WILLAS MMBTA9XLT1 Highvoltagetransistor Datasheet

WILLAS
FM120-M+
THRU
MMBTA9xLT1
FM1200-M+
1.0A SURFACE
SCHOTTKY
BARRIER RECTIFIERS -20V- 200V
HighMOUNT
Voltage
Transistor
Pb Free Product
SOD-123+ PACKAGE
Package outline
Features
• Batch process design, excellent power dissipation offers
better reverse leakage current and thermal resistance.
SOD-123H
• Low profile surface mounted application in order to
PNP Silicon
optimize board space.
• Low power loss, high efficiency.
• High current capability, low forward voltage drop.
surge capability.
• HighFEATURE
ƽHighfor
voltage.
overvoltage protection.
• Guardring
ƽFor
Telephony
or Professional communication equipment applications.
• Ultra high-speed switching.
ƽRoHS
product
forchip,
packing
code
suffixjunction.
"G"
epitaxial
planar
metal
silicon
• Silicon
Halogen
product
for packingstandards
code suffixof"H"
partsfree
meet
environmental
• Lead-free
0.146(3.7)
0.130(3.3)
0.012(0.3) Typ.
0.071(1.8)
0.056(1.4)
MIL-STD-19500 /228
product
for packing
codeORDERING
suffix "G"
• RoHS
DEVICE
MARKING
AND
INFORMATION
Halogen free product for packing code suffix "H"
Marking
Device
Mechanical
data
Shipping
MMBTA92LT1
2D
3000/Tape&Reel
: UL94-V0 rated flame retardant
• Epoxy
• Case : Molded plastic, SOD-123H
MMBTA93LT1
2E
3000/Tape&Reel
,
• Terminals :Plated terminals, solderable per MIL-STD-750
0.040(1.0)
SOT–230.024(0.6)
0.031(0.8) Typ.
0.031(0.8) Typ.
Method 2026
3
• Polarity : Indicated by cathode band
Position
: Any
• Mounting
MAXIMUM
RATINGS
• Weight : Approximated 0.011 gram
Rating
Dimensions in inches and (millimeters)
COLLECTOR
Value
Symbol MMBTA92 MMBTA93
1
BASE
Unit
MAXIMUM RATINGS AND
ELECTRICAL
CHARACTERISTICS
–300
–200
Vdc
Collector–Emitter Voltage
V CEO
Ratings at 25℃ ambient temperature unless otherwise specified.
Collector–Base Voltage
V CBO
–300
–200
Single phase half wave, 60Hz, resistive of inductive load.
Voltageby 20%
V EBO
–5.0
For capacitiveEmitter–Base
load, derate current
CollectorRATINGS
Current — Continuous
THERMAL CHARACTERISTICS
Characteristic
VRRM
VRMS
Total Device Dissipation FR– 5 Board, (1)
Maximum DC Blocking Voltage
VDC
TA = 25°C
Maximum Average
Forward
Rectified
Current
IO
Derate above 25°C
Maximum RMS Voltage
Thermal
Resistance,
Junction
to Ambient
Peak Forward Surge
Current
8.3 ms single
half sine-wave
Dissipation
superimposed onTotal
ratedDevice
load (JEDEC
method)
Alumina Substrate, (2) TA = 25°C
Typical Thermal Resistance (Note 2)
Derate above 25°C
Vdc
Vdc
–500 FM130-MH
mAdc
I C SYMBOL FM120-MH
FM140-MH FM150-MH FM160-MH FM180-MH FM1100-MH FM1150-MH FM1200-MH UNIT
Marking Code
Maximum Recurrent Peak Reverse Voltage
2
EMITTER
IFSM
12
13
20
30
Symbol
14
21
PD
20
30
RθJA
PD
RΘJA
CJ
Thermal Resistance, Junction to Ambient
Operating Temperature Range
TJ
Junction
and Storage Temperature
Storage Temperature
Range
TSTG
Typical Junction Capacitance (Note 1)
