ON MM5Z22VT1G Zener voltage regulator Datasheet

MM5ZxxxT1G Series,
SZMM5ZxxxT1G Series
Zener Voltage Regulators
300 mW SOD−523 Surface Mount
This series of Zener diodes is packaged in a SOD−523 surface
mount package. They are designed to provide voltage regulation
protection and are especially attractive in situations where space is at a
premium. They are well suited for applications such as cellular
phones, hand held portables, and high density PC boards.
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SOD−523
CASE 502
STYLE 1
Specification Features:
• Standard Zener Breakdown Voltage Range − 2.4 V to 75 V
• Steady State Power Rating of 300 mW
• Small Body Outline Dimensions:
•
•
•
•
•
0.047″ x 0.032″ (1.20 mm x 0.80 mm)
Low Body Height: 0.028″ (0.7 mm)
ESD Rating of Class 3 (> 16 kV) per Human Body Model
AEC−Q101 Qualified and PPAP Capable − SZMM5ZxxxT1G
SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements
These are Pb−Free Devices*
Mechanical Characteristics:
CASE: Void-free, transfer-molded, thermosetting plastic
2
ORDERING INFORMATION
MAXIMUM RATINGS
Junction and Storage
Temperature Range
1
XX M G
G
(Note: Microdot may be in either location)
Device Meets MSL 1 Requirements
Thermal Resistance,
Junction−to−Ambient (Note 1)
MARKING DIAGRAM
*Date Code orientation may vary depending
upon manufacturing location.
QUALIFIED MAX REFLOW TEMPERATURE: 260°C
Total Device Dissipation FR−5 Board,
@ TA = 25°C
2
Anode
XX = Specific Device Code
M = Date Code*
G
= Pb−Free Package
Epoxy Meets UL 94 V−0
LEAD FINISH: 100% Matte Sn (Tin)
MOUNTING POSITION: Any
Rating
1
Cathode
Symbol
Max
Unit
PD
300
mW
RqJA
390
°C/W
TJ, Tstg
−65 to +150
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. EIA/JEDEC51.3 board design and EIA/JEDEC51.2 still air test method
(25 mm2, 2 oz., 3.8 mm plating).
Device
Package
Shipping†
MM5ZxxxxT1G
SOD−523
(Pb−Free)
3,000 /
Tape & Reel
SZMM5ZxxxT1G
SOD−523
(Pb−Free)
3,000 /
Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics tables starting on
page 3 of this data sheet.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2013
April, 2013 − Rev. 10
1
Publication Order Number:
MM5Z2V4T1/D
MM5ZxxxT1G Series, SZMM5ZxxxT1G Series
ELECTRICAL CHARACTERISTICS
(TA = 25°C unless otherwise noted,
VF = 0.9 V Max. @ IF = 10 mA for all types)
Symbol
Parameter
VZ
Reverse Zener Voltage @ IZT
IZT
Reverse Current
ZZT
Maximum Zener Impedance @ IZT
IZK
Reverse Current
ZZK
Maximum Zener Impedance @ IZK
IR
Reverse Leakage Current @ VR
VR
Reverse Voltage
IF
Forward Current
VF
Forward Voltage @ IF
C
IF
VZ VR
IR VF
IZT
Maximum Temperature Coefficient of VZ
Zener Voltage Regulator
Max. Capacitance @VR = 0 and f = 1 MHz
TYPICAL CHARACTERISTICS
100
80
POWER DISSIPATION (%)
QVZ
I
60
40
20
0
0
25
50
75
100
125
TEMPERATURE (°C)
Figure 1. Steady State Power Derating
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2
150
V
MM5ZxxxT1G Series, SZMM5ZxxxT1G Series
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted, VF = 0.9 V Max. @ IF = 10 mA for all types)
Zener Voltage (Note 1)
Zener Impedance
Leakage Current
C
@ VR = 0
f = 1 MHz
@ IZT
ZZT
@ IZT
Max
