Panasonic MN101C70C Mn101c70c Datasheet

MN101C70C
Type
MN101C70C
MN101CF70D
Mask ROM
FLASH
ROM (byte)
48K
64K
RAM (byte)
2K
LQFP080-P-1414A,
TQFP080-P-1212D (Under planning)
0.1 µs (at 3.0 V to 3.6 V, 10 MHz)
0.235 µs (at 1.8 V to 3.6 V, 4.25 MHz)
62.5 µs (at 1.8 V to 3.6 V, 32 kHz)
4K
LQFP080-P-1414A (Under development),
TQFP080-P-1212D (Under planning)
0.25 µs (at 3.0 V to 3.6 V, 8 MHz)
0.50 µs (at 2.28 V to 3.6 V, 4 MHz)
62.5 µs (at 2.2 V to 3.6 V, 32 kHz)
Internal ROM type
Package (Lead-free)
Minimum Instruction
Execution Time
 Interrupts
RESET, Watchdog, External 0 to 2, External 4 (key interrupt dedicated), Timer 0 to 3, Timer 6, Timer 7 (2 systems), Timer 8 (2
systems), Time base, Serial 0 (2 systems), Serial 2, A/D conversion finish, Automatic transfer finish
 Timer Counter
Timer counter 0 : 8-bit × 1
(square-wave/8-bit PWM output, event count, generation of remote control carrier, simple pulse width measurement,
added pluse
(2-bit) system PWM output, real time output control)
(square-wave/PWM output to large current terminal P50 possible)
Clock source................ 1/2, 1/4 of system clock frequency; 1/1, 1/4, 1/16, 1/32, 1/64 of OSC oscillation clock frequency; 1/1 of
XI oscillation clock frequency; external clock input
Interrupt source ........... coincidence with compare register 0
Timer counter 1 : 8-bit × 1
(square-wave output, event count, synchronous output event, serial transfer clock output)
Clock source................ 1/2, 1/8 of system clock frequency; 1/1, 1/4, 1/16, 1/64, 1/128 of OSC oscillation clock frequency; 1/1 of
XI oscillation clock frequency; external clock input
Interrupt source ........... coincidence with compare register 1
Timer counter 0, 1 can be cascade-connected.
Timer counter 2 : 8-bit × 1
(square-wave output, added pluse (2-bit) system PWM output, PWM output, serial transfer clock output, real time
output control, event count, synchronous output event, simple pulse width measurement)
(square-wave/PWM output to large current terminal P52 possible)
Clock source................ 1/2, 1/4 of system clock frequency; 1/1, 1/4, 1/16, 1/32, 1/64 of OSC oscillation clock frequency; 1/1 of
XI oscillation clock frequency; external clock input
Interrupt source ........... coincidence with compare register 2
Timer counter 3 : 8-bit × 1
(square-wave output, event count, generation of remote control carrier, serial transfer clock)
Clock source................ 1/2, 1/8 of system clock frequency; 1/1, 1/4, 1/16, 1/64, 1/128 of OSC oscillation clock frequency; 1/1 of
XI oscillation clock frequency; external clock input
Interrupt source ........... coincidence with compare register 3
Timer counter 2, 3 can be cascade-connected.
Timer counter 6 : 8-bit freerun timer
Clock source................ 1/1 of system clock frequency; 1/1, 1/128, 1/8192 of OSC oscillation clock frequency; 1/1, 1/128, 1/8192
of XI oscillation clock frequency
Interrupt source ........... coincidence with compare register 6
Timer counter 7 : 16-bit × 1
(square-wave output, 16-bit PWM output (cycle / duty continuous variable), event count, synchronous output event,
pulse width measurement, input capture, real time output control, high performance IGBT output (Cycle/Duty can be
changed constantly))
(square-wave/PWM output to large current terminal P51 possible)
Clock source................ 1/1, 1/2, 1/4, 1/16 of system clock frequency; 1/1, 1/2, 1/4, 1/16 of OSC oscillation clock frequency; 1/1,
1/2, 1/4, 1/16 of external clock input frequency
Interrupt source ........... coincidence with compare register 7 (2 lines), input capture register
MAD00035JEM
MN101C70C
Timer counter 8 : 16 bit × 1
(square-wave/16-bit PWM output [duty continuous variable], event count, pulse width measurement, input
capture)(square-wave/PWM output to large current terminal P53 possible)
Clock source................ 1/1, 1/2, 1/4, 1/16 of system clock frequency; 1/1, 1/2, 1/4, 1/16 of OSC oscillation clock frequency; 1/1,
1/2, 1/4, 1/16 of external clock input frequency
Interrupt source ........... coincidence with compare register 8 (2 lines), input capture register
Timer counters 7, 8 can be cascade-connected. (square-wave output, PWM is possible as a 32-bit timer.)
