MOTOROLA MMSF10N03Z Single tmos power mosfet 10 amperes 30 volt Datasheet

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by MMSF10N03Z/D
SEMICONDUCTOR TECHNICAL DATA
Medium Power Surface Mount Products
! Motorola Preferred Device
EZFETs are an advanced series of power MOSFETs which utilize
Motorola’s High Cell Density TMOS process and contain monolithic
back–to–back zener diodes. These zener diodes provide protection
against ESD and unexpected transients. These miniature surface mount
MOSFETs feature ultra low RDS(on) and true logic level performance. They
are capable of withstanding high energy in the avalanche and commutation modes and the drain–to–source diode has a very low reverse recovery
time. EZFET devices are designed for use in low voltage, high speed
switching applications where power efficiency is important. Typical
applications are dc–dc converters, and power management in portable
and battery powered products such as computers, printers, cellular and
cordless phones. They can also be used for low voltage motor controls in
mass storage products such as disk drives and tape drives.
• Zener Protected Gates Provide Electrostatic Discharge Protection
• Designed to Withstand 200 V Machine Model and 2000 V Human Body Model D
• Ultra Low RDS(on) Provides Higher Efficiency and Extends Battery Life
• Logic Level Gate Drive — Can Be Driven by Logic ICs
• Miniature SO–8 Surface Mount Package — Saves Board Space
G
• Diode Is Characterized for Use In Bridge Circuits
• Diode Exhibits High Speed, With Soft Recovery
• IDSS Specified at Elevated Temperature
• Mounting Information for SO–8 Package Provided
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
SINGLE TMOS
POWER MOSFET
10 AMPERES
30 VOLTS
RDS(on) = 13 mW

CASE 751–05, Style 12
SO–8
Source
1
8
Drain
Source
2
7
Drain
Source
3
6
Drain
Gate
4
5
Drain
Top View
S
Parameter
Symbol
Max
Unit
VDSS
VDGR
30
Vdc
30
Vdc
VGS
ID
ID
IDM
PD
± 20
Vdc
10
7.7
50
Adc
2.5
20
Watts
mW/°C
PD
1.6
12
Watts
mW/°C
TJ, Tstg
EAS
– 55 to 150
Drain–to–Source Voltage
Drain–to–Gate Voltage (RGS = 1.0 MΩ)
Gate–to–Source Voltage — Continuous
Drain Current — Continuous @ TA = 25°C (1)
Drain Current — Continuous @ TA = 70°C (1)
Drain Current — Pulsed Drain Current (3)
Total Power Dissipation @ TA = 25°C (1)
Linear Derating Factor @ TA = 25°C (1)
Total Power Dissipation @ TA = 25°C (2)
Linear Derating Factor @ TA = 25°C (2)
Operating and Storage Temperature Range
Single Pulse Drain–to–Source Avalanche Energy — Starting TJ = 25°C
(VDD = 30 Vdc, VGS = 10 Vdc, IL = 10 Apk, L = 20 mH, RG = 25 W)
°C
mJ
1000
THERMAL RESISTANCE
Parameter
Symbol
RqJA
Junction–to–Ambient (1)
Junction–to–Ambient (2)
Typ
Max
Unit
—
—
50
80
°C/W
(1) When mounted on 1” square FR4 or G–10 board (VGS = 10 V, @ 10 seconds).
(2) When mounted on minimum recommended FR4 or G–10 board (VGS = 10 V, @ Steady State).
(3) Repetitive rating; pulse width limited by maximum junction temperature.
DEVICE MARKING
S10N3Z
ORDERING INFORMATION
Device
MMSF10N03ZR2
Reel Size
Tape Width
Quantity
13″
12 mm embossed tape
2500 units
This document contains information on a new product. Specifications and information herein are subject to change without notice.
HDTMOS is a trademark of Motorola, Inc. TMOS is a registered trademark of Motorola, Inc.
Thermal Clad is a trademark of the Bergquist Company.
Preferred devices are Motorola recommended choices for future use and best overall value.
TMOS
Motorola
Motorola, Inc.