mA
W
W
mA
mA
Volts
Min
Max
pF
2.4
2.6
5
100
1000
1.0
50
1.0
−3.5
0
450
2.5
2.7
2.9
5
100
1000
1.0
20
1.0
−3.5
0
450
2.8
3.0
3.2
5
100
1000
1.0
10
1.0
−3.5
0
450
05
3.1
3.3
3.5
5
95
1000
1.0
5
1.0
−3.5
0
450
MM5Z3V6T1G
06
3.4
3.6
3.8
5
90
1000
1.0
5
1.0
−3.5
0
450
MM5Z4V3T1G
08
4.0
4.3
4.6
5
90
1000
1.0
3
1.0
−3.5
0
450
MM5Z4V7T1G
09
4.4
4.7
5.0
5
80
800
1.0
3
2.0
−3.5
0.2
260
MM5Z5V1T1G
0A
4.8
5.1
5.4
5
60
500
1.0
2
2.0
−2.7
1.2
225
MM5Z5V6T1G
0C
5.2
5.6
6.0
5
40
200
1.0
1
2.0
−2.0
2.5
200
MM5Z6V2T1G
0E
5.8
6.2
6.6
5
10
100
1.0
3
4.0
0.4
3.7
185
MM5Z6V8T1G
0F
6.4
6.8
7.2
5
15
160
1.0
2
4.0
1.2
4.5
155
MM5Z7V5T1G
0G
7.0
7.5
7.9
5
15
160
1.0
1
5.0
2.5
5.3
140
MM5Z8V2T1G
0H
7.7
8.2
8.7
5
15
160
1.0
0.7
5.0
3.2
6.2
135
MM5Z9V1T1G
0K
8.5
9.1
9.6
5
15
160
1.0
0.2
7.0
3.8
7.0
130
MM5Z10VT1G
0L
9.4
10
10.6
5
20
160
1.0
0.1
8.0
4.5
8.0
130
MM5Z11VT1G
0M
10.4
11
11.6
5
20
160
1.0
0.1
8.0
5.4
9.0
130
MM5Z12VT1G
0N
11.4
12
12.7
5
25
80
1.0
0.1
8.0
6.0
10
130
MM5Z13VT1G
0P
12.4
13.25
14.1
5
30
80
1.0
0.1
8.0
7.0
11
120
MM5Z15VT1G
0T
14.3
15
15.8
5
30
80
1.0
0.05
10.5
9.2
13
110
MM5Z16VT1G
0U
15.3
16.2
17.1
5
40
80
1.0
0.05
11.2
10.4
14
105
MM5Z18VT1G
0W
16.8
18
19.1
5
45
80
1.0
0.05
12.6
12.4
16
100
MM5Z20VT1G
0Z
18.8
20
21.2
5
55
100
1.0
0.05
14.0
14.4
18
85
MM5Z22VT1G
10
20.8
22
23.3
5
55
100
1.0
0.05
15.4
16.4
20
85
MM5Z24VT1G
11
22.8
24.2
25.6
5
70
120
1.0
0.05
16.8
18.4
22
80
MM5Z27VT1G
12
25.1
27
28.9
2
80
300
1.0
0.05
18.9
21.4
25.3
70
MM5Z30VT1G
14
28
30
32
2
80
300
1.0
0.05
21.0
24.4
29.4
70
MM5Z33VT1G
18
31
33
35
2
80
300
1.0
0.05
23.2
27.4
33.4
70
MM5Z36VT1G
19
34
36
38
2
90
500
1.0
0.05
25.2
30.4
37.4
70
MM5Z39VT1G
20
37
39
41
2
130
500
1.0
0.05
27.3
33.4
41.2
45
MM5Z43VT1G
21
40
43
46
2
150
500
1.0
0.05
30.1
37.6
46.6
40
MM5Z47VT1G
1A
44
47
50
2
170
500
1.0
0.05
32.9
42.0
51.8
40
MM5Z51VT1G
1C
48
51
54
2
180
500
1.0
0.05
35.7
46.6
57.2
40
MM5Z56VT1G
1D
52
56
60
2
200
500
1.0
0.05
39.2
52.2
63.8
40
MM5Z62VT1G
1E
58
62
66
2
215
500
1.0
0.05
43.4
58.8
71.6
35
MM5Z68VT1G
1F
64
68
72
2
240
500
1.0
0.05
47.6
65.6
79.8
35
MM5Z75VT1G
1G
70
75
79
2
255
500
1.0
0.05
52.5
73.4
88.6
35
VZ (Volts)
Device
Marking
Min
Nom
MM5Z2V4T1G
00
2.2
MM5Z2V7T1G
01
MM5Z3V0T1G
02
MM5Z3V3T1G
Device*
ZZK @ IZK
IR @ VR
1. Zener voltage is measured with a pulse test current IZ at an ambient temperature of 25°C.
*Include SZ-prefix devices where applicable.
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3
QVZ
(mV/k) @ IZT
MM5ZxxxT1G Series, SZMM5ZxxxT1G Series
PACKAGE DIMENSIONS
SOD−523
CASE 502
ISSUE E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH.
MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS.
−X−
D
−Y−
E
2X
b
0.08
1
M
2
DIM
A
b
c
D
E
HE
L
L2
X Y
TOP VIEW
A
MILLIMETERS
MIN
NOM
MAX
0.50
0.60
0.70
0.25
0.30
0.35
0.07
0.14
0.20
1.10
1.20
1.30
0.70
0.80
0.90
1.50
1.60
1.70
0.30 REF
0.15
0.20
0.25
STYLE 1:
PIN 1. CATHODE (POLARITY BAND)
2. ANODE
c
HE
SIDE VIEW
2X
RECOMMENDED
SOLDERING FOOTPRINT*
L
2X
1.80
0.48
2X
2X
0.40
L2
BOTTOM VIEW
PACKAGE
OUTLINE
DIMENSION: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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