14
40
Max
28
225
40
35
50
Unit
mW
16
60
18
80
10
100
115
150
120
200
Volts
42
56
70
105
140
Volts
60
80
100
150
200
Volts
1.8
mW/°C
1.0
Amp
556
300
°C/W
mW
30
Amp
mW/°C
40
120
℃/W
2.4
RθJA
-55 to +125 417
TJ , Tstg
15
50
–55 to +150
PF
-55 to +150
°C/W
°C - 65 to +175
℃
℃
1. FR–5 = 1.0 x 0.75 x 0.062 in.
CHARACTERISTICS
2. Alumina
= 0.4 x 0.3 x 0.024 in. 99.5% SYMBOL
alumina. FM120-MH FM130-MH FM140-MH FM150-MH FM160-MH FM180-MH FM1100-MH FM1150-MH FM1200-MH UNIT
Volts
0.9
Maximum Forward
Voltage
at
1.0A
DC
0.92
F
0.50
0.70
0.85
3. Pulse Test: Pulse Width < 300 µs, DutyVCycle
< 2.0%.
0.5
Maximum Average Reverse Current at @T A=25℃
IR
mAmp
10
@T A=125℃
Rated DC Blocking Voltage
NOTES:
1- Measured at 1 MHZ and applied reverse voltage of 4.0 VDC.
2- Thermal Resistance From Junction to Ambient
2012-06
2012-11
WILLAS ELECTRONIC CORP.
WILLAS ELECTRONIC CORP.
WILLAS
FM120-M+
THRU
MMBTA9xLT1
FM1200-M+
1.0A SURFACE
SCHOTTKY
HighMOUNT
Voltage
Transistor
BARRIER RECTIFIERS -20V- 200V
Pb Free Product
SOD-123+ PACKAGE
Package outline
Features
• Batch process design, excellent power dissipation offers
A = 25°C
ELECTRICAL
unless otherwise noted.)
better reverse CHARACTERISTICS(T
leakage current and thermal
resistance.
• Low profile surface mounted application in order to
Characteristic
optimize board space.
Low power loss, high efficiency.
•OFF
CHARACTERISTICS
• High current capability, low forward voltage drop.
Collector–Emitter
Breakdown Voltage(3)
surge capability.
• High
(I
=
–1.0
mAdc,
I
= 0) protection.
C
B
• Guardring for overvoltage
• Ultra high-speed switching.
epitaxial planar
chip, metal
silicon junction.
• Silicon
Collector–Base
Breakdown
Voltage
• Lead-free parts meet environmental standards of
IE = 0)
(IC = –100 µAdc,
MIL-STD-19500
/228
• RoHS product for packing code suffix "G"
Halogen
free product
for packing
code suffix "H"
Emitter–Base
Breakdown
Voltage
SOD-123H
Symbol
Min
Max
0.146(3.7)
0.130(3.3)
Unit
0.012(0.3) Typ.
V(BR)CEO
Vdc
MMBTA92
–300
—
MMBTA93
–200
—
–300
—
–200
—
–5.0
—
0.071(1.8)
0.056(1.4)
V(BR)CBO
Vdc
MMBTA92
MMBTA93
V(BR)EBO
Mechanical
(IE = –100 µAdc,data
IC = 0)
: UL94-V0
flame retardant
• Epoxy
Collector
Cutoff rated
Current
: Molded
plastic,
• Case
( VCB
= –200Vdc,
IE =SOD-123H
0)
,
=
–300Vdc,
I
=
0) solderable per MIL-STD-750
(
V
CB
E
• Terminals :Plated terminals,
ICBO
µAdc
0.031(0.8) Typ.
2026
CollectorMethod
Cutoff Current
( VEB = –6.0Vdc, IC = 0)
Vdc
0.040(1.0)
0.024(0.6)
—
–0.1
—
–100
0.031(0.8) Typ.
