
47nH[0.047µH]
0.15µH
1µH
10µH
(5) Tolerance
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
K
M
±10%
±20%
(6) Packaging style
10s max.
T
Taping [reel]
250 to 260˚C
Natural
cooling
230˚C
(7) TDK internal code
PACKAGING STYLE AND QUANTITIES
180˚C
Packaging style
Taping
150˚C
Preheating
60 to 120s
Soldering
30 to 60s
Time(s)
Product’s thickness
0.85mm
1.25mm
Quantity
4000 pieces/reel
2000 pieces/reel
HANDLING AND PRECAUTIONS
• Before soldering, be sure to preheat components.
The preheating temperature should be set so that the temperature difference between the solder temperature and product
temperature does not exceed 150°C.
• After mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
• The inductance value may change due to magnetic saturation if
the current exceeds the rated maximum.
• Do not expose the inductors to stray magnetic fields.
• Avoid static electricity discharge during handling.
• When hand soldering, apply the soldering iron to the printed circuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
• Please contact our Sales office when your application is considered the following:
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
• All specifications are subject to change without notice.
001-05 / 20111129 / e511_mlf_02
(8/9)
SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD PATTERN
1.2
1.25±0.2
2.0±0.2
0.8
1
0.8
0.5±0.3
T
T(Thickness)
0.85±0.2
1.25±0.2
Weight(mg)
10
14
Dimensions in mm
ELECTRICAL CHARACTERISTICS
Inductance
(µH)
Inductance
tolerance
0.047
0.068
0.082
0.1
0.12
0.15
0.18
0.22
0.27
0.33
0.39
0.47
0.56
0.68
0.82
1
1.2
1.5
1.8
2.2
2.7
3.3
3.9
4.7
5.6
6.8
8.2
10
12
15
18
22
27
33
39
47
56
68
82
100
±20%
±20%
±20%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
Q
min.
15
15
15
20
20
20
20
20
20
20
25
25
25
25
25
45
45
45
45
45
45
45
45
45
50
50
50
50
50
30
30
30
30
30
35
35
35
25
25
25
typ.
25
25
25
30
30
30
30
30
30
30
35
35
35
35
35
55
55
60
60
60
70
70
70
70
75
75
75
75
75
45
45
45
45
45
55
55
55
45
45
45
Test
frequency
L, Q (MHz)
50
50
50
25
25
25
25
25
25
25
25
25
25
25
25
10
10
10
10
10
10
10
10
10
4
4
4
2
2
1
1
1
1
0.4
2
2
2
1
1
1
Test
current
L, Q (mA)
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
Self-resonant
frequency (MHz)
min.
typ.
550
700
500
600
450
550
400
500
360
450
320
410
280
370
250
330
220
300
200
270
180
250
160
230
150
210
140
190
130
170
120
160
110
150
100
140
90
130
80
120
70
100
60
90
55
80
50
70
45
65
40
60
35
55
30
50
25
45
22
40
20
38
18
35
17
33
15
28
13
23
11
20
10
18
9
16
8
14
7
12
DC resistance
(Ω )
max.
typ.
0.10
0.05
0.15
0.08
0.15
0.08
0.15
0.10
0.20
0.12
0.20
0.13
0.25
0.15
0.30
0.16
0.35
0.18
0.40
0.23
0.45
0.25
0.50
0.25
0.55
0.30
0.60
0.35
0.65
0.40
0.30
0.15
0.35
0.15
0.40
0.18
0.45
0.20
0.50
0.22
0.55
0.25
0.60
0.28
0.65
0.30
0.70
0.35
0.60
0.30
0.65
0.32
0.70
0.35
0.80
0.40
0.90
0.50
0.70
0.35
0.80
0.38
0.90
0.45
1.00
0.50
1.10
0.55
2.40
1.30
2.70
1.60
2.80
1.80
2.90
2.00
3.00
2.40
3.10
2.50
Rated
current
(mA)max.