1997 Power MOSFET Transistor Device Data
1
MMSF10N03Z
ELECTRICAL CHARACTERISTICS (TC = 25°C unless otherwise noted)
Characteristic
Symbol
Min
Typ
Max
Unit
30
—
—
65
—
—
—
—
—
—
1.0
10
—
—
3.0
1.0
—
1.2
3.5
1.7
—
—
—
10
13
13
18
gFS
7.0
13
—
Mhos
Ciss
—
720
1010
pF
Coss
—
570
800
Crss
—
78
110
td(on)
—
35
70
tr
—
105
210
td(off)
—
970
1940
tf
—
550
1100
QT
—
46
64
Q1
—
3.8
—
Q2
—
11
—
Q3
—
8.1
—
VSD
—
—
0.80
0.70
1.1
—
Vdc
trr
—
460
—
ns
ta
—
180
—
tb
—
280
—
QRR
—
4.2
—
OFF CHARACTERISTICS
(Cpk ≥ 2.0) (1) (3)
Drain–to–Source Breakdown Voltage
(VGS = 0 Vdc, ID = 0.25 mAdc)
Temperature Coefficient (Positive)
V(BR)DSS
Zero Gate Voltage Drain Current
(VDS = 30 Vdc, VGS = 0 Vdc)
(VDS = 30 Vdc, VGS = 0 Vdc, TJ = 125°C)
IDSS
Gate–Body Leakage Current (VGS = ± 20 Vdc, VDS = 0 Vdc)
IGSS
Vdc
mV/°C
µAdc
µAdc
ON CHARACTERISTICS(1)
Gate Threshold Voltage
(VDS = VGS, ID = 0.25 mAdc)
Threshold Temperature Coefficient (Negative)
(Cpk ≥ 2.0) (1) (3)
Static Drain–to–Source On–Resistance
(VGS = 10 Vdc, ID = 10 Adc)
(VGS = 4.5 Vdc, ID = 5.0 Adc)
(Cpk ≥ 2.0) (1) (3)
Forward Transconductance (VDS = 15 Vdc, ID = 5.0 Adc) (1)
VGS(th)
Vdc
RDS(on)
mV/°C
mΩ
DYNAMIC CHARACTERISTICS
Input Capacitance
Output Capacitance
(VDS = 25 Vdc,
Vdc VGS = 0 Vdc,
Vdc
f = 1.0 MHz)
Transfer Capacitance
SWITCHING CHARACTERISTICS(2)
Turn–On Delay Time
Rise Time
Turn–Off Delay Time
(VDD = 25 Vdc,
Vd ID = 1.0
1 0 Adc,
Ad
VGS = 10 Vdc
Vdc,
RG = 6.0 Ω)) (1)
Fall Time
Gate Charge
See Figure 8
((VDS = 15 Vdc,
Vd , ID = 2.0
2 0 Adc,
Ad ,
VGS = 10 Vdc) (1)
ns
nC
SOURCE–DRAIN DIODE CHARACTERISTICS
Forward On–Voltage
(IS = 10 Adc, VGS = 0 Vdc) (1)
(IS = 10 Adc, VGS = 0 Vdc, TJ = 125°C)
Reverse Recovery Time
((IS = 2
2.3
3 Adc,
Ad , VGS = 0 Vdc,
Vd ,
dIS/dt = 100 A/µs) (1)
Reverse Recovery Stored Charge
µC
(1) Pulse Test: Pulse Width ≤ 300 µs, Duty Cycle ≤ 2%.
(2) Switching characteristics are independent of operating junction temperatures.
(3) Reflects typical values.
