ATMEL MM067206HV-15-E Rad. tolerant high speed 16 kb x 9 parallel fifo Datasheet

Features
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First-in First-out Dual Port Memory
16384 bits x 9 Organization
Fast Flag and Access Times: 15, 30 ns
Wide Temperature Range: - 55°C to + 125°C
Fully Expandable by Word Width or Depth
Asynchronous Read/Write Operations
Empty, Full and Half Flags in Single Device Mode
Retransmit Capability
Bi-directional Applications
Battery Back-up Operation: 2V Data Retention
TTL Compatible
Single 5V ± 10% Power Supply
No Single Event Latch-up below a LET Threshold of 80 MeV/mg/cm2
Tested up to a Total Dose of 30 krads (Si) according to MIL STD 883 Method 1019
Quality grades: QML Q and V with SMD 5962-93177 and ESCC with specification
9301/048
Rad. Tolerant
High Speed
16 Kb x 9
Parallel FIFO
Description
The M67206H implements a first-in first-out algorithm, featuring asynchronous
read/write operations. The FULL and EMPTY flags prevent data overflow and underflow. The Expansion logic allows unlimited expansion in word size and depth with no
timing penalties. Twin address pointers automatically generate internal read and write
addresses, and no external address information is required. Address pointers are
automatically incremented with the write pin and read pin. The 9 bits wide data are
used in data communications applications where a parity bit for error checking is necessary. The Retransmit pin resets the Read pointer to zero without affecting the write
pointer. This is very useful for retransmitting data when an error is detected in the
system.
M67206H
Using an array of eight transistors (8T) memory cell, the M67206H combines an
extremely low standby supply current (typ = 0.1 µA) with a fast access time at 15 ns
over the full temperature range. All versions offer battery backup data retention capability with a typical power consumption at less than 2 µW.
The M67206H is processed according to the methods of the latest revision of the MIL
PRF 38535 (Q and V) or ESCC 9000.
Rev. 4143J–AERO–04/07
1
Block Diagram
Pin Configuration
DIL ceramic 28-pin 300 mils
FP 28-pin 400 mils
2
M67206H
4143J–AERO–04/07
M67206H
Pin Description
Names
Description
I0-8
Inputs
Q0-8
Outputs
W
Write Enable
R
Read Enable
RS
Reset
EF
Empty Flag
FF
Full Flag
XO/HF
Expansion Out/Half-Full Flag
XI
Expansion IN
FL/RT
First Load/Retransmit
VCC
Power Supply
GND
Ground
Data In (I0 - I8)
Data inputs for 9-bit data
Reset (RS)
Reset occurs whenever the Reset (RS) input is taken to a low state. Reset returns both
internal read and write pointers to the first location. A reset is required after power-up
before a write operation can be enabled. Both the Read Enable (R) and Write Enable
(W) inputs must be in the high state during the period shown in Figure 1 (i.e. tRSS before
the rising edge of RS) and should not change until tRSR after the rising edge of RS. The
Half-Full Flag (HF) will be reset to high After Reset (RS)
Figure 1. Reset
Notes:
1. EF, FF and HF may change status during reset, but flags will be valid at tRSC.
2. W and R = VIH around the rising edge of RS.
3
4143J–AERO–04/07
Write Enable (W)
A write cycle is initiated on the falling edge of this input if the Full Flag (FF) is not set.
Data set-up and hold times must be maintained in the rise time of the leading edge of
the Write Enable (W). Data is stored sequentially in the Ram array, regardless of any
current read operation.
Once half the memory is filled, and during the falling edge of the next write operation,
the Half-Full Flag (HF) will be set to low and remain in this state until the difference
between the write and read pointers is less than or equal to half of the total available
memory in the device. The Half-Full Flag (HF) is then reset by the rising edge of the
read operation.
To prevent data overflow, the Full Flag (FF) will go low, inhibiting further write operations. On completion of a valid read operation, the Full Flag (FF) will go high after TRFF,
allowing a valid write to begin. When the FIFO stack is full, the internal write pointer is
blocked from W, so that external changes to W will have no effect on the full FIFO stack.
Read Enable (R)
A read cycle is initiated on the falling edge of the Read Enable (R) provided that the
Empty Flag (EF) is not set. The data is accessed on a first-in/first-out basis, not including any current write operations. After Read Enable (R) goes high, the Data Outputs (Q0
- Q8) will return to a high impedance state until the next Read operation. When all the
data in the FIFO stack has been read, the Empty Flag (EF) will go low, allowing the
“final” read cycle, but inhibiting further read operations while the data outputs remain in
a high impedance state. Once a valid write operation has been completed, the Empty
Flag (EF) will go high after tWEF and a valid read may then be initiated. When the FIFO
stack is empty, the internal read pointer is blocked from R, so that external changes to R
will have no effect on the empty FIFO stack.
