Fairchild MM74HC86NX NL Quad 2-input exclusive or gate Datasheet

Revised January 2005
MM74HC86
Quad 2-Input Exclusive OR Gate
General Description
Features
The MM74HC86 EXCLUSIVE OR gate utilizes advanced
silicon-gate CMOS technology to achieve operating
speeds similar to equivalent LS-TTL gates while maintaining the low power consumption and high noise immunity
characteristic of standard CMOS integrated circuits. These
gates are fully buffered and have a fanout of 10 LS-TTL
loads. The 74HC logic family is functionally as well as pin
out compatible with the standard 74LS logic family. All
inputs are protected from damage due to static discharge
by internal diode clamps to VCC and ground.
■ Typical propagation delay: 9 ns
■ Wide operating voltage range: 2–6V
■ Low input current: 1 µA maximum
■ Low quiescent current: 20 µA maximum (74 Series)
■ Output drive capability: 10 LS-TTL loads
Ordering Code:
Order Number
Package
Package Description
Number
MM74HC86M
M14A
MM74HC86MX_NL
M14A
Pb-Free 14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow
MM74HC86SJ
M14D
Pb-Free 14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
MM74HC86MTC
MTC14
14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow
14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
MM74HC86N
N14A
14-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide
MM74HC86NX_NL
N14A
Pb-Free 14-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide
Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.
Pb-Free package per JEDEC J-STD-020B.
Connection Diagram
Truth Table
Inputs
Pin Assignments for DIP, SOIC, SOP and TSSOP
Outputs
A
B
L
L
Y
L
L
H
H
H
L
H
H
H
L
Y = A ⊕ B = A B + AB
Top View
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DS005305
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MM74HC86 Quad 2-Input Exclusive OR Gate
September 1983
MM74HC86
Absolute Maximum Ratings(Note 1)
Recommended Operating
Conditions
(Note 2)
−0.5 to +7.0V
Supply Voltage (VCC)
DC Input Voltage (VIN)
−1.5 to VCC +1.5V
DC Output Voltage (VOUT)
−0.5 to VCC +0.5V
Clamp Diode Current (IIK, IOK)
±20 mA
DC Output Current, per pin (IOUT)
±25 mA
DC VCC or GND Current, per pin (ICC)
±50 mA
Storage Temperature Range (TSTG)
Min
Max
Units
Supply Voltage (VCC)
2
6
V
DC Input or Output Voltage
0
VCC
V
−40
+85
°C
(VIN, VOUT)
Operating Temperature Range (TA)
Input Rise or Fall Times
−65°C to +150°C
(tr, tf)
Power Dissipation (PD)
(Note 3)
600 mW
S.O. Package only
500 mW
Symbol
VIH
VIL
VOH
Parameter
Conditions
ns
500
ns
VCC = 6.0V
400
ns
Note 2: Unless otherwise specified all voltages are referenced to ground.
260°C
DC Electrical Characteristics
1000
VCC = 4.5V
Note 1: Absolute Maximum Ratings are those values beyond which damage to the device may occur.
Lead Temperature (TL)
(Soldering 10 seconds)
VCC = 2.0V
Note 3: Power Dissipation temperature derating — plastic “N” package: −
12 mW/°C from 65°C to 85°C.
(Note 4)
TA = 25°C
VCC
Typ
TA = −40 to 85°C TA = −55 to 125°C
Guaranteed Limits
Units
Minimum HIGH Level
2.0V
1.5
1.5
1.5
Input Voltage
4.5V
3.15
3.15
3.15
V
V
6.0V
4.2
4.2
4.2
V
V
Maximum LOW Level
2.0V
0.5
0.5
0.5
Input Voltage
4.5V
1.35
1.35
1.35
V
6.0V
1.8
1.8
1.8
V
Minimum HIGH Level
VIN = VIH or VIL
Output Voltage
|IOUT| ≤ 20 µA
2.0V
2.0
1.9
1.9
1.9
V
4.5V
4.5
4.4
4.4
4.4
V
6.0V
6.0
5.9
5.9
5.9
V
|IOUT| ≤ 4.0 mA
4.5V
4.2
3.98
3.84
3.7
V
|IOUT| ≤ 5.2 mA
6.0V
5.7
5.48
5.34
5.2
V
VIN = VIH or VIL
VOL
Maximum LOW Level
VIN = VIH or VIL
Output Voltage
|IOUT| ≤ 20 µA
2.0V
0
0.1
0.1
0.1
V
4.5V
0
0.1
0.1
0.1
V
6.0V
0
0.1
0.1
0.1
V
|IOUT| ≤ 4.0 mA
4.5V
0.2
0.26
0.33
0.4
V
|IOUT | ≤5.2 mA
6.0V
0.2
0.26
0.33
0.4
V
VIN = VCC or GND
6.0V
±0.1
±1.0
±1.0
µA
Maximum Quiescent
VIN = VCC or GND
6.0V
2.0
20
40
µA
Supply Current
IOUT = 0 µA
VIN = VIH or VIL
IIN
Maximum Input
Current
ICC
Note 4: For a power supply of 5V ±10% the worst case output voltages (VOH, and VOL) occur for HC at 4.5V. Thus the 4.5V values should be used when
designing with this supply. Worst case VIH and VIL occur at VCC = 5.5V and 4.5V respectively. (The VIH value at 5.5V is 3.85V.) The worst case leakage current (IIN, ICC, and IOZ) occur for CMOS at the higher voltage and so the 6.0V values should be used.
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VCC = 5V, TA = 25°C, CL = 15 pF, tr = tf = 6 ns
Symbol
Parameter
tPHL, tPLH
Conditions
Typ
Maximum Propagation
Guaranteed
Limit
12
20
Units
ns
Delay
AC Electrical Characteristics
VCC = 2.0V to 6.0V, CL = 50 pF, tr = tf = 6 ns (unless otherwise specified)
Symbol
tPHL, tPLH
tTLH, tTHL
CPD
Parameter
Conditions
TA = 25°C
VCC
Typ
TA = −40 to 85°C TA = −55 to 125°C
Guaranteed Limits
Units
Maximum Propagation
2.0V
60
120
151
179
ns
Delay
4.5V
12
24
30
36
ns
6.0V
10
20
26
30
ns
Maximum Output Rise
2.0V
30
75
95
110
ns
and Fall Time
4.5V
8
15
19
22
ns
6.0V
7
13
16
19
Power Dissipation
(per gate)
25
ns
pF
Capacitance (Note 5)
CIN
Maximum Input
5
10
10
10
pF
Capacitance
Note 5: CPD determines the no load dynamic power consumption, PD = CPD VCC2 f + ICC VCC, and the no load dynamic current consumption,
IS = CPD VCC f + ICC.
3
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MM74HC86
AC Electrical Characteristics
MM74HC86
Physical Dimensions inches (millimeters) unless otherwise noted
14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow
Package Number M14A
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MM74HC86
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
Pb-Free 14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
Package Number M14D
5
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MM74HC86
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Package Number MTC14
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6
MM74HC86 Quad 2-Input Exclusive OR Gate
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
14-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide
Package Number N14A
Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and
Fairchild reserves the right at any time without notice to change said circuitry and specifications.
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FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD
SEMICONDUCTOR CORPORATION. As used herein:
2. A critical component in any component of a life support
device or system whose failure to perform can be reasonably expected to cause the failure of the life support
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1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the
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to perform when properly used in accordance with
instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the
user.
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