Fairchild MM74HC74AMX NL Dual d-type flip-flop with preset and clear Datasheet

Revised January 2005
MM74HC74A
Dual D-Type Flip-Flop with Preset and Clear
General Description
The MM74HC74A utilizes advanced silicon-gate CMOS
technology to achieve operating speeds similar to the
equivalent LS-TTL part. It possesses the high noise immunity and low power consumption of standard CMOS integrated circuits, along with the ability to drive 10 LS-TTL
loads.
This flip-flop has independent data, preset, clear, and clock
inputs and Q and Q outputs. The logic level present at the
data input is transferred to the output during the positivegoing transition of the clock pulse. Preset and clear are
independent of the clock and accomplished by a low level
at the appropriate input.
The 74HC logic family is functionally and pinout compatible
with the standard 74LS logic family. All inputs are protected
from damage due to static discharge by internal diode
clamps to VCC and ground.
Features
■ Typical propagation delay: 20 ns
■ Wide power supply range: 2–6V
■ Low quiescent current: 40 µA maximum (74HC Series)
■ Low input current: 1 µA maximum
■ Fanout of 10 LS-TTL loads
Ordering Code:
Order Number
Package
Package Description
Number
MM74HC74AM
M14A
14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow
MM74HC74AMX_NL
M14A
Pb-Free 14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow
MM74HC74ASJ
M14D
Pb-Free 14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
MM74HC74AMTC
MTC14
14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
MM74HC74AMTCX_NL
MTC14
Pb-Free 14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm
Wide
MM74HC74AN
N14A
14-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide
Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.
Pb-Free package per JEDEC J-STD-020B.
Connection Diagram
Truth Table
Pin Assignments for DIP, SOIC, SOP and TSSOP
Inputs
Outputs
PR
CLR
CLK
D
Q
Q
L
H
X
X
H
L
H
L
X
X
L
H
L
L
X
X
H (Note 1)
H (Note 1)
H
H
↑
H
H
L
H
H
↑
L
L
H
H
H
L
X
Q0
Q0
Note: Q0 = the level of Q before the indicated input conditions were established.
Note 1: This configuration is nonstable; that is, it will not persist when preset and clear inputs return to their inactive (HIGH) level.
© 2005 Fairchild Semiconductor Corporation
DS005106
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MM74HC74A Dual D-Type Flip-Flop with Preset and Clear
September 1983
MM74HC74A
Logic Diagram
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2
Recommended Operating
Conditions
(Note 3)
−0.5 to +7.0V
Supply Voltage (VCC)
DC Input Voltage (VIN)
−1.5 to VCC +1.5V
DC Output Voltage (VOUT)
−0.5 to VCC +0.5V
Clamp Diode Current (IIK, IOK)
±20 mA
DC Output Current, per pin (IOUT)
±25 mA
Min
Max
Supply Voltage (VCC)
2
6
V
DC Input or Output Voltage
0
VCC
V
−40
+85
°C
(VIN, OUT)
Operating Temperature Range (TA)
DC VCC or GND Current, per pin
Input Rise or Fall Times
±50 mA
(ICC)
Storage Temperature Range (TSTG)
−65°C to +150°C
(tr, tf) VCC = 2.0V
1000
ns
VCC = 4.5V
500
ns
VCC = 6.0V
400
ns
Power Dissipation (PD)
(Note 4)
600 mW
S.O. Package only
500 mW
Note 2: Absolute Maximum Ratings are those values beyond which damage to the device may occur.
Note 3: Unless otherwise specified all voltages are referenced to ground.
Lead Temperature (TL)
DC Electrical Characteristics
VIH
VIL
Parameter
Conditions
(Note 5)
TA = 25°C
VCC
Typ
TA = −40 to 85°C TA = −55 to 125°C
Guaranteed Limits
Units
Minimum HIGH Level
2.0V
1.5
1.5
1.5
V
Input Voltage
4.5V
3.15
3.15
3.15
V
6.0V
4.2
4.2
4.2
V
2.0V
0.5
0.5
0.5
V
4.5V
1.35
1.35
1.35
V
6.0V
1.8
1.8
1.8
V
Maximum LOW Level
Input Voltage
VOH
Note 4: Power Dissipation temperature derating — plastic “N” package: −
12 mW/°C from 65°C to 85°C.