First Load/Retransmit
(FL/RT)
This pin is a dual-purpose input. In the Depth Expansion Mode, this pin is connected to
ground to indicate that it is the first loaded (see Operating Modes). In the Single Device
Mode, this pin acts as the retransmit input. The Single Device Mode is initiated by connecting the Expansion In (XI) to ground.
The M67206H can be set to retransmit data when the Retransmit Enable Control (RT)
input is pulsed low. A retransmit operation will set the internal read point to the first location and will not affect the write pointer. Read Enable (R) and Write Enable (W) must be
in the high state during retransmit. The retransmit feature is intended for use when a
number of writes are equal to or less than the depth of the FIFO has occurred since the
last RS cycle. The retransmit feature is not compatible with the Depth Expansion Mode
and will affect the Half-Full Flag (HF), in accordance with the relative locations of the
read and write pointers.
Expansion In (XI)
The XI input is a dual-purpose pin. Expansion In (XI) is connected to GND to indicate an
operation in the single device mode. Expansion In (XI) is connected to Expansion Out
(XO) of the previous device in the Depth Expansion or Daisy Chain modes.
Full Flag (FF)
The Full Flag (FF) will go low, inhibiting further write operations when the write pointer is
one location less than the read pointer, indicating that the device is full. If the read
pointer is not moved after Reset (RS), the Full Flag (FF) will go low after 16384 writes.
Empty Flag (EF)
The Empty Flag (EF) will go low, inhibiting further read operations when the read pointer
is equal to the write pointer, indicating that the device is empty.
4
M67206H
4143J–AERO–04/07
M67206H
Expansion Out/Half-Full
Flag (XO/HF)
The XO/HF pin is a dual-purpose output. In the single device mode, when Expansion In
(XI) is connected to ground, this output acts as an indication of a half-full memory.
After half the memory is filled and on the falling edge of the next write operation, the
Half-Full Flag (HF) will be set to low and will remain set until the difference between the
write and read pointers is less than or equal to half of the total memory of the device.
The Half-Full Flag (HF) is then reset by the rising edge of the read operation.
In the Depth Expansion Mode, Expansion In (XI) is connected to Expansion Out (XO) of
the previous device. This output acts as a signal to the next device in the Daisy Chain by
providing a pulse to the next device when the previous device reaches the last memory
location.
Data Output (Q0 - Q8)
DATA output for 9-bit wide data. This data is in a high impedance condition whenever
Read (R) is in a high state.
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4143J–AERO–04/07
Functional Description
Single Device Mode
A single M67206H may be used when the application requirements are for 16384 words
or less. The M67206H is in a Single Device Configuration when the Expansion In (XI) control
input is grounded (see Figure 2). In this mode the Half-Full Flag (HF), which is an active low
output, is shared with Expansion Out (XO).
Figure 2. Block Diagram of Single 16384 bits × 9
HF
(HALF-FULL FLAG)
(W)
WRITE
(R)
READ
HF
9
DATAIN
9
(I)
FULL FLAG (FF)
RESET
(RS)
EXPANSION IN (XI)
Width Expansion Mode
DATAOUT
(Q)
(EF)
EMPTY FLAG
(RT)
RETRANSMIT
M67206H
Word width may be increased simply by connecting the corresponding input control signals of multiple devices. Status flags (EF, FF and HF) can be detected from any device.
Figure 3 demonstrates an 18-bit word width by using two M67206H. Any word width can be
attained by adding additional M67206H.
Figure 3. Block Diagram of 16384 bits x 18 FIFO Memory Used in Width Expansion Mode
H
Note:
6
Flag detection is accomplished by monitoring the FF, EF and the HF signals on either (any) device used in the width expansion
configuration. Do not connect any output control signals together.
