ON MMBZ6V8AL 24 and 40 watt peak power zener transient voltage suppressor Datasheet

MMBZ5V6ALT1 Series
Preferred Device
24 and 40 Watt Peak Power
Zener Transient Voltage
Suppressors
SOT−23 Dual Common Anode Zeners
for ESD Protection
http://onsemi.com
These dual monolithic silicon Zener diodes are designed for
applications requiring transient overvoltage protection capability. They
are intended for use in voltage and ESD sensitive equipment such as
computers, printers, business machines, communication systems,
medical equipment and other applications. Their dual junction common
anode design protects two separate lines using only one package. These
devices are ideal for situations where board space is at a premium.
1
3
2
3
Features
• Pb−Free Packages are Available
• SOT−23 Package Allows Either Two Separate Unidirectional
•
•
•
•
•
•
•
Configurations or a Single Bidirectional Configuration
Working Peak Reverse Voltage Range − 3 V to 26 V
Standard Zener Breakdown Voltage Range − 5.6 V to 33 V
Peak Power − 24 or 40 Watts @ 1.0 ms (Unidirectional),
per Figure 5 Waveform
ESD Rating of Class N (exceeding 16 kV) per the Human
Body Model
Maximum Clamping Voltage @ Peak Pulse Current
Low Leakage < 5.0 A
Flammability Rating UL 94 V−O
Mechanical Characteristics
CASE: Void-free, transfer-molded, thermosetting plastic case
FINISH: Corrosion resistant finish, easily solderable
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
1
SOT−23
CASE 318
STYLE 12
xxx
M
MARKING
DIAGRAM
2
xxx
M
= Device Code
= Date Code
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the table on page 3 of this data sheet.
Preferred devices are recommended choices for future use
and best overall value.
260°C for 10 Seconds
Package designed for optimal automated board assembly
Small package size for high density applications
Available in 8 mm Tape and Reel
Use the Device Number to order the 7 inch/3,000 unit reel.
Replace the “T1” with “T3” in the Device Number to order the
13 inch/10,000 unit reel.
 Semiconductor Components Industries, LLC, 2004
August, 2004 − Rev. 7
1
Publication Order Number:
MMBZ5V6ALT1/D
MMBZ5V6ALT1 Series
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Ppk
24
40
Watts
Total Power Dissipation on FR−5 Board (Note 2) @ TA = 25°C
Derate above 25°C
°PD°
225
1.8
°mW°
mW/°C
Thermal Resistance Junction−to−Ambient
RJA
556
°C/W
Total Power Dissipation on Alumina Substrate (Note 3) @ TA = 25°C
Derate above 25°C
°PD°
300
2.4
°mW
mW/°C
Peak Power Dissipation @ 1.0 ms (Note 1)
@ TL ≤ 25°C
MMBZ5V6ALT1 thru MMBZ10VALT1
MMBZ12VALT1 thru MMBZ33VALT1
Thermal Resistance Junction−to−Ambient
RJA
417
°C/W
Junction and Storage Temperature Range
TJ, Tstg
− 55 to +150
°C
TL
260
°C
Lead Solder Temperature − Maximum (10 Second Duration)
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
1. Non−repetitive current pulse per Figure 5 and derate above TA = 25°C per Figure 6.
2. FR−5 = 1.0 x 0.75 x 0.62 in.
3. Alumina = 0.4 x 0.3 x 0.024 in, 99.5% alumina.
*Other voltages may be available upon request.
