Freescale MMA7330L ±4g - 16g three axis low-g micromachined accelerometer Datasheet

Document Number: MMA7330L
Rev 2, 8/2007
Freescale Semiconductor
Technical Data
±4g, ±12g Three Axis Low-g
Micromachined Accelerometer
MMA7330L
The MMA7330L is a low power, low profile capacitive micromachined
accelerometer featuring signal conditioning, a 1-pole low pass filter,
temperature compensation, self test, and g-Select which allows for the
selection between 2 sensitivities. Zero-g offset and sensitivity are factory set
and require no external devices. The MMA7330L includes a Sleep Mode that
makes it ideal for handheld battery powered electronics.
Features
•
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MMA7330L: XYZ AXIS
ACCELEROMETER
±4g, ±12g
3mm x 5mm x 1.0mm LGA-14 Package
Low Current Consumption: 400 μA
Sleep Mode: 3 μA
Low Voltage Operation: 2.2 V – 3.6 V
Selectable Sensitivity (±4g, ±12g)
Fast Turn On Time (0.5 ms Enable Response Time)
Self Test for Freefall Detect Diagnosis
Signal Conditioning with Low Pass Filter
Robust Design, High Shocks Survivability
RoHS Compliant
Environmentally Preferred Product
Low Cost
Bottom View
14 LEAD
LGA
CASE 1935-01
Typical Applications
•
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•
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3D Gaming: Tilt and Motion Sensing, Event Recorder
HDD MP3 Player: Freefall Detection
Laptop PC: Freefall Detection, Anti-Theft
Cell Phone: Image Stability, Text Scroll, Motion Dialing, E-Compass
Pedometer: Motion Sensing
PDA: Text Scroll
Navigation and Dead Reckoning: E-Compass Tilt Compensation
Robotics: Motion Sensing
ORDERING INFORMATION
Top View
N/C
14
N/C
1
XOUT
2
12 N/C
YOUT
3
11 N/C
ZOUT
4
10 g-Select
VSS
5
VDD
6
13 Self Test
9 N/C
Part Number
Temperature
Range
Package
Drawing
Package
Shipping
MMA7330LT
–40 to +85°C
1935-01
LGA-14
Tray
7
MMA7330LR2
–40 to +85°C
1935-01
LGA-14
Tape & Reel
Sleep
8 N/C
Figure 1. Pin Connections
© Freescale Semiconductor, Inc., 2007. All rights reserved.
VDD
g-Select
Sleep
G-CELL
SENSOR
OSCILLATOR
CLOCK
GEN
X-TEMP
COMP
XOUT
C to V
CONVERTER
GAIN
+
FILTER
Y-TEMP
COMP
YOUT
Z-TEMP
COMP
ZOUT
SELFTEST
Self Test
CONTROL LOGIC
NVM TRIM
CIRCUITS
VSS
Figure 2. Simplified Accelerometer Functional Block Diagram
Table 1. Maximum Ratings
(Maximum ratings are the limits to which the device can be exposed without causing permanent damage.)
Rating
Symbol
Value
Unit
Maximum Acceleration (all axis)
gmax
±5000
g
Supply Voltage
VDD
–0.3 to +3.6
V
Drop Test(1)
Ddrop
1.8
m
Tstg
–40 to +125
°C
Storage Temperature Range
1. Dropped onto concrete surface from any axis.
ELECTRO STATIC DISCHARGE (ESD)
WARNING: This device is sensitive to electrostatic
discharge.
Although the Freescale accelerometer contains internal
2000 V ESD protection circuitry, extra precaution must be
taken by the user to protect the chip from ESD. A charge of
over 2000 volts can accumulate on the human body or
associated test equipment. A charge of this magnitude can
alter the performance or cause failure of the chip. When
handling the accelerometer, proper ESD precautions should
be followed to avoid exposing the device to discharges which
may be detrimental to its performance.