M67206H
4143J–AERO–04/07
M67206H
Table 1. Reset and Retransmit
Single Device Configuration/Width Expansion Mode
Inputs
Internal Status
Outputs
Mode
RS
RT
XI
Read Pointer
Write Pointer
EF
FF
HF
Reset
0
X
0
Location Zero
Location Zero
0
1
1
Retransmit
1
0
0
Location Zero
Unchanged
X
X
X
Read/Write
1
1
0
Increment(1)
Increment(1)
X
X
X
Note:
1. Pointer will increment if flag is high.
Table 2. Reset and First Load Truth Table
Depth Expansion/Compound Expansion Mode
Inputs
Mode
Internal Status
Outputs
RS
FL
XI
Read Pointer
Write Pointer
EF
FF
Reset First Device
0
0
(1)
Location Zero
Location Zero
0
1
Reset All Other
Devices
0
1
(1)
Location Zero
Location Zero
0
1
Read/Write
1
X
(1)
X
X
X
X
Note:
1. XI is connected to XO of previous device.
See Figure 4.
Depth Expansion (Daisy
Chain) Mode
The M67206H can be easily adapted for applications which require more than 16384
words. Figure 4 demonstrates Depth Expansion using three M67206Hs. Any depth can
be achieved by adding an additional M67206H.
The M67206H operates in the Depth Expansion configuration if the following conditions
are met:
1. The first device must be designated by connecting the First Load (FL) control
input to ground.
2. All other devices must have FL in the high state.
3. The Expansion Out (XO) pin of each device must be connected to the Expansion In
(XI) pin of the next device. See Figure 4
4. External logic is needed to generate a composite Full Flag (FF) and Empty Flag
(EF). This requires that all EF’s and all FFs be ORed (i.e. all must be set to generate the
correct composite FF or EF). See Figure 4.
5. The Retransmit (RT) function and Half-Full Flag (HF) are not available in the Depth
Expansion Mode.
Compound Expansion
Module
It is quite simple to apply the two expansion techniques described above together to create large FIFO arrays (see Figure 5).
7
4143J–AERO–04/07
Bi-directional Mode
Applications which require data buffering between two systems (each system being
capable of Read and Write operations) can be created by coupling M67206H as shown
in Figure 6. Care must be taken to ensure that the appropriate flag is monitored by each
system (i.e. FF is monitored on the device on which W is in use; EF is monitored on the device
on which R is in use). Both Depth Expansion and Width Expansion may be used in this mode.
Data Flow – Through
Modes
Two types of flow-through modes are permitted: a read flow-through and a write flowthrough mode. In the read flow-through mode (Figure 17) the FIFO stack allows a single
word to be read after one word has been written to an empty FIFO stack. The data is
enabled on the bus at (tWEF + tA) ns after the leading edge of W which is known as the
first write edge and remains on the bus until the R line is raised from low to high, after which the
bus will go into a three-state mode after tRHZ ns. The EF line will show a pulse indicating temporary reset and then will be set. In the interval in which R is low, more words may be written to
the FIFO stack (the subsequent writes after the first write edge will reset the Empty Flag); however, the same word (written on the first write edge) presented to the output bus as the read
pointer will not be incremented if R is low. On toggling R, the remaining words written to the
FIFO will appear on the output bus in accordance with the read cycle timings.
In the write flow-through mode (Figure 18), the FIFO stack allows a single word of data
to be written immediately after a single word of data has been read from a full FIFO
stack. The R line causes the FF to be reset, but the W line, being low, causes it to be set again
in anticipation of a new data word. The new word is loaded into the FIFO stack on the leading
edge of W. The W line must be toggled when FF is not set in order to write new data into the
FIFO stack and to increment the write pointer.
Figure 4. Block Diagram of 49152 bits × 9 FIFO Memory (Depth Expansion)
M
67206H
M
67206H
M
67206H
8
M67206H
4143J–AERO–04/07
M67206H
Figure 5. Compound FIFO Expansion
Q0 - Q8
Q9 - Q17
Q0 - Q8
M67206H
R W RS
Notes:
M67206H
I9 - I 17
I0 - I 8
I0 - I 8
Q (N-8) - QN
Q9 - Q17
I9 - I17
I(N-8) - IN
I(N-8) - IN
1. For depth expansion block see section on Depth Expansion and Figure 4.
2. For Flag detection see section on Width Expansion and Figure 3.
Figure 6. Bi-directional FIFO Mode
M
67206H
M
67206H
9
4143J–AERO–04/07
Electrical Characteristics
Absolute Maximum Ratings
*NOTICE:
Supply voltage (VCC - GND): .............................- 0.5V to 7.0V
Input or Output voltage applied: (GND - 0.3V) to (Vcc + 0.3V)
Storage temperature:................................. - 65 °C to + 150 °C
Stresses beyond those listed under "Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at these or any other conditions
beyond those indicated in the operational sections of
this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may
affect device reliability.
DC Parameters
DC Test Conditions
TA = -55°C to + 125°C; Vss = 0V; Vcc = 4.5V to 5.5V
Parameter
1.