Max limit – Typ
Cpk =
3 x SIGMA
2
Motorola TMOS Power MOSFET Transistor Device Data
MMSF10N03Z
TYPICAL ELECTRICAL CHARACTERISTICS
20
10 V
4.5 V
3.1 V
TJ = 25°C
VGS = 2.7 V
I D , DRAIN CURRENT (AMPS)
16
I D , DRAIN CURRENT (AMPS)
20
12
2.5 V
8.0
2.3 V
4.0
0
VDS ≥ 10 V
15
10
25°C
TJ = 100°C
5.0
– 55°C
2.1 V
1.9 V
0
0
0.5
1.0
1.5
VDS, DRAIN–TO–SOURCE VOLTAGE (VOLTS)
2.0
0
0.06
ID = 10 A
TJ = 25°C
0.05
0.04
0.03
0.02
0.01
0
6.0
8.0
2.0
4.0
VGS, GATE–TO–SOURCE VOLTAGE (VOLTS)
0
10
0.020
TJ = 25°C
0.015
4.5 V
VGS = 10 V
0.010
0.005
0
0
Figure 3. On–Resistance versus
Drain Current
5.0
10
15
ID, DRAIN CURRENT (AMPS)
20
Figure 4. On–Resistance versus Drain Current
and Gate Voltage
2.0
10,000
VGS = 0 V
1.5
VGS = 10 V
ID = 5.0 A
I DSS , LEAKAGE (nA)
RDS(on) , DRAIN–TO–SOURCE RESISTANCE
(NORMALIZED)
3.0
Figure 2. Transfer Characteristics
RDS(on) , DRAIN–TO–SOURCE RESISTANCE (OHMS)
RDS(on) , DRAIN–TO–SOURCE RESISTANCE (OHMS)
Figure 1. On–Region Characteristics
1.5
2.0
2.5
0.5
1.0
VGS, GATE–TO–SOURCE VOLTAGE (VOLTS)
1.0
0.5
1000
TJ = 125°C
100
100°C
10
1.0
25°C
0.1
0
– 50
0.01
– 25
0
25
50
75
100
125
150
TJ, JUNCTION TEMPERATURE (°C)
4.0
16
8.0
12
VDS, DRAIN–TO–SOURCE VOLTAGE (VOLTS)
Figure 5. On–Resistance Variation with
Temperature
Figure 6. Drain–To–Source Leakage
Current versus Voltage
Motorola TMOS Power MOSFET Transistor Device Data
0
20
3
MMSF10N03Z
POWER MOSFET SWITCHING
Switching behavior is most easily modeled and predicted
by recognizing that the power MOSFET is charge controlled.
The lengths of various switching intervals (∆t) are determined by how fast the FET input capacitance can be charged
by current from the generator.
The capacitance (Ciss) is read from the capacitance curve at
a voltage corresponding to the off–state condition when calculating td(on) and is read at a voltage corresponding to the
on–state when calculating td(off).
The published capacitance data is difficult to use for calculating rise and fall because drain–gate capacitance varies
greatly with applied voltage. Accordingly, gate charge data is
used. In most cases, a satisfactory estimate of average input
current (IG(AV)) can be made from a rudimentary analysis of
the drive circuit so that
At high switching speeds, parasitic circuit elements complicate the analysis. The inductance of the MOSFET source
lead, inside the package and in the circuit wiring which is
common to both the drain and gate current paths, produces a
voltage at the source which reduces the gate drive current.
The voltage is determined by Ldi/dt, but since di/dt is a function of drain current, the mathematical solution is complex.
The MOSFET output capacitance also complicates the
mathematics. And finally, MOSFETs have finite internal gate
resistance which effectively adds to the resistance of the
driving source, but the internal resistance is difficult to measure and, consequently, is not specified.
The resistive switching time variation versus gate resistance (Figure 9) shows how typical switching performance is
affected by the parasitic circuit elements. If the parasitics
were not present, the slope of the curves would maintain a
value of unity regardless of the switching speed. The circuit
used to obtain the data is constructed to minimize common
inductance in the drain and gate circuit loops and is believed
readily achievable with board mounted components. Most
power electronic loads are inductive; the data in the figure is
taken with a resistive load, which approximates an optimally
snubbed inductive load. Power MOSFETs may be safely operated into an inductive load; however, snubbing reduces
switching losses.
t = Q/IG(AV)
During the rise and fall time interval when switching a resistive load, VGS remains virtually constant at a level known as
the plateau voltage, VSGP. Therefore, rise and fall times may
be approximated by the following:
tr = Q2 x RG/(VGG – VGSP)
tf = Q2 x RG/VGSP
where
VGG = the gate drive voltage, which varies from zero to VGG
RG = the gate drive resistance
and Q2 and VGSP are read from the gate charge curve.