MMA7330L
2
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Freescale Semiconductor
Table 2. Operating Characteristics
Unless otherwise noted: –20°C < TA < 85°C, 2.2 V < VDD < 3.6 V, Acceleration = 0g, Loaded output(1)
Characteristic
Symbol
Min
Typ
Max
Unit
VDD
IDD
IDD
TA
2.2
—
—
-40
2.8
400
3
—
3.6
600
10
+85
V
μA
μA
°C
gFS
gFS
—
—
±4
±12
—
—
g
g
VOFF
VOFF, TA
1.316
—
1.4
±2.0
1.484
—
V
mg/°C
S4g
S12g
S,TA
289.5
75.2
—
308
83.6
±0.03
326.5
91.9
—
mV/g
mV/g
%/°C
f-3dBXY
f-3dBZ
ZO
—
—
—
400
300
32
—
—
—
Hz
Hz
kΩ
ΔgSTXY
ΔgSTZ
VIL
VIH
+0.05
+0.8
VSS
0.7 VDD
-0.1
+1.0
—
—
—
+1.2
0.3 VDD
VDD
g
g
V
V
nPSD
—
350
—
μg/ Hz
tRESPONSE
tENABLE
tST
—
—
—
1.0
0.5
2.0
2.0
2.0
5.0
ms
ms
ms
fGCELLXY
fGCELLZ
fCLK
—
—
—
6.0
3.4
11
—
—
—
kHz
kHz
kHz
VFSO
VSS+0.1
—
VDD–0.1
V
NLOUT
-1.0
—
+1.0
%FSO
VXY, XZ, YZ
-5.0
—
+5.0
%
(2)
Operating Range
Supply Voltage(3)
Supply Current(4)
Supply Current at Sleep Mode(4)
Operating Temperature Range
Acceleration Range, X-Axis, Y-Axis, Z-Axis
g-Select: 0
g-Select: 1
Output Signal
Zero g (TA = 25°C, VDD = 2.8 V)(5), (6)
Zero g(4)
Sensitivity (TA = 25°C, VDD = 2.8 V)
4g
12g
Sensitivity(4)
Bandwidth Response
XY
Z
Output Impedance
Self Test
Output Response
XOUT, YOUT
ZOUT
Input Low
Input High
Noise
Power Spectral Density RMS (0.1 Hz – 1 kHz)(4)
Control Timing
Power-Up Response Time(7)
Enable Response Time(8)
Self Test Response Time(9)
Sensing Element Resonant Frequency
XY
Z
Internal Sampling Frequency
Output Stage Performance
Full-Scale Output Range (IOUT = 30 µA)
Nonlinearity, XOUT, YOUT, ZOUT
Cross-Axis Sensitivity(10)
1. For a loaded output, the measurements are observed after an RC filter consisting of an internal 32kΩ resistor and an external 3.3nF capacitor
(recommended as a minimum to filter clock noise) on the analog output for each axis and a 0.1μF capacitor on VDD - GND. The output sensor
bandwidth is determined by the Capacitor added on the output. f = 1/2π * (32 x 103) * C. C = 3.3 nF corresponds to BW = 1507HZ, which is
the minimum to filter out internal clock noise.
2. These limits define the range of operation for which the part will meet specification.
3. Within the supply range of 2.2 and 3.6 V, the device operates as a fully calibrated linear accelerometer. Beyond these supply limits the device
may operate as a linear device but is not guaranteed to be in calibration.
4. This value is measured with g-Select in 4g mode.
5. The device can measure both + and – acceleration. With no input acceleration the output is at midsupply. For positive acceleration the output
will increase above VDD/2. For negative acceleration, the output will decrease below VDD/2.
6. For optimal 0g offset performance, adhere to AN3484 and AN3447.
7. The response time between 10% of full scale Vdd input voltage and 90% of the final operating output voltage.
8. The response time between 10% of full scale Sleep Mode input voltage and 90% of the final operating output voltage.
9. The response time between 10% of the full scale self test input voltage and 90% of the self test output voltage.
10. A measure of the device’s ability to reject an acceleration applied 90° from the true axis of sensitivity.
MMA7330L
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Freescale Semiconductor
3
PRINCIPLE OF OPERATION
The Freescale accelerometer is a surface-micromachined
integrated-circuit accelerometer.
The device consists of a surface micromachined
capacitive sensing cell (g-cell) and a signal conditioning ASIC
contained in a single package. The sensing element is sealed
hermetically at the wafer level using a bulk micromachined
cap wafer.
The g-cell is a mechanical structure formed from
semiconductor materials (polysilicon) using semiconductor
processes (masking and etching). It can be modeled as a set
of beams attached to a movable central mass that move
between fixed beams. The movable beams can be deflected
from their rest position by subjecting the system to an
acceleration (Figure 3).
As the beams attached to the central mass move, the
distance from them to the fixed beams on one side will
increase by the same amount that the distance to the fixed
beams on the other side decreases. The change in distance
is a measure of acceleration.
