ON MM3Z9V1ST3 Zener voltage regulator Datasheet

MM3Z2V4ST1 SERIES
Zener Voltage Regulators
200 mW SOD−323 Surface Mount
Tight Tolerance Portfolio
This series of Zener diodes is packaged in a SOD−323 surface
mount package that has a power dissipation of 200 mW. They are
designed to provide voltage regulation protection and are especially
attractive in situations where space is at a premium. They are well
suited for applications such as cellular phones, hand−held portables,
and high density PC boards.
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1
Cathode
2
Anode
MARKING
DIAGRAM
Specification Features:
• Standard Zener Breakdown Voltage Range −
•
•
•
•
•
•
•
2
2.4 V to 18 V
Steady State Power Rating of 200 mW
Small Body Outline Dimensions:
0.067″ x 0.049″ (1.7 mm x 1.25 mm)
Low Body Height: 0.035″ (0.9 mm)
Package Weight: 4.507 mg/unit
ESD Rating of Class 3 (>16 kV) per Human Body Model
Tight Tolerance VZ
Pb−Free Packages are Available
1
xx M
SOD−323
CASE 477
STYLE 1
xx = Specific Device Code
M = Date Code
ORDERING INFORMATION
Mechanical Characteristics:
CASE: Void-free, transfer-molded plastic
FINISH: All external surfaces are corrosion resistant
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
260°C for 10 Seconds
LEADS: Plated with Pb−Sn or Sn only (Pb−Free)
POLARITY: Cathode indicated by polarity band
FLAMMABILITY RATING: UL 94 V−0
MOUNTING POSITION: Any
Device
Package
Shipping†
MM3ZxxxST1
SOD−323
3000/Tape & Reel
MM3ZxxxST3
SOD−323
10,000/Tape & Reel
MM3ZxxxST1G
SOD−323
(Pb−Free)
3000/Tape & Reel
MM3ZxxxST3G
SOD−323
(Pb−Free)
10,000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
DEVICE MARKING INFORMATION
MAXIMUM RATINGS
Rating
Total Device Dissipation FR−5 Board,
(Note 1) @ TA = 25°C
Derate above 25°C
Thermal Resistance from
Junction−to−Ambient
Junction and Storage
Temperature Range
Symbol
Max
Unit
200
1.5
mW
mW/°C
RJA
635
°C/W
TJ, Tstg
−65 to +150
°C
See specific marking information in the device marking
column of the Electrical Characteristics table on page 2 of
this data sheet.
PD
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. FR−4 Minimum Pad.
 Semiconductor Components Industries, LLC, 2004
November, 2004 − Rev. 10
1
Publication Order Number:
MM3Z2V4ST1/D
MM3Z2V4ST1 SERIES
ELECTRICAL CHARACTERISTICS
(TA = 25°C unless otherwise noted,
VF = 0.9 V Max. @ IF = 10 mA for all types)
Parameter
Symbol
VZ
Reverse Zener Voltage @ IZT
IZT
Reverse Current
ZZT
Maximum Zener Impedance @ IZT
IZK
Reverse Current
ZZK
Maximum Zener Impedance @ IZK
IR
Reverse Leakage Current @ VR
VR
Reverse Voltage
IF
Forward Current
VF
Forward Voltage @ IF
VZ
C
I
IF
VZ VR
V
IR VF
IZT
Maximum Temperature Coefficient of VZ
Zener Voltage Regulator
Max. Capacitance @VR = 0 and f = 1 MHz
ELECTRICAL CHARACTERISTICS (VF = 0.9 Max @ IF = 10 mA for all types)
ZZT
IZ = IZT
@ 10%
Mod Max
A
V
Min
Max
C pF Max @
VR = 0
f = 1 MHz
Max
IR @ VR
dVZ/dt (mV/k)
@ IZT1 = 5 mA
Min
Max
ZZK IZ
= 0.5
mA Max
5.0
2.43
2.63
1000
100
120
1.0
−3.5
0
450
T3
5.0
2.67
2.91
1000
100
100
1.0
−3.5
0
450
MM3Z3V3ST1
T5
5.0
3.32
3.53
1000
95
5.0
1.0
−3.5
0
450
MM3Z3V3TT1, G
TX