ORDERING INFORMATION
Package
Shipping†
SOT−23
3000 Tape & Reel
SOT−23
(Pb−Free)
3000 Tape & Reel
SOT−23
10,000 Tape & Reel
SOT−23
(Pb−Free)
10,000 Tape & Reel
SOT−23
3000 Tape & Reel
SOT−23
(Pb−Free)
3000 Tape & Reel
SOT−23
10,000 Tape & Reel
SOT−23
(Pb−Free)
10,000 Tape & Reel
SOT−23
3000 Tape & Reel
SOT−23
(Pb−Free)
3000 Tape & Reel
SOT−23
10,000 Tape & Reel
SOT−23
(Pb−Free)
10,000 Tape & Reel
SOT−23
3000 Tape & Reel
SOT−23
(Pb−Free)
3000 Tape & Reel
SOT−23
10,000 Tape & Reel
SOT−23
(Pb−Free)
10,000 Tape & Reel
Device
MMBZ5V6ALT1
MMBZ5V6ALT1G
MMBZ5V6ALT3
MMBZ5V6ALT3G
MMBZ6VxALT1
MMBZ6VxALT1G
MMBZ6VxALT3
MMBZ6VxALT3G
MMBZ9V1ALT1
MMBZ9V1ALT1G
MMBZ9V1ALT3
MMBZ9V1ALT13G
MMBZxxVALT1
MMBZxxVALT1G
MMBZxxVALT3
MMBZxxVALT3G
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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2
MMBZ5V6ALT1 Series
ELECTRICAL CHARACTERISTICS
I
(TA = 25°C unless otherwise noted)
UNIDIRECTIONAL (Circuit tied to Pins 1 and 3 or 2 and 3)
Parameter
Symbol
IPP
Maximum Reverse Peak Pulse Current
VC
Clamping Voltage @ IPP
VRWM
IR
VBR
IT
VBR
IF
VC VBR VRWM
V
IR VF
IT
Working Peak Reverse Voltage
Maximum Reverse Leakage Current @ VRWM
Breakdown Voltage @ IT
Test Current
IPP
Maximum Temperature Coefficient of VBR
IF
Forward Current
VF
Forward Voltage @ IF
ZZT
Maximum Zener Impedance @ IZT
IZK
Reverse Current
ZZK
Maximum Zener Impedance @ IZK
Uni−Directional TVS
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
UNIDIRECTIONAL (Circuit tied to Pins 1 and 3 or Pins 2 and 3)
(VF = 0.9 V Max @ IF = 10 mA)
24 WATTS
Max Zener
Impedance (Note 5)
VC @ IPP
(Note 6)
@ IT
ZZT
@ IZT
Breakdown Voltage
IR @
VRWM
ZZK @ IZK
VC
IPP
VBR
Device
Device
Marking
VRWM
Volts
A
Min
Nom
Max
mA
mA
V
A
mV/C
MMBZ5V6AL
5A6
3.0
5.0
5.32
5.6
5.88
20
11
1600
0.25
8.0
3.0
1.26
MMBZ6V2AL
6A2
3.0
0.5
5.89
6.2
6.51
1.0
−
−
−
8.7
2.76
2.80
MMBZ6V8AL
6A8
4.5
0.5
6.46
6.8
7.14
1.0
−
−
−
9.6
2.5
3.4
MMBZ9V1AL
9A1
6.0
0.3
8.65
9.1
9.56
1.0
−
−
−
14
1.7
7.5
MMBZ10VAL
10A
6.5
0.3
9.50
10
10.5
1.0
−
−
−
14.2
1.7
7.5
VBR (Note 4) (V)
40 WATTS
(VF = 0.9 V Max @ IF = 10 mA)
VRWM
Device
Device
Marking
IR @
VRWM
Volts
nA
MMBZ12VAL
12A
8.5
MMBZ15VAL
15A
12
MMBZ18VAL
18A
MMBZ20VAL
20A
MMBZ27VAL
MMBZ33VAL
Breakdown Voltage
VC @ IPP (Note 6)
@ IT
VC
IPP
VBR
Min
Nom
Max
mA
V
A
mV/C
200
11.40
12
12.60
1.0
17
2.35
7.5
50
14.25
15
15.75
1.0
21
1.9
12.3
14.5
50
17.10
18
18.90
1.0
25
1.6
15.3
17
50
19.00
20
21.00
1.0
28
1.4
17.2
27A
22
50
25.65
27
28.35
1.0
40
1.0
24.3
33A
26
50
31.35
33
34.65
1.0
46
0.87
30.4
VBR (Note 4) (V)
4. VBR measured at pulse test current IT at an ambient temperature of 25°C.
5. ZZT and ZZK are measured by dividing the AC voltage drop across the device by the AC current applied. The specified limits are for IZ(AC)
= 0.1 IZ(DC), with the AC frequency = 1.0 kHz.
6. Surge current waveform per Figure 5 and derate per Figure 6
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3
MMBZ5V6ALT1 Series
TYPICAL CHARACTERISTICS
1000
15
100
12
IR (nA)
BREAKDOWN VOLTAGE (VOLTS)
(VBR @ IT)
18
9
10
1
6
0.1
3
0
−40
0
+ 100
+ 50
TEMPERATURE (°C)
+ 150
0.01
−40
Figure 1. Typical Breakdown Voltage
versus Temperature
+ 85
+ 25
TEMPERATURE (°C)
+ 125
Figure 2. Typical Leakage Current
versus Temperature
(Upper curve for each voltage is bidirectional mode,
lower curve is unidirectional mode)
320
PD, POWER DISSIPATION (mW)
300
C, CAPACITANCE (pF)
280
240
200
5.6 V
160
120
15 V
80
40
250
ALUMINA SUBSTRATE
200
150
100
FR−5 BOARD
50
0
0
0
1
2
3
0
BIAS (V)
Figure 3. Typical Capacitance versus Bias Voltage
25
50
75
100
125
TEMPERATURE (°C)
150
175
Figure 4. Steady State Power Derating Curve
(Upper curve for each voltage is unidirectional mode,
lower curve is bidirectional mode)
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4
MMBZ5V6ALT1 Series
PULSE WIDTH (tP) IS DEFINED
AS THAT POINT WHERE THE
PEAK CURRENT DECAYS TO
50% OF IPP.