IEBO
• Polarity : Indicated by cathode band
( VEB = –5.0Vdc, IC = 0)
• Mounting Position : Any
ELECTRICAL CHARACTERISTICS (TA
• Weight : Approximated 0.011 gram
—
—
–0.05
–100
Dimensions in inches and (millimeters)
µAdc
µAdc
= 25°C unless otherwise noted)
Characteristic
Symbol
Min
Max
Unit
MAXIMUM RATINGS
AND ELECTRICAL CHARACTERISTICS
ON CHARACTERISTICS
(3)
DC Current
Gain
hFE
—
Ratings at 25℃
ambient
temperature unless otherwise specified.
(I Chalf
=–1.0mAdc,
V CEresistive
= –10 Vdc)
Both Types
25
––
Single phase
wave, 60Hz,
of inductive load.
(I C load,
= –10derate
mAdc,current
V CE = –10Vdc)
Both Types
40
––
For capacitive
by 20%
(I C = –30mAdc,
V
=–10
Vdc)
MMBTA92
25
––
CE
SYMBOL FM120-MH FM130-MH FM140-MH FM150-MH FM160-MH FM180-MH FM1100-MH FM1150-MH FM1200-MH UNIT
RATINGS
MMBTA93
25
––
Marking Code
12
13
14
15
16
18
10
115
120
Collector–Emitter Saturation Voltage
V
Vdc
20
30
40 CE(sat) 50
60
80
100
150
200
Maximum Recurrent Peak Reverse Voltage
Volts
VRRM
(I C = –20mAdc, I B = –2.0 mAdc)
MMBTA92
––
–0.5
Volts
14
21
28
35
42
56
70
105
140
Maximum RMS Voltage
VRMS
MMBTA93
––
–0.5
Volts
Maximum DC Blocking Voltage
20
30
40
50
60
80
100
150
200
VDC
Base–Emitter Saturation Voltage
V
—
–0.9
Vdc
BE(sat)
Amps
Maximum Average
Forward Rectified
Current
IO
1.0
I B = –2.0
mAdc)
(I C = –20mAdc,
Peak Forward
Surge Current 8.3CHARACTERISTICS
ms single half sine-wave
SMALL–SIGNAL
superimposed on rated load (JEDEC method)
Storage Temperature Range
30
IFSM
Current–Gain — Bandwidth Product(3),(4)
Typical Thermal
(Note
RΘJA
(I CResistance
= –10mAdc,
V CE2)
= –20Vdc, f = 100MHz)
Typical Junction
Capacitance
(Note
1)
CJ
Collector – Base Capacitance
Operating Temperature
Range
TJ
(V CB = –20 Vdc, I E = 0, f = 1.0 MHz)
TSTG
50 40
120
fT
-55 to +125
MMBTA92
C cb
Amps
––
––
6.0
- 65 to +175
––
8.0
MMBTA93
℃/W
MHz
PF
pF
-55 to +150
℃
℃
3. Pulse CHARACTERISTICS
Test: Pulse Width < 300 µs, Duty Cycle < FM120-MH
2.0%. FM130-MH FM140-MH FM150-MH FM160-MH FM180-MH FM1100-MH FM1150-MH FM1200-MH
SYMBOL
VF
Maximum Forward Voltage at 1.0A DC
Maximum Average Reverse Current at @T A=25℃
Rated DC Blocking Voltage
@T A=125℃
IR
0.50
0.70
0.85
0.9
0.92
0.5
10
UNIT
Volts
mAmp
NOTES:
1- Measured at 1 MHZ and applied reverse voltage of 4.0 VDC.
2- Thermal Resistance From Junction to Ambient
2012-06
2012-11
WILLAS ELECTRONIC CORP.
WILLAS ELECTRONIC CORP.
WILLAS
FM120-M+
THRU
MMBTA9xLT1
FM1200-M+
1.0A SURFACE
SCHOTTKY
BARRIER RECTIFIERS -20V- 200V
HighMOUNT
Voltage
Transistor
Pb Free Product
SOD-123+ PACKAGE
Package outline
Features
• Batch process design, excellent power dissipation offers
better reverse leakage current and thermal resistance.
SOD-123H
• Low profile surface mounted application in order to
optimize board space.
power loss, high
• Low 150
T J =efficiency.
+125°C
• High current capability, low forward voltage drop.
surge capability.