Time base timer (one-minute count setting)
Clock source................ 1/1 of OSC oscillation clock frequency; 1/1 of XI oscillation clock frequency
Interrupt source ........... 1/128, 1/256, 1/512, 1/1024, 1/8192, 1/32768, of clock source frequency
Watchdog timer
Interrupt source ........... 1/65536, 1/262144, 1/1048576 of system clock frequency
 Serial interface
Serial 0 : synchronous type/UART (full-duplex) × 1
Clock source................ 1/2, 1/4 of system clock frequency; pulse output of timer counter 2 or 3; 1/2, 1/4, 1/16, 1/64 of OSC
oscillation clock frequency, external clock
Serial 2 : synchronous type/single-master I²C × 1
Clock source................ 1/2, 1/4 of system clock frequency; pulse output of timer counter 2 or 3; 1/2, 1/4, 1/16, 1/32 of OSC
oscillation clock frequency, external clock
 DMA controller
Max. Transfer cycles : 255
Starting factor : external request, various types of interrupt, software
Transfer mode : 1-byte transfer, word transfer, burst transfer
 I/O Pins
66
I/O
Common use , Specified pull-up resistor available, Input/output selectable (bit unit)
 A/D converter
10-bit × 16-ch. (with S/H)
 Display control function
LCD
32 segments × 4 commons (static, 1/2, 1/3, or 1/4 duty)
LCD power supply separated from VDD (usable if VDD ≤ VLCD ≤ 3.6 V)
LCD power step-up circuit contained (3/2, 2 and 3 times)
LCD power shunt resistance contained
LCD reference voltage is contained.
 Special Ports
Buzzer output, remote control carrier signal output, high-current drive port
 ROM Correction
Correcting address designation : up to 3 addresses possible
 Electrical Charactreistics (Supply current)
Parameter
Operating supply current
Supply current at HALT
Symbol
Condition
Limit
min
typ
max
Unit
IDD1
fosc = 4 MHz , VDD = 3 V
1
1.8
mA
IDD2
fx = 32 kHz , VDD = 3 V
4
15
µA
IDD3
fx = 32 kHz , VDD = 3 V, Ta = 25°C
2
5
µA
IDD4
fx = 32 kHz , VDD = 3 V , Ta = –40°C to +85°C
10
µA
Supply current at STOP
IDD5
VDD = 3 V , Ta = 25°C
2
µA
Supply current at STOP
IDD6
VDD = 3 V , Ta = –40°C to +85°C
8
µA
MAD00035JEM
 Development tools
In-circuit Emulator
PX-ICE101C/D+PX-PRB101C70-LQFP080-P-1414A-M
PX-ICE101C/D+PX-PRB101C70-TQFP080-P-1212-M
MN101C70C
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
TM8IO, P15
TM7IO, P14
TM3IO, P13
TM2IO, P12
TM1IO, P11
RMOUT, TM0IO, P10
SBT2, P07
SBI2, P06
SBO2, P05
SBT0A, P04
RXDA, SBI0A, P03
TXDA, SBO0A, P02
NBUZZERA, AN9, P01
BUZZERA, AN8, P00
AN7, PA7
AN6, PA6
AN5, PA5
AN4, PA4
AN3, PA3
AN2, PA2
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
VLC3, P34
VLC2
VLC1
C2
TM0O, LED0, P50, C1
TM7O, LED1, P51
TM2O, LED2, P52
TM8O, LED3, P53
VSS
OSC2
OSC1
SSTRT
XI
XO
SOSCMD
VDD
NRST, P27
VREF+
AN0, PA0
AN1, PA1
P70, SEG15
P71, SEG14
P72, SEG13
P73, SEG12
P74, SEG11
P75, SEG10
P76, SEG9
P77, SEG8
P80, SEG7
P81, SEG6
P82, SEG5
P83, SEG4
P84, SEG3
P85, SEG2
P86, SEG1
P87, SEG0
P30, COM0
P31, COM1
P32, COM2
P33, COM3
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
P67, SEG16
P66, SEG17
P65, SEG18
P64, SEG19, SBT0B
P63, SEG20, SBI0B, RXDB
P62, SEG21, SBO0B, TXDB
P61, SEG22, NBUZZERB
P60, SEG23, BUZZERB
P47, KEY7, SEG24, SDO7
P46, KEY6, SEG25, SDO6
P45, KEY5, SEG26, SDO5
P44, KEY4, SEG27, SDO4
P43, KEY3, SEG28, SDO3
P42, KEY2, SEG29, SDO2
P41, KEY1, SEG30, SDO1
P40, KEY0, SEG31, SDO0
VDD
P22, IRQ2
P21, IRQ1, ACZ
P20, IRQ0
 Pin Assignment
LQFP080-P-1414A
TQFP080-P-1212D
MAD00035JEM
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products, and no license is granted under any intellectual property right or other right owned by our company or any other
company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other
company which may arise as a result of the use of technical information described in this book.
(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office
equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
– Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body.
– Any applications other than the standard applications intended.
(4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
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Electric Industrial Co., Ltd. Industrial Co., Ltd.
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