The g-cell beams form two back-to-back capacitors
(Figure 3). As the center beam moves with acceleration, the
distance between the beams changes and each capacitor's
value will change, (C = Aε/D). Where A is the area of the
beam, ε is the dielectric constant, and D is the distance
between the beams.
The ASIC uses switched capacitor techniques to measure
the g-cell capacitors and extract the acceleration data from
the difference between the two capacitors. The ASIC also
signal conditions and filters (switched capacitor) the signal,
providing a high level output voltage that is ratiometric and
proportional to acceleration.
Acceleration
Figure 3. Simplified Transducer Physical Model
SPECIAL FEATURES
g-Select
The g-Select feature allows for the selection between two
sensitivities. Depending on the logic input placed on pin 10,
the device internal gain will be changed allowing it to function
with a 4g or 12g sensitivity (Table 3). This feature is ideal
when a product has applications requiring two different
sensitivities for optimum performance. The sensitivity can be
changed at anytime during the operation of the product. The
g-Select pin can be left unconnected for applications
requiring only a 4g sensitivity as the device has an internal
pull-down to keep it at that sensitivity (308mV/g)).
Table 3. g-Select Pin Description
g-Select
g-Range
Sensitivity
0
4g
308 mV/g
1
12g
83.6 mV/g
Sleep Mode
The 3 axis accelerometer provides a Sleep Mode that is
ideal for battery operated products. When Sleep Mode is
active, the device outputs are turned off, providing significant
reduction of operating current. A low input signal on pin 7
(Sleep Mode) will place the device in this mode and reduce
the current to 3 μA typ. For lower power consumption, it is
recommended to set g-Select to 4g mode. By placing a high
input signal on pin 7, the device will resume to normal mode
of operation.
Filtering
The 3 axis accelerometer contains an onboard single-pole
switched capacitor filter. Because the filter is realized using
switched capacitor techniques, there is no requirement for
external passive components (resistors and capacitors) to set
the cut-off frequency.
Ratiometricity
Ratiometricity simply means the output offset voltage and
sensitivity will scale linearly with applied supply voltage. That
is, as supply voltage is increased, the sensitivity and offset
increase linearly; as supply voltage decreases, offset and
sensitivity decrease linearly. This is a key feature when
interfacing to a microcontroller or an A/D converter because
it provides system level cancellation of supply induced errors
in the analog to digital conversion process.
Self Test
The sensor provides a self test feature that allows the
verification of the mechanical and electrical integrity of the
accelerometer at any time before or after installation. This
feature is critical in applications such as hard disk drive
protection where system integrity must be ensured over the
life of the product. Customers can use self test to verify the
solderability to confirm that the part was mounted to the PCB
correctly. When the self test function is initiated, an
electrostatic force is applied to each axis to cause it to deflect.
The x- and y-axis are deflected slightly while the z-axis is
trimmed to deflect 1g. This procedure assures that both the
mechanical (g-cell) and electronic sections of the
accelerometer are functioning.
MMA7330L
4
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Freescale Semiconductor
BASIC CONNECTIONS
Pin Descriptions
PCB Layout
Top View
POWER SUPPLY
N/C
XOUT
2
12 N/C
YOUT
3
11 N/C
ZOUT
4
10 g-Select
VSS
5
9 N/C
VDD
6
8 N/C
13 Self Test
7
Sleep
Pin No.
Pin Name
1
N/C
2
XOUT
X direction output voltage
3
YOUT
Y direction output voltage
4
ZOUT
Z direction output voltage
5
VSS
Power Supply Ground
6
VDD
Power Supply Input
7
Sleep
8
N/C
No internal connection
Leave unconnected
9
N/C
No internal connection
Leave unconnected
10
g-Select
11
N/C
Unused for factory trim
Leave unconnected
12
N/C
Unused for factory trim
Leave unconnected
13
Self Test
14
N/C
No internal connection
Leave unconnected
Logic input pin to enable product or Sleep Mode
P0
VSS
g-Select
P1
Self Test
P2
XOUT
YOUT
C
C
C
C
A/DIN
C
A/DIN
A/DIN
Input pin to initiate Self Test
13
2
3.3 nF
MMA7340L
VDD
YOUT
2. Physical coupling distance of the accelerometer to
the microcontroller should be minimal.
4. Use a 3.3nF capacitor on the outputs of the
accelerometer to minimize clock noise (from the
switched capacitor filter circuit).