5.0
3.19
3.41
100
95
5.0
1.0
−3.5
0
450
MM3Z3V6ST1, G
T6
5.0
3.60
3.85
1000
90
5.0
1.0
−3.5
0
450
MM3Z3V9ST1, G
T7
5.0
3.89
4.16
1000
90
3.0
1.0
−3.5
−2.5
450
MM3Z4V3ST1
T8
5.0
4.17
4.43
1000
90
3.0
1.0
−3.5
0
450
MM3Z4V7ST1, G
T9
5.0
4.55
4.75
800
80
3.0
2.0
−3.5
0.2
260
MM3Z5V1ST1
TA
5.0
4.98
5.2
500
60
2.0
2.0
−2.7
1.2
225
MM3Z5V6ST1
TC
5.0
5.49
5.73
200
40
1.0
2.0
−2.0
2.5
200
MM3Z6V2ST1
TE
5.0
6.06
6.33
100
10
3.0
4.0
0.4
3.7
185
MM3Z6V8ST1
TF
5.0
6.65
6.93
160
15
2.0
4.0
1.2
4.5
155
MM3Z7V5ST1
TG
5.0
7.28
7.6
160
15
1.0
5.0
2.5
5.3
140
MM3Z8V2ST1
TH
5.0
8.02
8.36
160
15
0.7
5.0
3.2
6.2
1358
MM3Z9V1ST1
TK
5.0
8.85
9.23
160
15
0.5
6.0
3.8
7.0
130
MM3Z10VST1
WB
5.0
9.80
10.20
160
15
0.5
6.0
4.5
8.0
130
MM3Z11VST1
WC
5.0
10.78
11.22
160
15
0.5
7.0
5.4
9.0
130
MM3Z12VST1
TN
5.0
11.74
12.24
80
25
0.1
8.0
6.0
10
130
MM3Z15VST1*
WF
5.0
14.7
15.3
80
30
0.05
10.5
9.2
13
110
MM3Z16VST1
TU
5.0
15.85
16.51
80
40
0.05
11.2
10.4
14
105
MM3Z18VST1
TW
5.0
17.56
18.35
80
45
0.05
12.6
12.4
16
100
Device
Marking
Test
Current
Izt mA
MM3Z2V4ST1
T2
MM3Z2V7ST1
Device
Zener Voltage VZ
*Product preview − parts available upon request.
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2
MM3Z2V4ST1 SERIES
Typical Characteristics
1000
TJ = 25°C
IZ(AC) = 0.1 IZ(DC)
f = 1 kHz
IF, FORWARD CURRENT (mA)
Z ZT , DYNAMIC IMPEDANCE ( Ω)
1000
100
100
IZ = 1 mA
10
5 mA
150°C
10
75°C
3.0
10
0.4
0.5
0°C
0.6
0.7
0.8
0.9
1.0
VF, FORWARD VOLTAGE (V)
VZ, NOMINAL ZENER VOLTAGE
Figure 1. Effect of Zener Voltage on
Zener Impedance
1.1
1.2
Figure 2. Typical Forward Voltage
1000
TA = 25°C
0 V BIAS
1 V BIAS
100
BIAS AT
50% OF VZ NOM
10
IR, LEAKAGE CURRENT ( µ A)
1000
C, CAPACITANCE (pF)
25°C
1.0
1.0
100
10
1.0
+150°C
0.1
0.01
+ 25°C
0.001
−55°C
0.0001
0.00001
1.0
4.0
10
VZ, NOMINAL ZENER VOLTAGE (V)
0
5.0
VZ, NOMINAL ZENER VOLTAGE (V)
Figure 3. Typical Capacitance
Figure 4. Typical Leakage Current
100
10
100
80
10
POWER DISSIPATION (%)
I Z , ZENER CURRENT (mA)
TA = 25°C
1.0
0.1
0.01
0
2.0
4.0
6.0
VZ, ZENER VOLTAGE (V)
8.0
10
60
40
20
0
0
25
50
75
100
TEMPERATURE (°C)
125
Figure 6. Steady State Power Derating
Figure 5. Zener Voltage versus Zener Current
(VZ Up to 9 V)
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3
150
MM3Z2V4ST1 SERIES
PACKAGE DIMENSIONS
SOD−323
CASE 477−02
ISSUE E
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. LEAD THICKNESS SPECIFIED PER L/F
DRAWING WITH SOLDER PLATING.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS OR GATE
BURRS.
5. DIMENSION L IS MEASURED FROM END OF
RADIUS.
K
A
D
1
2
B
DIM
A
B
C
D
E
H
J
K
L
E
C
J
NOTE 3
L
MILLIMETERS
MIN
MAX
1.60
1.80
1.15
1.35
0.80
1.00
0.25
0.40
0.15 REF
0.00
0.10
0.089
0.177
2.30
2.70
0.075
−−−
INCHES
MIN
MAX
0.063
0.071
0.045
0.053
0.031
0.039
0.010
0.016
0.006 REF
0.000
0.004
0.0035 0.0070
0.091
0.106
0.003
−−−
H
NOTE 5
STYLE 1:
PIN 1. CATHODE
2. ANODE
SOLDERING FOOTPRINT*
0.63
0.025
0.83
0.033
1.60
0.063
2.85
0.112
SCALE 10:1
mm inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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MM3Z2V4ST1/D
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