During the turn–on and turn–off delay times, gate current is
not constant. The simplest calculation uses appropriate values from the capacitance curves in a standard equation for
voltage change in an RC network. The equations are:
td(on) = RG Ciss In [VGG/(VGG – VGSP)]
td(off) = RG Ciss In (VGG/VGSP)
5000
VDS = 0 V
C, CAPACITANCE (pF)
4000
VGS = 0 V
TJ = 25°C
Ciss
3000
2000
Crss
Ciss
1000
Coss
Crss
0
–10
–5.0
0
5.0
10
15
20
VDS, DRAIN–TO–SOURCE VOLTAGE (VOLTS)
Figure 7. Capacitance Variation
4
Motorola TMOS Power MOSFET Transistor Device Data
QT
15
10
VDS
VGS
8.0
12
6.0
9.0
Q1
Q2
6.0
4.0
TJ = 25°C
ID = 2.0 A
2.0
3.0
Q3
0
0
0
5.0
10
15
20
25
30
35
40
45
10,000
VGS = 10 V
VDD = 25 V
ID = 1.0 A
TJ = 25°C
1000
t, TIME (ns)
18
12
V DS , DRAIN–TO–SOURCE VOLTAGE (VOLTS)
VGS, GATE–TO–SOURCE VOLTAGE (VOLTS)
MMSF10N03Z
td(off)
tf
tr
100
td(on)
10
1.0
50
10
QG, TOTAL GATE CHARGE (nC)
RG, GATE RESISTANCE (OHMS)
Figure 8. Gate–To–Source and Drain–To–Source
Voltage versus Total Charge
Figure 9. Resistive Switching Time
Variation versus Gate Resistance
100
DRAIN–TO–SOURCE DIODE CHARACTERISTICS
The switching characteristics of a MOSFET body diode
are very important in systems using it as a freewheeling or
commutating diode. Of particular interest are the reverse recovery characteristics which play a major role in determining
switching losses, radiated noise, EMI and RFI.
System switching losses are largely due to the nature of
the body diode itself. The body diode is a minority carrier device, therefore it has a finite reverse recovery time, trr, due to
the storage of minority carrier charge, QRR, as shown in the
typical reverse recovery wave form of Figure 15. It is this
stored charge that, when cleared from the diode, passes
through a potential and defines an energy loss. Obviously,
repeatedly forcing the diode through reverse recovery further
increases switching losses. Therefore, one would like a
diode with short trr and low QRR specifications to minimize
these losses.
The abruptness of diode reverse recovery effects the
amount of radiated noise, voltage spikes, and current ringing. The mechanisms at work are finite irremovable circuit
parasitic inductances and capacitances acted upon by high
di/dts. The diode’s negative di/dt during ta is directly controlled by the device clearing the stored charge. However,
the positive di/dt during tb is an uncontrollable diode characteristic and is usually the culprit that induces current ringing.
Therefore, when comparing diodes, the ratio of tb/ta serves
as a good indicator of recovery abruptness and thus gives a
comparative estimate of probable noise generated. A ratio of
1 is considered ideal and values less than 0.5 are considered
snappy.
Compared to Motorola standard cell density low voltage
MOSFETs, high cell density MOSFET diodes are faster
(shorter trr), have less stored charge and a softer reverse recovery characteristic. The softness advantage of the high
cell density diode means they can be forced through reverse
recovery at a higher di/dt than a standard cell MOSFET
diode without increasing the current ringing or the noise generated. In addition, power dissipation incurred from switching
the diode will be less due to the shorter recovery time and
lower switching losses.
10
I S , SOURCE CURRENT (AMPS)
9.0
TJ = 25°C
VGS = 0 V
8.0
7.0
6.0
5.0
4.0
3.0
2.0
1.0
0
0.4
0.5
0.6
0.7
0.8
VSD, SOURCE–TO–DRAIN VOLTAGE (VOLTS)
Figure 10. Diode Forward Voltage versus Current
Motorola TMOS Power MOSFET Transistor Device Data
5
MMSF10N03Z
di/dt = 300 A/µs
Standard Cell Density
trr
I S , SOURCE CURRENT
High Cell Density
trr
tb
ta
t, TIME
Figure 11. Reverse Recovery Time (trr)
SAFE OPERATING AREA
The Forward Biased Safe Operating Area curves define
the maximum simultaneous drain–to–source voltage and
drain current that a transistor can handle safely when it is forward biased. Curves are based upon maximum peak junction temperature and a case temperature (TC) of 25°C. Peak
repetitive pulsed power limits are determined by using the
thermal response data in conjunction with the procedures
discussed in AN569, “Transient Thermal Resistance – General Data and Its Use.”