• High100
+25°C protection.
• Guardring for overvoltage
high-speed switching.
• Ultra 70
chip, metal silicon junction.
• Silicon
–55°C
50 epitaxial planar
• Lead-free parts meet environmental standards of
0.146(3.7)
0.130(3.3)
h FE , DC CURRENT GAIN
Vdc
V CE = –100.012(0.3)
Typ.
0.071(1.8)
0.056(1.4)
MIL-STD-19500 /228
• RoHS30product for packing code suffix "G"
Halogen free product for packing code suffix "H"
Mechanical
data
20
0.040(1.0)
0.024(0.6)
• Epoxy : UL94-V0 rated flame retardant
15
–1.0
–3.0
–5.0
–7.0
–10
–20
plastic,–2.0
SOD-123H
• Case : Molded
0.031(0.8) Typ.
,
I
,
COLLECTOR
CURRENT
(mA)
C
• Terminals :Plated terminals, solderable per MIL-STD-750
• Polarity : Indicated by cathode band
100
• Mounting Position : Any
50 : Approximated 0.011 gram
• Weight
f T, CURRENT– GAIN — BANDWIDTH PRODUCT (MHz)
C, CAPACITANCE (pF)
–80 –100
0.031(0.8) Typ.
Dimensions in inches and (millimeters)
C ib
100
T J = 25°C
80
V CE = –20 Vdc
60
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25℃ ambient temperature unless otherwise specified.
10
Single phase half
wave, 60Hz, resistive of inductive load.
For capacitive load, derate current by 20%
Marking Code
–50
Figure 1. DC Current Gain
Method 2026
20
–30
5.0
RATINGS
40
30
FM140-MH FM150-MH FM160-MH FM180-MH FM1100-MH FM1150-MH FM1200-MH UNIT
SYMBOL FM120-MH FM130-MH20
Maximum Recurrent Peak Reverse Voltage
VRRM
12
C20
cb
13
30
14
40
15
50
16
60
18
80
10
100
115
150
120
200
Volts
Maximum RMS1.0
Voltage
VRMS
14
21
35
42
56
70
105
140
Volts
–50 –100 –200
VDC
20
0 28
–1.0
150
200
Volts
2.0
–0.1 –0.2
–0.5 –1.0 –2.0
–5.0 –10
Maximum DC Blocking Voltage
–20
–500 –1000
V R , REVERSE
Maximum Average Forward Rectified
Current VOLTAGE (VOLTS)
IO
30
40
superimposed on rated load (JEDEC method)
–1.0
Typical Thermal Resistance (Note 2)
Typical Junction Capacitance (Note 1)
Operating Temperature Range
Storage Temperature Range
CHARACTERISTICS
Maximum Forward Voltage at 1.0A DC
V, VOLTAGE (VOLTS)
–0.8
–0.4
Maximum Average Reverse Current at @T A=25℃
Rated DC Blocking Voltage
–0.2
@T A=125℃
NOTES:
–20
–50
–100
Amp
30
Amp
RΘJA
40
120
℃/W
CJ
V BE @ V CE-55
= –10
toV+125
PF
-55 to +150
℃
- 65 to +175
TSTG
℃
SYMBOL FM120-MH FM130-MH FM140-MH FM150-MH FM160-MH FM180-MH FM1100-MH FM1150-MH FM1200-MH UNIT
VF
0.50
0.70
0.85
0.9
0.92
0.5
IR
10
V CE(sat) @ I C /I B = 10 mA
Volts
mAmp
0
1- Measured at 1 MHZ and applied reverse voltage of 4.0
–1.0VDC.–2.0
2- Thermal Resistance From Junction to Ambient
–10
IFSM
TJ
–0.6
–5.0
50
60
80
100
I C , COLLECTOR CURRENT (mA)
1.0
Figure 3. Current–Gain — Bandwidth Product
Figure 2. Capacitances
Peak Forward Surge Current 8.3 ms single half sine-wave
–2.0
–5.0
–10
–20
–50
–100
I C , COLLECTOR CURRENT (mA)
Figure 4. “On” Voltages
2012-06
2012-11
WILLAS ELECTRONIC CORP.