260°C
(Soldering 10 seconds)
Symbol
Units
Minimum HIGH Level
VIN = VIH or VIL
Output Voltage
|IOUT| ≤ 20 µA
2.0V
2.0
1.9
1.9
1.9
V
4.5V
4.5
4.4
4.4
4.4
V
6.0V
6.0
5.9
5.9
5.9
V
|IOUT| ≤ 4.0 mA
4.5V
4.3
3.98
3.84
3.7
V
|IOUT| ≤ 5.2 mA
6.0V
5.2
5.48
5.34
5.2
V
VIN = VIH or VIL
VOL
Maximum LOW Level
VIN = VIH or VIL
Output Voltage
|IOUT| ≤ 20 µA
2.0V
0
0.1
0.1
0.1
V
4.5V
0
0.1
0.1
0.1
V
6.0V
0
0.1
0.1
0.1
V
|IOUT| ≤ 4.0 mA
4.5V
0.2
0.26
0.33
0.4
V
|IOUT| ≤ 5.2 mA
6.0V
0.2
0.26
0.33
0.4
V
VIN = VCC or GND
6.0V
±0.1
±1.0
±1.0
µA
Maximum Quiescent
VI N =VCC or GND
6.0V
4.0
40
80
µA
Supply Current
IOUT = 0 µA
VIN = VIH or VIL
IIN
Maximum Input
Current
ICC
Note 5: For a power supply of 5V ±10% the worst case output voltages (VOH, and VOL) occur for HC at 4.5V. Thus the 4.5V values should be used when
designing with this supply. Worst case VIH and VIL occur at VCC = 5.5V and 4.5V respectively. (The VIH value at 5.5V is 3.85V.) The worst case leakage current (IIN, ICC, and IOZ) occur for CMOS at the higher voltage and so the 6.0V values should be used.
3
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MM74HC74A
Absolute Maximum Ratings(Note 2)
MM74HC74A
AC Electrical Characteristics
VCC = 5V, TA = 25°C, CL = 15 pF, tr = tf = 6 ns
Symbol
Parameter
Conditions
Guaranteed
Typ
Limit
Units
fMAX
Maximum Operating Frequency
72
30
MHz
tPHL, tPLH
Maximum Propagation
10
30
ns
17
40
ns
6
5
ns
10
20
ns
0
0
ns
8
16
ns
Delay Clock to Q or Q
tPHL, tPLH
Maximum Propagation
Delay Preset or Clear to Q or Q
tREM
Minimum Removal Time,
Preset or Clear to Clock
ts
Minimum Setup Time
Data to Clock
tH
Minimum Hold Time
Clock to Data
tW
Minimum Pulse Width
Clock, Preset or Clear
AC Electrical Characteristics
CL = 50 pF, tr = tf = 6 ns (unless otherwise specified)
Symbol
fMAX
Parameter
Conditions
TA = 25°C
VCC
Typ
TA = −40 to 85°C TA = −55 to 125°C
Guaranteed Limits
Units
Maximum Operating
2.0V
22
6
5
4
MHz
Frequency
4.5V
72
30
24
20
MHz
6.0V
94
35
28
24
MHz
tPHL, tPLH Maximum Propagation
2.0V
34
110
140
165
ns
Delay Clock to Q or Q
4.5V
12
22
28
33
ns
6.0V
10
19
24
28
ns
2.0V
66
150
190
225
ns
tPHL, tPLH Maximum Propagation
tREM
ts
tH
Delay Preset or Clear
4.5V
20
30
38
45
ns
To Q or Q
6.0V
16
26
33
38
ns
Minimum Removal Time
2.0V
20
50
65
75
ns
Preset or Clear
4.5V
6
10
13
15
ns
To Clock
6.0V
5
9
11
13
ns
Minimum Setup Time
2.0V
35
80
100
120
ns
Data to Clock
4.5V
10
16
20
24
ns
6.0V
8
14
17
20
ns
Minimum Hold Time
2.0V
0
0
0
ns
Clock to Data
tW
0
0
ns
0
0
ns
ns
2.0V
30
80
101
119
Clock, Preset or Clear
4.5V
9
16
20
24
ns
6.0V
8
14
17
20
ns
Rise and Fall Time
CPD
0
0
Minimum, Pulse Width
tTLH, tTHL Maximum Output
tr, tf
4.5V
6.0V
2.0V
25
75
95
110
ns
4.5V
7
15
19
22
ns
6.0V
6
13
16
19
ns
ns
Maximum Input Rise
2.0V
1000
1000
1000
and Fall Time
4.5V
500
500
500
ns
6.0V
400
400
400
ns
Power Dissipation
(per flip-flop)
80
pF
Capacitance (Note 6)
CIN
Maximum Input
5
10
10
10
Capacitance
Note 6: CPD determines the no load dynamic power consumption, PD = CPD VCC2 f + ICC VCC, and the no load dynamic current consumption,
IS = CPD VCC f + ICC.
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4
pF
MM74HC74A
Physical Dimensions inches (millimeters) unless otherwise noted
14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow
Package Number M14A
5
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MM74HC74A
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
Pb-Free 14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
Package Number M14D
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6
MM74HC74A
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Package Number MTC14
7
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MM74HC74A Dual D-Type Flip-Flop with Preset and Clear
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
14-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide
Package Number N14A
Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and
Fairchild reserves the right at any time without notice to change said circuitry and specifications.
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FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD
SEMICONDUCTOR CORPORATION. As used herein:
2. A critical component in any component of a life support
device or system whose failure to perform can be reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the
body, or (b) support or sustain life, and (c) whose failure
to perform when properly used in accordance with
instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the
user.
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