Switching between the off–state and the on–state may traverse any load line provided neither rated peak current (IDM)
nor rated voltage (VDSS) is exceeded, and that the transition
time (tr, tf) does not exceed 10 µs. In addition the total power
1000
EAS , SINGLE PULSE DRAIN–TO–SOURCE
AVALANCHE ENERGY (mJ)
ID, DRAIN CURRENT (AMPS)
100
100 mS
10
1.0 ms
10 ms
1.0
VGS = 10 V
SINGLE PULSE
TC = 25°C
0.1
dc
RDS(on) LIMIT
THERMAL LIMIT
PACKAGE LIMIT
0.01
0.1
6
averaged over a complete switching cycle must not exceed
(TJ(MAX) – TC)/(RθJC).
A power MOSFET designated E–FET can be safely used
in switching circuits with unclamped inductive loads. For reliable operation, the stored energy from circuit inductance dissipated in the transistor while in avalanche must be less than
the rated limit and must be adjusted for operating conditions
differing from those specified. Although industry practice is to
rate in terms of energy, avalanche energy capability is not a
constant. The energy rating decreases non–linearly with an
increase of peak current in avalanche and peak junction temperature.
1.0
VDS = 30 V
VGS = 10 V
IL = 10 Apk
L = 20 mH
800
600
400
200
0
10
100
25
50
75
100
125
150
VDS, DRAIN–TO–SOURCE VOLTAGE (VOLTS)
TJ, STARTING JUNCTION TEMPERATURE (°C)
Figure 12. Maximum Rated Forward Biased
Safe Operating Area
Figure 13. Maximum Avalanche Energy versus
Starting Junction Temperature
Motorola TMOS Power MOSFET Transistor Device Data
MMSF10N03Z
TYPICAL ELECTRICAL CHARACTERISTICS
Rthja(t), EFFECTIVE TRANSIENT
THERMAL RESISTANCE
1
D = 0.5
0.2
0.1
0.1
0.05
0.02
P(pk)
0.01
0.01
t1
t2
DUTY CYCLE, D = t1/t2
SINGLE PULSE
0.001
1.0E–05
1.0E–04
1.0E–03
1.0E–02
1.0E–01
t, TIME (s)
1.0E+00
RθJC(t) = r(t) RθJC
D CURVES APPLY FOR POWER
PULSE TRAIN SHOWN
READ TIME AT t1
TJ(pk) – TC = P(pk) RθJC(t)
1.0E+01
1.0E+02
1.0E+03
Figure 14. Thermal Response
di/dt
IS
trr
ta
tb
TIME
0.25 IS
tp
IS
Figure 15. Diode Reverse Recovery Waveform
Motorola TMOS Power MOSFET Transistor Device Data
7
MMSF10N03Z
INFORMATION FOR USING THE SO–8 SURFACE MOUNT PACKAGE
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the semiconductor packages must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct pad
geometry, the packages will self–align when subjected to a
solder reflow process.
0.060
1.52
0.275
7.0
0.155
4.0
0.024
0.6
0.050
1.270
inches
mm
SO–8 POWER DISSIPATION
The power dissipation of the SO–8 is a function of the input
pad size. This can vary from the minimum pad size for
soldering to the pad size given for maximum power
dissipation. Power dissipation for a surface mount device is
determined by TJ(max), the maximum rated junction
temperature of the die, RθJA, the thermal resistance from the
device junction to ambient; and the operating temperature, TA.
Using the values provided on the data sheet for the SO–8
package, PD can be calculated as follows:
PD =
TJ(max) – TA
RθJA
The values for the equation are found in the maximum
ratings table on the data sheet. Substituting these values into
the equation for an ambient temperature TA of 25°C, one can
calculate the power dissipation of the device which in this case
is 1.6 Watts.
PD =
150°C – 25°C
= 1.6 Watts
80°C/W
The 80°C/W for the SO–8 package assumes the
recommended footprint on a glass epoxy printed circuit board
to achieve a power dissipation of 1.6 Watts using the footprint
shown. Another alternative would be to use a ceramic
substrate or an aluminum core board such as Thermal Clad.
Using board material such as Thermal Clad, the power
dissipation can be doubled using the same footprint.
SOLDERING PRECAUTIONS
The melting temperature of solder is higher than the rated
temperature of the device. When the entire device is heated
to a high temperature, failure to complete soldering within a
short time could result in device failure. Therefore, the
following items should always be observed in order to
minimize the thermal stress to which the devices are
subjected.
• Always preheat the device.
• The delta temperature between the preheat and soldering
should be 100°C or less.*
• When preheating and soldering, the temperature of the
leads and the case must not exceed the maximum
temperature ratings as shown on the data sheet. When
using infrared heating with the reflow soldering method,
the difference shall be a maximum of 10°C.