2.
3.
M67206H-15
Unit
Value
Operating
supply current
110
120
mA
Max
ICCSB
(2)
Standby
supply current
5
5
mA
Max
ICCPD
(3)
Power down
current
400
400
µA
Max
Icc measurements are made with outputs open.
R = W = RS = FL/RT = VIH.
All input = Vcc.
Description
M67206H
Unit
Value
ILI (1)
Input leakage current
±1
µA
Max
ILO (2)
Output leakage current
±1
µA
Max
VIL (3)
Input low voltage
0.8
V
Max
VIH(3)
Input high voltage
2.2
V
Min
VOL (4)
Output low voltage
0.4
V
Max
VOH(4)
Output high voltage
2.4
V
Min
C IN (5)
Input capacitance
8
pF
Max
Output capacitance
8
pF
Max
C OUT(5)
10
M67206H-30
ICCOP (1)
Parameter
1.
2.
3.
4.
5.
Description
0.4 ≤ Vin ≤ Vcc.
R = VIH, 0.4 ≤ VOUT ≤ VCC.
VIH max = Vcc + 0.3 V. VIL min = -0.3V or -1V pulse width 50 ns. For XI input, VIH = 2.8V
Vcc min, IOL = 8 mA, IOH = -2 mA.
Guaranteed but not tested.
M67206H
4143J–AERO–04/07
M67206H
AC Test Conditions
Input pulse levels: Gnd to 3.0V
Output reference levels: 1.5V
Input rise/Fall times: 5 ns
Output load: See Figure 7
Input timing reference levels: 1.5V
Figure 7. Output Load
Table 3. AC Test Conditions
Symbol (1)
Symbol (2)
M67206H- 15
M67206H- 30
(4)
Min
Max
Min
Max
Read cycle time
25
–
40
–
ns
Access time
–
15
–
30
ns
Parameter (3)
Unit
Read Cycle
TRLRL
tRC
TRLQV
tA
TRHRL
tRR
Read recovery time
10
–
10
–
ns
TRLRH
tRPW
Read pulse width (5)
15
–
30
–
ns
TRLQX
tRLZ
Read low to data low Z (6)
0
–
0
–
ns
TWHQX
tWLZ
Write low to data low Z (6) (7)
3
–
5
–
ns
TRHQX
tDV
Data valid from read high
5
–
5
–
ns
TRHQZ
tRHZ
Read high to data high Z(6)
–
15
–
20
ns
TWLWL
tWC
Write cycle time
25
–
40
–
ns
TWLWH
tWPW
Write pulse width(5)
15
–
30
–
ns
TWHWL
tWR
Write recovery time
10
–
10
–
ns
TDVWH
tDS
Data set-up time
9
–
18
–
ns
TWHDX
tDH
Data hold time
0
–
0
–
ns
Reset cycle time
25
–
40
–
ns
Reset pulse width (5)
15
–
30
–
ns
Write Cycle
Reset Cycle
TRSLWL
tRSC
TRSLRSH
tRS
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4143J–AERO–04/07
Table 3. AC Test Conditions (Continued)
Symbol
(1)
Symbol
(2)
Parameter
(3) (4)
M67206H- 15
M67206H- 30
Min
Max
Min
Max
Unit
TWHRSH
tRSS
Reset set-up time
20
–
30
–
ns
TRSHWL
tRSR
Reset recovery time
10
–
10
–
ns
TRTLWL
tRTC
Retransmit cycle time
25
–
40
–
ns
TRTLRTH
tRT
Retransmit pulse width(5)
15
–
30
–
ns
TWHRTH
tRTS
Retransmit set-up time(6)
15
–
30
–
ns
TRTHWL
tRTR
Retransmit recovery time
10
–
10
–
ns
TRSLEFL
tEFL
Reset to EF low
–
25
–
30
ns
TRSLFFH
tHFH, tFFH
Reset to HF/FF high
–
25
–
30
ns
TRLEFL
tREF
Read low to EF low
–
25
–
30
ns
TRHFFH
tRFF
Read high to FF high
–
25
–
30
ns
TEFHRH
tRPE
Read width after EF high
15
–
30
–
ns
TWHEFH
tWEF
Write high to EF high
–
15
–
30
ns
TWLFFL
tWFF
Write low to FF low
–
20
–
30
ns
TWLHFL
tWHF
Write low to HF low
–
30
–
30
ns
TRHHFH
tRHF
Read high to HF high
–
30
–
30
ns
TFFHWH
tWPF
Write width after FF high
15
–
30
–
ns
TWLXOL
tXOL
Read/Write to XO low
–
15
–
30
ns
TWHXOH
tXOH
Read/Write to XO high
–
15
–
30
ns
TXILXIH
tXI
XI pulse width
15
–
30
–
ns
TXIHXIL
tXIR
XI recovery time
10
–
10
–
ns
TXILRL
tXIS
XI set-up time
10
–
10
–
ns
Retransmit Cycle
Flags
Expansion
1.