300
300
300
300
300
300
300
250
250
250
200
200
150
150
150
80
80
80
80
50
50
50
30
30
15
15
15
15
15
5
5
5
5
5
4
4
4
2
2
2
Thickness
T
(mm)
0.85
0.85
0.85
0.85
0.85
0.85
0.85
0.85
0.85
0.85
0.85
1.25
1.25
1.25
1.25
0.85
0.85
0.85
0.85
0.85
1.25
1.25
1.25
1.25
1.25
1.25
1.25
1.25
1.25
1.25
1.25
1.25
1.25
1.25
1.25
1.25
1.25
1.25
1.25
1.25
Part No.
MLF2012D47N∗MT
MLF2012D68NMT
MLF2012D82NMT
MLF2012DR10KT
MLF2012DR12KT
MLF2012DR15KT
MLF2012DR18KT
MLF2012DR22KT
MLF2012DR27KT
MLF2012DR33KT
MLF2012DR39KT
MLF2012DR47KT
MLF2012DR56KT
MLF2012DR68KT
MLF2012DR82KT
MLF2012A1R0KT
MLF2012A1R2KT
MLF2012A1R5KT
MLF2012A1R8KT
MLF2012A2R2KT
MLF2012A2R7KT
MLF2012A3R3KT
MLF2012A3R9KT
MLF2012A4R7KT
MLF2012E5R6KT
MLF2012E6R8KT
MLF2012E8R2KT
MLF2012E100KT
MLF2012E120KT
MLF2012C150KT
MLF2012C180KT
MLF2012C220KT
MLF2012C270KT
MLF2012C330KT
MLF2012K390KT
MLF2012K470KT
MLF2012K560KT
MLF2012C680KT
MLF2012C820KT
MLF2012C101KT
∗
47N means for 47nH (0.047µH).
• Test equipment
Inductance, Q: Ag4294A-16034G
• All specifications are subject to change without notice.
001-05 / 20111129 / e511_mlf_02
(9/9)
TYPICAL ELECTRICAL CHARACTERISTICS
INDUCTANCE CHANGE vs. DC SUPERPOSITION
CHARACTERISTICS
IMPEDANCE vs. FREQUENCY CHARACTERISTICS
100
100
22µH
10µH
10
Impedance (kΩ)
Inductance (µH)
10
1µH
1
1
22µH
10µH
0.1µH
0.1
0.01
1
5
10
50 100
DC current (mA)
0.01
500 1000
INDUCTANCE CHANGE vs. TEMPERATURE
CHARACTERISTICS
∆L /L(%)
5
10
50 100
Frequency (MHz)
500 1000
80
1µH
10µH
0.1µH
8
4
10µH
60
22µH
0 25
50
85
– 4 Temperature (˚C)
–8
1µH
Q
0
1
0.1µH
Q vs. FREQUENCY CHARACTERISTICS
12
–25
22µH
0.1µH
1µH
10µH
1µH
0.1
0.1µH
40
22µH
20
–12
–16
0
PACKAGING STYLES
REEL DIMENSIONS
0.1
0.5 1
5 10
50 100
Frequency (MHz)
5001000
TAPE DIMENSIONS
1.5 +0.1
–0.0
1.1max.
1.5±0.2
4.0±0.1
4.0±0.1
2.0±0.05
ø13±0.2
14.4max.
ø21±0.8
1.5max.
Sprocket hole
1.5 +0.1
–0.0
0.5min.
Cavity
8.0±0.3
Dimensions in mm
0.3max.
1.5±0.2
4.0±0.1
4.0±0.1
2.0±0.05
160min.
Drawing direction
Taping
2.3±0.2
ø180±2.0
t=1.25mm
3.5±0.05
8.4 +2.0
–0.0
1.75±0.1
2.0±0.5
2.3±0.2
8.0±0.3
ø60min.
Cavity
3.5±0.05
Sprocket hole
1.0
1.75±0.1
t=0.85mm
200min.
300min.
Dimensions in mm
• All specifications are subject to change without notice.
001-05 / 20111129 / e511_mlf_02
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