tr ≤ 10 s
VALUE (%)
100
PEAK VALUE − IPP
IPP
HALF VALUE −
2
50
tP
0
0
1
2
3
t, TIME (ms)
4
PEAK PULSE DERATING IN % OF PEAK
POWER OR CURRENT @ TA = 25°C
TYPICAL CHARACTERISTICS
100
90
80
70
60
50
40
30
20
10
0
0
25
Figure 5. Pulse Waveform
50
75
100
125
150 175
TA, AMBIENT TEMPERATURE (°C)
Figure 6. Pulse Derating Curve
MMBZ5V6ALT1
MMBZ5V6ALT1
100
RECTANGULAR
WAVEFORM, TA = 25°C
Ppk, PEAK SURGE POWER (W)
Ppk, PEAK SURGE POWER (W)
100
BIDIRECTIONAL
10
1
200
UNIDIRECTIONAL
RECTANGULAR
WAVEFORM, TA = 25°C
BIDIRECTIONAL
10
UNIDIRECTIONAL
1
0.1
1
10
100
1000
0.1
1
10
100
PW, PULSE WIDTH (ms)
PW, PULSE WIDTH (ms)
Figure 7. Maximum Non−repetitive Surge
Power, Ppk versus PW
Figure 8. Maximum Non−repetitive Surge
Power, Ppk(NOM) versus PW
Power is defined as VRSM x IZ(pk) where VRSM is
the clamping voltage at IZ(pk).
Power is defined as VZ(NOM) x IZ(pk) where
VZ(NOM) is the nominal Zener voltage measured at
the low test current used for voltage classification.
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5
1000
MMBZ5V6ALT1 Series
TYPICAL COMMON ANODE APPLICATIONS
A quad junction common anode design in a SOT−23
package protects four separate lines using only one package.
This adds flexibility and creativity to PCB design especially
when board space is at a premium. Two simplified examples
of TVS applications are illustrated below.
Computer Interface Protection
A
KEYBOARD
TERMINAL
PRINTER
ETC.
B
C
I/O
D
FUNCTIONAL
DECODER
GND
MMBZ5V6ALT1
THRU
MMBZ33VALT1
Microprocessor Protection
VDD
VGG
ADDRESS BUS
RAM
ROM
DATA BUS
CPU
I/O
CLOCK
MMBZ5V6ALT1
THRU
MMBZ33VALT1
CONTROL BUS
GND
MMBZ5V6ALT1
THRU
MMBZ33VALT1
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6
MMBZ5V6ALT1 Series
PACKAGE DIMENSIONS
SOT−23 (TO−236)
CASE 318−09
ISSUE AH
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. MAXIUMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
4. 318−01, −02, AND −06 OBSOLETE, NEW
STANDARD 318−09.
A
L
3
1
V
B
2
S
G
DIM
A
B
C
D
G
H
J
K
L
S
V
C
D
H
K
J
INCHES
MIN
MAX
0.1102
0.1197
0.0472
0.0551
0.0385
0.0498
0.0140
0.0200
0.0670
0.0826
0.0040
0.0098
0.0034
0.0070
0.0180
0.0236
0.0350
0.0401
0.0830
0.0984
0.0177
0.0236
STYLE 12:
PIN 1. CATHODE
2. CATHODE
3. ANODE
SOLDERING FOOTPRINT*
0.95
0.037
0.95
0.037
2.0
0.079
0.9
0.035
0.8
0.031
SCALE 10:1
mm inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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7
MILLIMETERS
MIN
MAX
2.80
3.04
1.20
1.40
0.99
1.26
0.36
0.50
1.70
2.10
0.10
0.25
0.085
0.177
0.45
0.60
0.89
1.02
2.10
2.50
0.45
0.60
MMBZ5V6ALT1 Series
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
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For additional information, please contact your
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MMBZ5V6ALT1/D
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