ON MM5Z3V9ST1 Zener voltage regulator Datasheet

MM5Z2V4ST1 SERIES
Zener Voltage Regulators
100 mW SOD−523 Surface Mount
This series of Zener diodes is packaged in a SOD−523 surface
mount package. They are designed to provide voltage regulation
protection and are especially attractive in situations where space is at a
premium. They are well suited for applications such as cellular
phones, hand held portables, and high density PC boards.
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Specification Features
• Standard Zener Breakdown Voltage Range −2.4 V to 9.1 V
• Steady State Power Rating of 100 mW
• Small Body Outline Dimensions:
•
•
•
•
1
Cathode
0.047″ x 0.032″ (1.20 mm x 0.80 mm)
Low Body Height: 0.028″ (0.7 mm)
ESD Rating of Class 3 (>16 kV) per Human Body Model
Tight Tolerance VZ
These devices are manufactured with a Pb−Free external lead
finish only.
2
Anode
2
1
SOD−523
CASE 502
Mechanical Characteristics
CASE: Void-free, transfer-molded, thermosetting plastic
MARKING DIAGRAM
Epoxy Meets UL 94, V−0
LEAD FINISH: 100% Matte Sn (Tin)
MOUNTING POSITION: Any
XXd
1
QUALIFIED MAX REFLOW TEMPERATURE: 260°C
2
Device Meets MSL 1 Requirements
XX = Specific Device Code
d
= Date Code
MAXIMUM RATINGS
Rating
Total Device Dissipation FR−5 Board,
(Note 1) @ TA = 25°C
Derate above 25°C
Thermal Resistance from
Junction−to−Ambient
Junction and Storage Temperature Range
Symbol
Max
Unit
200
1.5
mW
mW/°C
RJA
635
°C/W
TJ, Tstg
−65 to
+150
°C
ORDERING INFORMATION
PD
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. FR−4 Minimum Pad.
 Semiconductor Components Industries, LLC, 2004
September, 2004 − Rev. 2
1
Device
MM5ZxxxST1
Package
Shipping†
SOD−523
(Pb−Free)
3000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics table on page 2 of
this data sheet.
Publication Order Number:
MM5Z2V4ST1/D
MM5Z2V4ST1 SERIES
ELECTRICAL CHARACTERISTICS
(TA = 25°C unless otherwise noted,
VF = 0.9 V Max. @ IF = 10 mA for all types)
I
IF
Parameter
Symbol
VZ
Reverse Zener Voltage @ IZT
IZT
Reverse Current
ZZT
Maximum Zener Impedance @ IZT
IZK
Reverse Current
ZZK
Maximum Zener Impedance @ IZK
IR
Reverse Leakage Current @ VR
VR
Reverse Voltage
IF
Forward Current
VF
Forward Voltage @ IF
VZ
Maximum Temperature Coefficient of VZ
C
Max. Capacitance @VR = 0 and f = 1 MHz
VZ VR
V
IR VF
IZT
Figure 1. Zener Voltage Regulator
ELECTRICAL CHARACTERISTICS (VF = 0.9 Max @ IF = 10 mA for all types)
Zener Voltage
VZ
ZZT
IZ = IZT
@ 10%
Mod Max
A
V
Min
Max
C pF Max @
VR = 0
f = 1 MHz
Max
IR @ VR
dVZ/dt (mV/k)
@ IZT1 = 5 mA
Min
Max
ZZK IZ
= 0.5
mA Max
5.0
2.43
2.63
1000
100
120
1.0
−3.5
0
450
T3
5.0
2.67
2.91
1000
100
100
1.0
−3.5
0
450
T6
5.0
3.60
3.85
1000
90
5.0
1.0
−3.5
0
450
MM5Z3V9ST1
T7
5.0
3.89
4.16
1000
90
3.0
1.0
−3.5
−2.5
450
MM5Z4V3ST1
T8
5.0
4.17
4.43
1000
90
3.0
1.0
−3.5
0
450
MM5Z4V7ST1
T9
5.0
4.55
4.75
800
80
3.0
2.0
−3.5
0.2
260
MM5Z5V1ST1
TA
5.0
4.98
5.2
500
60
2.0
2.0
−2.7
1.2
225
MM5Z5V6ST1
TC
5.0
5.49
5.73
200
40
1.0
2.0
−2.0
2.5
200
MM5Z6V2ST1
TE
5.0
6.06
6.33
100
10
3.0
4.0
0.4
3.7
185
MM5Z6V8ST1
TF
5.0
6.65
6.93
160
15
2.0
4.0
1.2
4.5
155
MM5Z7V5ST1
TG
5.0
7.28
7.6
160
15
1.0
5.0
2.5
5.3
140
MM5Z8V2ST1
TH
5.0
8.02
8.36
160
15
0.7
5.0
3.2
6.2
1358
MM5Z9V1ST1
TK
5.0
8.85
9.23
160
15
0.5
6.0
3.8
7.0
130
Device
Device
Marking
Test
Current
Izt mA
MM5Z2V4ST1
T2
MM5Z2V7ST1
MM5Z3V6ST1
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2
MM5Z2V4ST1 SERIES
100
POWER DISSIPATION (%)
80
60
40
20
0
0
25
50
75
100
125
TEMPERATURE (°C)
Figure 2. Steady State Power Derating
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3
150
MM5Z2V4ST1 SERIES
PACKAGE DIMENSIONS
SOD−523
CASE 502−01
ISSUE A
−X−
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD THICKNESS
IS THE MINIMUM THICKNESS OF BASE
MATERIAL.
A
−Y−
B
1
2
D 2 PL
0.08 (0.003)
M
DIM
A
B
C
D
J
K
S
T X Y
MILLIMETERS
MIN
NOM
MAX
1.10
1.20
1.30
0.70
0.80
0.90
0.50
0.60
0.70
0.25
0.30
0.35
0.07
0.14
0.20
0.15
0.20
0.25
1.50
1.60
1.70
MIN
0.043
0.028
0.020
0.010
0.0028
0.006
0.059
INCHES
NOM
0.047
0.032
0.024
0.012
0.0055
0.008
0.063
MAX
0.051
0.035
0.028
0.014
0.0079
0.010
0.067
C
−T−
K
J
SEATING
PLANE
S
SOLDERING FOOTPRINT*
1.40
0.0547
0.40
0.0157
0.40
0.0157
SCALE 10:1
mm inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
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MM5Z2V4ST1/D
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