8
• The soldering temperature and time shall not exceed
260°C for more than 10 seconds.
• When shifting from preheating to soldering, the maximum
temperature gradient shall be 5°C or less.
• After soldering has been completed, the device should be
allowed to cool naturally for at least three minutes.
Gradual cooling should be used as the use of forced
cooling will increase the temperature gradient and result
in latent failure due to mechanical stress.
• Mechanical stress or shock should not be applied during
cooling.
* Soldering a device without preheating can cause excessive
thermal shock and stress which can result in damage to the
device.
Motorola TMOS Power MOSFET Transistor Device Data
MMSF10N03Z
TYPICAL SOLDER HEATING PROFILE
For any given circuit board, there will be a group of control
settings that will give the desired heat pattern. The operator
must set temperatures for several heating zones and a figure
for belt speed. Taken together, these control settings make up
a heating “profile” for that particular circuit board. On
machines controlled by a computer, the computer remembers
these profiles from one operating session to the next. Figure
16 shows a typical heating profile for use when soldering a
surface mount device to a printed circuit board. This profile will
vary among soldering systems, but it is a good starting point.
Factors that can affect the profile include the type of soldering
system in use, density and types of components on the board,
type of solder used, and the type of board or substrate material
being used. This profile shows temperature versus time. The
STEP 1
PREHEAT
ZONE 1
“RAMP”
200°C
STEP 2
STEP 3
VENT
HEATING
“SOAK” ZONES 2 & 5
“RAMP”
DESIRED CURVE FOR HIGH
MASS ASSEMBLIES
line on the graph shows the actual temperature that might be
experienced on the surface of a test board at or near a central
solder joint. The two profiles are based on a high density and
a low density board. The Vitronics SMD310 convection/infrared reflow soldering system was used to generate this
profile. The type of solder used was 62/36/2 Tin Lead Silver
with a melting point between 177 –189°C. When this type of
furnace is used for solder reflow work, the circuit boards and
solder joints tend to heat first. The components on the board
are then heated by conduction. The circuit board, because it
has a large surface area, absorbs the thermal energy more
efficiently, then distributes this energy to the components.
Because of this effect, the main body of a component may be
up to 30 degrees cooler than the adjacent solder joints.
STEP 6
VENT
STEP 5
STEP 4
HEATING
HEATING
ZONES 3 & 6 ZONES 4 & 7
“SPIKE”
“SOAK”
170°C
STEP 7
COOLING
205° TO 219°C
PEAK AT
SOLDER JOINT
160°C
150°C
150°C
100°C
140°C
100°C
SOLDER IS LIQUID FOR
40 TO 80 SECONDS
(DEPENDING ON
MASS OF ASSEMBLY)
DESIRED CURVE FOR LOW
MASS ASSEMBLIES
50°C
TIME (3 TO 7 MINUTES TOTAL)
TMAX
Figure 16. Typical Solder Heating Profile
Motorola TMOS Power MOSFET Transistor Device Data
9
MMSF10N03Z
PACKAGE DIMENSIONS
–A–
M
1
4
R
0.25 (0.010)
4X
–B–
X 45 _
B
M
5
P
8
NOTES:
1. DIMENSIONS A AND B ARE DATUMS AND T IS A
DATUM SURFACE.
2. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
3. DIMENSIONS ARE IN MILLIMETER.
4. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
5. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
6. DIMENSION D DOES NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS
OF THE D DIMENSION AT MAXIMUM MATERIAL
CONDITION.
J
M_
C
F
G
–T–
K
SEATING
PLANE
8X
D
0.25 (0.010)
M
T B
S
A
S
CASE 751–05
SO–8
ISSUE P
DIM
A
B
C
D
F
G
J
K
M
P
R
MILLIMETERS
MIN
MAX
4.80
5.00
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.18
0.25
0.10
0.25
0_
7_
5.80
6.20
0.25
0.50
STYLE 12:
PIN 1.
2.
3.
4.
5.
6.
7.
8.
SOURCE
SOURCE
SOURCE
GATE
DRAIN
DRAIN
DRAIN
DRAIN
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
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Mfax is a trademark of Motorola, Inc.
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10
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MMSF10N03Z/D
Motorola TMOS Power MOSFET Transistor
Device Data
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