WILLAS ELECTRONIC CORP.
WILLAS
FM120-M+
THRU
MMBTA9xLT1
FM1200-M+
HighMOUNT
Voltage
Transistor
1.0A SURFACE
SCHOTTKY
BARRIER RECTIFIERS -20V- 200V
Pb Free Product
SOD-123+ PACKAGE
Package outline
Features
• Batch process design, excellent power dissipation offers
better reverse leakage current and thermal resistance.
SOD-123H
• Low profile surface mounted application in order to
optimize board space.
.106(2.70)
• RoHS product for packing code suffix "G"
• Epoxy : UL94-V0 rated flame retardant
• Case : Molded plastic, SOD-123H
,
• Terminals :Plated terminals, solderable per MIL-STD-750
0.071(1.8)
0.056(1.4)
.110(2.80)
Halogen free product for packing code suffix "H"
Mechanical data
0.012(0.3) Typ.
0.031(0.8) Typ.
Method 2026
• Polarity : Indicated by cathode band
• Mounting Position : Any
• Weight : Approximated 0.011
gram
.080(2.04)
0.040(1.0)
0.024(0.6)
.083(2.10)
MIL-STD-19500 /228
0.146(3.7)
0.130(3.3)
.006(0.15)MIN.
.063(1.60)
.047(1.20)
• Low power loss, high efficiency.
• High current capability, low forward voltage drop. SOT-23
• High surge capability.
• Guardring for overvoltage protection.
• Ultra high-speed switching.
• Silicon epitaxial planar chip, metal silicon junction.
.122(3.10)
of
• Lead-free parts meet environmental standards
0.031(0.8) Typ.
Dimensions in inches and (millimeters)
.008(0.20)
.003(0.08)
.070(1.78)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25℃ ambient temperature unless otherwise specified.
Single phase half wave, 60Hz, resistive of inductive load.
For capacitive load, derate current by 20%
RATINGS
Marking Code
SYMBOL FM120-MH FM130-MH FM140-MH FM150-MH FM160-MH FM180-MH FM1100-MH FM1150-MH FM1200-MH UNIT
.004(0.10)MAX.
VRRM
Maximum Recurrent Peak Reverse Voltage
12
20
13
30
14
40
15
50
16
60
18
80
10
100
115
150
120
200
Volts
VRMS
14
21
28
35
42
56
70
105
140
Maximum DC Blocking Voltage
VDC
20
30
40
50
60
80
100
150
200
Volts
IO
Maximum Average Forward Rectified Current
Peak Forward Surge Current 8.3 ms single half sine-wave
superimposed on rated load (JEDEC method)
RΘJA
Typical Thermal Resistance (Note 2)
CJ
Typical Junction Capacitance (Note 1)
Dimensions
in inches
-55 toand
+125(millimeters)
TJ
Operating Temperature Range
Storage Temperature Range
CHARACTERISTICS
Maximum Average Reverse Current at @T A=25℃
@T A=125℃
1.0
Amps
30
Amps
40
120
℃/W
PF
-55 to +150
℃
- 65 to +175
TSTG
Maximum Forward Voltage at 1.0A DC
Rated DC Blocking Voltage
.020(0.50)
IFSM
.012(0.30)
.055(1.40)
.035(0.89)
Maximum RMS Voltage
Volts
℃
SYMBOL FM120-MH FM130-MH FM140-MH FM150-MH FM160-MH FM180-MH FM1100-MH FM1150-MH FM1200-MH UNIT
VF
0.037
0.95
IR
0.50
0.037
0.95
0.70
0.85
0.9
0.92
0.5
10
Volts
mAmp
NOTES:
1- Measured at 1 MHZ and applied reverse voltage of 4.0 VDC.
0.079
2.0
2- Thermal Resistance From Junction to Ambient
0.035
0.9
0.031
0.8
2012-06
2012-11
inches
mm
WILLAS ELECTRONIC CORP.
WILLAS ELECTRONIC CORP.
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