2.
3.
4.
5.
6.
7.
12
STD symbol.
ALT symbol.
Timings referenced as in AC test conditions.
All parameters tested only.
Pulse widths less than minimum value are not allowed.
Values guaranteed by design, not currently tested.
Only applies to read data flow-through mode.
M67206H
4143J–AERO–04/07
M67206H
Figure 8. Asynchronous Write and Read Operation
Figure 9. Full Flag from Last Write to First Read
Figure 10. Empty Flag from Last Read to First Write
13
4143J–AERO–04/07
Figure 11. Retransmit
Figure 12. Empty Flag Timing
Figure 13. Full Flag Timing
14
M67206H
4143J–AERO–04/07
M67206H
Figure 14. Half Full Flag Timing
Figure 15. Expansion Out
Figure 16. Expansion In
15
4143J–AERO–04/07
Figure 17. Read Data Flow – Through Mode
Figure 18. Write Data Flow – Through Mode
16
M67206H
4143J–AERO–04/07
M67206H
Ordering Information
Temperature
Range
Speed
Package
Quality Flow
MMCP-67206HV-15-E(1)
25°C
15 ns
SB28.3
Engineering Samples
SMCP-67206HV-15SCC
-55 to +125°C
15 ns
SB28.3
ESCC
SMCP-67206HV-30SCC
-55 to +125°C
30 ns
SB28.3
ESCC
5962-9317708QTC
-55 to +125°C
15 ns
SB28.3
QML Q
5962-9317707QTC
-55 to +125°C
30 ns
SB28.3
QML Q
5962-9317708VTC
-55 to +125°C
15 ns
SB28.3
QML V
5962D9317708VTC
-55 to +125°C
15 ns
SB28.3
QML V RHA
5962D9317707VTC
-55 to +125°C
30 ns
SB28.3
QML V RHA
5962-9317707VTC
-55 to +125°C
30 ns
SB28.3
QML V
25°C
15 ns
FP28.4
Engineering Samples
SMDP-67206HV-15SCC
-55 to +125°C
15 ns
FP28.4
ESCC
SMDP-67206HV-30SCC
-55 to +125°C
30 ns
FP28.4
ESCC
5962-9317708QNC
-55 to +125°C
15 ns
FP28.4
QML Q
5962-9317707QNC
-55 to +125°C
30 ns
FP28.4
QML Q
5962-9317708VNC
-55 to +125°C
15 ns
FP28.4
QML V
5962-9317707VNC
-55 to +125°C
30 ns
FP28.4
QML V
5962D9317708VNC
-55 to +125°C
15 ns
FP28.4
QML V RHA
5962D9317707VNC
-55 to +125°C
30 ns
FP28.4
QML V RHA
MM0 -67206HV-15SV(1)
-55 to +125°C
15 ns
Die
QML V
25°C
15 ns
Die
Engineering Samples
Part Number
MMDP-67206HV-15-E
MM067206HV-15-E(1)
Note:
1. Contact Atmel for availability.
17
4143J–AERO–04/07
Package Drawings
28-lead Side Braze (300 Mils)
18
M67206H
4143J–AERO–04/07
28-lead Flat Pack (400 Mils)
19
M67206H
4143J–AERO–04/07
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Disclaimer: Atmel Corporation makes no warranty for the use of its products, other than those expressly contained in the Company’s standard
warranty which is detailed in Atmel’s Terms and Conditions located on the Company’s web site. The Company assumes no responsibility for any
errors which may appear in this document, reserves the right to change devices or specifications detailed herein at any time without notice, and
does not make any commitment to update the information contained herein. No licenses to patents or other intellectual property of Atmel are
granted by the Company in connection with the sale of Atmel products, expressly or by implication. Atmel’s products are not authorized for use
as critical components in life support devices or systems.
©2007 Atmel Corporation. All rights reserved. Atmel ®, logo and combinations thereof, and Everywhere You Are® are the trademarks or registered trademarks, of Atmel Corporation or its subsidiaries. Other terms and product names may be trademarks of others.
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