6. Accelerometer and microcontroller should not be a
high current path.
7. A/D sampling rate and any external power supply
switching frequency should be selected such that
they do not interfere with the internal accelerometer
sampling frequency (11 kHz for the sampling
frequency). This will prevent aliasing errors.
g-Select
Self Test
NOTES:
1. Use 0.1 µF capacitor on VDD to decouple the power
source.
5. PCB layout of power and ground should not couple
power supply noise.
Unused for factory trim
Leave unconnected
10
Figure 6. Recommended PCB Layout for Interfacing
Accelerometer to Microcontroller
3. Place a ground plane beneath the accelerometer to
reduce noise, the ground plane should be attached to
all of the open ended terminals shown in Figure 6.
Logic input pin to select g level
6
3
8. 10MΩ or higher is recommended on XOUT, YOUT and
ZOUT to prevent loss due to the voltage divider
relationship between the internal 32 kΩ resistor and
the measurement input impedance.
3.3 nF
0.1 μF
5
Logic
Input
Sleep
C
Description
XOUT
Logic
Input
VDD
ZOUT
Table 4. Pin Descriptions
VDD
VRH
VSS
Figure 4. Pinout Description
Logic
Input
VDD
Microcontroller
1
Accelerometer
14
N/C
7
VSS
Sleep
ZOUT
4
3.3 nF
Figure 5. Accelerometer with Recommended
Connection Diagram
MMA7330L
Sensors
Freescale Semiconductor
5
DYNAMIC ACCELERATION
Top View
+Y
4
3
2
1
7
+X
14
8
9
+Z
Bottom
-X
5
Top
6
Side View
-Z
10 11 12 13
-Y
: Arrow indicates direction of package movement.
14-Pin LGA Package
STATIC ACCELERATION
Direction of Earth's gravity field.*
Top View
6
5
4
3
2
1
7
14
9
Side View
Top
10 11 12 13
10 11 12 13
9
1
2
8
7
OUT
13 12 11 10
@ +1g = 1.708 V
9
8
X
OUT
@ 0g = 1.4 V
@ 0g = 1.4 V
@ +1g = 1.708 V
OUT
OUT
Bottom
1
OUT
Z
@ 0g = 1.4 V
Z
2
Y
OUT
@ 0g =1.4 V
14
X
OUT
Y
3
3
OUT
Bottom
X
4
4
@ 0g = 1.4 V
OUT
10 11 12 13
6
@ +1g = 1.708 V
Z
5
@ 0g = 1.4 V
6
OUT
Y
9
X
8
5
7
14
8
Y
@ 0g = 1.4 V
Z
@ 0g = 1.4 V
OUT
14
7
@ -1g = 1.092 V
OUT
Top
X
OUT
Y
@ 0g = 1.4 V
Z
@ -1g = 1.092 V
OUT
OUT
1
2
X
OUT
3
4
5
@ -1g = 1.092 V
Z
@ 0g = 1.4 V
OUT
6
@ 0g = 1.4 V
Y
OUT
@ 0g = 1.4 V
* When positioned as shown, the Earth’s gravity will result in a positive 1g output.
MMA7330L
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Freescale Semiconductor
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
PCB Mounting Recommendations
MEMS based sensors are sensitive to Printed Circuit
Board (PCB) reflow processes. For optimal zero-g offset after
PCB mounting, care must be taken to PCB layout and reflow
conditions. Reference application note AN3484 for best
practices to minimize the zero-g offset shift after PCB
mounting.
Surface mount board layout is a critical portion of the total
design. The footprint for the surface mount packages must be
the correct size to ensure proper solder connection interface
between the board and the package.
With the correct footprint, the packages will self-align when
subjected to a solder reflow process. It is always
recommended to design boards with a solder mask layer to
avoid bridging and shorting between solder pads.
1
13
10x0.8
6x2
6
8
14x0.6
12x1
14x0.9
Figure 7. LGA 14-Lead, 5 x 3 mm Die Sensor
MMA7330L
Sensors
Freescale Semiconductor
7
PACKAGE DIMENSIONS
CASE 1935-01
ISSUE 0
14-LEAD LGA
MMA7330L
8
Sensors
Freescale Semiconductor
PACKAGE DIMENSIONS
CASE 1935-01
ISSUE 0
14-LEAD LGA
MMA7330L
Sensors
Freescale Semiconductor
9
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MMA7330L
Rev. 2
8/2007
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